2001 Microchip Technology Inc. Preliminary DS41115C-page 1
HCS101
FEATURES
Operating
2 Programmable 32-bit serial numbers
10-bit serial number
66-bit transmission code length
Non-volatile 16-bit counter
3.5V -13.3V operation
3 inputs, 7 functions available
Selectable baud rate
Automatic code word completion
Battery low signal transmitted to receiver
Other
Pin-out compatible with most KEELOQ®Encoders
Simple programming interface
On-chip EEPROM
On-chip oscillator and timing components
Button inputs have internal pull-down resistors
Minimum External Components required
Typical Applications
The HCS101 is ideal for remote control applications.
These applications include:
Low-end automotive alarm systems
Low-end automotive immobilizers
Gate and garage door openers
Identity tokens
Low-end burglar alarm systems
Fan and lighting controls
•Toys
DESCRIPTION
The HCS101 from Microchip Technology Inc. is a fixed
code encoder designed for remote control systems. It
provides a small package outline and low cost to make
this device a perfect solution for unidirectional remote
control systems.
It is also pin compatiblewith Microchip’s HCS201 Code
Hopping Encoder allowing easy upgrading to a more
secure remote keyless entry (RKE) system.
The 8-pin HCS101 operates over a wide voltage range
of 3.5V to 13.3V and has three button inputs allowing
the system designerthe freedomto utilize up to 7 func-
tions. The only components required for device opera-
tion are the buttons andRF circuitry, allowing a verylow
system cost.
PACKAGE TYPES
HCS101 BLOCK DIAGRAM
1
2
3
4
8
7
6
5
S0
S1
S2
NC
VDD
NC
DATA
VSS
PDIP, SOIC
HCS101
VSS
VDD
Power
latching
and
switching
Button input port
Transmit register
EEPROM
DATA
S2 S1 S0
Oscillator
RESET Circuit Controller
Fixed Code Encoder
HCS101
DS41115C-page 2 Preliminary
2001 Microchip Technology Inc.
1.0 SYSTEM OVERVIEW
As indicated in the block diagram in Figure 1-1, the
HCS101 has a small EEPROM array, which must be
loaded with several parameters before use. These
parameters include:
Two 32-bit serial numbers
16-bit counter value
Additional 10-bit serial number
Configuration data
The EEPROM data for each transmitter is programmed
by the manufacturer at the time of production.
Any type of controller may be used as a receiver, but it
is typically a microcontroller with compatible firmware
that allows the receiver to operate in conjunction with a
transmitter, based on the HCS101.
FIGURE 1-1: BASIC OPERATION OF TRANSMITTER ENCODER
EEPROM Array
Serial Number 1
Transmitted Information
Serial Number 3
Counter
Counter
Serial
Number 3 Function
Bits
Function
Bits
Serial Number 1
2001 Microchip Technology Inc. Preliminary DS41115C-page 3
HCS101
2.0 DEVICE OPERATION
As shown in the typical application circuits in Figure 2-
1, the HCS101 is easy to use. It requires only the addi-
tion of buttons and RF circuitry for use as the transmit-
ter in your application.A descriptionof each pin is given
in Table 2-1.
FIGURE 2-1: TYPICAL CIRCUITS
TABLE 2-1: PIN DESCRIPTIONS
The HCS101 will wake-up upon detecting a switch clo-
sure and then delay for a debounce delay (TDB)as
shown in Figure 2-2. The device will then update the
16-bit counter before it loads the transmit register. The
data is then transmitted serially on the DATA pin in
Pulse Width Modulation (PWM) format.
If additionalbuttons are pressed during a transmission,
the current transmission is terminated. The HCS101
restarts and the new transmission will contain the latest
button information. When all buttons are released, the
device completes the current code word and then pow-
ers down. Released buttons do not terminate and/or
restart transmissions.
FIGURE 2-2: ENCODER OPERATION
Name Pin
Number Description
S0 1 Switch input 0
S1 2 Switch input 1
S2 3 Switch input2/Clockpin for
Programming mode
NC 4 No connection
VSS 5 Ground reference connection
DATA 6 Pulse Width Modulation (PWM)
output pin/Data pin for
Programming mode
NC 7 No connection
VDD 8 Positive supply voltage connection
VDD
B0
Tx out
S0
S1
S2
NC
NC
VDD
DATA
VSS
2 button remote control
B1
Tx out
S0
S1
S2
NC
VDD
DATA
VSS
4buttonremotecontrol
B3 B2 B1 B0
Note: Upto7functionscanbeimplemented
by pressing more than one button
simultaneously or by using a suitable
diode array.
NC
VDD
Power-Up
RESET and Debounce Delay
Sample Inputs
Update Counter
Load Transmit Register
Buttons
Added
?
All
Buttons
Released
?
(A button has been pressed)
Transmit
Stop
No
Yes
No
Yes
Complete Code
Word Transmission
HCS101
DS41115C-page 4 Preliminary
2001 Microchip Technology Inc.
3.0 TRANSMITTED WORD
3.1 Transmission Format (PWM Mode)
The HCS101 transmission is made up of several code
words as shown in Figure 3-1. Each code word starts
with a preamble and a header, followed by the data.
The code word is followed by a guard period before the
next code word begins. The same code word is trans-
mitted as long as the button is pressed. Refer to
Table 7-3 for transmission timing requirements.
3.2 Code Word Organization
The HCS101 transmits a 66-bit code word. The 66-bit
word is constructed from the serial numbers, counter
and function information. The code word format is
showninFigure3-2.
Under normal conditions, serial number 1istransmitted
with the counter and serial number 3. If all the buttons
are pressed, serial number 2 is transmitted in place of
the counter and serial number 3.
FIGURE 3-1: CODE WORD TRANSMISSION FORMAT
FIGURE 3-2: CODE WORD ORGANIZATION
LOGIC ‘0’
LOGIC ‘1’
Bit
Period
Preamble Header Counter, SER_3
and Function
Guard
Time
Tp Th Tg
Start Pulse
(Te)
SER_1
and Function
TE
Serial Number 3
(10 bits)
Transmission Direction
Serial Number 1Function**
(0/4 bits) (32/28 bits)**
* See Section 4.3.6, S3 Setting (S3SET)
** See Section 4.3.7 Extended Serial Number (XSER)
*** Serial Number 2 is transmitted when all buttons are pressed LSb first
S2 S1 S0 S3*
S2 S1 S0 S3*
(16 bits)
Counter ‘00
(2 bits)
Function
(4 bits)
‘1’
(1 bit) VLOW
(1 bit)
Serial Number 2***
(32 bits)
MSb LSb
2001 Microchip Technology Inc. Preliminary DS41115C-page 5
HCS101
4.0 EEPROM MEMORY
ORGANIZATION
The HCS101 contains 192 bits (12 x 16-bit words) of
EEPROM memory as shown in Table 4-1. Further
descriptions of the memory array are given in the fol-
lowing sections.
TABLE 4-1: EEPROM MEMORY MAP
4.1 CNTR (Counter)
This is the 16-bit gray code counter value that can be
used to track the number of times a transmitter has
been activated.
4.2 SER_1, SER_2, SER_3 (Encoder
Serial Number)
SER_1, and SER_2 are the 32-bit device serial num-
bers.SER_3 is an additional 10-bitserial number trans-
mitted with every transmission. The most significant 6
bits of the 16-bit SER_3 word are reserved and should
be set to zero.
4.3 Configuration Word
The configuration word is a 16-bit word stored in the
EEPROM array that is used by the device to store the
status configuration options. Further explanations of
each of the bits are described in the following sections.
TABLE 4-2: CONFIGURATION WORD
4.3.1 OSCILLATOR TUNING BITS
(OSC0 TO OSC3)
These bits are used to tune the nominal frequency of
the HCS101 to within ±10% of its nominal value over
temperature and voltage.
4.3.2 LOW VOLTAGE TRIP POINT
SELECT (VLOWS)
The low voltage trip point selectbit (VLOWS) and the S3
setting bit (S3SET) are used to determine the voltage
level for the low voltage detector.
* See also Section 4.3.6
4.3.3 BAUDRATE SELECT BITS (BRS)
BRS selects the speed of transmission and the code
word blanking. Table 4-3 shows how the bit is used to
selectthe different baud rates and Section 5.2 provides
a detailed explanation of code word blanking.
TABLE 4-3: BAUDRATE SELECT
WORD
ADDRESS MNEMONIC DESCRIPTION
0 RESERVED Set to 0000H
1 RESERVED Set to 0000H
2 RESERVED Set to 0000H
3 RESERVED Set to 0000H
4 CNTR Counter
5 RESERVED Set to 0000H
6 SER_1 Device Serial Number 1
(word0)16LSbs
7 SER_1 Device Serial Number 1
(word1)16MSbs
8 SER_2 Device Serial Number 2
(word0)16LSbs
9 SER_2 Device Serial Number 2
(word1)16MSbs
10 SER_3 Device Serial Number 3
11 CONFIG Config Word
Bit Number Bit Name
0OSC0
1OSC1
2OSC2
3OSC3
4V
LOWS
5BRS
6MTX4
7 TXEN
8 S3SET
9 XSER
10 RESERVED
11 RESERVED
12 RESERVED
13 RESERVED
14 RESERVED
15 RESERVED
VLOWS S3SET* Trip Point
004.4
014.4
109
116.75
BRS Basic Pulse
Element Code Words
Transmitted
0 400µs All
1 200µs 1 out of 2
HCS101
DS41115C-page 6 Preliminary
2001 Microchip Technology Inc.
4.3.4 MINIMUM FOUR TRANSMISSIONS
(MTX4)
If this bitiscleared, atleast one code word is completed
when the HCS101 is activated. If this bit is set, at least
four complete code words are transmitted.
4.3.5 TRANSMIT PULSE ENABLE (TXEN)
If this bit is cleared, no start pulse occurs before a
transmission. If the bit is set, a start pulse (1 TElong) is
transmitted before the first code word’s preamble.
4.3.6 S3 SETTING (S3SET)
This bit determinesthe value of S3 in the function code
during a transmission and the high trip point selected
by VLOWS in Section 4.3.2. If this bit is cleared, S3 mir-
rors S2 during a transmission. If the S3SET bit is set,
S3 in the function code is always set, independent of
the value of S2.
4.3.7 EXTENDED SERIAL NUMBER
(XSER)
If this bit is cleared, the most significant four bits of the
32-bit Serial Number 1 are replaced with the function
code. If this bit is set, the full 32-bit Serial Number 1 is
transmitted.
5.0 SPECIAL FEATURES
5.1 Code Word Completion
Code word completion is an automatic feature that
ensures the entire code word is transmitted, even if the
button is released before the transmission is complete.
If the button is held down beyond the time for one code
word, multiple code words will result. If another button
is activated during a transmission, the active transmis-
sion will be aborted and a new transmission will begin
using the new button information.
5.2 Blank Alternate Code Word
Federal Communications Commission (FCC) Rules,
Part 15 specify the limits on fundamental power and har-
monics that can be transmitted. Power is calculated on
the worst case average power transmitted in a 100 ms
window. It is therefore advantageous to minimize the
duty cycle of the transmission by minimizing the duty
cycle of the individual bits and by blanking out consecu-
tive words. The transmission duty cycle can be lowered
by setting BRS. This reduces the average power trans-
mitted and hence, assists in FCC approval of a transmit-
ter device. Shortening the code word length and
transmitting only every other code word (Figure 5-1) also
may allow a higher amplitude transmission for greater
range.
5.3 Auto-Shutoff
The auto-shutoff function automatically stops the
device from transmitting if a button inadvertently gets
pressed for longer than the time-out period, TTO.This
will prevent the device from draining the battery if a but-
ton gets pressed while the transmitter is in a pocket or
purse.
5.4 VLOW: Voltage LOW Indicator
The VLOW bit is included in every transmission and will
be transmitted as a one if the operating voltage has
dropped below the low voltage trip point. Refer to
Figure 3-2. The trip point is selectable based on the
battery voltage being used. See Section 4.3.2 for a
description of how the low voltage select option is set.
FIGURE 5-1: CODE WORD TRANSMISSIONS
One Code Word
BRS = 0
BRS = 1
A
2A
100ms 100ms 100ms 100ms
Amplitude
Time
2001 Microchip Technology Inc. Preliminary DS41115C-page 7
HCS101
6.0 PROGRAMMING THE HCS101
When using the HCS101 in a system, the user will have
to program some parameters into the device, including
the serial number and the counter, before it can be
used. The programming cycle allows the user to input
a 192-bit serial data stream which is then stored inter-
nally in EEPROM. Programming will be initiated by
forcing the DATA line high after the S2 line has been
held high for the appropriate length of time. Refer to
Table 6-1 and Figure 6-1.
After the Program mode is entered, a delay must be
provided to the device for the automatic bulk write cycle
to complete. This willwrite all locations in the EEPROM
to all zeros. The device can then be programmed by
clocking in 16 bits at a time, using S2 as the clock line
and DATA as the data in line. After each 16-bit word is
loaded,a programmingdelay is required for the internal
program cycle to complete. This delay can take up to
Twc.
The HCS101 will signal that the write is complete by
sending out a train of ACK pulses, TACKH high, TACKL
low on DATA. The ACK pulses will continue until S2 is
dropped. These times can be used to calculate the
oscillator calibration value. The first pulse’s width
should NOT be used for calibration.
At theend of the programming cycle, the device can be
verified as shown in Figure 6-2 by reading back the
EEPROM. Reading is done by clocking the S2 line and
reading the data bits on the DATA pin.A verify opera-
tion can only be done once, immediately following
the program cycle.
FIGURE 6-1: PROGRAMMING WAVEFORMS
FIGURE 6-2: VERIFY WAVEFORMS
Note: To ensure that the device does not acci-
dentally enter Programming mode, DATA
should never be pulled high by the circuit
connected to it. Special care should be
taken when driving PNP RF transistors.
DATA
Enter Program
Mode
(Data)
(Clock)
Note: S0 and S1 button inputs to be held to ground during the entire programming sequence.
Bit0 Bit1 Bit2 Bit3 Bit14 Bit15 Bit 16 Bit 17
TPH1
TPBW
TPS
Repeat 12 times for each word
TPH2
TCLKH
TCLKL TWC
TDS
S2
Data for Word 1
TDH
TCLKL
Initiate DataPolling Here
Write Cycle
Complete Here
TACLKL
TACLKH
Calibration Pulses
TPHOLD
DATA
(Clock)
(Data)
Note: If a Verify operation is to be done, then it must immediately follow the Program cycle.
End of
Programming Cycle Begin Verify Cycle Here
Bit1 Bit2 Bit3 Bit15
Bit 14 Bit 16 Bit 17 Bit190Bit191
TWC
Data in Word 0
TDV
S2
Bit 0Bit191Bit190
HCS101
DS41115C-page 8 Preliminary
2001 Microchip Technology Inc.
TABLE 6-1: PROGRAMMING/VERIFY TIMING REQUIREMENTS
Note 1: Typical values - not tested in production
VDD = 5.0V ± 10%
25° 5°C
Parameter Symbol Min. Max. Units
Program mode setup time TPS 2.0 5.0 ms
Hold time 1 TPH14.0 ms
Hold time 2 TPH250 µs
Bulk Write time TPBW 4.0 ms
Program delay time TPROG 4.0 ms
Program cycle time TWC 50 ms
Clock low time TCLKL 50 µs
Clock high time TCLKH 50 µs
Data setup time TDS 0—µs
Data hold time TDH 30 µs
Data out valid time TDV —30µs
Hold time TPHOLD 100 µs (1)
Acknowledge low time TACKL 800 µs (1)
Acknowledge high time TACKH 800 µs (1)
2001 Microchip Technology Inc. Preliminary DS41115C-page 9
HCS101
7.0 ELECTRICAL CHARACTERISTICS FOR HCS101
Absolute Maximum Ratings
VDD Supply voltage .....................................................................................................................................-0.3 to 13.5 V
VIN Input voltage ................................................................................................................................-0.3 to VDD +0.3V
VOUT Output voltage .......................................................................................................................... -0.3 to VDD +0.3V
IOUT Max output current......................................................................................................................................... 50 mA
TSTG Storage temperature (Note).............................................................................................................. -55 to +125°C
TLSOL Lead soldering temp (Note)......................................................................................................................... 300°C
VESD ESD rating ....................................................................................................................................................2000 V
TABLE 7-1: DC CHARACTERISTICS
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other condi-
tions above those indicated in the operation listings of this specification is not implied. Exposure to
maximum rating conditions for extended periods may affect device reliability.
Commercial (C):TAMB =0°Cto+70°C Industrial (I):TAMB =-40°Cto+85°C
3.5V < VDD < 5.0V 5.0V < VDD < 13.3V
Parameter Sym. Min. Typ1Max. Min. Typ1Max. Unit Conditions
Operating Current
(avg)(2) ICC —0.5 —2
mA
mA
Standby Current ICCS 0.1 1.0 0.1 1.0 µA
Auto-shutoff
Current(3,4) ICCS 40 75 160 300 µA
High Level Input
Voltage VIH 0.55VDD VDD+0.3 2.75 VDD+0.3 V
Low Level Input
Voltage VIL -0.3 0.15VDD -0.3 0.75 V
High Level Output
Voltage VOH 0.6VDD 3.3 V
VIOH =-1.0mAVDD =3.5V
IOH =-2.0mAVDD =10V
Low Level Output
Voltage VOL 0.08VDD 0.4 V
VIOL =1.0mAVDD =3.5V
IOL =2.0mAVDD = 10V
Pull-down Resistance;
S0-S2 RSO-240 60 80 40 60 80 kVDD =4.0V
Pull-down Resistance;
DATA RDATA 80 120 160 80 120 160 kVDD =4.0V
Note 1: Typical values are at 25°C.
2: No load.
3: Auto-shutoff current specification does not include the current through the input pulldown resistors.
4: Auto-shutoff current is periodically sampled and not 100% tested.
HCS101
DS41115C-page 10 Preliminary
2001 Microchip Technology Inc.
FIGURE 7-1: POWER-UP AND TRANSMIT TIMING
TABLE 7-2: POWER-UP AND TRANSMIT TIMING(2)
FIGURE 7-2: PREAMBLE/HEADER FORMAT
FIGURE 7-3: DATA WORD FORMAT (XSER = 0)
Standard Operating Conditions (unless otherwise specified):
Commercial (C): 0°C TA +70°C
Industrial (I):-40°C TA +85°C
Symbol Parameters Min. Typ. Max. Units Conditions
TBP Time to second button press 10 + Code
Word Time 26 + Code
Word Time ms (Note 1)
TTD Transmit delay from button detect 12 26 ms
TDB Debounce delay 6 20 ms
TTO Auto-shutoff time-out period 27 s
Ts Start pulse delay 4.5 ms
Note 1: TBP is the time in which a second button can be pressed without completion of the first code word and the
intention was to press the combination of buttons.
2: Typical values - not tested in production.
Button Press Detect
Sn
TDB
DATA
TTD
Code Word Transmission
TTO
Code
Word
1
Code
Word
2
Code
Word
3
Code
Word
n
TBP
TS
Preamble Header
P1 P12
23 TE10 TE
Data Word
Transmission
Bit 0 Bit 1
Bit 0 Bit 1
Header
Bit 30 Bit 31 Bit 32 Bit 33 Bit 58 Bit 59
Guard
LSBLSB MSB MSB S3* S0 S1 S2 Vlow
Time
Serial Number 1 Function Code Status
Bit 60 Bit 61 Bit 62 Bit 63 Bit 64 Bit 65
* See S3SET
Counter & Serial Number 3
& Function Code
2001 Microchip Technology Inc. Preliminary DS41115C-page 11
HCS101
TABLE 7-3: CODE WORD TRANSMISSION TIMING REQUIREMENTS
VDD = +3.5 to 13.3V
Commercial (C):TAMB =0°Cto+70°C
Industrial (I):TAMB =-40°Cto+85°C
Code Words Transmitted
All 1 out of 2
Symbol Characteristic Number of TEMin. Typ. Max. Min. Typ. Max. Units
TEBasic pulse element 1 360 400 440 180 200 220 µs
TBP PWM bit pulse width 3 3 3 ms
TPPreamble duration 24 8.64 9.6 10.56 4.32 4.8 5.28 ms
THHeader duration 10 3.6 4.0 4.4 1.8 2.0 2.2 ms
THOP Hopping code duration 96 34.56 38.4 42.24 17.28 19.2 21.12 ms
TFIX Fixed code duration 102 36.72 40.8 44.88 18.36 20.4 22.44 ms
TGGuard Time 39 14.04 15.6 17.16 7.02 7.8 8.58 ms
Total Transmit Time 271 97.56 108.4 119.24 48.78 54.2 59.62 ms
PWM data rate 925 833 757 1851 1667 1515 bps
Note: The timing parameters are not tested but derived from the oscillator clock.
HCS101
DS41115C-page 12 Preliminary
2001 Microchip Technology Inc.
8.0 PACKAGING INFORMATION
8.1 Package Marking Information
8-Lead PDIP (300 mil)
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXXNNN
YYWW
HCS101
XXXXXNNN
0025
XXXXXXX
XXXYYWW
NNN
HCS101
XXX0025
NNN
Legend: XX...X Customer specific information*
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*Standard PICmicro device marking consists of Microchip part number, year code, week code, and
traceability code. For PICmicro device marking beyond this, certain price adders apply. Please check
with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP
price.
2001 Microchip Technology Inc. Preliminary DS41115C-page 13
HCS101
8.2 Package Details
8-Lead Plastic Dual In-line (P) - 300 mil (PDIP)
B1
B
A1
A
L
A2
p
α
E
eB
β
c
E1
n
D
1
2
Units INCHES* MILLIMETERS
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n88
Pitch p.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness c.008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top α51015 51015
Mold Draft Angle Bottom β51015 51015
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
JEDEC Equivalent: MS-001
Drawing No. C04-018
.010” (0.254mm) per side.
§ Significant Characteristic
HCS101
DS41115C-page 14 Preliminary
2001 Microchip Technology Inc.
8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC)
Foot Angle φ048048
1512015120
β
Mold Draft Angle Bottom 1512015120
α
Mold Draft Angle Top 0.510.420.33.020.017.013BLead Width 0.250.230.20.010.009.008
c
Lead Thickness
0.760.620.48.030.025.019LFoot Length 0.510.380.25.020.015.010hChamfer Distance 5.004.904.80.197.193.189DOverall Length 3.993.913.71.157.154.146E1Molded Package Width 6.206.025.79.244.237.228EOverall Width 0.250.180.10.010.007.004A1Standoff § 1.551.421.32.061.056.052A2Molded Package Thickness 1.751.551.35.069.061.053AOverall Height 1.27.050
p
Pitch 88
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
D
n
p
B
E
E1
h
L
β
c
45°
φ
A2
α
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
§ Significant Characteristic
2001 Microchip Technology Inc. Preliminary DS41115C-page 15
HCS101
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Microchip provides on-line support on the Microchip
World Wide Web (WWW) site.
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files and information easily available to customers. To
view the site, the user musthave access to the Internet
and a web browser, such as Netscape or Microsoft
Explorer. Files are also available for FTP download
from our FTP site.
ConnectingtotheMicrochipInternetWebSite
The Microchip web site is available by using your
favorite Internet browser to attach to:
www.microchip.com
The file transfer site is available by using an FTP ser-
vice to connect to:
ftp://ftp.microchip.com
Thewebsiteandfiletransfersiteprovideavarietyof
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
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The Systems Information and Upgrade Line provides
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can receive any currently available upgrade kits.The
Hot Line Numbers are:
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
HCS101
DS41115C-page 16 Preliminary
2001 Microchip Technology Inc.
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DS41115C
HCS101
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this data sheet easy to follow? If not, why?
4. What additions to the data sheet do you think would enhance the structure and subject?
5. What deletions from the data sheet could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
8. How would you improve our software, systems, and silicon products?
2001 Microchip Technology Inc. Preliminary DS41115C-page 17
HCS101
HCS101 PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
Package: P = Plastic DIP (300 mil Body), 8-lead)
SN = Plastic SOIC (150 mil Body), 8-lead
Temperature Blank = 0°C to +70°C
Range: I=40°Cto+85°C
Device: HCS101 =Code Hopping Encoder
HCS101T =Code Hopping Encoder (Tape and Reel)
HCS101 - /P
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office.
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277.
3. The Microchip Worldwide Site. (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
HCS101
DS41115C-page 18 Preliminary
2001 Microchip Technology Inc.
NOTES:
2001 Microchip Technology Inc. Preliminary DS41115C - page 19
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
Trademarks
The Microchip name and logo, theMicrochip logo, PIC, PICmicro,
PICMASTER, PICSTART, PRO MATE, KEELOQ,SEEVAL,
MPLAB and The Embedded Control Solutions Company are reg-
istered trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
Total Endurance, ICSP, In-Circuit Serial Programming, FilterLab,
MXDEV, microID,
Flex
ROM,
fuzzy
LAB, MPASM, MPLINK,
MPLIB, PICC, PICDEM, PICDEM.net, ICEPIC, Migratable
Memory, FanSense, ECONOMONITOR, Select Mode, dsPIC,
rfPIC and microPort are trademarks of Microchip Technology
Incorporated in the U.S.A.
Serialized Quick Term Programming(SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2001, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandlerand Tempe,Arizonain July 1999.The
Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro®8-bit MCUs, KEELOQ®code hopping
devices, Serial EEPROMs and microperipheral
products. In addition, Microchip’s quality
system for the design and manufacture of
development systems is ISO 9001 certified.
Note the following details of the code protection feature on PICmicro®MCUs.
The PICmicro family meets the specifications contained in the Microchip Data Sheet.
Microchip believes that its family of PICmicro microcontrollersis one of the mostsecure products of its kind on the market today,
when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowl-
edge, require using the PICmicro microcontroller in a manner outside the operating specifications contained in the data sheet.
The person doing so may be engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
NeitherMicrochip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable”.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of
our product.
If you have any further questions about this matter, please contact the local sales office nearest to you.
DS41115C-page 20 Preliminary
2001 Microchip Technology Inc.
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