 
   
1
FEATURES DESCRIPTION
APPLICATIONS
3
2
4
5
DCK PACKAGE
(TOP VIEW)
1FB/NC
GND
NC
OUT
IN
GND
TPS715xxOUT
IN MSP430
Solar
Cell
TPS715xx
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.................................................................................................................................................... SLVS338P – MAY 2001 – REVISED NOVEMBER 2008
50 mA, 24 V, 3.2- µA Supply CurrentLow-Dropout Linear Regulator in SC70 Package
2
•24-V Maximum Input Voltage
The TPS715xx low-dropout (LDO) voltage regulatorsoffer the benefits of high input voltage, low-dropout•Low 3.2- µA Quiescent Current at 50 mA
voltage, low-power operation, and miniaturized•Stable With Any Capacitor ( ≥0.47 µF)
packaging. The devices, which operate over an input•50-mA Low-Dropout Regulator
range of 2.5 V to 24 V, are stable with any capacitor•Available in 1.8 V, 1.9 V, 2.3 V, 2.5 V, 3.0 V, (≥0.47 µF). The low dropout voltage and lowquiescent current allow operations at extremely low3.3 V, 3.45 V, 5.0 V, and
power levels. Therefore, the devices are ideal forAdjustable (1.2 V to 15 V)
powering battery management ICs. Specifically, since•Designed to Support MSP430 Families:
the devices are enabled as soon as the applied– 1.9-V version ensured to be higher than
voltage reaches the minimum input voltage, theminimum V
IN
of 1.8 V
output is quickly available to power continuouslyoperating battery charging ICs.– 2.3-V version ensured to meet 2.2-Vminimum V
IN
for FLASH on MSP430F2xx
The usual PNP pass transistor has been replaced bya PMOS pass element. Because the PMOS pass– 3.45-V version ensured to be lower than
element behaves as a low-value resistor, the lowmaximum V
IN
of 3.6 V
dropout voltage, typically 415 mV at 50 mA of load– Wide variety of fixed output voltage options
current, is directly proportional to the load current.to match V
IN
to the minimum required for
The low quiescent current (3.2 µA typically) is stabledesired MSP430 speed
over the entire range of output load current (0 mA to•Minimum/Maximum Specified Current Limit
50 mA).•5-Pin SC70/SOT-323 (DCK) Package•– 40 ° C to +125 ° C Specified JunctionTemperature Range•For 80-mA Rated Current and Higher PowerPackage, see TPS715Axx
•Ultra-Low Power Microcontrollers•Cellular/Cordless Handsets•Portable/Battery-Powered Equipment
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001 – 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
ABSOLUTE MAXIMUM RATINGS
(1) (2)
DISSIPATION RATING TABLE
TPS715xx
SLVS338P – MAY 2001 – REVISED NOVEMBER 2008 ....................................................................................................................................................
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
PRODUCT V
OUT
(2)
TPS715 xxyyyzXX is nominal output voltage (for example, 28 = 2.8 V, 285 = 2.85 V, 01 = Adjustable).YYY is package designator.Zis package quantity.
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TIweb site at www.ti.com .(2) Output voltages from 1.25 V to 5.4 V in 50-mV increments are available through the use of innovative factory EEPROM programming;minimum order quantities may apply. Contact factory for details and availability.
Over operating temperature range (unless otherwise noted).
UNIT
V
IN
range – 0.3 V to +24 VV
OUT
range – 0.3 V to +16.5 VPeak output current Internally limitedESD rating, HBM 2 kVESD rating, CDM 500 VContinuous total power dissipation See Dissipation Rating TableJunction temperature range, T
J
– 40 ° C to +150 ° CStorage temperature range, T
stg
– 65 ° C to +150 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under recommended operatingconditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values are with respect to network ground terminal.
DERATING FACTOR T
A
≤25 ° C T
A
= +70 ° C T
A
= +85 ° CBOARD PACKAGE R
θJC
° C/W R
θJA
° C/W
ABOVE T
A
= +25 ° C POWER RATING POWER RATING POWER RATING
Low-K
(1)
DCK 165 395 2.52 mW/ ° C 250 mW 140 mW 100 mWHigh-K
(2)
DCK 165 315 3.18 mW/ ° C 320 mW 175 mW 130 mW
(1) The JEDEC Low-K (1s) board design used to derive this data was a 3 inch × 3 inch, two-layer board with 2 ounce copper traces on topof the board.(2) The JEDEC High-K (2s2p) board design used to derive this data was a 3 inch × 3 inch, multilayer board with 1 ounce internal power andground planes and 2 ounce copper traces on top and bottom of the board.
2Submit Documentation Feedback Copyright © 2001 – 2008, Texas Instruments Incorporated
ELECTRICAL CHARACTERISTICS
TPS715xx
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.................................................................................................................................................... SLVS338P – MAY 2001 – REVISED NOVEMBER 2008
Over operating junction temperature range (T
J
= – 40 ° C to +125 ° C), V
IN
= V
OUT(NOM)
+ 1 V, I
OUT
= 1 mA, and C
OUT
= 1 µF,unless otherwise noted. Typical values are at T
J
= +25 ° C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
O
= 10 mA 2.5 24Input voltage
(1)
V
IN
VI
O
= 50 mA 3 24V
OUT
voltage range (TPS71501) 1.2 15 VV
IN
+ 1.0 V ≤V
IN
≤24 VV
OUT
accuracy
(1)
Over V
IN
, I
OUT
, and T – 4.0 +4.0 %100 µA≤I
OUT
≤50 mA0≤I
OUT
≤50 mA, T
J
= – 40 ° C to +85 ° C 3.2 4.2Ground pin current
(2)
I
GND
0 mA ≤I
OUT
≤50 mA 3.2 4.8 µA0 mA ≤I
OUT
≤50 mA, V
IN
= 24 V 5.8Load regulation ΔV
OUT
/ΔI
OUT
I
OUT
= 100 µA to 50 mA 22 mVOutput voltage
ΔV
OUT
/ΔV
IN
V
OUT
+ 1 V < V
IN
≤24 V 20 60 mVline regulation
(1)
BW = 200 Hz to 100 kHz, C
OUT
= 10 µF,Output noise voltage V
n
575 µVrmsI
OUT
= 50 mAV
OUT
= 0 V, V
IN
≥3.5 V 125 750 mAOutput current limit I
CL
V
OUT
= 0 V, V
IN
< 3.5 V 90 750 mAPower-supply ripple rejection PSRR f = 100 kHz, C
OUT
= 10 µF 60 dBDropout voltage
V
DO
I
OUT
= 50 mA 415 750 mVV
IN
= V
OUT(NOM)
– 0.1 V
(1) Minimum V
IN
= V
OUT
+ V
DO
or the value shown for Input voltage in this table, whichever is greater.(2) See Figure 1 . The TPS715xx family employs a leakage null control circuit. This circuit is active only if output current is less than passFET leakage current. The circuit is typically active when output load is less than 5 µA, V
IN
is greater than 18 V, and die temperature isgreater than +100 ° C.
Copyright © 2001 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
_+
Current
Sense LeakageNull
ControlCircuit
R1
R2
V(IN)
GND
V(OUT)
ILIM
Bandgap
Reference
V =1.205V
ref
FB
_+
Current
Sense LeakageNull
ControlCircuit
R1
R2
V(IN)
GND
V(OUT)
ILIM
Bandgap
Reference
V =1.205V
ref
TPS715xx
SLVS338P – MAY 2001 – REVISED NOVEMBER 2008 ....................................................................................................................................................
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FUNCTIONAL BLOCK DIAGRAMS
Figure 1. Functional Block Diagram — Adjustable Version
Figure 2. Functional Block Diagram — Fixed Version
Table 1. Terminal Functions
TERMINAL
NO. DESCRIPTIONNAME
FIXED ADJ.
FB 1 Adjustable version only. This terminal is used to set the output voltage.NC 1 No connectionGND 2 2 GroundNC 3 3 No connectionIN 4 4 Input supply.OUT 5 5 Output of the regulator, any output capacitor ≥0.47 µF can be used for stability.
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TYPICAL CHARACTERISTICS
3.290
3.295
3.300
3.305
3.310
3.315
3.320
0 10 20 30 40 50
IO − Output Current − mA
VIN = 4.3 V
COUT = 1 µF
TJ = 25°C
VOUT − Output Voltage − V
−40−25−10 5 20 35 50 65 80 95 110 125
TJ − Junction Temperature − °C
3.25
3.26
3.27
3.28
3.29
3.30
3.31
3.32
VIN = 4.3 V
COUT = 1 µF
IOUT = 50 mA
IOUT = 1 mA
VOUT − Output Voltage − V
2
2.5
3
3.5
4
4.5
−40−25−10 5 20 35 50 65 80 95 110 125
TJ − Junction Temperature − °C
VIN = 4.3 V
VOUT = 3.3 V
IOUT = 1 µF
IGND − Ground Current − µ A
100 1 k 10 k 100 k
f − Frequency − Hz
IOUT = 1 mA
IOUT = 50 mA
µHzOutput Spectral Noise Density −
0
1
2
3
4
5
6
7
8VIN = 4.3 V
VOUT = 3.3 V
COUT = 1 µF
V/
f − Frequency − Hz
− Output Impedance −ZoΩ
14
8
0
12
2
4
10
VIN = 4.3 V
VOUT = 3.3 V
COUT = 1 µF
TJ = 25°C
IOUT = 1 mA
100 1 M10 1k 10k 100k 10 M
IOUT = 50 mA
6
16
18
0
100
200
300
400
500
600
0 10 20 30 40 50
TJ = 125°C
TJ = 25°C
TJ = −40°C
VIN = 3.2 V
COUT = 1 µF
IOUT − Output Current − mA
− Dropout Voltage − mV
VDO
0
0.1
0.2
0.4
0.5
0.6
0.7
0.8
0.9
1
0 3 6 9 12 15
VIN − Input Voltage − V
− Dropout Voltage − V
VDO
IOUT = 50 mA
TJ = 25°C
TJ = −40°C
TJ = 125°C
0.3
TJ − Junction Temperature − °C
− Dropout Voltage − mV
VDO
−40 5−25 20 35 65 110 12550−10 80 95
VIN = 3.2 V
IOUT = 50 mA
IOUT = 10 mA
0
100
200
300
400
500
600
TPS715xx
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.................................................................................................................................................... SLVS338P – MAY 2001 – REVISED NOVEMBER 2008
OUTPUT VOLTAGE OUTPUT VOLTAGE QUIESCENT CURRENTvs vs vsOUTPUT CURRENT JUNCTION TEMPERATURE JUNCTION TEMPERATURE
Figure 3. Figure 4. Figure 5.
OUTPUT SPECTRAL
NOISE DENSITY OUTPUT IMPEDANCE DROPOUT VOLTAGEvs vs vsFREQUENCY FREQUENCY OUTPUT CURRENT
Figure 6. Figure 7. Figure 8.
TPS71501 POWER-SUPPLYDROPOUT VOLTAGE DROPOUT VOLTAGE RIPPLE REJECTIONvs vs vsINPUT VOLTAGE JUNCTION TEMPERATURE FREQUENCY
Figure 9. Figure 10. Figure 11.
Copyright © 2001 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
18161412
VIN VOUT
VOUT = 3.3 V
RL = 66 Ω
COUT = 10 µF
8
7
6
5
4
3
2
1
0
t − Time − ms
20 64 108 20
VOUT − Output Voltage − V
VIN − Input Voltage − V
t − Time − µs
0 15010050 200 250 350300 400 450 500
5.3
VOUT = 3.3 V
IOUT = 50 mA
COUT = 10 µF
4.3
100
50
0
−50
DVOUT − Change in
Output Voltage − mV
VIN − Input Voltage − V
t − Time − ms
0 300200100 400 500 700600 800 900 1000
60
40
20
0
V =4.3V
V =3.3V
C =10 F
IN
OUT
OUT m
D -
-
V Changein
OutputVoltage mV
OUT
IOutputCurrent mA- -
OUT
0
400
-200
200
TPS715xx
SLVS338P – MAY 2001 – REVISED NOVEMBER 2008 ....................................................................................................................................................
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TYPICAL CHARACTERISTICS (continued)
POWER-UP / POWER-DOWN LINE TRANSIENT RESPONSE LOAD TRANSIENT RESPONSE
Figure 12. Figure 13. Figure 14.
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APPLICATION INFORMATION
TPS71533
IN OUT
VIN VOUT
C1
0.1 µF0.47 µF
GND
External Capacitor Requirements
Power Dissipation and Junction Temperature
PD(max) +TJmax *TA
RqJA
(1)
PD+ǒVIN*VOUTǓ IOUT
(2)
Regulator Protection
TPS715xx
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.................................................................................................................................................... SLVS338P – MAY 2001 – REVISED NOVEMBER 2008
The TPS715xx family of LDO regulators has been optimized for ultra-low power applications such as theMSP430 microcontroller. Its ultra-low supply current maximizes efficiency at light loads, and its high input voltagerange makes it suitable for supplies such as unconditioned solar panels.
Figure 15. Typical Application Circuit (Fixed Voltage Version)
Although not required, a 0.047- µF or larger input bypass capacitor, connected between IN and GND and locatedclose to the device, is recommended to improve transient response and noise rejection of the power supply as awhole. A higher-value input capacitor may be necessary if large, fast-rise-time load transients are anticipated andthe device is located several inches from the power source.
The TPS715xx requires an output capacitor connected between OUT and GND to stabilize the internal controlloop. Any capacitor (including ceramic and tantalum) greater than or equal to 0.47 µF properly stabilizes thisloop. X7R type capacitors are recommended, but X5R and others may be used.
To ensure reliable operation, worst-case junction temperature should not exceed +125 ° C. This restriction limitsthe power dissipation the regulator can handle in any given application. To ensure the junction temperature iswithin acceptable limits, calculate the maximum allowable dissipation, P
D(max)
, and the actual dissipation, P
D
,which must be less than or equal to P
D(max)
.
The maximum-power-dissipation limit is determined using the following equation:
where:
•T
J
max is the maximum allowable junction temperature.•R
θJA
is the thermal resistance junction-to-ambient for the package (see the Dissipation Ratings table).•T
A
is the ambient temperature.
The regulator dissipation is calculated using:
For a higher power package version of the TPS715xx, see the TPS715Axx .
The TPS715xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the inputvoltage drops below the output voltage (e.g., during power-down). Current is conducted from the output to theinput and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might beappropriate.
The TPS715xx features internal current limiting. During normal operation, the TPS715xx limits output current toapproximately 500 mA. When current limiting engages, the output voltage scales back linearly until theovercurrent condition ends. Take care not to exceed the power dissipation ratings of the package.
Copyright © 2001 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 7
Programming the TPS71501 Adjustable LDO Regulator
VOUT +VREF ǒ1)R1
R2Ǔ
(3)
R1 +ǒVOUT
VREF *1Ǔ R2
(4)
OUTPUT VOLTAGE
PROGRAMMING GUIDE
OUTPUT
VOLTAGE R1 R2
1.8 V
2.8 V
5.0 V
0.499 MΩ
1.33 MΩ
3.16 MΩ
1 MΩ
1 MΩ
1 MΩ
GND FB
IN OUT
VIN VOUT
R1CFB
R2
TPS71501
VOUT +VREF ǒ1)R1
R2Ǔ
0.1µF 0.47µF
Power the MSP430 Microcontroller
TPS715xx
SLVS338P – MAY 2001 – REVISED NOVEMBER 2008 ....................................................................................................................................................
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The output voltage of the TPS71501 adjustable regulator is programmed using an external resistor divider asshown in Figure 16 . The output voltage operating range is 1.2 V to 15 V, and is calculated using:
where:
•V
REF
= 1.205 V typ (the internal reference voltage)
Resistors R1 and R2 should be chosen for approximately 1.5- µA divider current. Lower value resistors can beused for improved noise performance, but the solution consumes more power. Higher resistor values should beavoided as leakage current into/out of FB across R1/R2 creates an offset voltage that artificiallyincreases/decreases the feedback voltage and thus erroneously decreases/increases V
OUT
. The recommendeddesign procedure is to choose R2 = 1 M Ωto set the divider current at 1.5 µA, and then calculate R1 usingEquation 4 :
Figure 16. TPS71501 Adjustable LDO Regulator Programming
Several versions of the TPS715xx are ideal for powering the MSP430 microcontroller .Table 2 shows potentialapplications of some voltage versions.
Table 2. Typical MSP430 Applications
DEVICE V
OUT
(TYP) APPLICATION
TPS71519 1.9 V V
OUT, MIN
> 1.800 V required by many MSP430s. Allows lowest power consumption operation.TPS71523 2.3 V V
OUT, MIN
> 2.200 V required by some MSP430s FLASH operation.TPS71530 3.0 V V
OUT, MIN
> 2.700 V required by some MSP430s FLASH operation.TPS715345 3.45 V V
OUT, MIN
< 3.600 V required by some MSP430s. Allows highest speed operation.
The TPS715xx family offers many output voltage versions to allow designers to minimize the supply voltage forthe processing speed required of the MSP430. This minimizes the supply current consumed by the MSP430.
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
BQ71525DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
BQ71525DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
BQ71533DCKR ACTIVE SC70 DCK 5 TBD Call TI Call TI
BQ71533DCKRG4 ACTIVE SC70 DCK 5 TBD Call TI Call TI
TPS71501DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71501DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71518DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71518DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71519DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71519DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71523DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71523DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71525DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71525DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71530DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71530DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71533DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71533DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
TPS715345DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS715345DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71550DCKR ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
TPS71550DCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS71501, TPS71525, TPS71530, TPS71533, TPS71550 :
•Automotive: TPS71501-Q1, TPS71525-Q1, TPS71530-Q1, TPS71533-Q1, TPS71550-Q1
PACKAGE OPTION ADDENDUM
www.ti.com 17-Aug-2012
Addendum-Page 3
•Enhanced Product: TPS71501-EP
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
BQ71525DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TPS71501DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TPS71501DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TPS71518DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TPS71519DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TPS71523DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TPS71523DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TPS71525DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TPS71525DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TPS71530DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TPS71530DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TPS71533DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
TPS71533DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TPS715345DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TPS71550DCKR SC70 DCK 5 3000 180.0 8.4 2.25 2.4 1.22 4.0 8.0 Q3
TPS71550DCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ71525DCKR SC70 DCK 5 3000 202.0 201.0 28.0
TPS71501DCKR SC70 DCK 5 3000 202.0 201.0 28.0
TPS71501DCKR SC70 DCK 5 3000 180.0 180.0 18.0
TPS71518DCKR SC70 DCK 5 3000 202.0 201.0 28.0
TPS71519DCKR SC70 DCK 5 3000 202.0 201.0 28.0
TPS71523DCKR SC70 DCK 5 3000 180.0 180.0 18.0
TPS71523DCKR SC70 DCK 5 3000 202.0 201.0 28.0
TPS71525DCKR SC70 DCK 5 3000 180.0 180.0 18.0
TPS71525DCKR SC70 DCK 5 3000 202.0 201.0 28.0
TPS71530DCKR SC70 DCK 5 3000 202.0 201.0 28.0
TPS71530DCKR SC70 DCK 5 3000 180.0 180.0 18.0
TPS71533DCKR SC70 DCK 5 3000 180.0 180.0 18.0
TPS71533DCKR SC70 DCK 5 3000 202.0 201.0 28.0
TPS715345DCKR SC70 DCK 5 3000 202.0 201.0 28.0
TPS71550DCKR SC70 DCK 5 3000 202.0 201.0 28.0
TPS71550DCKR SC70 DCK 5 3000 180.0 180.0 18.0
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Aug-2012
Pack Materials-Page 2
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