Products Leam Develop Support Type Here to Search Products QO Oeavah ARK Menu (yee Intel Core 15-2515E Processor (3M Cache, up to 3.10 GHz) Seta tel sla Specifications Related Products SSSQUIENs 6 Essentials 2nd Generation Intel Performance Core i5 Processors Status Launched Memory Specifications Intel Core j3-2500 -. oo Launch Date 1'11 Mobile Processor Series Graphics Specifications cecuerevenseeneneneesaeeeneennesntenns Bridge Package Specifications Cache a MIB SmartCache Advanced Technologies Instruction Set 64-bit (intel ee eels leh ae oll Instruction Set Extensions Ahm a Tela lale ee) 44 seeteecuenesaueauesussesseseeeeeeceeceeeeeceeceeaueaussssseeseeeeeeeseeeeeeees Intel Platform Embedded Options Available Cy Wes Protection Technology ; . Lithography 32 nm Visit the Embedded Design Center > Compatible Products Recommended Customer Price $256.00 Datasheet Link . . Product Images Quick Links bd =) #0 ae nl # of Cores 2 support Overview > Download Drivers # of Threads 4 search Distributors > Processor Base Frequency 2.3 GHz ; PCN/MDDS Information Max Turbo Frequency 3.1 GHZ SRO?S TDP 35 WY 911601: PCN | MDDS Max Memory Size (dependent an memory type) 16 GB Memory Types DDR3 1066/1333 Max # of Memory Channels 2 Max Memory Bandwidth 27.3 GB,'s ECC Memory Supported + IQ) Wes Processor Graphics + Intel HD Graphics 3000 Graphics Base Frequency G20 Mhz 6 ie Pe eee eer et Intel Quick Sync Video Q] Yes Intel Intru 30 Technology Yes Intel Wireless Display IQ] Yes Intel Flexible Display Interface (Intel FDI) Ves Intel Clear Video HD Technology Wes Macrovision* License Required No # of Displays SUpported + a 6 opal Teed ag eee PC] Express Revision 20 AGU Ered SEPM BUEN Iai s eee Max # of PC] Express Lanes 16 6 Package Specifications TAUNCTION es Package Size 31mm * 24mm (FCRBGAIMI2 3) Graphics and IMC Lithography a2 mM sockets Supported FCBGATOZS Low Halogen Options Available 5ee MDDS 6 ates a] =1e ella a] alee Intel Turao Boost Technology + 20 Intel yPro Technology 4 Cy Wes Intel Hyper-Threading Technology 4 IQ] Yes Intel Virtualization Technology (T-x) + Wes Intel Virtualization Technology for Directed | 0 Vrs aq) Intel VT-x with Extended Page Tables (EPT)+ |Q] Yes Intel 64 4 Q] Yes Idle States Ves Enhanced Intel SpeedStep? Technology (Q) Yes Intel Demand Based Switching IQ) No Thermal Monitoring Technologies Wes Intel Fast Memory Access Wes Intel Flex Memory Access Yes Intel [dentity Protection Technology + Yes Intel Data Protection Technology Intel AES New Instructions [Q| Wes 6 Intel Platform Protection Technology Trusted Execution Technology + [Q| Wes All information provided is subject ta change at any time, without notice. Intel may make changes to manufacturing lite cycle, specifications, and product descriptions atany time, without notice. The information herein is Browied "as-is" and Intel does not make any representations of warranties whatsoever regarding accuracy of the information, naran the product features, availability, functionality, ar compatibility at the products listed. Please contact system wendar far mare information on speciic products or systems. Intel classifications" consistat Export Gontral Classification Numbers |ECCH) and Harnonied Tarif Schedule |HTS) numbers. Any use made of intel classifications are without recourse ta Intel and shall not be construed as 4 representation or warranty regarding the praper ECON or HTS. Your company may be the 6s porter of record, and as such, your company 6 responsible for determining the correct class fication of any item at the tine of 24 port. Refer ta Datasheet for formal definitions af product properties and features. Announced SKUs are notyet available Please refer to the Launch Date far market availability. Some products can support AES Mew Instructions with a Processar Configuration update, in particular, i?-26300RMfi7-26350M, i?-26 GO Mfi?-26 750M, 5-24-50 5-245 5h 9-247 0h 5-2-4 oh, Please contact OEM far the BIOS that includes the latest Processarcantiguration update. + This feature may nat be availablean all computing systems. Please check with the system vendar ta determing fyoursystem delivers this feature, or reference the system specifications |rotherboard, processor, chipset, power supply, HOO, sraphics contraller, menary, BIOS, drivers, virtual machine maonitor-VeM, plattorm software, and/or operating system] far feature compatibility. Functionality, Pedormance, and other benefits of this feature may vary depending on system configuration. "Conflict free" and conflict-free" means ORC conflict free", which 6 defined by the U5. Securities and Exchange Goromission rules ta mean products that da not contain conflict minerals |tin, tantalum, tungsten andor. gald) that directhy ar indirectly finance or benetit armed sroupa in the Democratic Republic af the Ganga |ORG) or adjoining countries. Intel alao ues the term conflictfree" ina broader sense ta refer ta SUpPliers, supply chains, smelters and refiners whose saurces of conflict minerals da notfinance conflict in the ORC or adjoining countries. Intel processars manufactured before dtanuary 1, 2013 are nat confirmed conflict free. The conflict free designation refers only ta product manufactured after that date. For Intel Boxed Processars, the conflict free designation refers ta the processaraniy, nat ta any additional included accessaries,such as heatsinks coolers. Se Atte hen el Co foo ten tony Os fen Pach recto rea d-tech no logy hy per-th read ing hy perth read ing-tech nology htt wapkw= hy pereth reading far mare information including details an which Processdrs support intel* HT Technalagy. Plas Turbo Frequency refers to the masiniunm single-core processor frequency that can be achieved with Intel Turbo Boost Technology. Fee wi intel com technology turbo boost) far more information. The Recommended Customer Price |RCP") is pricing fumdance far Intel products. Prices are far direct Intel customers, typically represent 7 OOO-unit purchase quantities, and aresubGsect ta change without notice. Tases and shipping, etc. nat included. Prices may vary forather package types and shipment quantities, and special promotional arrangements may apply. faald in bulk, price represents individual unit. Listing of these RCP does notcanstitutea farmal pricing offer fram Intel. Please work with your appropriate Intel representative ta obtain a formal price quotation. Systen and Masinum TOPis based on worst casescenarios. Actual TOP may be lower if motall Os for chipsets are used. Low Halogen: Applies aniy ta Braominated and chlorinated flame retardants |BFRa/CFRa] and PYCin thetinal product. Intel components as well as purchased components on the finished assembly meet 15-700 requirements, and the PCB f substrate meet IEG 61249-2-21 requirements. The replacement of halogenated flame retardants andor PVC may nat Ge better far the enviranment. For benchmarking data see http Shan intel conf peta rmnance. Intel processdr numbers are nota measureat petormance. Processor numbers ditfterentiate features within each processar family, otacross different processar families. Dee tte. in tel com focontent ana Os fen processed raf processar-numbGers.htral far details. Processors thatsupport B4Ebit computing on Intel architecture require an Intel 64 architecture-enabled BIOS. (9 send us your feedback! a USA (English) Company Information OurCommitment Communities Investor Relations Contact Us intel Newsroom Jobs f in ow G& 2 Intel Corporation | Terms of Use | *Trademarks | Privacy | Cookies | Supply Chain Transparency | Site Map