AXS(1) IC SOCKETS ROUND aa aed FEATURES e This is a high reliability IC socket with round pin external contacts constructed with 4 point inter- nal contacts. Because of the gold plating on all surfaces, the 4 point contact construction offers superior resist- ance to vibration, shock, and environmental con- ditions, resulting in high reliability. e Terminal shape prevents entrance of solder flux. Because of the round pin construction and suffi- cient distance being provided between the PC board mounting surface and the frame, flux cannot rise up into the contact section. With advanced design method of the frame, stress transmission from the PC board is greatly reduced. 1. Characteristics Item 7 Specifications _ po : Condition ~ _ _ Rated current 1A a Electrical Breakdown voltage 1,000V AC for 1 min. Detection current: mA ectrica - - - cette ee eon characteristics insulation resistance Min. 1,000MQ ; Using 500V DC megger Contact resistance Max. 20mQ Measured with YHP4328A _ Electrostatic capacitance Max. 2pF _. at 1kHz | Vibration resistance 10 to 2,000Hz, 147m/s? {15G} After carrying current (Max. 100mA) during the test, no Shock resistance 980m/s? {100G} interruption of current longer than 1s does not occur. Mechanical Insertion force of : a ! Max. 3.33N {340g} characteristics single contact _ 340g; Measured by steel-gauge with 0.4x0.25mm cross section Pull-out force of : area or by pingauge with diameter 0.4mm single contact en ON I ee | Lifetime Insertion and removal life Min. 100 times With usage of applicable leads characteristics . : . After 96 hours of exposure to humidity 90 to 95% R.H., HSgas _ Contact resistance after test: Max. 20m0 temperature 40C +2C, concentration 31 ppm __ . . After 48 hours of exposure to humidity 90 to 95% R.H., SO: gs Contact resistance after test: Max. 20m.) temperature 40C-+2C, concentration 10+3 ppm Humidit Contact resistance after test: Max. 20m After 96 hours of exposure to humidity 90 to 95% R.H., Environmental ' u y Insulation resistance after test: Min. 300MQ. temperature 40C +2C - characteristics . Low temperature: ~55C (30 min.) . Contact resistance after test: Max. 20mQ : cycle Thermal shock resistance ; . an High temperature: + 125C (30 min.) fe Insulation resistance after test: Min. 300MQ No. of cycles: 5 cycles 7 Ambient temperature ~5C to +126C _ a _ . 350C: within 3 sec. Soldering temperature 260C: within 10 sec. _ _ Applicable lead Square lead: 0.5x0.25mm ppicanie leads a Round lead: Diameter 0.4 to 0.53mm__ _ _ 2. Materials and surface treatment Part name Material Surface treatment Frame Glass-reinforced PBT (UL94V-0) External sleeve Brass SnPb plating over Ni or Au plating over Ni SnPb plating over Ni Internal contact Beryllium copper Au plating (0.25.m) over Ni : Au plating (0.76.m) over Ni 128ORDERING INFORMATION IC socket 10: Round pin type aAxs [10, | | | | e Number of contacts 08: 14: 16: 18: 20: 22: 24: 8 contacts 14 contacts 16 contacts 18 contacts 20 contacts 22 contacts 24 contacts 28 32 36 40 48 64 : 28 contacts : 32 contacts : 36 contacts : 40 contacts : 48 contacts : 64 contacts Terminal and layout 2: SIL layout, Soider-dip terminal (See PRODUCT TYPES) 7: DIL layout, Solder-dip terminal (24 contacts: row pitch 7.62mm) Plating (Internal contact/External sleeve) 1: Au 0.25 wm/SnPb 3: Au 0.76 wm/SnPb 7: Au 0.76 um/Au 9: SnPb/SnPb Note) Not every combination is available. Please refer to the table, PRODUCT TYPES. CONTACT CONSTRUCTION ! | | | N. \. internal contact External sieeve Senate PRODUCT TYPES 1. Solder dip terminal type External sieeve SnPb plating - _ Au plating . : : : 7 : i Packaging Internal contact SnPb plating _ Au plating (0.2um) Au plating (0.764m) | Au plating 0.76um) | No. of contacts Part No. Part No. Part No. Part No. nso Outer carton a: AXS100819 - aX$100811 AXS100813 AXS100817 50 pes. 300 pcs. 44 AXS101419 AXS101411 AXS101413 AXS101417 25 pcs. 300 pes. 46 AXS101619 AXS101611 AXS101613 AXS101617 | 25pes. 300 pes. 48 AXS101819 AXS101811 AXS101813 AXS101817 | 20 pes. 300 pcs. 20 AXS102019 __AXS102011 AXS102013 AXS102017 20 pes. 300 pes. 22 AXS102219 AXS102211 AXS102213 AXS102217 15 pes. 300 pes. DIL | 24" AXS102419 AXS102411 AXS102413 __AXS102417 15 pes. 300 pes. | 24 AXS102479 AXS102471 AXS102473 | AXS102477 15 pes. 300 pes. | 28 AXS102819 AXS102811 AXS102813 AXS102817 15 pes. 300 pes. 32 AXS103219 AXS103211 AXS103213 AXS103217.-*1 pcs. 300 pes. 36 AXS103619 AXS103611 AXS103613 AXS103617 10 pes. 300 pes 40 AXS104019 | AXS104011 AXS104013 AXS104017 10 pcs. , 300pcs. _ 48 AXS104819 AXS104811 AXS104813_ = AXS104817 Bpes. | 200pcs. _ 64 AXS106419 AXS106411 AXS106413 AXS106417 Spes. 100 pes SIL 32 AXS103229 AXS103221 AXS103223 AXS103227. 10pes. 100 pes. __ Notes) 1. *1 Pitch: 15.24mm *2 Pitch: 7.62mm 2. All are stick packaged. 129(Custom ordered product) Low profile type When ordering, please change the fourth digit of part number 10" to "14". <ex.> AXS140819 Please see SPECIFICATIONS. Please see DIMENSIONS. When ordering, please change t the fourth digit of part number + 2.6" 1 "10" to "16", 2.2=02 <ex.> AXS160819 . Please see SPECIFICATIONS except for insertion force of single contact. Insertion force of | single contact: 1.7N {173.4gf} TEST DATA (data in 2. to 10. apply to all products) 1.-@ Insertion and removal endurance test (SnPb/SnPb) Note: (inner contact/outer sleeve) Sample: 3 terminals Conditions: Insertion and removai terminal 0.41mm diam., insertion and removal force measurement gauge 0.41mm diam. steel pin, insertion and removal speed 500 to 600 times/hour -- Unit insertion and removal force, g Insertion force Removal force Change in contact resistance, mQ. Initial 100 200 300 400 500 (times) = w o Initial = 100 200 300 400 500 (times) 1.-@ Insertion and removal endurance test (Au 0.25 zm/SnPb, Au 0.76 um/SnPb, Au 0.76 wm/Au) Sample: 3 terminals Conditions: insertion and removal terminal 0.41 mm diam., insertion and removal force measurement gauge 0.41mm diam. steel pin, insertion and removal speed 500 to 600 times/hour Unit insertion and removal force, g Insertion farce =t Removal force Change of contact resistance, m2 Initial, = 100 200 300 400 500 i (times) | 10 30 25 20 Initial 100 200 300 400 500 (times) Please see DIMENSIONS. Mounting height Part no. Specifications | Dimensions Surface treatment e 4.7mm | zi ee | 5 | 4.7802 Please see PRODUCT TYPES. | Please see SPECIFICATIONS. | Please see DIMENSIONS. Please see PRODUCT TYPES". | 7 OF tae a 3.9mm / Please see PRODUCT TYPES", however, external sleeve Au plating is not available. 1302. Thermal shock test (header and socket mated) Sample: 56 terminals (28 contacts, 2 pcs.) Conditions: As shown in figure below 425C 25 e ie 5 min s 556 TS et Qo 1 cycle c a 3 50 S & 40 c 8 5 30 ov 2 20 aq 6 10 | 0 1 ital 50 100 (cycles) 3. Humidity test (header and socket mated) Sample: 56 terminals (28 contacts, 2 pcs.) Conditions: Ambient ternperature 40C +2C, humidity 90 to 95% RH AXS(1) 4. SO, test (header and socket separate) Sample: 56 terminals (28 contacts, 2 pcs.) Conditions: Gas concentration 10ppmt3ppm, temperature 40C +2C, humidity 90 to 95% RH I a 60 --= Change of contact resistance, mQ. initial =: 100 200 300 400 500 (hours) ---- Change of contact resistance, mQ initial 100 200 300 400 500 (hours) | 5. HS test (header and socket separate) Sample: 56 terminais (28 contacts, 2 pcs.) Conditions: Gas concentration 3ppm+1 ppm, temperature 40C:+2C, humidity 90 to 95% RH 6. SO, test (header and socket mated) Sample: 56 terminals (28 contacts, 2 pcs.) Conditions: Gas concentration 10ppm+3ppm, temperature 40C +2C, humidity 90 to 95% RH 7. H,S test (header and socket mated) Sample: 56 terminals (28 contacts, 2 pcs.) Conditions: Gas concentration 3ppm+1 ppm, temperature 40C +2C, humidity 90 to 95% RH 1 ---= Change of contact resistance, mQ | 7 Initial == -100 200 300 400 500 i {hours} - = Change of contact resistance, mQ. initial 100 20 300 400 500 (hours) r i Change of contact resistance, mQ | | | | =O initial 100 206 300 400 500 (hours) 8. Saltwater spray test (header and socket mated) Sample: 56 terminals (28 contacts, 2 pes.) Conditions: Saltwater concentration 5%+1%, bath temperature 35C +1C, continuous spraying 9. Vibration endurance test (header and socket mated) Sample: 56 terminals (28 contacts, 2 pcs.) Conditions: Frequency of 25 to 2000 to 25Hz for 2 minutes, acceleration 15G, vibration time 4 hours/axis, vibration directions X, Y and Z axes 10. Heat resistance test (header and socket mated) Sample: 56 terminals (28 contacts, 2 pcs.) Conditions: Ambient temperature 125C +5C -~= Change of contact resistance, m0 initial 50 100 i (hours) | ---- Change of contact resistance, m0 After test 10h Initial 50 40 30 20 ~ Change of contact resistance, mO. 10 Initial 100 200 300 400 500 i (hours) 131AXS(1) DIMENSIONS @ Solder-dip type 1) Standard type (4.2mm) 2) Low profile type (8.9mm) mm General tolerance: +0.3 PC board pattern (mounting pat layout) Dimension table (mm) 4.7? (3.9792) Note 2) Lt aa in ee pom ben 9 pene 1 S 4 To a s oo}. | 2,69! a j q | 7 r q p20: : 5 | 1 -Note 1) | | Do Th, -. wofefent E 49.3 1 | | : | D 1 PN ee at bog | - ! 0.89% L 2 r \. dia. hole 2 0NT i | 2.54+008 Be oe anaes oT pe | Notes} 1. Rib is not provided for 8, 14 and 4 00.52" 16 pins; 1 rib is provided for 18, Dimension table (mm) fee BS 20, 22, 24 and 28 pins; 2 ribs No. of ' are provided for 32, 36 40 and contacts A B c D E 48 pins; 4 ribs are provided for i 64 pins. 8 10.16 | 7.62 | 10.16 7.62 | 43 2. Dimensions of low profile will be 14 17.78 | 15.24 | 10.16 7.62 4.3 3.9mm +0.2. 16 20.32 | 17.78 | 10.16 7.62 43 18 22.86 | 20.32 | 10.16 7.62 4.3 20 25.4 | 22.86 10.16; 7.62) 43 22 1 27.94 | 25.4 12.7 10.16 6.4 24 30.48 | 27.94 | 17.78 | 15.24 | 11.2 24"? 30.48 | 27.94 | 10.16 7.62 4.3 28 | 36.56 | 33.02 | 17.78 | 15.24 [ 11.2 32 (| 40.64 | 38.1 | 17.78 | 15.24 | 11.2 36 45.72 | 43.18 | 17.78 | 16.24 | 11.2 40 50.8 48.26 | 17.78 | 15.24 | 11.2 48 | 60.96 | 58.42 | 17.78 | 15.24 | 11.2 64 81.28 | 78.74 25.4 | 22.86) 17.8 Notes} *1 Pitch: 15.24mm *2 Pitch: 7.62mm 3) Low profile type (2.6mm) PC board pattern (mounting pat layout) Sire EHE PTT TTT eT thoy | pou Bp | De Pea Peete tp ee be, \igt-$$-e0ebe-sebeoal 2.54*905 yb : 7 lt BROT ee 0.97995 \._dia. nole | Notes} 1. Rio is not provided for 8, 14 and 16 pins; 1 rib is provided for 18, 20, 22, 24 and 28 pins; 2 ribs are provided for 32, 36 40 and 48 pins; 4 ribs are provided for No. of A B c D E 64 pins. contacts 2. Dimensions of tow profile will be 8 10.16 | 7.62 | 10.16 | 7.62 43 3.9mm +0.2. 14 17.78 | 15.24 | 10.16 | 7.62 4.3 16 20.32 | 17.78 | 10.16 | 7.62 4.3 18 22.86 | 20.32 | 10.16 | 7.62 4.3 20 25.4 | 22.86 | 10.16 | 7.62 43 22 27.94 | 25.4 | 12.7 | 10.16 6.4 24" 30.48 | 27.94 | 17.78 | 15.24 | 11.2 24" 30.48 | 27.94 | 10.16 | 7.62 43 28 35.56 | 33.02 | 17.78 | 15.24 | 11.2 32 40.64 | 38.1 | 17.78 | 15.24 | 11.2 36 45.72 | 43.18 | 17.78 | 15.24 | 11.2 40 50.8 | 48.26 | 17.78 | 15.24 | 11.2 48 60.96 | 58.42 | 17.78 | 15.24 | 11.2 64 81.28 | 78.74 | 25.4 | 22.86 | 17.8 Notes) *1 Pitch: 15.24mm *2 Pitch: 7.62mm 132@ Rib layout (for DIL type) AXS(1) mm General tolerance: 0.3 Te y 2640.1] | hie 32 to 48 contact Dimension table mm 8 to 16 contact Dimension No.of | a f t 5 table (mm) | ] contacts H No. of - 4 7] contacts F 22 ts 8 3.2 ~ __36 | 13.5 14 3B 40 | 15.5 eas ~ a :) 15.5 64 contact 18 to 28 contact Dimension table (mm) pep i No. of E G 4166+; aaa apt TH Tt contacts r Ce A en I OR ES a SPC Ceove? 18 3.5 3.0 : 7 20 36 | 3.0 ai ' rt OX ay 22 38 | 3.0 TL L ! | | fH- +6 F 24 4.0 3.2 460- bod i i I 1 i) 1 1 t tot ! fot { 1 t mo ! 28 4.0 3.2 el HS 4- ata ah ata ala ste [ |-14 | a YD 4 4. SIL Solder-dip terminals (32 contacts) PC board pattern (BOTTOM VIEW) / j-- 81.28.83 ~~ 4.7402 | 2.7402 2.54 2 | ee "12.5440.05 \ 0.8+0.08 dia. hole _ 78.7420.1 __.| 2.5440.2 _Los+0.1 dia. DIMENSIONS Terminal (Common for DIL and SIL terminals) Dip terminal | Y | 25 A | y 1 ae: V0.5 dia. A y Z 1. Do not use for inserting of leads other 4. Flux of the non-corroding rosin type 9. For mounting and removing the IC, a than of applicable dimension. There is the possibility of distorting the internal 5. contacts. 2. Because repeated flexing of the termi- 6. nals can lead to the breakage of the terminal, care should be taken. 3. Soldering should be done under the 7. following conditions. 260C: Within 10 seconds soldering bath 8 350C: Within 3 seconds soldering iron should be used. Liquid flux of minimum chemical ac- tion type alcohol can be used. Sufficient care should be taken to prevent flux from entering the upper surface of the IC socket. Flux cleaning solution of the freon, alcohol, and chlorothene type should be used. of the cleaning solution into the contact internal section. Malfunction can result from solution entry. special tool for insertion and removal of ICs should be used. . Care should be taken to prevent entry 133