Micro Chip Fuse
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
Product Code
Micro Chip Fuse
Structure
Rectangular type
Product shape
1206 inch size
(3.2 mm҂1.6 mm)
Packaging Type
Code
Punched Carrier Taping
4mmpitch, 5,000 pcs.
R
2
B
3
R
4
D
5
1
6 7
R
8
0
9
0
10
X
V
R
G
0603 inch size
(1.6 mm҂0.8 mm)
E
Rated Current (A)
0R25
0R31
0R37
0R50
0R75
1R00
1R25
0.25 A
0.315 A
0.375 A
0.50 A
0.75 A
1.0 A
1.25 A
1R50
2R00
2R50
3R00
4R00
5R00
1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
5.0 A
0402 inch size
(1.0 mm҂0.5 mm)
DPressed Carrier Taping
2mmpitch, 10,000 pcs. ERBRD
ERBRE
ERBRG
X
Almina Substrate
Fusing Element Electrode
(Outer)
Protective Coating Electrode (Base)
a
b
t
W
L
Micro Chip Fuse
Type: ERBRD
ERBRE
ERBRG
■Explanation of Part Numbers
■Features
● Small size
● Fast-acting and withstanding in-rush current characteristics
● RoHS compliant
■Construction ■Dimensions in mm (not to scale)
Type
(inch size)
Dimensions (mm)
Mass (Weight)
(g/1000 pcs.)
LWa b t
ERBRD
(0402) 1.00±0.10 0.50+0.10 0.15±0.10 0.25±0.10 0.39
±0.10 0.7
ERBRE
(0603) 1.60±0.15 0.80+0.15 0.24±0.15 0.30±0.15 0.54
±0.10 2.2
ERBRG
(1206) 3.20±0.20 1.60±0.15 0.30±0.20 0.55±0.20 0.65±0.10 10
-0.05
-0.05
■Approved Safety Standards
UL248-14 : File No.E194052
c-UL C22.2 No.248-14 : File No.E194052
Aug. 201101
Micro Chip Fuse
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
■Ratings
● 0603 inch size : Type ERBRE
Part No. ERBRE첸R첸첸V
0R50 0R75 1R00 1R25 1R50 2R00 2R50 3R00 4R00 5R00
Rated Current (A) 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0 4.0 5.0
Marking Code F G H J K N O P S T
Internal R (m액) at 25 °C max.
330 190 125 94 72 51 40 33 22 19
Fusing Current/Fusing Time
(at 25 °C)
Rated Current ҂100 %/4 hours min.
Rated Current ҂200 %/5 seconds max.
Rated Current ҂300 %/0.2 seconds max.
Rated Voltage
(Open Circuit Voltage) 32 VDC
Interrupting Rating
(at Rated Voltage) 50 A
Category Temp. Range −40 °C to ＋125 °C
● 0402 inch size : Type ERBRD
Part No. ERBRD첸R첸첸X
0R25 0R31 0R37 0R50 0R75 1R00 1R25 1R50 2R00 2R50 3R00
Rated Current (A) 0.25 0.315 0.375 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0
Marking Code V X Y F G H J K N O P
Internal R (m액) at 25 °C max.
700 520 440 310 190 125 82 70 53 42 37
Fusing Current/Fusing Time
(at 25 °C)
Rated Current ҂100 %/4 hours min.
Rated Current ҂200 %/5 seconds max.
Rated Current ҂300 %/0.2 seconds max.
Rated Voltage
(Open Circuit Voltage) 32 VDC
Interrupting Rating
(at Rated Voltage) 35 A
Category Temp. Range −40 °C to ＋125 °C
Part No. ERBRG첸R첸첸V
0R50 0R75 1R00 1R25 1R50 2R00 2R50 3R00 4R00
Rated Current (A) 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0 4.0
Marking Code F G H J K N O P S
Internal R (m액) at 25 °C max.
560 340 210 175 115 85 65 45 35
Fusing Current/Fusing Time
(at 25 °C)
Rated Current ҂100 %/4 hours min.
Rated Current ҂200 %/5 seconds max.
Rated Current ҂300 %/0.2 seconds max.
Rated Voltage
(Open Circuit Voltage) 63 VDC 32 VDC
Interrupting Rating
(at Rated Voltage) 50 A
Category Temp. Range −40 °C to ＋125 °C
● 1206 inch size : Type ERBRG
✽
The thin type is available about 1005 (0402 inch) size. Please contact us for details.
✽
Please contact us when another rated current is needed.
Aug. 201102
Micro Chip Fuse
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
TT
A
P0
P2
P1
P1
φD0
B
F
W
E
(2mmpitch)
Pressed
Carrier
Punched
Carrier
φN
W2
W1
φA
φC
100
Fusing Time (s)
0.0001
0.001
0.01
0.1
1
10
0.1 1 10 100
Fusing Time (s)
0.0001
0.001
0.01
0.1
10
1
0.1 1 10
Fusing Current (A) Fusing Current (A)
0.5 A
0.75 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
5.0 A
● 1608 (0603 inch) size
(Type ERBRE)
● 1005 (0402 inch) size
(Type ERBRD)
0.5 A
0.25 A
0.315 A
0.375 A
0.75 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
100
Fusing Time (s)
0.0001
0.001
0.01
0.1
1
10
0.1 1 10
Fusing Current (A)
● 3216 (1206 inch) size
(Type ERBRG)
0.5 A
0.75 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
✽ Reference Only
✽ Reference Only
✽ Reference Only
■Fusing Characteristics (25 °C typical)
● Carrier Taping ● Taping Reel
■Packaging Methods
● Standard Quantity
Type A B W F E
ERBRD 0.68±0.10 1.20±0.10
8.00±0.20 3.50±0.05 1.75±0.10
ERBRE 1.10±0.10 1.90±0.10
ERBRG 2.00±0.15 3.60±0.20
Type Kind of Taping Pitch (P1) Quantity
ERBRD Pressed Carrier Taping 2 mm 10000 pcs./ reel
ERBRE Punched Carrier Taping 4 mm 5000 pcs./ reel
ERBRG
(Unit : mm)
Type P1P2P0φD0T
ERBRD 2.00±0.10
2.00±0.05 4.00±0.10 1.50+0.10
0.67±0.07
ERBRE 4.00±0.10 0.78±0.07
ERBRG 0.84±0.07
(Unit : mm)
Type φAφNφCW
1W2
ERBRD
ERBRE
ERBRG
180.0–1.5 60 0 13.0±0.2 9.0 0 11.4±1.0
0 +1.0 +1.0
0
May. 201201
Micro Chip Fuse
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
C
A
B
Preheating
Peak
Heating
Temperature
Time
The following are precautions for individual products. Please also refer to the common precautions shown of this
catalog.
1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses)
under normal conditions is within 70% of the rated current.
2. Do not continuously pass a current exceeding the rated current through the fuses.
3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take
care not to cause unwanted fusing. Calculate the I2t value of the pulse and check the tolerance to the number
of pulses according to the I2t-t characteristic curve before deciding to use the fuses. Before checking the
tolerance, consult our sales staff in advance.
4. The fuses are designed to be blown out by a current that is double or greater than the rated current. Ensure
that the abnormal current generated when a circuit abnormality occurs in your product is at least double or
greater than the rated current of the fuses. In addition, ensure that the abnormal cur rent of your product does not
exceed the maximum interrupting current of the fuses.
5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the primary
side.
6. Ensure that the voltage applied to the fuses are within their rated voltage.
7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the fuses
on your products and carefully check and evaluate their category temperature range.
Safety Precautions
■Recommended Land Pattern
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Type
(inch size)
Dimensions (mm)
ABC
ERBRD(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
ERBRE(0603) 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0
ERBRG(1206) 2.0 to 2.4 4.4 to 5.0 1.2 to 1.8
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
For soldering For lead-free soldering
Temperature TimeTemperatureTime
Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s
Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s
■Recommended Soldering Conditions
Recommendations and precautions are described below.
●Recommended soldering conditions for refl ow
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
●Recommended soldering conditions for fl ow
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
May. 201201
