CREAT BY ART
- Dual rectifier construction, positive center-tap
- Glass passivated chip junctions
- Superfast recovery time, high voltage
- Low forward voltage, high current capability
- Low thermal resistance
- Low power loss, high efficiency
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
V
RRM
50 100 150 200 300 400 600 V
V
RMS
35 70 105 140 210 280 420 V
V
DC
50 100 150 200 300 400 600 V
I
F(AV)
A
Trr ns
Cj pF
R
θJC O
C/W
T
JO
C
T
STG O
C
Document Number: DS_D1401017 Version: G14
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: TO-247AD (TO-3P)
Polarity: As marked
SF3001PT thru SF3008PT
Taiwan Semiconductor
Glass Passivated Su
p
er Fast Rectifiers
FEATURES
SF
3001
PT
SF
3002
PT
SF
3003
PT
SF
3004
PT
SF
3005
PT
TO-247AD (TO-3P)
SF
3006
PT
SF
3008
PT
UNIT
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Mounting torque: 10 in-lbs maximum
Weight: 5.6g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER
Maximum reverse recovery time (Note 2)
SYMBOL
Maximum DC blocking voltage
Maximum average forward rectified current 30
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
300
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=125 ℃I
R
A
Maximum instantaneous forward voltage (Note 1)
I
F
= 15 A V
F
1.7 V
Typical thermal resistance 1.0
Operating junction temperature range
175
- 55 to +150
Storage temperature range - 55 to +150
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, Recover to 0.25A.
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Note 1: Pulse Test with PW=300 μs, 1% Duty Cycle
0.95 1.3
10
500 μA
35
Typical junction capacitance (Note 3)
PART NO.
PART NO.
SF3006PT
SF3006PT
(TA=25℃ unless otherwise noted)
Document Number: DS_D1401017 Version: G14
SF30xxPT
(Note 1) C0 Suffix "G" TO-3P
SF3001PT thru SF3008PT
Taiwan Semiconductor
ORDERING INFORMATION
PACKING CODE GREEN COMPOUND
CODE PACKAGE
EXAMPLE
PREFERRED P/N PACKING CODE GREEN COMPOUND
CODE
Green compound
DESCRIPTION
30 / Tube
PACKING
RATINGS AND CHARACTERISTICS CURVES
SF3006PT C0 C0
SF3006PT C0G C0 G
Note 1: "xx" defines voltage from 50V (SF3001PT) to 600V (SF3008PT)
0
6
12
18
24
30
36
050100150
AVERAGE FORWARD A
CURRENT (A)
CASE TEMPERATURE (oC)
FIG.1- MAXIMUM FORWARD CURRENT DERATING
CURVE
RESISTIVE OR
INDUCTIVE LOAD
WITH HEATSINK
0
50
100
150
200
250
300
1 10 100
PEAK FORWARD SURGE CURRENT
(A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3- MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single Half Sine Wave
JEDEC Method
0.1
1
10
100
1000
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT
(μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 2- TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=100℃
TJ=75℃
0.1
1
10
100
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8
INSTANTANEOUS FORWARD CURRENT. (A)
FORWARD VOLTAGE. (V)
FIG. 4- TYPICAL INSTANEOUS FORWARD
CHARACTERISTICS
125oC
25oC
Pulse Width=300μs
1% Duty Cycle
SF3005PT-08PT
SF3001PT-04PT
Min Max Min Max
A 15.90 16.40 0.626 0.646
B 7.90 8.20 0.311 0.323
C 5.70 6.20 0.224 0.244
D 20.80 21.30 0.819 0.839
E 3.50 4.10 0.138 0.161
F 19.70 20.20 0.776 0.795
G - 4.30 - 0.169
H 2.90 3.40 0.114 0.134
I 1.93 2.18 0.076 0.086
J 2.97 3.22 0.117 0.127
K 1.12 1.22 0.044 0.048
L 5.20 5.70 0.205 0.224
M 4.90 5.16 0.193 0.203
N 2.70 3.00 0.106 0.118
O 0.51 0.76 0.020 0.030
P/N = Marking Code
G = Green Compound
YWW = Date Code
F = Factory Code
Document Number: DS_D1401017 Version: G14
MARKING DIAGRAM
SF3001PT thru SF3008PT
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
10
100
1000
0.1 1 10 100
CAPACITANCE (pF)
REVERSE VOLTAGE. (V)
FIG. 5- TYPICAL JUNCTION CAPACITANCE
f=1MHz
Vsig=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1401017 Version: G14
SF3001PT thru SF3008PT
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
