Technical Data DS4313 Effective June 2017
Supersedes Sepetember 2011
Product features
•13.7 x 12.9 x 8.0mm surface mount package
•High current handling capability, compact
footprint
•Ferrite core material
•Inductance range from 0.110µH to 0.440µH
•Current range from 32 to 120 amps
•Frequency range up to 2MHz
•Halogen free, lead free, RoHS compliant
Applications
•Voltage regulator modules (VRMs) for servers
and microprocessors
•Multi-phase buck inductors
•High frequency, high current switching power
supplies
•Storage temperature range (component):
-40 °C to +125 °C
•Operating temperature range: -40 °C to +125 °C
(ambient plus self-temperature rise)
•Solder reflow temperature:
J-STD-020 (latest revision) compliant
FP1308
High frequency, high current power inductors
Pb
HALOGEN
HF
FREE
SMD Device Environmental data
W DE
FP1308R3-R
NE
RECOMMENDED FOR
SIGNS
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc
2I
rms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
3I
sat: Peak current for approximately 20% rolloff at +25°C.
4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K *L *ΔI. Bp-p (mT): (Gauss), K:
(K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps).
5 Part Number Definition: FP1308-xxx-R
• FP1308 = Product code and size
• xxx= Inductance value in μH, R = decimal point. If no “R” is present, then
third character = # of zeros.
• “-R” suffix = RoHS compliant
Product Specifications
Part Rated OCL1Irms2Isat3DCR (mΩ) @ DCR (mΩ) @ K-factor4
Number5Inductance (μH) ± 10% (μH) (Amps) (Amps) 25°C Typical 25°C Max
FP1308-R11-R 0.110 0.110 68 120 0.20 0.24 21.330
FP1308-R21-R 0.210 0.210 68 72 0.20 0.24 21.333
FP1308-R26-R 0.260 0.260 68 60 0.20 0.24 21.335
FP1308-R32-R 0.320 0.320 68 45 0.20 0.24 21.340
FP1308-R44-R 0.440 0.440 68 32 0.20 0.24 21.366
2
Technical Data DS4313
Effective June 2017
FP1308
High frequency, high current power inductors
www.eaton.com/electronics
W DES
FP1308R3-R
NE
RECOMMENDED FOR
IGNS
1
2
FP1308-XXX
wwllyy R
12.95 max.
13.70 max.
8.0 max.
5.4
2.54 (2plcs)
8.0
7.62
3.18
7.2
1
2
Top View Bottom View Recommended Pad Layout
Front View
Left View
Schematic
DDiimmeennssiioonnss -- mmmm
2.0 1.5 diia. min A
1.75
Section A-A
11.5
24.0 ±0.3
13.9
FP1308-XXX
wwllyy R
13.2 A
User direction of feed
4.0
1.5 dia. +0.1/-0.0
8.2
0
20
40
60
80
100
Total Loss (W)
Temperature Rise (°C)
3
2.52
1.5
10.50
Part Marking: FP1308 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # 0f zeros wwllyy = Date code R = Revision level
Supplied in tape-and-reel packaging, 400 parts per reel, 13” diameter reel.
Packaging Information - mm
Temperature Rise vs. Total Loss
3
FP1308
High frequency, high current power inductors
www.eaton.com/electronics
Technical Data DS4313
Effective June 2017
Core Loss vs B
0.0001
0.001
0.01
0.1
1
10
1000100101
B (mT)
1MHz
500kHz
300kHz
100kHz
50kHz
Core L o ss (W)
p-p
p-
p
OCL vs I sat
0%
20%
40%
60%
80%
100%
120%
0% 20% 40% 60% 80% 100% 120% 140% 160%
%ofI
sat
%ofOCL
+25 °C
-40 °C
+125 °C
Inductance Characteristics
Core Loss
FP1308R3-R
NEW DES
RECOMMENDED FOR
IGNS
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/electronics
© 2017 Eaton
All Rights Reserved
Printed in USA
Publication No. DS4313 BU-SB111090
June 2017
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Solder Reflow Profile
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
25°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
Ta
ab
bl
le
e
1
1
-
-
S
St
ta
an
nd
da
ar
rd
d
S
Sn
nP
Pb
b
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
VolumeVolume
Package mm3mm3
Thickness <350 _
>350
<2.5mm 235°C220°C
_
>2.5mm 220°C220°C
T
Ta
ab
bl
le
e
2
2
-
-
L
Le
ea
ad
d
(
(P
Pb
b)
)
F
Fr
re
ee
e
S
So
ol
ld
de
er
r
(
(T
Tc
c)
)
Volume Volume Volume
Package mm3mm3mm3
Thickness <350 350 - 2000 >2000
<1.6mm 260°C260°C260°C
1.6 – 2.5mm 260°C250°C245°C
>2.5mm 250°C245°C245°C
Reference JDEC J-STD-020
Standard SnPb Solder Lead (Pb) Free SolderProfile Feature
Preheat and Soak•eTmperature min. (Tsmin) 100°C150°C
• Temperature max. (Tsmax) 150°C200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds60-120 Seconds
3°C/ Second Max. 3°C/ Second Max.
183°C217°C
60-150 Seconds60-150 Seconds
Table 1 able 2T
20 Seconds** 30 Seconds**
6°C/ Second Max. 6°C/ Second Max.
Average ramp up rate Tsmaxto Tp
Liquidous temperature (T
L
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tpto Tsmax)
Time 25°C to Peak Temperature Minutes Max.68 Minutes Max.
*Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Technical Data DS4313
Effective June 2017
FP1308
High frequency, high current power inductors
FP1308R3-R
NEW DES
RECOMMENDED FOR
IGNS
