BD5352FVE - ROHM Co., Ltd. - Datasheet.Directory

○Product structure：Silicon monolithic integrated circuit ○This product is not designed for protection against radioactive rays

1/13

Datashee

TSZ02201-0R7R0G300040-1-2

18.Dec.2012 Rev.005

TSZ22111・14・001

www.rohm.com

Voltage Detector IC Series

Free Delay Time Setting

CMOS Voltage Detector IC Series

BD52xx series BD53xx series

●General Description

Rohm's BD52xx and BD53xx series are highly

accurate, low current consumption Voltage Detector

ICs with a capacitor-controlled time delay. The line up

includes BD52xx devices with N channel open drain

output and BD53xx devices with CMOS output. The

devices are available for specific detection voltages

ranging from 2.3V to 6.0V in increments of 0.1V.

●Features

 Delay Time Controlled by external Capacitor

 Two output types (N channel open drain and CMOS

output)

 Ultra-low current consumption

 Very small and low height package

 Package SSOP5 is similar to SOT-23-5(JEDEC)

●Key Specifications

 Detection voltage: 2.3V to 6.0V (Typ.)

0.1V steps

 High accuracy detection voltage: ±1.0%

 Ultra-low current consumption: 0.95µA (Typ.)

●Package

SSOP5: 2.90mm x 2.80mm x 1.25mm

VSOF5: 1.60mm x 1.60mm x 0.60mm

●Applications

Circuits using microcontrollers or logic circuits that

require a reset.

●Typical Application Circuit

●Connection Diagram

SSOP5 VSOF5

●Pin Descriptions

SSOP5 VSOF5

PIN No. Symbol Function PIN No. Symbol Function

1 VOUT Reset Output 1 VOUT Reset Output

2 VDD Power Supply Voltage 2 SUB Substrate*

3 GND GND 3 CT Capacitor connection terminal for

output delay time

4 N.C. Unconnected Terminal 4 GND GND

5 CT Capacitor connection terminal for

output delay time 5 VDD Power Supply Voltage

*Connect the substrate to GND.

Open Drain Output type

BD52xx Series

CMOS Output type

BD53xx Series

VDD1

BD52xx

VDD2

GND

(Capacitor for

noise filtering)

RST Micro

controller

VDD1

BD53xx

GND

CTCL

(Capacitor for

noise filtering)

RST Micro

controller

TOP VIEW TOP VIEW

VOUT VDD GND

N.C. CT

Lot. No

Marking

GND

VOUT SUB CT

VDD

Marking Lot. No

Datasheet

2/13

BD52xx series BD53xx series

TSZ02201-0R7R0G300040-1-2

18.Dec.2012 Rev.005

www.rohm.com

TSZ22111・15・001

●Ordering Information

(Unit : mm)

SSOP5

2.9±0.2

0.13

4°+6°

−4°

1.6

2.8±0.2

1.1±0.05

0.05±0.05

+0.2

−0.1

+0.05

−0.03

0.42+0.05

−0.04

0.95

123

1.25Max.

0.2Min.

0.1

Direction of feed

Reel

∗

Order quantity needs to be multiple of the minimum quantity.

Embossed carrier tapeTape

Quantity

Direction

of feed

The direction is the 1pin of product is at the upper right when you hold

reel on the left hand and you pull out the tape on the right hand

3000pcs

()

1pin

(Unit : mm)

VSOF5

1.2±0.05

1.0±0.05

0.6MAX

0.22±0.05

0.5

1.6±0.05

0.13±0.05

0.2MAX

1.6±0.05

(MAX 1.28 include BURR)

BDxxxx x-TR

Part Output Type Reset Voltage Value Package Packaging and

Number 52 : Open Drain 23 : 2.3V G : SSOP5 forming specification

53 : CMOS 0.1V step FVE : VSOF5 TR : Embossed tape

60 : 6.0V and reel

Datasheet

3/13

BD52xx series BD53xx series

TSZ02201-0R7R0G300040-1-2

18.Dec.2012 Rev.005

www.rohm.com

TSZ22111・15・001

●Lineup

Output Type Open Drain CMOS

Detection Voltage Marking Part Number Marking Part Number

6.0V PW BD5260 RW BD5360

5.9V PV BD5259 RV BD5359

5.8V PU BD5258 RU BD5358

5.7V PT BD5257 RT BD5357

5.6V PS BD5256 RS BD5356

5.5V PR BD5255 RR BD5355

5.4V PQ BD5254 RQ BD5354

5.3V PP BD5253 RP BD5353

5.2V PN BD5252 RN BD5352

5.1V PM BD5251 RM BD5351

5.0V PL BD5250 RL BD5350

4.9V PK BD5249 RK BD5349

4.8V PJ BD5248 RJ BD5348

4.7V PH BD5247 RH BD5347

4.6V PG BD5246 RG BD5346

4.5V PF BD5245 RF BD5345

4.4V PE BD5244 RE BD5344

4.3V PD BD5243 RD BD5343

4.2V PC BD5242 RC BD5342

4.1V PB BD5241 RB BD5341

4.0V PA BD5240 RA BD5340

3.9V MV BD5239 QV BD5339

3.8V MU BD5238 QU BD5338

3.7V MT BD5237 QT BD5337

3.6V MS BD5236 QS BD5336

3.5V MR BD5235 QR BD5335

3.4V MQ BD5234 QQ BD5334

3.3V MP BD5233 QP BD5333

3.2V MN BD5232 QN BD5332

3.1V MM BD5231 QM BD5331

3.0V ML BD5230 QL BD5330

2.9V MK BD5229 QK BD5329

2.8V MJ BD5228 QJ BD5328

2.7V MH BD5227 QH BD5327

2.6V MG BD5226 QG BD5326

2.5V MF BD5225 QF BD5325

2.4V ME BD5224 QE BD5324

2.3V MD BD5223 QD BD5323

Datasheet

4/13

BD52xx series BD53xx series

TSZ02201-0R7R0G300040-1-2

18.Dec.2012 Rev.005

www.rohm.com

TSZ22111・15・001

●Absolute maximum ratings

Parameter Symbol Limits Unit

Power Supply Voltage VDD-GND -0.3 to +10 V

Output Voltage Nch Open Drain Output VOUT GND-0.3 to +10 V

CMOS Output GND-0.3 to VDD+0.3

Output Current Io 80 mA

Power

Dissipation

SSOP5 *1*3

Pd 540 mW

VSOF5 *2*3 210

Operating Temperature Topr -40 to +105 °C

Ambient Storage Temperature Tstg -55 to +125 °C

*1 Reduced by 5.4mW/°C when used over 25°C.

*2 Reduced by 2.1mW/°C when used over 25°C.

*3 When mounted on ROHM standard circuit board (70mm×70mm×1.6mm, glass epoxy board).

●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C)

Parameter Symbol Condition Limit Unit

Min. Typ. Max.

Detection Voltage VDET

VDD=HÆL, RL=470k *1 VDET(T)

×0.99 VDET(T) VDET(T)

×1.01

VDET=2.5V

Ta=+25°C 2.475 2.5 2.525

Ta=-40°C to 85°C 2.417 - 2.580

Ta=85°C to 105°C 2.422 - 2.598

VDET=3.0V

Ta=+25°C 2.970 3.0 3.030

Ta=-40°C to 85°C 2.901 - 3.095

Ta=85°C to 105°C 2.906 - 3.117

VDET=3.3V

Ta=+25°C 3.267 3.3 3.333

Ta=-40°C to 85°C 3.191 - 3.405

Ta=85°C to 105°C 3.196 - 3.429

VDET=4.2V

Ta=+25°C 4.158 4.2 4.242

Ta=-40°C to 85°C 4.061 - 4.334

Ta=85°C to 105°C 4.068 - 4.364

VDET=4.8V

Ta=+25°C 4.752 4.8 4.848

Ta=-40°C to 85°C 4.641 - 4.953

Ta=85°C to 105°C 4.649 - 4.988

Circuit Current when ON IDD1 VDD=VDET-0.2V

VDET =2.3-3.1V - 0.80 2.40

µA

VDET =3.2-4.2V - 0.85 2.55

VDET =4.3-5.2V - 0.90 2.70

VDET =5.3-6.0V - 0.95 2.85

Circuit Current when OFF IDD2 VDD=VDET+2.0V

VDET =2.3-3.1V - 0.75 2.25

µA

VDET =3.2-4.2V - 0.80 2.40

VDET =4.3-5.2V - 0.85 2.55

VDET =5.3-6.0V - 0.90 2.70

Operating Voltage Range VOPL VOL0.4V, Ta=25 to 105°C, RL=470k 0.95 - -

VOL0.4V, Ta=-40 to 25°C, RL=470k 1.20 - -

‘Low’ Output Voltage (Nch) VOL VDD=1.5V, ISINK = 0.4 mA, VDET=2.3-6.0V - - 0.5

VDD=2.4V, ISINK = 2.0 mA, VDET=2.7-6.0V - - 0.5

‘High’ Output Voltage (Pch) VOH

VDD=4.8V, ISOURCE=0.7 mA, VDET(2.3V to 4.2V) VDD-0.5 - -

VDD=6.0V, ISOURCE=0.9 mA, VDET(4.3V to 5.2V) VDD-0.5 - -

VDD=8.0V, ISOURCE=1.1 mA, VDET(5.3V to 6.0V) VDD-0.5 - -

VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)

RL: Pull-up resistor to be connected between VOUT and power supply.

Design Guarantee. (Outgoing inspection is not done on all products.)

*1 Guaranteed at Ta=25°C.

Datasheet

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BD52xx series BD53xx series

TSZ02201-0R7R0G300040-1-2

18.Dec.2012 Rev.005

www.rohm.com

TSZ22111・15・001

●Electrical characteristics (Unless Otherwise Specified Ta=-40 to 105°C) - continued

Parameter Symbol Condition Limit Unit

Min. Typ. Max.

Leak Current Ileak VDD=VDS=10V *1 - - 0.1 µA

CT pin Threshold Voltage VCTH

VDD=VDET×1.1, VDET=2.3-2.6V, RL=470k VDD

×0.30

VDD

×0.40

VDD

×0.60

VDD=VDET×1.1, VDET=2.7-4.2V, RL=470k VDD

×0.30

VDD

×0.45

VDD

×0.60

VDD=VDET×1.1, VDET=4.3-5.2V, RL=470k VDD

×0.35

VDD

×0.50

VDD

×0.60

VDD=VDET×1.1, VDET=5.3-6.0V, RL=470k VDD

×0.40

VDD

×0.50

VDD

×0.60

Output Delay Resistance RCT VDD=VDET×1.1 VCT=0.5V *1 5.5 9 12.5 M

CT pin Output Current ICT VCT=0.1V VDD=0.95V *1 15 40 - µA

VCT=0.5V VDD=1.5V 150 240 -

Detection Voltage

Temperature coefficient VDET/T Ta=-40°C to 105°C - ±100 ±360 ppm/°C

Hysteresis Voltage  VDET VDD=LÆHÆL, RL=470k VDET

×0.03

VDET

×0.05

VDET

×0.08 V

VDET (T) : Standard Detection Voltage (2.3V to 6.0V, 0.1V step)

RL: Pull-up resistor to be connected between VOUT and power supply.

Design Guarantee. (Outgoing inspection is not done on all products.)

*1 Guaranteed at Ta=25°C.

Datasheet

6/13

BD52xx series BD53xx series

TSZ02201-0R7R0G300040-1-2

18.Dec.2012 Rev.005

www.rohm.com

TSZ22111・15・001

●Block Diagrams

Vref

VOUT

VDD

GND CT

Vref

VOUT

VDD

GND CT

Fig.1 BD52xx Series

Fig.2 BD53xx Series

Datasheet

7/13

BD52xx series BD53xx series

TSZ02201-0R7R0G300040-1-2

18.Dec.2012 Rev.005

www.rohm.com

TSZ22111・15・001

●Typical Performance Curves

Fig.3 Circuit Current

0.0

0.5

1.0

1.5

2.0

01 23 456 78 910

VDD SUPPLY VOLTAGE ：VDD[V]

CIRCUIT CURRENT ： IDD [A]

【BD5242G/FVE】

0.0 0.5 1.0 1.5 2.0 2.5

DRAIN-SOURCE VOLTAGE ： VDS

[V]

"LOW" OUTPUT CURRENT ： IOL[mA]

【BD5242G/FVE】

VDD=2.4V

VDD=1.2V

Fig.4 “Low” Output Current

0123456

DRAIN-SOURCE VOLTAGE ： VDS

[V]

"HIGH" OUTPUT CURRENT ： IOH[mA]

【BD5342G/FVE】

VDD=8.0V

VDD=6.0V

VDD=4.8V

Fig.5 “High” Output Current Fig.6 I/O Characteristics

00.5 11.522.5 33.544.5 55.5

VDD SUPPLY VOLTAGE ：VDD[V]

OUTPUT VOLTAGE

： VOUT[V]

【BD5242G/FVE】

Ta=25℃

【BD5242】

【BD5342】

【BD5242】

【BD5342】

【BD5242】

【BD5342】

Datasheet

8/13

BD52xx series BD53xx series

TSZ02201-0R7R0G300040-1-2

18.Dec.2012 Rev.005

www.rohm.com

TSZ22111・15・001

●Typical Performance Curves – continued

0.0

0.2

0.4

0.6

0.8

1.0

0.0 0.5 1.0 1.5 2.0 2.5

VDD SUPPLY VOLTAGE ： VDD[V]

OUTPUT VOLTAGE

： VOUT[V]

【BD5242G/FVE】

Fig.7 Operating Limit Voltage Fig.8 CT Terminal Current

100

150

200

250

300

350

400

450

012345

VDD SUPPLY VOLTAGE ： VDD[V]

CT OUTPUT CURRENT ： ICT[A]

【BD5242G/FVE】

3.2

3.6

4.0

4.4

4.8

5.2

5.6

-40 0 40 80

TEMPERATURE ： Ta[℃]

DETECTION VOLTAGE ： VDET[V]

Low to hig h(VDET+ΔVDET)

High to low(VDET)

【BD5242G/FVE】

～

Fig.9 Detection Voltage

Release Voltage

0.0

0.5

1.0

1.5

-40 -20 0 20 40 60 80 100

TEMPERATURE ： Ta[℃]

CIRCUIT CURRENT WHEN ON ： IDD1 [A]

【BD5242G/FVE】

Fig.10 Circuit Current when ON

【BD5242】

【BD5342】

【BD5242】

【BD5342】

【BD5242】

【BD5342】

【BD5242】

【BD5342】

Datasheet

9/13

BD52xx series BD53xx series

TSZ02201-0R7R0G300040-1-2

18.Dec.2012 Rev.005

www.rohm.com

TSZ22111・15・001

●Typical Performance Curves – continued

0.0

0.5

1.0

1.5

-40 -20 0 20 40 60 80 100

TEMPERATURE ： Ta[℃]

CIRCUIT CURRENT WHEN OFF ： I DD2 [A]

【BD5242G/FVE】

Fig.11 Circuit Current when OFF

0.0

0.5

1.0

1.5

-40-200 20406080100

TEMPERATURE ： Ta[℃]

MINIMUM OPERATING VOLTAGE ： VOPL[V]

【BD5242G/FVE】

Fig.12 Operating Limit Voltage

-40 -20 0 20 40 60 80 100

TEMPERATURE ： Ta[℃]

RESISTANCE OF CT ： RCT[M]

【BD5242G/FVE】

Fig.13 CT Terminal Circuit Resistance

0.1

100

1000

10000

0.0001 0.001 0.01 0.1

CAPACITANCE OF CT ： CCT[F]

DELAY TIME ： tPL H [ms]

【BD5242G/FVE】

Fig.14 Delay Time (tPLH) and

CT Terminal External Capacitance

【BD5242】

【BD5342】

【BD5242】

【BD5342】

【BD5242】

【BD5342】

【BD5242】

【BD5342】

Datasheet

10/13

BD52xx series BD53xx series

TSZ02201-0R7R0G300040-1-2

18.Dec.2012 Rev.005

www.rohm.com

TSZ22111・15・001

●Application Information

Explanation of Operation

For both the open drain type (Fig.15) and the CMOS output type (Fig.16), the detection and release voltages are used as

threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the VOUT terminal

voltage switches from either “High” to “Low” or from “Low” to “High”. Please refer to the Timing Waveform and Electrical

Characteristics for information on hysteresis. Because the BD52xx series uses an open drain output type, it is necessary to

connect a pull-up resistor to VDD or another power supply if needed [The output “High” voltage (VOUT) in this case becomes

VDD or the voltage of the other power supply].

Fig.15 (BD52xxType Internal Block Diagram) Fig.16 (BD53xxType Internal Block Diagram)

Setting of Detector Delay Time

It is possible to set the delay time at the rise of VDD using a capacitor connected to the Ct terminal.

Delay time at the rise of VDD t

PLH：Time until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release

voltage(VDET+VDET)

tPLH = -CCT×RCT×ln

C CT: CT pin External Capacitance

RCT: CT pin Internal Impedance（Please refer to Electrical Characteristics.）

VCTH: CT pin Threshold Voltage（Please refer to Electrical Characteristics.）

ln : Natural Logarithm

Reference Data of Falling Time (tPHL) Output

Examples of Falling Time (tPHL) Output

Part Number tPHL[µs] -40°C tPHL[µs] ,+25°C tPHL[µs],+105°C

BD5227 30.8 30 28.8

BD5327 26.8 26 24.8

*This data is for reference only.

The figures will vary with the application, so please confirm actual operating conditions before use.

Timing Waveforms

Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output

voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in

Figure.15 and 16).

1 When the power supply is turned on, the output is unstable

from after over the operating limit voltage (VOPL) until tPHL.

Therefore it is possible that the reset signal is not outputted when

the rise time of VDD is faster than tPHL.

2 When VDD is greater than VOPL but less than the reset release

voltage (VDET+VDET), the CT terminal (VCT) and output (VOUT)

voltages will switch to L.

3 If VDD exceeds the reset release voltage (VDET+VDET), then

VOUT switches from L to H (with a delay due to the CT terminal).

4 If VDD drops below the detection voltage (VDET) when the

power supply is powered down or when there is a power supply

fluctuation, VOUT switches to L (with a delay of tPHL).

5 The potential difference between the detection voltage and the

release voltage is known as the hysteresis width (VDET). The

system is designed such that the output does not toggle with

power supply fluctuations within this hysteresis width, preventing

malfunctions due to noise.

Vref

VDD

GND

VOUT

RESET

VDD

Vref

VDD

GND

VOUT

RESET

VDD

VDD-VCTH

VDD

VDET+ΔVDET

VDET

VOPL

1/2 VDD

tPHL

①

tPLH

tPHL

tPLH

② ③ ④

⑤

VOUT

Fig.17 Timing Waveform

Datasheet

11/13

BD52xx series BD53xx series

TSZ02201-0R7R0G300040-1-2

18.Dec.2012 Rev.005

www.rohm.com

TSZ22111・15・001

●Circuit Applications

1) Examples of a common power supply detection reset circuit

Application examples of BD52xx series (Open Drain

output type) and BD53xx series (CMOS output type) are

shown below.

CASE1: Power supply of the microcontroller (VDD2)

differs from the power supply of the reset detection

(VDD1).

Use an open drain output type (BD52xx) device with a

load resistance RL attached as shown Fig.18.

CASE2: Power supply of the microcontroller (VDD1) is the

same as the power supply of the reset detection (VDD1).

Use a CMOS output type (BD53xx) device or an open

drain output type (BD52xx) device with a pull up resistor

between the output and VDD1.

When a capacitance CL for noise filtering is connected to

the VOUT pin (the reset signal input terminal of the

microcontroller), please take into account the waveform

of the rise and fall of the output voltage (VOUT).

Please refer to Operational Notes for recommendations

on resistor and capacitor values.

2) The following is an example of a circuit application in which an OR connection between two types of detection voltage

resets the microcontroller.

To reset the microcontroller when many independent power supplies are used in the system, OR connect an open drain

output type (BD52xx series) to the microcontroller’s input with pull-up resistor to the supply voltage of the microcontroller

(VDD3) as shown in Fig. 20. By pulling-up to VDD3, output “High” voltage of micro-controller power supply is possible.

VDD1

BD52xx

VDD2

GND

（Noise-filtering

Capacitor）

RST Micro

controller

Fig.18 Open Drain Output Type

（Noise-filtering

Capacitor）

VDD1

BD53xx

GND

RST Micro

controller

Fig.19 CMOS Output Type

VDD1 VDD3

GND

microcontroller

VDD2

BD52xx

NO.1

BD52xx

NO.2

Fig.20

Datasheet

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BD52xx series BD53xx series

TSZ02201-0R7R0G300040-1-2

18.Dec.2012 Rev.005

www.rohm.com

TSZ22111・15・001

3) Examples of the power supply with resistor dividers

In applications wherein the power supply voltage of an IC comes from a resistor divider circuit, an in-rush current will flow

into the circuit when the output level switches from “High” to “Low” or vice versa. In-rush current is a sudden surge of

current that flows from the power supply (VDD) to ground (GND) as the output logic changes its state. This current flow

may cause malfunction in the systems operation such as output oscillations, etc.

Figure.21

When an in-rush current (I1) flows into the circuit (Refer to Fig. 21) at the time when output switches from “Low” to “High”,

a voltage drop of I1×R2 (input resistor) will occur in the circuit causing the VDD supply voltage to decrease. When the VDD

voltage drops below the detection voltage, the output will switch from “High” to “Low”. While the output voltage is at “Low”

condition, in-rush current will stop flowing and the voltage drop will be reduced. As a result, the output voltage will switches

again from “Low” to “High” which causes an in-rush current and a voltage drop. This operation repeats and will result to

oscillation.

Figure.22 IDD Peak Current vs. Power Supply Voltage

* This data is for reference only.

The figures will vary with the application, so please confirm actual operating conditions before use.

VOUT

VDD

BD52xx

BD53xx

GND

CIN

IDD

VDD

VDET

Through

Current

0.001

0.01

0.1

345678910

IDD-peak[mA]

VDD[V]

VDD - IDD Peak Current Ta=25℃

BD52xx

BD53xx

Datasheet

13/13

BD52xx series BD53xx series

TSZ02201-0R7R0G300040-1-2

18.Dec.2012 Rev.005

www.rohm.com

TSZ22111・15・001

●Operational Notes

1) Absolute maximum ratings

Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit

between pins or an open circuit between pins. Therefore, it is important to consider circuit protection measures, such

as adding a fuse, in case the IC is operated over the absolute maximum ratings.

2) Ground Voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no

pins are at a voltage below the ground pin at any time, even during transient condition.

3) Recommended operating conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.

The electrical characteristics are guaranteed under the conditions of each parameter.

4) Bypass Capacitor for Noise Rejection

To help reject noise, put a 1µF capacitor between VDD pin and GND and 1000pF capacitor between VOUT pin and GND.

Be careful when using extremely big capacitor as transient response will be affected.

5) Short between pins and mounting errors

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong

orientation or if pins are shorted together. Short circuit may be caused by conductive particles caught between the pins.

6) Operation under strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

7) The VDD line impedance might cause oscillation because of the detection current.

8) A VDD to GND capacitor (as close connection as possible) should be used in high VDD line impedance condition.

9) Lower than the mininum input voltage puts the VOUT in high impedance state, and it must be VDD in pull up (VDD)

condition.

10) External parameters

The recommended value of RL Resistor is 50k to 1M. The recommended value of CT Capacitor is over 100pF to

0.1µF. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using

practical applications.

11) Power on reset operation

Please note that the power on reset output varies with the VDD rise time. Please verify the behavior in the actual

operation.

12) Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

13) Rush current

When power is first supplied to the IC, rush current may flow instantaneously. It is possible that the charge current to

the parasitic capacitance of internal photo diode or the internal logic may be unstable. Therefore, give special

consideration to power coupling capacitance, power wiring, width of GND wiring, and routing of connections.

14) CT pin discharge

Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input

pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation.

Datasheet

Notice - Rev.003

Notice

●General Precaution

1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2) All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

●Precaution on using ROHM Products

1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3) Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4) The Products are not subject to radiation-proof design.

5) Please verify and confirm characteristics of the final or mounted products in using the Products.

6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8) Confirm that operation temperature is within the specified range described in the product specification.

9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Datasheet

Notice - Rev.003

●Precaution for Mounting / Circuit board design

1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

●Precautions Regarding Application Examples and External Circuits

1) If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2) You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

●Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

●Precaution for Storage / Transportation

1) Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3) Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4) Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

●Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

●Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

●Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

●Precaution Regarding Intellectual Property Rights

1) All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Datasheet

Notice - Rev.003

●Other Precaution

1) The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

2) This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

3) The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

4) In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

5) The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.