Cyclone V Device Overview
2014.10.06
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The Cyclone® V devices are designed to simultaneously accommodate the shrinking power consumption,
cost, and time-to-market requirements; and the increasing bandwidth requirements for high-volume and
cost-sensitive applications.
Enhanced with integrated transceivers and hard memory controllers, the Cyclone V devices are suitable
for applications in the industrial, wireless and wireline, military, and automotive markets.
Related Information
Cyclone V Device Handbook: Known Issues
Lists the planned updates to the Cyclone V Device Handbook chapters.
Key Advantages of Cyclone V Devices
Table 1: Key Advantages of the Cyclone V Device Family
Advantage Supporting Feature
Lower power consumption Built on TSMC's 28 nm low-power (28LP) process technology
and includes an abundance of hard intellectual property (IP)
blocks
Up to 40% lower power consumption than the previous
generation device
Improved logic integration and
differentiation capabilities 8-input adaptive logic module (ALM)
Up to 13.59 megabits (Mb) of embedded memory
Variable-precision digital signal processing (DSP) blocks
Increased bandwidth capacity 3.125 gigabits per second (Gbps) and 6.144 Gbps transceivers
Hard memory controllers
Hard processor system (HPS) with
integrated ARM® Cortex-A9
MPCore processor
Tight integration of a dual-core ARM Cortex-A9 MPCore
processor, hard IP, and an FPGA in a single Cyclone V system-
on-a-chip (SoC)
Supports over 128 Gbps peak bandwidth with integrated data
coherency between the processor and the FPGA fabric
© 2014 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, ENPIRION, MAX, MEGACORE, NIOS, QUARTUS and STRATIX words and logos are
trademarks of Altera Corporation and registered in the U.S. Patent and Trademark Office and in other countries. All other words and logos identified as
trademarks or service marks are the property of their respective holders as described at www.altera.com/common/legal.html. Altera warrants performance
of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any
products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any information,
product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
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Advantage Supporting Feature
Lowest system cost Requires only two core voltages to operate
Available in low-cost wirebond packaging
Includes innovative features such as Configuration via Protocol
(CvP) and partial reconfiguration
Summary of Cyclone V Features
Table 2: Summary of Features for Cyclone V Devices
Feature Description
Technology TSMC's 28-nm low-power (28LP) process technology
1.1 V core voltage
Packaging Wirebond low-halogen packages
Multiple device densities with compatible package footprints for seamless
migration between different device densities
RoHS-compliant and leaded(1)options
High-performance FPGA
fabric Enhanced 8-input ALM with four registers
Internal memory blocks M10K—10-kilobits (Kb) memory blocks with soft error correction code
(ECC)
Memory logic array block (MLAB)—640-bit distributed LUTRAM where
you can use up to 25% of the ALMs as MLAB memory
Embedded Hard IP blocks
Variable-precision
DSP Native support for up to three signal processing
precision levels (three 9 x 9, two 18 x 18, or one
27 x 27 multiplier) in the same variable-precision DSP
block
64-bit accumulator and cascade
Embedded internal coefficient memory
Preadder/subtractor for improved efficiency
Memory controller DDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC
support
Embedded
transceiver I/O PCI Express® (PCIe®) Gen2 and Gen1 (x1, x2, or x4)
hard IP with multifunction support, endpoint, and root
port
(1) Contact Altera for availability.
2Summary of Cyclone V Features CV-51001
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Feature Description
Clock networks Up to 550 MHz global clock network
Global, quadrant, and peripheral clock networks
Clock networks that are not used can be powered down to reduce dynamic
power
Phase-locked loops (PLLs) Precision clock synthesis, clock delay compensation, and zero delay
buffering (ZDB)
Integer mode and fractional mode
FPGA General-purpose I/Os
(GPIOs) 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS
transmitter
400 MHz/800 Mbps external memory interface
On-chip termination (OCT)
3.3 V support with up to 16 mA drive strength
Low-power high-speed serial
interface 614 Mbps to 6.144 Gbps integrated transceiver speed
Transmit pre-emphasis and receiver equalization
Dynamic partial reconfiguration of individual channels
HPS
( Cyclone V SE, SX, and ST
devices only)
Single or dual-core ARM Cortex-A9 MPCore processor-up to 925 MHz
maximum frequency with support for symmetric and asymmetric
multiprocessing
Interface peripherals—10/100/1000 Ethernet media access control
(EMAC), USB 2.0 On-The-GO (OTG) controller, quad serial peripheral
interface (QSPI) flash controller, NAND flash controller, Secure
Digital/MultiMediaCard (SD/MMC) controller, UART, controller area
network (CAN), serial peripheral interface (SPI), I2C interface, and up to
85 HPS GPIO interfaces
System peripherals—general-purpose timers, watchdog timers, direct
memory access (DMA) controller, FPGA configuration manager, and
clock and reset managers
On-chip RAM and boot ROM
HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and
lightweight HPS-to-FPGA bridges that allow the FPGA fabric to issue
transactions to slaves in the HPS, and vice versa
FPGA-to-HPS SDRAM controller subsystem—provides a configurable
interface to the multiport front end (MPFE) of the HPS SDRAM controller
ARM CoreSight JTAG debug access port, trace port, and on-chip trace
storage
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Feature Description
Configuration Tamper protection—comprehensive design protection to protect your
valuable IP investments
Enhanced advanced encryption standard (AES) design security features
CvP
Partial and dynamic reconfiguration of the FPGA
Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive
parallel (FPP) x8 and x16 configuration options
Cyclone V Device Variants and Packages
Table 3: Device Variants for the Cyclone V Device Family
Variant Description
Cyclone V E Optimized for the lowest system cost and power requirement for a wide
spectrum of general logic and DSP applications
Cyclone V GX Optimized for the lowest cost and power requirement for 614 Mbps to
3.125 Gbps transceiver applications
Cyclone V GT The FPGA industry’s lowest cost and lowest power requirement for
6.144 Gbps transceiver applications
Cyclone V SE SoC with integrated ARM-based HPS
Cyclone V SX SoC with integrated ARM-based HPS and 3.125 Gbps transceivers
Cyclone V ST SoC with integrated ARM-based HPS and 5 Gbps transceivers
Cyclone V E
This section provides the available options, maximum resource counts, and package plan for the
Cyclone V E devices.
The information in this section is correct at the time of publication. For the latest information and to get
more details, refer to the Altera Product Selector.
Related Information
Altera Product Selector
Provides the latest information about Altera products.
Available Options
4Cyclone V Device Variants and Packages CV-51001
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Figure 1: Sample Ordering Code and Available Options for Cyclone V E Devices
Family Signature
Embedded Hard IPs
Package Type
Package Code
Operating Temperature
FPGA Fabric Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
E : Enhanced logic/memory
B : No hard PCIe or hard
memory controller
F : No hard PCIe and maximum
2 hard memory controllers
5C : Cyclone V
F : FineLine BGA (FBGA)
U : Ultra FineLine BGA (UBGA)
M : Micro FineLine BGA (MBGA)
FBGA Package Type
17 : 256 pins
23 : 484 pins
27 : 672 pins
31 : 896 pins
UBGA Package Type
15 : 324 pins
19 : 484 pins
MBGA Package Type
13 : 383 pins
15 : 484 pins
C : Commercial (TJ = 0° C to 85° C)
I : Industrial (TJ = -40° C to 100° C)
A : Automotive (TJ = -40° C to 125° C)
6 (fastest)
7
8
N : Lead-free packaging
Contact Altera for availability
of leaded options
ES : Engineering sample
5C E F A9 F 31 C7N
Member Code
Family Variant
A2 : 25K logic elements
A4 : 49K logic elements
A5 : 77K logic elements
A7 : 149.5K logic elements
A9 : 301K logic elements
Maximum Resources
Table 4: Maximum Resource Counts for Cyclone V E Devices
Resource Member Code
A2 A4 A5 A7 A9
Logic Elements (LE) (K) 25 49 77 149.5 301
ALM 9,434 18,480 29,080 56,480 113,560
Register 37,736 73,920 116,320 225,920 454,240
Memory (Kb) M10K 1,760 3,080 4,460 6,860 12,200
MLAB 196 303 424 836 1,717
Variable-precision DSP Block 25 66 150 156 342
18 x 18 Multiplier 50 132 300 312 684
PLL 4 4 6 7 8
GPIO 224 224 240 480 480
LVDS Transmitter 56 56 60 120 120
Receiver 56 56 60 120 120
Hard Memory Controller 1 1 2 2 2
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Related Information
I/O Features in Cyclone V Devices
Provides the number of LVDS channels in each device package.
Package Plan
Table 5: Package Plan for Cyclone V E Devices
Member Code
M383
(13 mm)
M484
(15 mm)
U324
(15 mm)
F256
(17 mm)
U484
(19 mm)
F484
(23 mm)
F672
(27 mm)
F896
(31 mm)
GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO
A2 223 176 128 224 224
A4 223 176 128 224 224
A5 175 224 240
A7 240 240 240 336 480
A9 240 224 336 480
Cyclone V GX
This section provides the available options, maximum resource counts, and package plan for the
Cyclone V GX devices.
The information in this section is correct at the time of publication. For the latest information and to get
more details, refer to the Altera Product Selector.
Related Information
Altera Product Selector
Provides the latest information about Altera products.
Available Options
The following figure shows sample ordering code and lists the options available for Cyclone V GX devices.
6Package Plan CV-51001
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Figure 2: Sample Ordering Code and Available Options for Cyclone V GX Devices
Family Signature
Embedded Hard IPs
Transceiver Count
Transceiver
Speed Grade
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
GX : 3-Gbps transceivers
B : No hard PCIe or hard
memory controller
F : Maximum 2 hard PCIe and
2 hard memory controllers
5C : Cyclone V
C3 : 31.5K logic elements
C4 : 50K logic elements
C5 : 77K logic elements
C7 : 149.5K logic elements
C9 : 301K logic elements
B : 3
F : 4
A : 5
C : 6
D : 9
E : 12
6 : 3.125 Gbps
7 : 2.5 Gbps
F : FineLine BGA (FBGA)
U : Ultra FineLine BGA (UBGA)
M : Micro FineLine BGA (MBGA)
FBGA Package Type
23 : 484 pins
27 : 672 pins
31 : 896 pins
35 : 1,152 pins
UBGA Package Type
15 : 324 pins
19 : 484 pins
MBGA Package Type
11 : 301 pins
13 : 383 pins
15 : 484 pins
C : Commercial (TJ = 0° C to 85° C)
I : Industrial (TJ = -40° C to 100° C)
A : Automotive (TJ = -40° C to 125° C)
6 (fastest)
7
8
N : Lead-free packaging
Contact Altera for availability
of leaded options
ES
:
Engineering sample
5C GX FC9 E 6F 35 C7N
Member Code
Family Variant
Maximum Resources
Table 6: Maximum Resource Counts for Cyclone V GX Devices
Resource Member Code
C3 C4 C5 C7 C9
Logic Elements (LE) (K) 35.7 50 77 149.7 301
ALM 13,460 18,860 29,080 56,480 113,560
Register 53,840 75,440 116,320 225,920 454,240
Memory (Kb) M10K 1,350 2,500 4,460 6,860 12,200
MLAB 291 678 678 1,338 2,748
Variable-precision DSP
Block 51 70 150 156 342
18 x 18 Multiplier 102 140 300 312 684
PLL 4 6 6 7 8
3 Gbps Transceiver 3 6 6 9 12
GPIO(2) 208 336 336 480 560
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Resource Member Code
C3 C4 C5 C7 C9
LVDS Transmitter 52 84 84 120 140
Receiver 52 84 84 120 140
PCIe Hard IP Block 1 2 2 2 2
Hard Memory Controller 1 2 2 2 2
Related Information
I/O Features in Cyclone V Devices
Provides the number of LVDS channels in each device package.
Package Plan
Table 7: Package Plan for Cyclone V GX Devices
Member
Code
M301
(11 mm)
M383
(13 mm)
M484
(15 mm)
U324
(15 mm)
U484
(19 mm)
GPIO XCVR GPIO XCVR GPIO XCVR GPIO XCVR GPIO XCVR
C3 144 3 208 3
C4 129 4 175 6 224 6
C5 129 4 175 6 224 6
C7 240 3 240 6
C9 240 5
Member Code
F484
(23 mm)
F672
(27 mm)
F896
(31 mm)
F1152
(35 mm)
GPIO XCVR GPIO XCVR GPIO XCVR GPIO XCVR
C3 208 3
C4 240 6 336 6
C5 240 6 336 6
C7 240 6 336 9 480 9
C9 224 6 336 9 480 12 560 12
Cyclone V GT
This section provides the available options, maximum resource counts, and package plan for the
Cyclone V GT devices.
(2) The number of GPIOs does not include transceiver I/Os. In the Quartus II software, the number of user
I/Os includes transceiver I/Os.
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more details, refer to the Altera Product Selector.
Related Information
Altera Product Selector
Provides the latest information about Altera products.
Available Options
The following figure shows sample ordering code and lists the options available for Cyclone V GT devices.
Figure 3: Sample Ordering Code and Available Options for Cyclone V GT Devices
Family Signature
Embedded Hard IPs
Transceiver Count
Transceiver
Speed Grade
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
GT : 6-Gbps transceivers
F : Maximum 2 hard PCIe and
2 hard memory controllers
5C : Cyclone V
D5 : 77K logic elements
D7 : 149.5K logic elements
D9 : 301K logic elements
B : 3
F : 4
A : 5
C : 6
D : 9
E : 12
5 : 6.144 Gbps
F : FineLine BGA (FBGA)
U : Ultra FineLine BGA (UBGA)
M : Micro FineLine BGA (MBGA)
FBGA Package Type
23 : 484 pins
27 : 672 pins
31 : 896 pins
35 : 1,152 pins
UBGA Package Type
19 : 484 pins
MBGA Package Type
11 : 301 pins
13 : 383 pins
15 : 484 pins
C : Commercial (TJ = 0° C to 85° C)
I : Industrial (TJ = -40° C to 100° C)
A : Automotive (TJ = -40° C to 125° C)
6 (fastest)
7
8
5C GT F D9 E 5 F 35 C 7N
Member Code
Family Variant Optional Suffix
Indicates specific device
options or shipment method
N : Lead-free packaging
Contact Altera for availability
of leaded options
ES : Engineering sample
Maximum Resources
Table 8: Maximum Resource Counts for Cyclone V GT Devices
Resource Member Code
D5 D7 D9
Logic Elements (LE) (K) 77 149.5 301
ALM 29,080 56,480 113,560
Register 116,320 225,920 454,240
Memory (Kb) M10K 4,460 6,860 12,200
MLAB 424 836 1,717
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Resource Member Code
D5 D7 D9
Variable-precision DSP Block 150 156 342
18 x 18 Multiplier 300 312 684
PLL 6 7 8
6 Gbps Transceiver 6 9 12
GPIO(3) 336 480 560
LVDS Transmitter 84 120 140
Receiver 84 120 140
PCIe Hard IP Block 2 2 2
Hard Memory Controller 2 2 2
Related Information
I/O Features in Cyclone V Devices
Provides the number of LVDS channels in each device package.
Package Plan
Table 9: Package Plan for Cyclone V GT Devices
Member Code
M301
(11 mm)
M383
(13 mm)
M484
(15 mm)
U484
(19 mm)
GPIO XCVR GPIO XCVR GPIO XCVR GPIO XCVR
D5 129 4 175 6 224 6
D7 240 3 240 6
D9 240 5
Member Code
F484
(23 mm)
F672
(27 mm)
F896
(31 mm)
F1152
(35 mm)
GPIO XCVR GPIO XCVR GPIO XCVR GPIO XCVR
D5 240 6 336 6
D7 240 6 336 9 (4) 480 9 (4)
D9 224 6 336 9 (4) 480 12 (5) 560 12 (5)
(3) The number of GPIOs does not include transceiver I/Os. In the Quartus II software, the number of user
I/Os includes transceiver I/Os.
(4) If you require CPRI (at 6.144 Gbps) and PCIe Gen2 transmit jitter compliance, Altera recommends that you
use only up to three full-duplex transceiver channels for CPRI, and up to six full-duplex channels for PCIe
Gen2. The CMU channels are not considered full-duplex channels.
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Cyclone V SE
This section provides the available options, maximum resource counts, and package plan for the
Cyclone V SE devices.
The information in this section is correct at the time of publication. For the latest information and to get
more details, refer to the Altera Product Selector.
Related Information
Altera Product Selector
Provides the latest information about Altera products.
Available Options
The following figure shows sample ordering code and lists the options available for Cyclone V SE devices.
Figure 4: Sample Ordering Code and Available Options for Cyclone V SE Devices
Family Signature
Embedded Hard IPs
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
SE : SoC with enhanced logic/memory
5C : Cyclone V
F : FineLine BGA (FBGA)
U : Ultra FineLine BGA (UBGA)
FBGA Package Type
31 : 896 pins
UBGA Package Type
19 : 484 pins
23 : 672 pins
C : Commercial (TJ = 0° C to 85° C)
I : Industrial (TJ = -40° C to 100° C)
A : Automotive (TJ = -40° C to 125° C)
6 (fastest)
7
8
Processor Cores
Omit for dual-core
S : Single-core
N : Lead-free packaging
Contact Altera for availability
of leaded options
ES : Engineering sample
5C SE M A6 F 31 C6 S N
Member Code
Family Variant
A2 : 25K logic elements
A4 : 40K logic elements
A5 : 85K logic elements
A6 : 110K logic elements
B : No hard PCIe or hard
memory controller
M : No hard PCIe and
1 hard memory controller
Maximum Resources
Table 10: Maximum Resource Counts for Cyclone V SE Devices
Resource Member Code
A2 A4 A5 A6
Logic Elements (LE) (K) 25 40 85 110
(5) If you require CPRI (at 6.144 Gbps) and PCIe Gen2 transmit jitter compliance, Altera recommends that you
use only up to three full-duplex transceiver channels for CPRI, and up to eight full-duplex channels for PCIe
Gen2. The CMU channels are not considered full-duplex channels.
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Resource Member Code
A2 A4 A5 A6
ALM 9,434 15,094 32,075 41,509
Register 37,736 60,376 128,300 166,036
Memory (Kb) M10K 1,400 2,700 3,970 5,570
MLAB 138 231 480 621
Variable-precision DSP Block 36 84 87 112
18 x 18 Multiplier 72 168 174 224
FPGA PLL 5 5 6 6
HPS PLL 3 3 3 3
FPGA GPIO 145 145 288 288
HPS I/O 181 181 181 181
LVDS Transmitter 32 32 72 72
Receiver 37 37 72 72
FPGA Hard Memory Controller 1 1 1 1
HPS Hard Memory Controller 1 1 1 1
ARM Cortex-A9 MPCore
Processor Single- or
dual-core Single- or
dual-core Single- or dual-
core Single- or dual-core
Related Information
I/O Features in Cyclone V Devices
Provides the number of LVDS channels in each device package.
Package Plan
Table 11: Package Plan for Cyclone V SE Devices
The HPS I/O counts are the number of I/Os in the HPS and does not correlate with the number of HPS-specific
I/O pins in the FPGA. Each HPS-specific pin in the FPGA may be mapped to several HPS I/Os.
Member Code
U484
(19 mm)
U672
(23 mm)
F896
(31 mm)
FPGA GPIO HPS I/O FPGA GPIO HPS I/O FPGA GPIO HPS I/O
A2 66 151 145 181
A4 66 151 145 181
A5 66 151 145 181 288 181
A6 66 151 145 181 288 181
Cyclone V SX
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This section provides the available options, maximum resource counts, and package plan for the
Cyclone V SX devices.
The information in this section is correct at the time of publication. For the latest information and to get
more details, refer to the Altera Product Selector.
Related Information
Altera Product Selector
Provides the latest information about Altera products.
Available Options
The following figure shows sample ordering code and lists the options available for Cyclone V SX devices.
Figure 5: Sample Ordering Code and Available Options for Cyclone V SX Devices
Family Signature
Embedded Hard IPs Transceiver Count
Transceiver
Speed Grade
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
SX : SoC with 3-Gbps transceivers
F : Maximum 2 hard PCIe
controllers and 1 hard
memory controller
5C : Cyclone V
C2 : 25K logic elements
C4 : 40K logic elements
C5 : 85K logic elements
C6 : 110K logic elements
C : 6
D : 9
6 : 3.125 Gbps
F : FineLine BGA (FBGA)
U : Ultra FineLine BGA (UBGA)
FBGA Package Type
31 : 896 pins
UBGA Package Type
23 : 672 pins
C : Commercial (TJ = 0° C to 85° C)
I : Industrial (TJ = -40° C to 100° C)
A : Automotive (TJ = -40° C to 125° C)
6 (fastest)
7
8
N : Lead-free packaging
Contact Altera for availability
of leaded options
ES : Engineering sample
5C SX FC6 D 6F 31 C6N
Member Code
Family Variant
Maximum Resources
Table 12: Maximum Resource Counts for Cyclone V SX Devices
Resource Member Code
C2 C4 C5 C6
Logic Elements (LE) (K) 25 40 85 110
ALM 9,434 15,094 32,075 41,509
Register 37,736 60,376 128,300 166,036
Memory (Kb) M10K 1,400 2,700 3,970 5,570
MLAB 138 231 480 621
Variable-precision DSP Block 36 84 87 112
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Resource Member Code
C2 C4 C5 C6
18 x 18 Multiplier 72 168 174 224
FPGA PLL 5 5 6 6
HPS PLL 3 3 3 3
3 Gbps Transceiver 6 6 9 9
FPGA GPIO (6) 145 145 288 288
HPS I/O 181 181 181 181
LVDS Transmitter 32 32 72 72
Receiver 37 37 72 72
PCIe Hard IP Block 2 2 2 (7) 2 (7)
FPGA Hard Memory Controller 1 1 1 1
HPS Hard Memory Controller 1 1 1 1
ARM Cortex-A9 MPCore
Processor Dual-core Dual-core Dual-core Dual-core
Related Information
I/O Features in Cyclone V Devices
Provides the number of LVDS channels in each device package.
Package Plan
Table 13: Package Plan for Cyclone V SX Devices
The HPS I/O counts are the number of I/Os in the HPS and does not correlate with the number of HPS-specific
I/O pins in the FPGA. Each HPS-specific pin in the FPGA may be mapped to several HPS I/Os.
Member Code
U672
(23 mm)
F896
(31 mm)
FPGA GPIO HPS I/O XCVR FPGA GPIO HPS I/O XCVR
C2 145 181 6
C4 145 181 6
C5 145 181 6 288 181 9
C6 145 181 6 288 181 9
Cyclone V ST
(6) The number of GPIOs does not include transceiver I/Os. In the Quartus II software, the number of user
I/Os includes transceiver I/Os.
(7) 1 PCIe Hard IP Block in U672 package.
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This section provides the available options, maximum resource counts, and package plan for the
Cyclone V ST devices.
The information in this section is correct at the time of publication. For the latest information and to get
more details, refer to the Altera Product Selector.
Related Information
Altera Product Selector
Provides the latest information about Altera products.
Available Options
The following figure shows sample ordering code and lists the options available for Cyclone V ST devices.
Figure 6: Sample Ordering Code and Available Options for Cyclone V ST Devices
Family Signature
Embedded Hard IPs
Transceiver Count
Transceiver
Speed Grade
Package Type
Package Code
Operating Temperature
FPGA Fabric
Speed Grade
Optional Suffix
Indicates specific device
options or shipment method
ST : SoC with 5-Gbps transceivers
F : 2 hard PCIe controllers
and 1 hard memory controller
5C : Cyclone V
D5 : 85K logic elements
D6 : 110K logic elements
D : 9
5 : 6.144 Gbps
F : FineLine BGA (FBGA)
31 : 896 pins
C : Commercial (TJ = 0° C to 85° C)
I : Industrial (TJ = -40° C to 100° C)
A : Automotive (TJ = -40° C to 125° C)
6 (fastest)
7
8
N : Lead-free packaging
Contact Altera for availability
of leaded options
ES : Engineering sample
5C ST FD6 D 5F 31 C6N
Member Code
Family Variant
Maximum Resources
Table 14: Maximum Resource Counts for Cyclone V ST Devices
Resource Member Code
D5 D6
Logic Elements (LE) (K) 85 110
ALM 32,075 41,509
Register 128,300 166,036
Memory (Kb) M10K 3,970 5,570
MLAB 480 621
Variable-precision DSP Block 87 112
18 x 18 Multiplier 174 224
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Resource Member Code
D5 D6
FPGA PLL 6 6
HPS PLL 3 3
5 Gbps Transceiver 9 9
FPGA GPIO(8) 288 288
HPS I/O 181 181
LVDS Transmitter 72 72
Receiver 72 72
PCIe Hard IP Block 2 2
FPGA Hard Memory Controller 1 1
HPS Hard Memory Controller 1 1
ARM Cortex-A9 MPCore Processor Dual-core Dual-core
Related Information
I/O Features in Cyclone V Devices
Provides the number of LVDS channels in each device package.
Package Plan
Table 15: Package Plan for Cyclone V ST Devices
The HPS I/O counts are the number of I/Os in the HPS and does not correlate with the number of HPS-specific
I/O pins in the FPGA. Each HPS-specific pin in the FPGA may be mapped to several HPS I/Os.
Member Code
F896
(31 mm)
FPGA GPIO HPS I/O XCVR
D5 288 181 9 (9)
D6 288 181 9 (9)
(8) The number of GPIOs does not include transceiver I/Os. In the Quartus II software, the number of user
I/Os includes transceiver I/Os.
(9) If you require CPRI (at 4.9152 Gbps) and PCIe Gen2 transmit jitter compliance, Altera recommends that you
use only up to seven full-duplex transceiver channels for CPRI, and up to six full-duplex channels for PCIe
Gen2. The CMU channels are not considered full-duplex channels.
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I/O Vertical Migration for Cyclone V Devices
Figure 7: Vertical Migration Capability Across Cyclone V Device Packages and Densities
The arrows indicate the vertical migration paths. The devices included in each vertical migration path are
shaded. You can also migrate your design across device densities in the same package option if the devices
have the same dedicated pins, configuration pins, and power pins.
Variant Member
Code
Package
M301 M383 M484 F256 U324 U484 F484 U672 F672 F896 F1152
Cyclone V E
A2
A4
A5
A7
A9
Cyclone V GX
C3
C4
C5
C7
C9
Cyclone V GT
D5
D7
D9
Cyclone V SE
A2
A4
A5
A6
Cyclone V SX
C2
C4
C5
C6
Cyclone V ST D5
D6
You can achieve the vertical migration shaded in red if you use only up to 175 GPIOs for the M383
package, and 138 GPIOs for the U672 package. These migration paths are not shown in the Quartus® II
software Pin Migration View.
Note: To verify the pin migration compatibility, use the Pin Migration View window in the Quartus II
software Pin Planner.
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Adaptive Logic Module
Cyclone V devices use a 28 nm ALM as the basic building block of the logic fabric.
The ALM, as shown in following figure, uses an 8-input fracturable look-up table (LUT) with four
dedicated registers to help improve timing closure in register-rich designs and achieve an even higher
design packing capability than previous generations.
Figure 8: ALM for Cyclone V Devices
You can configure up to 25% of the ALMs in the Cyclone V devices as distributed memory using MLABs.
Related Information
Embedded Memory Capacity in Cyclone V Devices on page 20
Lists the embedded memory capacity for each device.
Variable-Precision DSP Block
Cyclone V devices feature a variable-precision DSP block that supports these features:
Configurable to support signal processing precisions ranging from 9 x 9, 18 x 18 and 27 x 27 bits
natively
A 64-bit accumulator
A hard preadder that is available in both 18- and 27-bit modes
Cascaded output adders for efficient systolic finite impulse response (FIR) filters
Internal coefficient register banks, 8 deep, for each multiplier in 18- or 27-bit mode
Fully independent multiplier operation
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A second accumulator feedback register to accommodate complex multiply-accumulate functions
Efficient support for single-precision floating point arithmetic
The inferability of all modes by the Quartus II design software
Table 16: Variable-Precision DSP Block Configurations for Cyclone V Devices
Usage Example Multiplier Size (Bit) DSP Block Resource
Low precision fixed point for video
applications Three 9 x 9 1
Medium precision fixed point in FIR
filters Two 18 x 18 1
FIR filters and general DSP usage Two 18 x 18 with
accumulate 1
High precision fixed- or floating-
point implementations One 27 x 27 with
accumulate 1
You can configure each DSP block during compilation as independent three 9 x 9, two 18 x 18, or one
27 x 27 multipliers. With a dedicated 64 bit cascade bus, you can cascade multiple variable-precision DSP
blocks to implement even higher precision DSP functions efficiently.
Table 17: Number of Multipliers in Cyclone V Devices
The table lists the variable-precision DSP resources by bit precision for each Cyclone V device.
Variant Member
Code
Variable-
precision
DSP Block
Independent Input and Output
Multiplications Operator 18 x 18
Multiplier
Adder
Mode
18 x 18
Multiplier Adder
Summed with
36 bit Input
9 x 9
Multiplier
18 x 18
Multiplier
27 x 27
Multiplier
Cyclone V E
A2 25 75 50 25 25 25
A4 66 198 132 66 66 66
A5 150 450 300 150 150 150
A7 156 468 312 156 156 156
A9 342 1,026 684 342 342 342
Cyclone V GX
C3 51 153 102 51 51 51
C4 70 210 140 70 70 70
C5 150 450 300 150 150 150
C7 156 468 312 156 156 156
C9 342 1,026 684 342 342 342
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Variant Member
Code
Variable-
precision
DSP Block
Independent Input and Output
Multiplications Operator 18 x 18
Multiplier
Adder
Mode
18 x 18
Multiplier Adder
Summed with
36 bit Input
9 x 9
Multiplier
18 x 18
Multiplier
27 x 27
Multiplier
Cyclone V GT
D5 150 450 300 150 150 150
D7 156 468 312 156 156 156
D9 342 1,026 684 342 342 342
Cyclone V SE
A2 36 108 72 36 36 36
A4 84 252 168 84 84 84
A5 87 261 174 87 87 87
A6 112 336 224 112 112 112
Cyclone V SX
C2 36 108 72 36 36 36
C4 84 252 168 84 84 84
C5 87 261 174 87 87 87
C6 112 336 224 112 112 112
Cyclone V ST D5 87 261 174 87 87 87
D6 112 336 224 112 112 112
Embedded Memory Blocks
The embedded memory blocks in the devices are flexible and designed to provide an optimal amount of
small- and large-sized memory arrays to fit your design requirements.
Types of Embedded Memory
The Cyclone V devices contain two types of memory blocks:
10 Kb M10K blocks—blocks of dedicated memory resources. The M10K blocks are ideal for larger
memory arrays while still providing a large number of independent ports.
640 bit memory logic array blocks (MLABs)—enhanced memory blocks that are configured from dual-
purpose logic array blocks (LABs). The MLABs are ideal for wide and shallow memory arrays. The
MLABs are optimized for implementation of shift registers for digital signal processing (DSP) applica‐
tions, wide shallow FIFO buffers, and filter delay lines. Each MLAB is made up of ten adaptive logic
modules (ALMs). In the Cyclone V devices, you can configure these ALMs as ten 32 x 2 blocks, giving
you one 32 x 20 simple dual-port SRAM block per MLAB.
Embedded Memory Capacity in Cyclone V Devices
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Table 18: Embedded Memory Capacity and Distribution in Cyclone V Devices
Variant Member
Code
M10K MLAB
Total RAM Bit (Kb)Block RAM Bit (Kb) Block RAM Bit (Kb)
Cyclone V E
A2 176 1,760 314 196 1,956
A4 308 3,080 485 303 3,383
A5 446 4,460 679 424 4,884
A7 686 6,860 1338 836 7,696
A9 1,220 12,200 2748 1,717 13,917
Cyclone V GX
C3 119 1,190 255 159 1,349
C4 250 2,500 472 295 2,795
C5 446 4,460 679 424 4,884
C7 686 6,860 1338 836 7,696
C9 1,220 12,200 2748 1,717 13,917
Cyclone V GT
D5 446 4,460 679 424 4,884
D7 686 6,860 1338 836 7,696
D9 1,220 12,200 2748 1,717 13,917
Cyclone V SE
A2 140 1,400 221 138 1,538
A4 270 2,700 370 231 2,460
A5 397 3,970 768 480 4,450
A6 557 5,570 994 621 5,761
Cyclone V SX
C2 140 1,400 221 138 1,538
C4 270 2,700 370 231 2,460
C5 397 3,970 768 480 4,450
C6 557 5,570 994 621 5,761
Cyclone V ST D5 397 3,970 768 480 4,450
D6 557 5,570 994 621 5,761
Embedded Memory Configurations
Table 19: Supported Embedded Memory Block Configurations for Cyclone V Devices
This table lists the maximum configurations supported for the embedded memory blocks. The information is
applicable only to the single-port RAM and ROM modes.
Memory Block Depth (bits) Programmable Width
MLAB 32 x16, x18, or x20
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Memory Block Depth (bits) Programmable Width
M10K
256 x40 or x32
512 x20 or x16
1K x10 or x8
2K x5 or x4
4K x2
8K x1
Clock Networks and PLL Clock Sources
550 MHz Cyclone V devices have 16 global clock networks capable of up to operation. The clock network
architecture is based on Altera's global, quadrant, and peripheral clock structure. This clock structure is
supported by dedicated clock input pins and fractional PLLs.
Note: To reduce power consumption, the Quartus II software identifies all unused sections of the clock
network and powers them down.
PLL Features
The PLLs in the Cyclone V devices support the following features:
Frequency synthesis
On-chip clock deskew
Jitter attenuation
Programmable output clock duty cycles
PLL cascading
Reference clock switchover
Programmable bandwidth
User-mode reconfiguration of PLLs
Low power mode for each fractional PLL
Dynamic phase shift
Direct, source synchronous, zero delay buffer, external feedback, and LVDS compensation modes
Fractional PLL
In addition to integer PLLs, the Cyclone V devices use a fractional PLL architecture. The devices have up
to eight PLLs, each with nine output counters. You can use the output counters to reduce PLL usage in
two ways:
Reduce the number of oscillators that are required on your board by using fractional PLLs
Reduce the number of clock pins that are used in the device by synthesizing multiple clock frequencies
from a single reference clock source
If you use the fractional PLL mode, you can use the PLLs for precision fractional-N frequency synthesis—
removing the need for off-chip reference clock sources in your design.
The transceiver fractional PLLs that are not used by the transceiver I/Os can be used as general purpose
fractional PLLs by the FPGA fabric.
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FPGA General Purpose I/O
Cyclone V devices offer highly configurable GPIOs. The following list describes the features of the GPIOs:
Programmable bus hold and weak pull-up
LVDS output buffer with programmable differential output voltage (VOD ) and programmable pre-
emphasis
On-chip parallel termination (RT OCT) for all I/O banks with OCT calibration to limit the termination
impedance variation
On-chip dynamic termination that has the ability to swap between series and parallel termination,
depending on whether there is read or write on a common bus for signal integrity
Easy timing closure support using the hard read FIFO in the input register path, and delay-locked loop
(DLL) delay chain with fine and coarse architecture
PCIe Gen1 and Gen2 Hard IP
Cyclone V GX, GT, SX, and ST devices contain PCIe hard IP that is designed for performance and
ease-of-use. The PCIe hard IP consists of the MAC, data link, and transaction layers.
The PCIe hard IP supports PCIe Gen2 and Gen1 end point and root port for up to x4 lane configuration.
The PCIe Gen2 x4 support is PCIe-compatible.
The PCIe endpoint support includes multifunction support for up to eight functions, as shown in the
following figure. The integrated multifunction support reduces the FPGA logic requirements by up to
20,000 LEs for PCIe designs that require multiple peripherals.
Figure 9: PCIe Multifunction for Cyclone V Devices
PCIe Link
External System FPGA Device
Host CPU
Memory
Controller
Root
Complex
Local
Peripheral 1
Local
Peripheral 2
PCIe RP
PCIe EP
CAN
GbE
ATA
Bridge
to PCIe
SPI
GPIO
I2C
USB
The Cyclone V PCIe hard IP operates independently from the core logic. This independent operation
allows the PCIe link to wake up and complete link training in less than 100 ms while the Cyclone V device
completes loading the programming file for the rest of the device.
In addition, the PCIe hard IP in the Cyclone V device provides improved end-to-end datapath protection
using ECC.
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External Memory Interface
This section provides an overview of the external memory interface in Cyclone V devices.
Hard and Soft Memory Controllers
Cyclone V devices support up to two hard memory controllers for DDR3, DDR2, and LPDDR2 SDRAM
devices. Each controller supports 8 to 32 bit components of up to 4 gigabits (Gb) in density with two chip
selects and optional ECC. For the Cyclone V SoC devices, an additional hard memory controller in the
HPS supports DDR3, DDR2, and LPDDR2 SDRAM devices.
All Cyclone V devices support soft memory controllers for DDR3, DDR2, and LPDDR2 SDRAM devices
for maximum flexibility.
External Memory Performance
Table 20: External Memory Interface Performance in Cyclone V Devices
The maximum and minimum operating frequencies depend on the memory interface standards and the
supported delay-locked loop (DLL) frequency listed in the device datasheet.
Interface Voltage
(V)
Maximum Frequency (MHz) Minimum Frequency (MHz)
Hard Controller Soft Controller
DDR3 SDRAM 1.5 400 303 303
1.35 400 303 303
DDR2 SDRAM 1.8 400 300 167
LPDDR2 SDRAM 1.2 333 300 167
Related Information
External Memory Interface Spec Estimator
For the latest information and to estimate the external memory system performance specification, use
Altera's External Memory Interface Spec Estimator tool.
HPS External Memory Performance
Table 21: HPS External Memory Interface Performance
The hard processor system (HPS) is available in Cyclone V SoC devices only.
Interface Voltage (V) HPS Hard Controller (MHz)
DDR3 SDRAM 1.5 400
1.35 400
DDR2 SDRAM 1.8 400
LPDDR2 SDRAM 1.2 333
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Related Information
External Memory Interface Spec Estimator
For the latest information and to estimate the external memory system performance specification, use
Altera's External Memory Interface Spec Estimator tool.
Low-Power Serial Transceivers
Cyclone V devices deliver the industry’s lowest power 6.144 Gbps transceivers at an estimated 88 mW
maximum power consumption per channel. Cyclone V transceivers are designed to be compliant with a
wide range of protocols and data rates.
Transceiver Channels
The transceivers are positioned on the left outer edge of the device. The transceiver channels consist of the
physical medium attachment (PMA), physical coding sublayer (PCS), and clock networks.
Figure 10: Device Chip Overview for Cyclone V GX and GT Devices
The figure shows a Cyclone V FPGA with transceivers. Different Cyclone V devices may have a different
floorplans than the one shown here.
I/O, LVDS, and Memory Interface
I/O, LVDS, and Memory Interface
I/O, LVDS, and Memory Interface
Transceiver PMA Blocks
Fractional PLLs
Hard PCS Blocks
Fractional PLL
Fractional PLLs
PCIe Hard IP Blocks
Hard Memory Controller
Hard Memory Controller
Core Logic Fabric and MLABs
Variable-Precision DSP Blocks
M10K Internal Memory Blocks
Transceiver
PMA
Transceiver
PMA
Transceiver
PMA Hard
PCS
Hard
PCS
Hard
PCS
Clock Networks
Transceiver
Individual Channels
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PMA Features
To prevent core and I/O noise from coupling into the transceivers, the PMA block is isolated from the rest
of the chip—ensuring optimal signal integrity. For the transceivers, you can use the channel PLL of an
unused receiver PMA as an additional transmit PLL.
Table 22: PMA Features of the Transceivers in Cyclone V Devices
Features Capability
Backplane support Driving capability up to 6.144 Gbps
PLL-based clock recovery Superior jitter tolerance
Programmable deserialization and word
alignment Flexible deserialization width and configurable word
alignment pattern
Equalization and pre-emphasis Up to 14.37 dB of pre-emphasis and up to 4.7 dB of
equalization
No decision feedback equalizer (DFE)
Ring oscillator transmit PLLs 614 Mbps to 6.144 Gbps
Input reference clock range 20 MHz to 400 MHz
Transceiver dynamic reconfiguration Allows the reconfiguration of a single channel without
affecting the operation of other channels
PCS Features
The Cyclone V core logic connects to the PCS through an 8, 10, 16, 20, 32, or 40 bit interface, depending
on the transceiver data rate and protocol. Cyclone V devices contain PCS hard IP to support PCIe Gen1
and Gen2, Gbps Ethernet (GbE), Serial RapidIO® (SRIO), and Common Public Radio Interface (CPRI).
Most of the standard and proprietary protocols from 614 Mbps to 6.144 Gbps are supported.
Table 23: Transceiver PCS Features for Cyclone V Devices
PCS Support Data Rates
(Gbps)
Transmitter Data Path Feature Receiver Data Path Feature
3-Gbps and 6-Gbps Basic 0.614 to 6.144 Phase compensation FIFO
Byte serializer
8B/10B encoder
Transmitter bit-slip
Word aligner
Deskew FIFO
Rate-match FIFO
8B/10B decoder
Byte deserializer
Byte ordering
Receiver phase
compensation FIFO
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PCS Support Data Rates
(Gbps)
Transmitter Data Path Feature Receiver Data Path Feature
PCIe Gen1
(x1, x2, x4) 2.5 and 5.0
Dedicated PCIe PHY IP
core
PIPE 2.0 interface to the
core logic
Dedicated PCIe PHY
IP core
PIPE 2.0 interface to
the core logic
PCIe Gen2
( x1, x2, x4)(10)
GbE 1.25 Custom PHY IP core with
preset feature
GbE transmitter synchro‐
nization state machine
Custom PHY IP core
with preset feature
GbE receiver synchro‐
nization state machine
XAUI (11) 3.125 Dedicated XAUI PHY IP
core
XAUI synchronization
state machine for bonding
four channels
Dedicated XAUI PHY
IP core
XAUI synchronization
state machine for
realigning four
channels
HiGig 3.75
SRIO 1.3 and 2.1 1.25 to 3.125 Custom PHY IP core with
preset feature
SRIO version
2.1-compliant x2 and x4
channel bonding
Custom PHY IP core
with preset feature
SRIO version
2.1-compliant x2 and
x4 deskew state
machine
SDI, SD/HD, and 3G-SDI 0.27(12), 1.485,
and 2.97 Custom PHY IP core with
preset feature Custom PHY IP core with
preset feature
JESD204A 0.3125(13)
to 3.125
Serial ATA Gen1 and Gen2 1.5 and 3.0 Custom PHY IP core with
preset feature
Electrical idle
Custom PHY IP core
with preset feature
Signal detect
Wider spread of
asynchronous SSC
(10) PCIe Gen2 is supported for Cyclone V GT and ST devices. The PCIe Gen2 x4 support is PCIe-compatible.
(11) XAUI is supported through the soft PCS.
(12) The 0.27-Gbps data rate is supported using oversampling user logic that you must implement in the FPGA
fabric.
(13) The 0.3125-Gbps data rate is supported using oversampling user logic that you must implement in the
FPGA fabric.
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PCS Support Data Rates
(Gbps)
Transmitter Data Path Feature Receiver Data Path Feature
CPRI 4.1(14) 0.6144 to
6.144 Dedicated deterministic
latency PHY IP core
Transmitter (TX) manual
bit-slip mode
Dedicated determin‐
istic latency PHY IP
core
Receiver (RX)
deterministic latency
state machine
OBSAI RP3 0.768 to
3.072
V-by-One HS Up to 3.75
Custom PHY IP core Custom PHY IP core
Wider spread of
asynchronous SSC
DisplayPort 1.2(15) 1.62 and
2.7
SoC with HPS
Each SoC combines an FPGA fabric and an HPS in a single device. This combination delivers the
flexibility of programmable logic with the power and cost savings of hard IP in these ways:
Reduces board space, system power, and bill of materials cost by eliminating a discrete embedded
processor
Allows you to differentiate the end product in both hardware and software, and to support virtually
any interface standard
Extends the product life and revenue through in-field hardware and software updates
HPS Features
The HPS consists of a dual-core ARM Cortex-A9 MPCore processor, a rich set of peripherals, and a
shared multiport SDRAM memory controller, as shown in the following figure.
(14) High-voltage output mode (1000-BASE-CX) is not supported.
(15) Pending characterization.
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Figure 11: HPS with Dual-Core ARM Cortex-A9 MPCore Processor
FPGA Fabric
HPS
HPS-to-FPGA Lightweight
HPS-to-FPGA
FPGA-to-HPS FPGA-to-HPS SDRAM
Configuration
Controller
FPGA
Manager
64 KB
On-Chip RAM
64 KB
Boot ROM
Level 3
Interconnect
Ethernet
MAC (2x)
USB
OTG (2x)
NAND Flash
Controller
SD/MMC
Controller
DMA
Controller STM
ETR
(Trace)
Debug
Access Port ARM Cortex-A9 MPCore
MPU Subsystem
CPU0
ARM Cortex-A9
with NEON/FPU,
32 KB Instruction Cache,
32 KB Data Cache, and
Memory Management
Unit
CPU1
ARM Cortex-A9
with NEON/FPU,
32 KB Instruction Cache,
32 KB Data Cache, and
Memory Management
Unit
SCUACP
Level 2 Cache (512 KB)
Multiport
DDR SDRAM
Controller
with
Optional ECC
Peripherals
(UART, Timer, I2C, Watchdog Timer, GPIO, SPI, Clock Manager, Reset Manager, Scan Manager, System Manager, and Quad
SPI Flash Controller)
System Peripherals and Debug Access Port
Each Ethernet MAC, USB OTG, NAND flash controller, and SD/MMC controller module has an
integrated DMA controller. For modules without an integrated DMA controller, an additional DMA
controller module provides up to eight channels of high-bandwidth data transfers. Peripherals that
communicate off-chip are multiplexed with other peripherals at the HPS pin level. This allows you to
choose which peripherals to interface with other devices on your PCB.
The debug access port provides interfaces to industry standard JTAG debug probes and supports ARM
CoreSight debug and core traces to facilitate software development.
HPS–FPGA AXI Bridges
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The HPS–FPGA bridges, which support the Advanced Microcontroller Bus Architecture (AMBA®)
Advanced eXtensible Interface (AXI) specifications, consist of the following bridges:
FPGA-to-HPS AXI bridge—a high-performance bus supporting 32, 64, and 128 bit data widths that
allows the FPGA fabric to issue transactions to slaves in the HPS.
HPS-to-FPGA AXI bridge—a high-performance bus supporting 32, 64, and 128 bit data widths that
allows the HPS to issue transactions to slaves in the FPGA fabric.
Lightweight HPS-to-FPGA AXI bridge—a lower latency 32 bit width bus that allows the HPS to issue
transactions to slaves in the FPGA fabric. This bridge is primarily used for control and status register
(CSR) accesses to peripherals in the FPGA fabric.
The HPS–FPGA AXI bridges allow masters in the FPGA fabric to communicate with slaves in the HPS
logic, and vice versa. For example, the HPS-to-FPGA AXI bridge allows you to share memories instanti‐
ated in the FPGA fabric with one or both microprocessors in the HPS, while the FPGA-to-HPS AXI
bridge allows logic in the FPGA fabric to access the memory and peripherals in the HPS.
Each HPS–FPGA bridge also provides asynchronous clock crossing for data transferred between the
FPGA fabric and the HPS.
HPS SDRAM Controller Subsystem
The HPS SDRAM controller subsystem contains a multiport SDRAM controller and DDR PHY that are
shared between the FPGA fabric (through the FPGA-to-HPS SDRAM interface), the level 2 (L2) cache,
and the level 3 (L3) system interconnect. The FPGA-to-HPS SDRAM interface supports AMBA AXI and
Avalon® Memory-Mapped (Avalon-MM) interface standards, and provides up to six individual ports for
access by masters implemented in the FPGA fabric.
To maximize memory performance, the SDRAM controller subsystem supports command and data
reordering, deficit round-robin arbitration with aging, and high-priority bypass features. The SDRAM
controller subsystem supports DDR2, DDR3, or LPDDR2 devices up to 4 Gb in density operating at up to
400 MHz (800 Mbps data rate).
FPGA Configuration and Processor Booting
The FPGA fabric and HPS in the SoC are powered independently. You can reduce the clock frequencies
or gate the clocks to reduce dynamic power, or shut down the entire FPGA fabric to reduce total system
power.
You can configure the FPGA fabric and boot the HPS independently, in any order, providing you with
more design flexibility:
You can boot the HPS independently. After the HPS is running, the HPS can fully or partially
reconfigure the FPGA fabric at any time under software control. The HPS can also configure other
FPGAs on the board through the FPGA configuration controller.
You can power up both the HPS and the FPGA fabric together, configure the FPGA fabric first, and
then boot the HPS from memory accessible to the FPGA fabric.
Note: Although the FPGA fabric and HPS are on separate power domains, the HPS must remain
powered up during operation while the FPGA fabric can be powered up or down as required.
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Related Information
Cyclone V Device Family Pin Connection Guidelines
Provides detailed information about power supply pin connection guidelines and power regulator
sharing.
Hardware and Software Development
For hardware development, you can configure the HPS and connect your soft logic in the FPGA fabric to
the HPS interfaces using the Qsys system integration tool in the Quartus II software.
For software development, the ARM-based SoC devices inherit the rich software development ecosystem
available for the ARM Cortex-A9 MPCore processor. The software development process for Altera SoCs
follows the same steps as those for other SoC devices from other manufacturers. Support for Linux,
VxWorks®, and other operating systems is available for the SoCs. For more information on the operating
systems support availability, contact the Altera sales team.
You can begin device-specific firmware and software development on the Altera SoC Virtual Target. The
Virtual Target is a fast PC-based functional simulation of a target development system—a model of a
complete development board that runs on a PC. The Virtual Target enables the development of
device-specific production software that can run unmodified on actual hardware.
Related Information
Altera Worldwide Sales Support
Dynamic and Partial Reconfiguration
The Cyclone V devices support dynamic reconfiguration and partial reconfiguration(16).
Dynamic Reconfiguration
The dynamic reconfiguration feature allows you to dynamically change the transceiver data rates, PMA
settings, or protocols of a channel, without affecting data transfer on adjacent channels. This feature is
ideal for applications that require on-the-fly multiprotocol or multirate support. You can reconfigure the
PMA and PCS blocks with dynamic reconfiguration.
Partial Reconfiguration
Note: Partial reconfiguration is an advanced feature of the device family. If you are interested in using
partial reconfiguration, contact Altera for support.
Partial reconfiguration allows you to reconfigure part of the device while other sections of the device
remain operational. This capability is important in systems with critical uptime requirements because it
allows you to make updates or adjust functionality without disrupting services.
Apart from lowering cost and power consumption, partial reconfiguration increases the effective logic
density of the device because placing device functions that do not operate simultaneously is not necessary.
Instead, you can store these functions in external memory and load them whenever the functions are
(16) Partial reconfiguration is an advanced feature of the device family. If you are interested in using partial
reconfiguration, contact Altera for support.
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required. This capability reduces the size of the device because it allows multiple applications on a single
device—saving the board space and reducing the power consumption.
Altera simplifies the time-intensive task of partial reconfiguration by building this capability on top of the
proven incremental compile and design flow in the Quartus II design software. With the Altera® solution,
you do not need to know all the intricate device architecture details to perform a partial reconfiguration.
Partial reconfiguration is supported through the FPP x16 configuration interface. You can seamlessly use
partial reconfiguration in tandem with dynamic reconfiguration to enable simultaneous partial reconfigu‐
ration of both the device core and transceivers.
Enhanced Configuration and Configuration via Protocol
Cyclone V devices support 1.8 V, 2.5 V, 3.0 V, and 3.3 V programming voltages and several configuration
modes.
Table 24: Configuration Modes and Features Supported by Cyclone V Devices
Mode Data
Width Max
Clock
Rate
(MHz)
Max Data
Rate
(Mbps)
Decompres‐
sion Design
Security Partial
Reconfigu‐
ration(17)
Remote System
Update
AS through the
EPCS and EPCQ
serial configura‐
tion device
1 bit, 4
bits 100 Yes Yes Yes
PS through
CPLD or
external
microcontroller
1 bit 125 125 Yes Yes
FPP 8 bits 125 Yes Yes Parallel flash loader
16 bits 125 Yes Yes Yes
CvP (PCIe) x1, x2,
and x4
lanes
Yes Yes Yes
JTAG 1 bit 33 33
Instead of using an external flash or ROM, you can configure the Cyclone V devices through PCIe using
CvP. The CvP mode offers the fastest configuration rate and flexibility with the easy-to-use PCIe hard IP
block interface. The Cyclone V CvP implementation conforms to the PCIe 100 ms power-up-to-active
time requirement.
(17) Partial reconfiguration is an advanced feature of the device family. If you are interested in using partial
reconfiguration, contact Altera for support.
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Related Information
Configuration via Protocol (CvP) Implementation in Altera FPGAs User Guide
Provides more information about CvP.
Power Management
Leveraging the FPGA architectural features, process technology advancements, and transceivers that are
designed for power efficiency, the Cyclone V devices consume less power than previous generation
Cyclone FPGAs:
Total device core power consumption—less by up to 40%.
Transceiver channel power consumption—less by up to 50%.
Additionally, Cyclone V devices contain several hard IP blocks that reduce logic resources and deliver
substantial power savings of up to 25% less power than equivalent soft implementations.
Document Revision History
Date Version Changes
October 2014 2014.10.06 Added a footnote to the "Transceiver PCS Features for Cyclone V
Devices" table to show that PCIe Gen2 is supported for Cyclone V GT
and ST devices.
July 2014 2014.07.07 Updated the I/O vertical migration figure to clarify the migration
capability of Cyclone V SE and SX devices.
December
2013 2013.12.26 Corrected single or dual-core ARM Cortex-A9 MPCore processor-up
to 925 MHz from 800 MHz.
Removed "Preliminary" texts from Ordering Code figures, Maximum
Resources, Package Plan and I/O Vertical Migration tables.
Removed the note "The number of GPIOs does not include
transceiver I/Os. In the Quartus II software, the number of user I/Os
includes transceiver I/Os." for GPIOs in the Maximum Resource
Counts table for Cyclone V E and SE.
Added link to Altera Product Selector for each device variant.
Updated Embedded Hard IPs for Cyclone V GT devices to indicate
Maximum 2 hard PCIe and 2 hard memory controllers.
Added leaded package options.
Removed the note "The number of PLLs includes general-purpose
fractional PLLs and transceiver fractional PLLs." for all PLLs in the
Maximum Resource Counts table.
Corrected max LVDS counts for transmitter and receiver for Cyclone
V E A5 device from 84 to 60.
Corrected max LVDS counts for transmitter and receiver for Cyclone
V E A9 device from 140 to 120.
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Date Version Changes
Corrected variable-precision DSP block, 27 x 27 multiplier, 18 x 18
multiplier adder mode and 18 x 18 multiplier adder summed with 36
bit input for Cyclone V SE devices from 58 to 84.
Corrected 18 x 18 multiplier for Cyclone V SE devices from 116 to
168.
Corrected 9 x 9 multiplier for Cyclone V SE devices from 174 to 252.
Corrected LVDS transmitter for Cyclone V SE A2 and A4 as well as
SX C2 and C4 devices from 31 to 32.
Corrected LVDS receiver for Cyclone V SE A2 and A4 as well as SX
C2 and C4 devices from 35 to 37.
Corrected transceiver speed grade for Cyclone V ST devices ordering
code from 4 to 5.
Updated the DDR3 SDRAM for the maximum frequency's soft
controller and the minimum frequency from 300 to 303 for voltage
1.35V.
Added links to Altera's External Memory Spec Estimator tool to the
topics listing the external memory interface performance.
Corrected XAUI is supported through the soft PCS in the PCS
features for Cyclone V.
Added decompression support for the CvP configuration mode.
May 2013 2013.05.06 Added link to the known document issues in the Knowledge Base.
Moved all links to the Related Information section of respective topics
for easy reference.
Corrected the title to the PCIe hard IP topic. Cyclone V devices
support only PCIe Gen1 and Gen2.
Updated Supporting Feature in Table 1 of Increased bandwidth
capacity to '6.144 Gbps'.
Updated Description in Table 2 of Low-power high-speed serial
interface to '6.144 Gbps'.
Updated Description in Table 3 of Cyclone V GT to '6.144 Gbps'.
Updated the M386 package to M383 for Figure 1, Figure 2 and Figure
3.
Updated Figure 2 and Figure 3 for Transceiver Count by adding 'F :
4'.
Updated LVDS in the Maximum Resource Counts tables to include
Transmitter and Receiver values.
Updated the package plan with M383 for the Cyclone V E device.
Removed the M301 and M383 packages from the Cyclone V GX C4
device.
Updated the GPIO count to '129' for the M301 package of the
Cyclone V GX C5 device.
Updated 5 Gbps to '6.144 Gbps' for Cyclone V GT device.
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Date Version Changes
Updated HPS I/O for U484 (19 mm) in Table 11 with '151' for A2,
A4, A5 and A6.
Updated Memory (Kb) for Maximum Resource Counts for Cyclone V
SE A4 and A6, SX C4 and C6, ST D6 devices.
Updated FPGA PLL for Maximum Resource Counts for Cyclone V
SE A2, SX C2, devices.
Removed '36 x 36' from the Variable-Precision DSP Block.
Updated Variable-precision DSP Blocks and 18 x 18 Multiplier for
Maximum Resource Counts for Cyclone V SX C4 device.
Updated the HPS I/O counts for Cyclone V SE, SX, and ST devices.
Updated Figure 7 which shows the I/O vertical migration table.
Updated Table 17 for Cyclone V SX C4 device.
Updated Embedded Memory Capacity and Distribution table for
Cyclone V SE A4 and A6, SX C4 and C6, ST D6 devices.
Removed 'Counter reconfiguration' from the PLL Features.
Updated Low-Power Serial Transceivers by replacing 5 Gbps with
6.144 Gbps.
Removed 'Distributed Memory' symbol.
Updated the Capability in Table 22 of Backplane support to
'6.144 Gbps'.
Updated Capability in Table 22 of Ring oscillator transmit PLLs with
6.144 Gbps.
Updated the PCS Support in Table 23 from 5 Gbps to '6 Gbps'.
Updated the Data Rates (Gbps) in Table 23 of 3 Gbps and 6 Gbps
Basic to '6.144 Gbps'.
Updated the Data Rates (Gbps) in Table 23 of CPRI 4.1 to
'6.144 Gbps'.
Clarified that partial reconfiguration is an advanced feature. Contact
Altera for support of the feature.
December
2012 2012.12.28 Updated the pin counts for the MBGA packages.
Updated the GPIO and transceiver counts for the MBGA packages.
Updated the GPIO counts for the U484 package of the Cyclone V E
A9, GX C9, and GT D9 devices.
Updated the vertical migration table for vertical migration of the
U484 packages.
Updated the MLAB supported programmable widths at 32 bits depth.
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Date Version Changes
November
2012 2012.11.19 Added new MBGA packages and additional U484 packages for
Cyclone V E, GX, and GT.
Added ordering code for five-transceiver devices for Cyclone V GT
and ST.
Updated the vertical migration table to add MBGA packages.
Added performance information for HPS memory controller.
Removed DDR3U support.
Updated Cyclone V ST speed grade information.
Added information on maximum transceiver channel usage restric‐
tions for PCI Gen2 and CPRI at 4.9152 Gbps transmit jitter
compliance.
Added note on the differences between GPIO reported in Overview
with User I/O numbers shown in the Quartus II software.
Updated template.
July 2012 2.1 Added support for PCIe Gen2 x4 lane configuration (PCIe-compatible)
June 2012 2.0 Restructured the document.
Added the “Embedded Memory Capacity” and “Embedded Memory
Configurations” sections.
Added Table 1, Table 3, Table 16, Table 19, and Table 20.
Updated Table 2, Table 4, Table 5, Table 6, Table 7, Table 8, Table 9,
Table 10, Table 11, Table 12, Table 13, Table 14, Table 17, and Table
18.
Updated Figure 1, Figure 2, Figure 3, Figure 4, Figure 5, Figure 6, and
Figure 10.
Updated the “FPGA Configuration and Processor Booting” and
“Hardware and Software Development” sections.
Text edits throughout the document.
February 2012 1.2 Updated Table 1–2, Table 1–3, and Table 1–6.
Updated “Cyclone V Family Plan” on page 1–4 and “Clock Networks
and PLL Clock Sources” on page 1–15.
Updated Figure 1–1 and Figure 1–6.
November
2011 1.1 Updated Table 1–1, Table 1–2, Table 1–3, Table 1–4, Table 1–5, and
Table 1–6.
Updated Figure 1–4, Figure 1–5, Figure 1–6, Figure 1–7, and Figure
1–8.
Updated “System Peripherals” on page 1–18, “HPS–FPGA AXI
Bridges” on page 1–19, “HPS SDRAM Controller Subsystem” on page
1–19, “FPGA Configuration and Processor Booting” on page 1–19,
and “Hardware and Software Development” on page 1–20.
Minor text edits.
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Date Version Changes
October 2011 1.0 Initial release.
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