SN74CBT3253C DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER 5-V BUS SWITCH WITH -2-V UNDERSHOOT PROTECTION www.ti.com SCDS123B - JULY 2003 - REVISED JANUARY 2007 FEATURES * * * * * * * * * * * * * * * SN74CBT3253C Functionally Identical to Industry-Standard '3253 Function Undershoot Protection for Off-Isolation on A and B Ports up to -2 V Bidirectional Data Flow, With Near-Zero Propagation Delay Low ON-State Resistance (ron) Characteristics (ron = 3 Typical) Low Input/Output Capacitance Minimizes Loading and Signal Distortion (Cio(OFF) = 5.5 pF Typical) Data and Control Inputs Provide Undershoot Clamp Diodes Low Power Consumption (ICC = 3 A Max) VCC Operating Range From 4 V to 5.5 V Data I/Os Support 0 to 5-V Signaling Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 - 2000-V Human-Body Model (A114-B, Class II) - 1000-V Charged-Device Model (C101) Supports I2C Bus Expansion Supports Both Digital and Analog Applications: USB Interface, Bus Isolation, Low-Distortion Signal Gating DESCRIPTION/ORDERING INFORMATION The SN74CBT3253C is a high-speed TTL-compatible FET multiplexer/demultiplexer with low ON-state resistance (ron), allowing for minimal propagation delay. Active Undershoot-Protection Circuitry on the A and B ports of the SN74CBT3253C provides protection for undershoot up to -2 V by sensing an undershoot event and ensuring that the switch remains in the proper OFF state. The SN74CBT3253C is organized as two 1-of-4 multiplexer/demultiplexers with separate output-enable (1OE, 2OE) inputs. The select (S0, S1) inputs control the data path of each multiplexer/demultiplexer. When OE is low, the associated multiplexer/demultiplexer is enabled, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the associated multiplexer/demultiplexer is disabled, and a high-impedance state exists between the A and B ports. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2003-2007, Texas Instruments Incorporated SN74CBT3253C DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER 5-V BUS SWITCH WITH -2-V UNDERSHOOT PROTECTION www.ti.com SCDS123B - JULY 2003 - REVISED JANUARY 2007 DESCRIPTION/ORDERING INFORMATION (CONTINUED) This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION PACKAGE (1) TA QFN - RGY SOIC - D -40C to 85C SSOP - DB SSOP (QSOP) - DBQ TSSOP - PW (1) ORDERABLE PART NUMBER Reel of 1000 SN74CBT3253CRGYR Tube of 40 SN74CBT3253CD Reel of 2500 SN74CBT3253CDR Tube of 80 SN74CBT3253CDB Reel of 2000 SN74CBT3253CDBR Reel of 2500 SN74CBT3253CDBQR Tube of 90 SN74CBT3253CPW Reel of 2000 SN74CBT3253CPWR CU253C CBT3253C CU253C CU253C CU253C Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each multiplexer/demultiplexer) INPUTS 2 TOP-SIDE MARKING S0 INPUT/OUTPUT A FUNCTION L L B1 A port = B1 port L H B2 A port = B2 port L H L B3 A port = B3 port L H H B4 A port = B4 port H X X X Disconnect OE S1 L L Submit Documentation Feedback SN74CBT3253C DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER 5-V BUS SWITCH WITH -2-V UNDERSHOOT PROTECTION www.ti.com SCDS123B - JULY 2003 - REVISED JANUARY 2007 LOGIC DIAGRAM (POSITIVE LOGIC) 7 1A 6 1B1 SW 5 1B2 SW 4 1B3 SW 3 1B4 SW 10 9 2A 2B1 SW 11 2B2 SW 12 2B3 SW 13 SW 2B4 14 S0 2 S1 1 1OE 15 2OE SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW) (1) EN (1) EN is the internal enable signal applied to the switch. Submit Documentation Feedback 3 SN74CBT3253C DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER 5-V BUS SWITCH WITH -2-V UNDERSHOOT PROTECTION www.ti.com SCDS123B - JULY 2003 - REVISED JANUARY 2007 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage -0.5 7 V VIN Control input voltage range (2) (3) -0.5 7 V VI/O Switch I/O voltage range (2) (3) (4) IIK Control input clamp current VIN < 0 -50 mA II/OK I/O port clamp current VI/O < 0 -50 mA 128 mA 100 mA II/O ON-state switch -0.5 current (5) Continuous current through VCC or GND terminals JA Tstg (1) (2) (3) (4) (5) (6) (7) Package thermal impedance 7 D package (6) 73 DB package (6) 82 DBQ package (6) 90 PW package (6) 108 RGY package (7) 39 Storage temperature range -65 150 UNIT V C/W C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Recommended Operating Conditions (1) MIN MAX VCC Supply voltage 4 5.5 V VIH High-level control input voltage 2 5.5 V VIL Low-level control input voltage 0 0.8 V VI/O Data input/output voltage 0 5.5 V TA Operating free-air temperature -40 85 C (1) 4 UNIT All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback SN74CBT3253C DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER 5-V BUS SWITCH WITH -2-V UNDERSHOOT PROTECTION www.ti.com SCDS123B - JULY 2003 - REVISED JANUARY 2007 Electrical Characteristics (1) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK Control inputs MIN TYP (2) TEST CONDITIONS VCC = 4.5 V, IIN = -18 mA VIKU Data inputs VCC = 5 V, 0 mA > II -50 mA, VIN = VCC or GND, IIN Control inputs VCC = 5.5 V, VIN = VCC or GND IOZ (3) VCC = 5.5 V, VO = 0 to 5.5 V, VI = 0, Switch OFF, VIN = VCC or GND Ioff VCC = 0, VO = 0 to 5.5 V, VI = 0 VCC = 5.5 V, II/O = 0, VIN = VCC or GND, Switch ON or OFF One input at 3.4 V, Other inputs at VCC or GND ICC ICC (4) Control inputs VCC = 5.5 V, Cin Control inputs VIN = 3 V or 0 Cio(OFF) A port B port Cio(ON) Switch OFF UNIT -1.8 V -2 V 1 A 10 A 10 A 3 A 2.5 mA 3.5 pF 14 VI/O = 3 V or 0, Switch OFF, VIN = VCC or GND VI/O = 3 V or 0, Switch ON, VIN = VCC or GND VCC = 4 V, TYP at VCC = 4 V VI = 2.4 V, IO = -15 mA 8 12 IO = 64 mA 3 6 IO = 30 mA 3 6 IO = -15 mA 5 10 ron (5) VI = 0 VCC = 4.5 V VI = 2.4 V, (1) (2) (3) (4) (5) MAX pF 5.5 22 pF VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins. All typical values are at VCC = 5 V (unless otherwise noted), TA = 25C. For I/O ports, the parameter IOZ includes the input leakage current. This is the increase in supply current for each input that is at the specified voltage level, rather than VCC or GND Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals. Switching Characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 3) VCC = 5 V 0.5 V MIN MIN TO (OUTPUT) tpd (1) A or B B or A 0.24 0.15 ns tpd(s) S A 5.9 1.5 5.4 ns S B 6.2 1.5 5.8 OE A or B 5.7 1.5 5.3 S B 6.2 1.5 5.8 OE A or B 5.7 1.5 5.3 ten tdis (1) VCC = 4 V FROM (INPUT) PARAMETER MAX UNIT MAX ns ns The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). Submit Documentation Feedback 5 SN74CBT3253C DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER 5-V BUS SWITCH WITH -2-V UNDERSHOOT PROTECTION www.ti.com SCDS123B - JULY 2003 - REVISED JANUARY 2007 Undershoot Characteristics See Figure 1 and Figure 2 PARAMETER VOUTU (1) TEST CONDITIONS VCC = 5.5 V, Switch OFF, VIN = VCC or GND MIN TYP (1) 2 VOH - 0.3 MAX All typical values are at VCC = 5 V (unless otherwise noted), TA = 25C. 100 k 50 100 k Figure 1. Device Test Setup 6 Submit Documentation Feedback Figure 2. Transient Input Voltage (VI) and Output Voltage (VOUTU) Waveforms (Switch OFF) UNIT V SN74CBT3253C DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER 5-V BUS SWITCH WITH -2-V UNDERSHOOT PROTECTION www.ti.com SCDS123B - JULY 2003 - REVISED JANUARY 2007 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN 50 50 VG1 TEST CIRCUIT DUT 7V Input Generator S1 RL VO VI 50 50 VG2 CL (see Note A) RL TEST VCC S1 RL VI CL tpd(s) 5 V 0.5 V 4V Open Open 500 500 VCC or GND VCC or GND 50 pF 50 pF tPLZ/tPZL 5 V 0.5 V 4V 7V 7V 500 500 GND GND 50 pF 50 pF 0.3 V 0.3 V tPHZ/tPZH 5 V 0.5 V 4V Open Open 500 500 VCC VCC 50 pF 50 pF 0.3 V 0.3 V V 3V Output Control (VIN) 1.5 V 3V 1.5 V 1.5 V 0V tPLH VOH Output 1.5 V Output Waveform 1 S1 at 7 V (see Note B) tPLZ 3.5 V 1.5 V 1.5 V VOL Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES (tpd(s)) VOL + V VOL tPZH tPHL 1.5 V 0V tPZL Output Control (VIN) Open GND tPHZ VOH 1.5 V VOH - V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). H. All parameters and waveforms are not applicable to all devices. Figure 3. Test Circuit and Voltage Waveforms Submit Documentation Feedback 7 PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) SN74CBT3253CD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CDBQR ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74CBT3253CDBQRE4 ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74CBT3253CDBQRG4 ACTIVE SSOP DBQ 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74CBT3253CDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 16-Aug-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) SN74CBT3253CPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBT3253CRGYR ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74CBT3253CRGYRG4 ACTIVE VQFN RGY 16 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74CBT3253CDBR Package Package Pins Type Drawing SSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DB 16 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1 SN74CBT3253CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 SN74CBT3253CPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 SN74CBT3253CRGYR VQFN RGY 16 3000 330.0 12.4 3.8 4.3 1.5 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74CBT3253CDBR SSOP DB 16 2000 367.0 367.0 38.0 SN74CBT3253CDR SOIC D 16 2500 333.2 345.9 28.6 SN74CBT3253CPWR TSSOP PW 16 2000 367.0 367.0 35.0 SN74CBT3253CRGYR VQFN RGY 16 3000 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E - JANUARY 1995 - REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0-8 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. 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