1
HLMP-EGxx, HLMP-EHxx, HLMP-ELxx
New T-1¾ (5mm) Extra High Brightness AlInGaP LED Lamps
Data Sheet
Features
x Viewing angle: 15°, 23°, 30°
x High luminous output
x Colors:
590nm Amber
615nm Red Orange
626nm Red
x Package options:
With or without lead standoff
x Superior resistance to moisture
x Untinted for 15°, 23° and 30° lamps
Applications
x Traffic management:
- Traffic signals
- Pedestrian signals
- Work zone warning lights
- Variable message signs
x Solar Power signs
x Commercial outdoor advertising
- Signs
- Marquees
Description
These Precision Optical Performance AlInGaP LEDs
provide superior light output for excellent readability in
sunlight and are extremely reliable. AlInGaP LED tech-
nology provides extremely stable light output over long
periods of time. Precision Optical Performance lamps
utilize the aluminum indium gallium phosphide (AlInGaP)
technology.
These LED lamps are untinted, T-1¾ packages incorpo-
rating second generation optics producing well defined
spatial radiation patterns at specific viewing cone angles.
These lamps are made with an advanced optical grade
epoxy offering superior high temperature and high
moisture resistance performance in outdoor signal and
sign application. The maximum LED junction tempera-
ture limit of +130°C enables high temperature operation
in bright sunlight conditions. The epoxy contains both
uv-a and uv-b inhibitors to reduce the effects of long
term exposure to direct sunlight.
Benefits
x Superior performance for outdoor environments
x Suitable for auto-insertion onto PC board
2
Package Dimension
A: Non-standoff B: Standoff
Viewing Angle d
15° 12.39±0.25
(0.476±0.010)
23° & 30° 11.96±0.25
(0.459±0.010)
Notes:
1. All dimensions are in millimeters (inches)
2. Leads are mild steel with tin plating.
3. The epoxy meniscus is 1.21mm max
4. For Identification of polarity after the
leads are trimmed off, please refer to the
illustration below:
CATHODEANODE
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
2.35 (0.093)
MAX.
CATHODE
FLAT
1.14 ± 0.20
(0.045 ± 0.008)
5.80 ± 0.20
(0.228 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
CATHODE
FLAT
d
1.50 ± 0.15
(0.059 ± 0.006)
5.00 ± 0.20
(0.197 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
3
Part Numbering System
Note: Please refer to AB 5337 for complete information on part numbering system.
Device Selection Guide
Typical viewing
Angle
2θ1/2 (Deg) [4]
Color and Dominant
Wavelength (nm),
Typ [3]
Lamps without Standoff
on leads
(Package drawing A)
Lamps with Standoff
on leads
(Package drawing B)
Luminous Intensity
Iv (mcd) [1,2,5] at 20 mA
Min Max
15° Amber 590 HLMP-EL1A-Z1KDD HLMP-EL1B-Z1KDD 12000 21000
HLMP-EL1A-Z1LDD HLMP-EL1B-Z1LDD 12000 21000
Red 626 HLMP-EG1A-Z10DD HLMP-EG1B-Z10DD 12000 21000
Red Orange 615 HLMP-EH1A-Z10DD HLMP-EH1B-Z10DD 12000 21000
23° Amber 590 HLMP-EL2A-XYKDD HLMP-EL2B-XYKDD 7200 12000
HLMP-EL2A-XYLDD HLMP-EL2B-XYLDD 7200 12000
Red 626 HLMP-EG2A-XY0DD HLMP-EG2B-XY0DD 7200 12000
Red Orange 615 HLMP-EH2A-XY0DD HLMP-EH2B-XY0DD 7200 12000
30° Amber 590 HLMP-EL3A-VWKDD HLMP-EL3B-VWKDD 4200 7200
HLMP-EL3A-VWLDD HLMP-EL3B-VWLDD 4200 7200
HLMP-EL3A-WXKDD HLMP-EL3B-WXKDD 5500 9300
HLMP-EL3A-WXLDD HLMP-EL3B-WXLDD 5500 9300
Red 626 HLMP-EG3A-VW0DD HLMP-EG3B-VW0DD 4200 7200
HLMP-EG3A-WX0DD HLMP-EG3B-WX0DD 5500 9300
Red Orange 615 HLMP-EH3A-WX0DD HLMP-EH3B-WX0DD 5500 9300
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
5. Tolerance for each bin limit is ± 15%
HLMP – E x xx - x x x xx
Mechanical Options
DD : Ammo Pack
Color Bin Selections
0 : Full color distribution
K : Color Bin 2 & 4
L : Color Bin 4 & 6
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Viewing Angle and Lead Standoffs
1A: 15° without lead standoff
1B: 15° with lead standoff
2A: 23° without lead standoff
2B: 23° with lead standoff
3A: 30° without lead standoff
3B: 30° with lead standoff
Color
G : Red 626nm
L : Amber 590nm
H: Red Orange 615nm
Refer to Device Selection Guide
4
Electrical / Optical Characteristics
TJ = 25°C
Parameter Symbol Min Typ.Max Units Test Conditions
Forward Voltage
Amber/ Red / Red Orange VF1.8 2.1 2.4 V
IF = 20 mA
Reverse Voltage VR5VI
R = 100 μA
Dominant Wavelength [1]
Amber
Red
Red Orange
Od
584.5
618.0
612.0
590.0
626.0
615.0
594.5
630.0
619.0
nm IF = 20 mA
Peak Wavelength
Amber
Red
Red Orange
OPEAK
594
634
621
nm Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
Spectral Halfwidth
Amber
Red
Red Orange
ΔO1/2
13
14
14
nm
Thermal resistance RTJ-PIN 240 °C/W LED junction to anode lead
Luminous Efficacy [2]
Amber
Red
Red Orange
ηv
500
200
265
lm/W Emitted Luminous Flux/
Emitted Radiant Flux
Luminous Flux
Amber
Red
Red Orange
Φv
2100
2300
2300
mlm IF = 20 mA
Luminous Efficiency [3]
Amber
Red
Red Orange
ηe
50
55
55
lm/W Emitted Luminous
Flux/Electrical Power
Thermal coefficient of Od
Amber
Red
Red Orange
0.08
0.05
0.07
nm/°C IF = 20 mA ;
+25°C ≤ TJ ≤ +100°C
Notes:
1. The dominant wavelength, λd is derived from the CIE Chromaticity Diagram referenced to Illuminant E. Tolerance for each color of dominant
wavelength is +/- 0.5nm.
2. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / ηV where Iv is the luminous intensity in candela and ηV is
the luminous efficacy in lumens/ watt.
3. ηe = Φv /IF x VF where Φv is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
Absolute Maximum Ratings
TJ = 25°C
Parameter Red/ Amber/ Red Orange Unit
DC Forward Current [2] 50 mA
Peak Forward Current 100 [1] mA
Average forward current 30 mA
Power Dissipation 120 mW
Reverse Voltage 5 V
Operating Temperature Range -40 to +100 °C
Storage Temperature Range -40 to +100 °C
Notes:
1. Duty Factor 30%, frequency 1KHz.
2. Derate linearly as shown in Figure 4
5
Figure 1. Relative Intensity vs Peak Wavelength Figure 2. Forward Current vs Forward Voltage
Figure 3. Relative Luminous Intensity vs Forward Current Figure 4. Maximum Forward Current vs Ambient Temperature
Figure 5.Radiation Pattern for 15° Viewing Angle Lamp Figure 6. Radiation Pattern for 23° Viewing Angle Lamp
0
20
40
60
80
100
0123
FORWARD VOLTAGE-V
FORWARD CURRENT-mA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0 20406080100
DC FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
0
10
20
30
40
50
60
0 20 40 60 80 100
TA - AMBIENT TEMPERATURE - -C
IFMAX - MAXIMUM FORWARD CURRENT - mA
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
NORMALIZED INTENSITY
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
NORMALIZED INTENSITY
0.0
0.2
0.4
0.6
0.8
1.0
500 550 600 650
WAVELENGTH - nm
RELATIVE INTENSITY
RedAmber
Red Orange
6
0.0
0.2
0.4
0.6
0.8
1.0
-90 -60 -30 0 30 60 90
ANGULAR DISPLACEMENT-DEGREE
NORMALIZED INTENSITY
Figure 7. Radiation Pattern for 30° Viewing Angle Lamp
Relative Forward Voltage vs Junction Temperature
Relative Light Output vs Junction Temperature
0.1
1.0
10.0
-40 -20 0 20 40 60 80 100 120 140
TJ - JUNCTION TEMPERATURE - °C
RELATIVE LIGHT OUTPUT
(NORMALIZED AT TJ=25°C)
-0.30
-0.25
-0.20
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
0.20
-40 -20 0 20 40 60 80 100 120 140
TJ - JUNCTION TEMPERATURE - °C
FORWARD VOLTAGE SHIFT - V
Red Orange
Red
Amber
Red Orange
Red
Amber
7
Intensity Bin Limit Table (1.3:1 Iv bin ratio)
Bin
Intensity (mcd) at 20mA
Min Max
V 4200 5500
W 5500 7200
X 7200 9300
Y 9300 12000
Z 12000 16000
1 16000 21000
Tolerance for each bin limit is ± 15%
VF Bin Table (V at 20mA)
Bin IDMin Max
VD 1.8 2.0
VA 2.0 2.2
VB 2.2 2.4
Tolerance for each bin limit is ± 0.05V
Avago Color Bin on CIE 1931 Chromaticity Diagram
0.280
0.300
0.320
0.340
0.360
0.380
0.400
0.420
0.440
0.460
0.500 0.550 0.600 0.650 0.700 0.750 0.800
X
Y
2
4
6
Amber
Red
Red Orange
Red Color Range
Min
Dom
Max
Dom X min Y Min X max Y max
618 630 0.6872 0.3126 0.6890 0.2943
0.6690 0.3149 0.7080 0.2920
Tolerance for each bin limit is ± 0.5nm
Amber Color Range
Bin
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
2 587 589.5 0.5570 0.4420 0.5670 0.4250
0.5530 0.4400 0.5720 0.4270
4 589.5 592 0.5720 0.4270 0.5820 0.4110
0.5670 0.4250 0.5870 0.4130
6 592 594.5 0.5870 0.4130 0.5950 0.3980
0.5820 0.4110 0.6000 0.3990
Tolerance for each bin limit is ± 0.5nm
Red Orange Color Range
Min
Dom
Max
Dom Xmin Ymin Xmax Ymax
612 619 0.6712 0.6887 0.6716 0.6549
0.3280 0.3109 0.3116 0.3282
Tolerance for each bin limit ± 0.5nm
Note:
All bin categories are established for classification of products. Products
may not be available in all bin categories. Please contact Avago
representative for further information.
8
Precautions:
Lead Forming:
x The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
x For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
x If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
x Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
x LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
1.59mm
x ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
x Recommended soldering condition:
Wave Soldering
[1, 2]
Manual Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 60 sec Max -
Peak temperature 260 °C Max. 260 °C Max.
Dwell time 5 sec Max. 5 sec Max
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
x Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
Anode
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 260°C and the solder
contact time does not exceeding 5sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED Configuration
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
x Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
Note: In order to further assist customer in designing jig accurately
that fit Avago Technologies’ product, 3D model of the product is
available upon request.
x At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
x If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
x Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
x Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
9
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Ammo Packs Drawing
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
60sec Max
TIME (sec)
260 °C Max
105 °C Max
TEMPERATURE (°C)
10
Packaging Box for Ammo Packs
Note: The dimension for ammo pack is applicable for the device with standoff and without standoff.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
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AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR
FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
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(ii) Avago Baby Label (Only available on bulk packaging)
Acronyms and Definition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color
bin and VF bin)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB”
2: Color bin 2 only
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-1687EN - February 23, 2010