SMF5.0AT1G Series, SZSMF5.0AT1G Series 200 W Transient Voltage Suppressor SOD-123 Flat Lead Package The SMF5.0AT1G Series is designed to protect voltage sensitive components from high voltage, high energy transients. Excellent clamping capability, high surge capability, low zener impedance and fast response time. Because of its small size, it is ideal for use in cellular phones, portable devices, business machines, power supplies and many other industrial/consumer applications. Features * * * * * * * * * * * * * * Stand-off Voltage: 5 - 58 Volts Peak Power - 200 Watts @ 1 ms (SMF5.0A - SMF58A) Low Leakage Response Time is Typically < 1 ns ESD Rating of Class 3 (> 16 kV) per Human Body Model ESD Rating of Level 4 (8 kV Contact Discharge) per IEC61000-4-2 EFT (Electrical Fast Transients) Rating of 40 A per IEC61000-4-4 Low Profile - Maximum Height of 1.0 mm Small Footprint - Footprint Area of 8.45 mm2 Supplied in 8 mm Tape and Reel - 3,000 Units per Reel Cathode Indicated by Polarity Band Lead Orientation in Tape: Cathode Lead to Sprocket Holes SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable Pb-Free Packages are Available* http://onsemi.com PLASTIC SURFACE MOUNT ZENER OVERVOLTAGE TRANSIENT SUPPRESSOR 5 - 58 VOLTS 200 WATT PEAK POWER SOD-123FL CASE 498 PLASTIC 1 1: CATHODE 2: ANODE MARKING DIAGRAM 1 CATHODE xx M G Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V-0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any 2 xx M G G 2 ANODE = Device Code (Refer to page 3) = Date Code = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION QUALIFIED MAX REFLOW TEMPERATURE: 260C Device Meets MSL 1 Requirements Package Shipping SMFxxxAT1G SOD-123FL (Pb-Free) 3,000 / Tape & Reel SZSMFxxxAT1G SOD-123FL (Pb-Free) 3,000 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (c) Semiconductor Components Industries, LLC, 2012 August, 2012 - Rev. 6 1 See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet. Publication Order Number: SMF5.0AT1/D SMF5.0AT1G Series, SZSMF5.0AT1G Series MAXIMUM RATINGS Symbol Value Unit Maximum Ppk Dissipation (PW-10/1000 ms) (Note 1) SMF5.0A - SMF58A Rating Ppk 200 W Maximum Ppk Dissipation @ TA = 25C, (PW-8/20 ms) (Note 2) Ppk 1000 W DC Power Dissipation @ TA = 25C (Note 3) Derate above 25C Thermal Resistance, Junction-to-Ambient (Note 3) PD 385 4.0 325 mW mW/C C/W RqJcathode 26 C/W TJ, Tstg -55 to +150 C RqJA Thermal Resistance, Junction-to-Lead (Note 3) Operating and Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Non-repetitive current pulse at TA = 25C, per waveform of Figure 2. 2. Non-repetitive current pulse at TA = 25C, per waveform of Figure 3. 3. Mounted with recommended minimum pad size, DC board FR-4. ELECTRICAL CHARACTERISTICS (TA = 25C unless I otherwise noted, VF = 3.5 V Max. @ IF (Note 4) = 12 A) Symbol IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM IR VBR IF Parameter VC VBR VRWM Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM IR VF IT Breakdown Voltage @ IT IT Test Current IF Forward Current VF Forward Voltage @ IF IPP Uni-Directional TVS 4. 1/2 sine wave (or equivalent square wave), PW = 8.3 ms, duty cycle = 4 pulses per minute maximum. http://onsemi.com 2 V SMF5.0AT1G Series, SZSMF5.0AT1G Series ELECTRICAL CHARACTERISTICS (TL = 30C unless otherwise noted, VF = 1.25 Volts @ 200 mA) VRWM (V) VBR @ IT (V) (Note 6) IT IR @ VRWM VC(Max) IPP(Max) (A) Marking (Note 5) Min Nom Max (mA) (mA) (V) (Note 7) SMF5.0AG KE 5 6.4 6.7 7 10 400 9.2 21.7 SMF6.0AG KG 6 6.67 7.02 7.37 10 400 10.3 19.4 SMF6.5AG KK 6.5 7.22 7.6 7.98 10 250 11.2 17.9 SMF7.0AG KM 7 7.78 8.2 8.6 10 100 12 16.7 SMF7.5AG KP 7.5 8.33 8.77 9.21 1 50 12.9 15.5 SMF8.0AG KR 8 8.89 9.36 9.83 1 25 13.6 14.7 SMF9.0AG KV 9 10 10.55 11.1 1 5 15.4 13.0 SMF10AG KX 10 11.1 11.7 12.3 1 2.5 17 11.8 SMF11AG KZ 11 12.2 12.85 13.5 1 2.5 18.2 11.0 SMF12AG LE 12 13.3 14 14.7 1 2.5 19.9 10.1 SMF13AG LG 13 14.4 15.15 15.9 1 1 21.5 9.3 SMF14AG LK 14 15.6 16.4 17.2 1 1 23.2 8.6 SMF15AG LM 15 16.7 17.6 18.5 1 1 24.4 8.2 SMF18AG LT 18 20 21 22.1 1 1 29.2 6.8 SMF20AG LV 20 22.2 23.35 24.5 1 1 32.4 6.2 SMF22AG LX 22 24.4 25.6 26.9 1 1 35.5 5.6 SMF24AG LZ 24 26.7 28.1 29.5 1 1 38.9 5.1 SMF26AG ME 26 28.9 30.4 31.9 1 1 42.1 4.8 SMF28AG MG 28 31.1 32.8 34.4 1 1 45.4 4.4 SMF30AG MK 30 33.3 35.1 36.8 1 1 48.4 4.1 SMF33AG MM 33 36.7 38.7 40.6 1 1 53.3 3.8 SMF36AG MP 36 40 42.1 44.2 1 1 58.1 3.4 SMF48AG MX 48 53.3 56.1 58.9 1 1 77.4 2.6 SMF51AG MZ 51 56.7 59.7 62.7 1 1 82.4 2.4 SMF58AG NG 58 64.4 67.8 71.2 1 1 93.6 2.1 Device* 5. A transient suppressor is normally selected according to the Working Peak Reverse Voltage (VRWM) which should be equal to or greater than the DC or continuous peak operating voltage level. 6. VBR measured at pulse test current IT at ambient temperature of 25C. 7. Surge current waveform per Figure 2 and derate per Figure 3. *Include SZ-prefix devices where applicable. http://onsemi.com 3 SMF5.0AT1G Series, SZSMF5.0AT1G Series TYPICAL PROTECTION CIRCUIT Zin LOAD Vin PP, PEAK POWER (WATTS) 10,000 VALUE (%) RSM I HALF VALUE - RSM 2 50 100 tP 1.0 100 10 1000 3 4 Figure 2. 10 X 1000 ms Pulse Waveform 60 160 140 120 100 HALF VALUE IRSM/2 @ 20 ms 50 40 tP 10 0 2 Figure 1. Pulse Rating Curve 70 0 1 t, TIME (ms) PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK CURRENT DECAY = 8 ms 20 0 tP, PULSE WIDTH (ms) 80 30 0 10,000 PEAK VALUE IRSM @ 8 ms tr 90 100 20 40 PEAK PULSE DERATING IN % OF PEAK POWER OR CURRENT @ TA = 25C 10 % OF PEAK PULSE CURRENT PULSE WIDTH (tP) IS DEFINED AS THAT POINT WHERE THE PEAK tr CURRENT DECAYS TO 50% OF IRSM. tr 10 ms PEAK VALUE - I 100 1000 VL 60 80 80 60 40 20 0 0 t, TIME (ms) 25 50 75 100 125 TA, AMBIENT TEMPERATURE (C) Figure 4. Pulse Derating Curve Figure 3. 8 X 20 ms Pulse Waveform http://onsemi.com 4 150 1 0.7 DERATING FACTOR 0.5 0.3 0.2 PULSE WIDTH 10 ms 0.1 0.07 0.05 1 ms 0.03 100 ms 0.02 0.1 0.2 0.5 1 2 5 10 20 50 100 400 350 300 250 200 150 100 50 0 0 25 50 75 100 125 150 D, DUTY CYCLE (%) T, TEMPERATURE (C) Figure 5. Typical Derating Factor for Duty Cycle Figure 6. Steady State Power Derating 175 1000 1.2 1.0 C, CAPACITANCE (pF) V F, TYPICAL FORWARD VOLTAGE (VOLTS) 0.01 10 ms P D , MAXIMUM POWER DISSIPATION (mW SMF5.0AT1G Series, SZSMF5.0AT1G Series 0.8 0.6 0.4 MEASURED @ ZERO BIAS 100 MEASURED @ 50% VRWM 10 0.2 0 -55 25 85 1 150 1 10 100 1000 WORKING PEAK REVERSE VOLTAGE (VOLTS) T, TEMPERATURE (C) Figure 7. Forward Voltage Figure 8. Capacitance versus Working Peak Reverse Voltage http://onsemi.com 5 SMF5.0AT1G Series, SZSMF5.0AT1G Series PACKAGE DIMENSIONS SOD-123FL CASE 498 ISSUE B E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. 4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP. q D DIM A A1 b c D E L HE q A1 POLARITY INDICATOR OPTIONAL AS NEEDED A L MIN 0.90 0.00 0.70 0.10 1.50 2.50 0.55 3.40 0 MILLIMETERS NOM MAX 0.95 1.00 0.05 0.10 0.90 1.10 0.15 0.20 1.65 1.80 2.70 2.90 0.75 0.95 3.60 3.80 8 - MIN 0.035 0.000 0.028 0.004 0.059 0.098 0.022 0.134 0 INCHES NOM 0.037 0.002 0.035 0.006 0.065 0.106 0.030 0.142 - MAX 0.039 0.004 0.043 0.008 0.071 0.114 0.037 0.150 8 b SOLDERING FOOTPRINT* EEEE EEEE EEEE EEEE HE q c EEEE EEEE EEEE EEEE 0.91 0.036 2.36 0.093 4.19 0.165 1.22 0.048 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. 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