bq2201 SRAM Nonvolatile Controller Unit Features General Description Power monitoring and switching for 3-volt battery-backup applications The CMOS bq2201 SRAM Nonvolatile Controller Unit provides all necessary functions for converting a standard CMOS SRAM into nonvolatile read/write memory. Write-protect control 3-volt primary cell inputs Les s than 10ns chip- e nable propagation delay 5% or 10% supply operation A precision comparator monitors the 5V VCC input for an out-of-tolerance condition. When out of tolerance is detected, a conditioned chip-enable output is forced inactive to writeprotect any standard CMOS SRAM. Pin Connections During a power failure, the external SRAM is switched from the V CC supply to one of two 3V backup supplies. On a subsequent power-up, the SRAM is write-protected until a power-valid condition exists. The bq2201 is footprint- and timingcompatible with industry standards with the added benefit of a chip-enable propagation delay of less than 10ns. Pin Names NC 1 16 NC VOUT 2 15 VCC VOUT Supply output BC1--BC2 3-volt primary backup cell inputs THS Threshold select input CE chip-enable active low input CECON Conditioned chip-enable output VOUT 1 8 VCC NC 3 14 NC BC2 2 7 BC1 BC2 4 13 BC1 THS 3 6 CECON NC 5 12 NC VCC +5-volt supply input VSS 4 5 CE THS 6 11 CECON VSS Ground NC 7 10 NC NC No Connect VSS 8 9 CE 8-Pin Narrow DIP or SOIC PN220101.eps 16-Pin SOIC PN2201E.eps Functional Description An external CMOS static RAM can be battery-backed using the VOUT and the conditioned chip-enable output pin from the bq2201. As VCC slews down during a power failure, the conditioned chip-enable output CE CON is forced inactive independent of the chip-enable input CE. If THS is tied to VSS, power-fail detection occurs at 4.62V typical for 5% supply operation. If THS is tied to VCC, power-fail detection occurs at 4.37V typical for 10% supply operation. The THS pin must be tied to VSS or VCC for proper operation. This activity unconditionally write-protects external SRAM as VCC falls to an out-of-tolerance threshold VPFD. VPFD is selected by the threshold select input pin, THS. If a memory access is in process during power-fail detection, that memory cycle continues to completion before the memory is write-protected. If the memory cycle is not terminated within time tWPT, the CECON output is unconditionally driven high, write-protecting the memory. Oct. 1998 D 1 bq2201 A valid isolation signal requires CE low as VCC crosses both VPFD and VSO during a power-down. See Figure 2. Between these two points in time, CE must be brought to the point of (0.48 to 0.52)*VCC and held for at least 700ns. The isolation signal is invalid if CE exceeds 0.54*VCC at any point between VCC crossing VPFD and VSO. As the supply continues to fall past VPFD, an internal switching device forces VOUT to one of the two external backup energy sources. CECON is held high by the VOUT energy source. During power-up, VOUT is switched back to the VCC supply as VCC rises above the backup cell input voltage sourcing VOUT. The CECON output is held inactive for time t CER (120 ms maximum) after the supply has reached VPFD, independent of the CE input, to allow for processor stabilization. The appropriate battery is connected to VOUT and CECON immediately on subsequent application and removal of VCC. During power-valid operation, the CE input is fed through to the CECON output with a propagation delay of less than 10ns. Nonvolatility is achieved by hardware hookup, as shown in Figure 1. VPFD Energy Cell Inputs--BC1, BC2 Two primary backup energy source inputs are provided on the bq2201. The BC1 and BC2 inputs accept a 3V primary battery, typically some type of lithium chemistry. If no primary cell is to be used on either BC1 or BC2, the unused input should be tied to VSS. VCC VSO If both inputs are used, during power failure the VOUT output is fed only by BC1 as long as it is greater than 2.5V. If the voltage at BC1 falls below 2.5V, an internal isolation switch automatically switches VOUT from BC1 to BC2. 0.5 VCC CE 700ns To prevent battery drain when there is no valid data to retain, VOUT and CECON are internally isolated from BC1 and BC2 by either of the following: Initial connection of a battery to BC1 or BC2, or Presentation of an isolation signal on CE. TD220101.eps Figure 2. Battery Isolation Signal 5V VCC From Address Decoder VOUT VCC CE bq2201 BC1 CE CECON CMOS SRAM THS 3V Primary Cell VSS BC2 3V Primary Cell FG220101.eps Figure 1. Hardware Hookup (5% Supply Operation) Oct. 1998 D 2 bq2201 Absolute Maximum Ratings Symbol Parameter Value Unit Conditions VCC DC voltage applied on VCC relative to VSS -0.3 to 7.0 V VT DC voltage applied on any pin excluding VCC relative to VSS -0.3 to 7.0 V VT VCC + 0.3 TOPR 0 to +70 C Commercial Operating temperature -40 to +85 C Industrial "N" TSTG Storage temperature -55 to +125 C TBIAS Temperature under bias -40 to +85 C TSOLDER Soldering temperature 260 C IOUT VOUT current 200 mA Note: For 10 seconds Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation should be limited to the Recommended DC Operating Conditions detailed in this data sheet. Exposure to conditions beyond the operational limits for extended periods of time may affect device reliability. Recommended DC Operating Conditions (TA = TOPR) Symbol VCC Parameter Minimum Typical Maximum Unit 4.75 5.0 5.5 V THS = VSS 4.50 5.0 5.5 V THS = VCC 0 0 0 V Supply voltage VSS Supply voltage VIL Input low voltage -0.3 - 0.8 V VIH Input high voltage 2.2 - VCC + 0.3 V VBC1, VBC2 Backup cell voltage 2.0 - 4.0 V THS Threshold select -0.3 - VCC + 0.3 V Note: Typical values indicate operation at TA = 25C, VCC = 5V or VBC. Oct. 1998 D 3 Notes bq2201 DC Electrical Characteristics (TA = TOPR, VCC = 5V 10%) Symbol Parameter Minimum Typical Maximum Unit Conditions/Notes - - 1 A 2.4 - - V IOH = -2.0mA VBC - 0.3 - - V VBC > VCC, IOH = -10A IOL = 4.0mA ILI Input leakage current VOH Output high voltage VOHB VOH, BC supply VOL Output low voltage - - 0.4 V ICC Operating supply current - 3 5 mA VPFD 4.55 4.62 4.75 V Power-fail detect voltage THS = VSS 4.30 4.37 4.50 V THS = VCC VIN = VSS to VCC No load on VOUT and CECON. VSO Supply switch-over voltage - VBC - V ICCDR Data-retention mode current - - 100 nA VOUT1 VOUT voltage VCC - 0.2 - - V VCC > VBC, IOUT = 100mA VCC - 0.3 - - V VCC > VBC, IOUT = 160mA VBC - 0.3 - - V VCC < VBC, IOUT = 100A VOUT data-retention current to additional memory not included. VOUT2 VOUT voltage VBC Active backup cell voltage - VBC2 - V VBC1 < 2.5V - VBC1 - V VBC1 > 2.5V IOUT1 VOUT current - - 160 mA VOUT > VCC - 0.3V IOUT2 VOUT current - 100 - A VOUT > VBC - 0.2V Note: Typical values indicate operation at TA = 25C, VCC = 5V or VBC. Oct. 1998 D 4 bq2201 Capacitance (TA = 25C, F = 1MHz, VCC = 5.0V) Minimum Typical Maximum Unit CIN Symbol Input capacitance - - 8 pF Input voltage = 0V COUT Output capacitance - - 10 pF Output voltage = 0V Note: Parameter Conditions This parameter is sampled and not 100% tested. AC Test Conditions Parameter Test Conditions Input pulse levels 0V to 3.0V Input rise and fall times 5ns Input and output timing reference levels 1.5V (unless otherwise specified) Output load (including scope and jig) See Figure 3 5V 960 CECON 510 100pF FG220102.eps Figure 3. Output Load Oct. 1998 D 5 bq2201 Power-Fail Control (TA = TOPR) Symbol Parameter Minimum Typical Maximum Unit Notes tPF VCC slew, 4.75V to 4.25V 300 - - s tFS VCC slew, 4.25V to VSO 10 - - s tPU VCC slew, 4.25V to 4.75V 0 - - s tCED Chip-enable propagation delay - 7 10 ns tCER Chip-enable recovery 40 80 120 ms Time during which SRAM is write-protected after VCC passes VPFD on power-up. tWPT Write-protect time 40 100 150 s Delay after VCC slews down past VPFD before SRAM is write-protected. Note: Typical values indicate operation at TA = 25C. Caution: Negative undershoots below the absolute maximum rating of -0.3V in battery-backup mode may affect data integrity. Power-Down Timing tPF 4.75 VPFD VCC tFS 4.25 VSO CE tWPT VOHB CECON TD220102.eps Oct. 1998 D 6 bq2201 Power-Up Timing tPU VCC 4.25 VSO 4.75 VPFD tCER CE CECON tCED VOHB tCED TD220103.eps Oct. 1998 D 7 bq2201 8-Pin DIP Narrow (PN) 8-Pin DIP Narrow (PN) Dimension A A1 B B1 C D E E1 e G L S Minimum 0.160 0.015 0.015 0.055 0.008 0.350 0.300 0.230 0.300 0.090 0.115 0.020 Maximum 0.180 0.040 0.022 0.065 0.013 0.380 0.325 0.280 0.370 0.110 0.150 0.040 All dimensions are in inches. 8-Pin SOIC Narrow (SN) 8-Pin SOIC Narrow (SN) Dimension A A1 B C D E e H L Minimum 0.060 0.004 0.013 0.007 0.185 0.150 0.045 0.225 0.015 Maximum 0.070 0.010 0.020 0.010 0.200 0.160 0.055 0.245 0.035 All dimensions are in inches. Oct. 1998 D 8 bq2201 S: 16-Pin SOIC 16-Pin S (SOIC) D Dimension Minimum A 0.095 A1 0.004 B 0.013 C 0.008 D 0.400 E 0.290 e 0.045 H 0.395 L 0.020 All dimensions are in inches. B e E H A C .004 L A1 Oct. 1998 D 9 Maximum 0.105 0.012 0.020 0.013 0.415 0.305 0.055 0.415 0.040 bq2201 Data Sheet Revision History Change No. Page No. 1 Note: Description Nature of Change Added industrial temperature range Was: THS tied to VOUT Is: THS tied to VCC 2 1, 3, 4 10% supply operation 3 1, 9, 11 Added 16-pin package option Change 1 = Sept. 1991 B changes from Sept. 1990 A. Change 2 = Aug. 1997 C changes from Sept. 1991 B. Change 3 = Oct. 1998 D changes from Aug. 1997 C. Oct. 1998 D 10 bq2201 Ordering Information bq2201 Temperature Range: blank = Commercial (0 to +70C) N = Industrial (-40 to +85C) Package Option: PN = 8-pin narrow plastic DIP SN = 8-pin narrow SOIC S = 16-pin SOIC Device: bq2201 Nonvolatile SRAM Controller Oct. 1998 D 11 PACKAGE OPTION ADDENDUM www.ti.com 13-Nov-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty BQ2201PN ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type BQ2201PNE4 ACTIVE PDIP P 8 50 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type BQ2201SN ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2201SN-N ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2201SN-NG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2201SN-NTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2201SN-NTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2201SNG4 ACTIVE SOIC D 8 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2201SNTR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM BQ2201SNTRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 75 Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant BQ2201SN-NTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 BQ2201SNTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ2201SN-NTR SOIC D 8 2500 346.0 346.0 29.0 BQ2201SNTR SOIC D 8 2500 346.0 346.0 29.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee(R) Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2008, Texas Instruments Incorporated