Javascript must be enabled to view full functionality of our site. Search LX2160XE72029B(Active) QorIQ, 16xA72 64b Arm at 2GHz, 2.9GT/s DDR4, -40C to 105C, SEC enabled, CAN, 40x40, Rev 2, Prod Data Sheet Product Summary Software & Tools Package BGA1517 BGA1517, plastic ball grid array package 1517 balls, 1 mm pitch, 40 mm x 40 mm x 3.36 mm body Buy Options Operating Characteristics Environmental Information Quality Information Shipping Information Buy Options LX2160XE72029B 935402524557 Active TRAY-Tray, Bakeable, Multiple in Drypack Min. Package Quantity: 21 Lead Time: 26 weeks 100 @ US Available Distributors: LX2160XE72029B Operating Characteristics Parameter Value Silicon Rev Rev 2 Qualification tier Industrial Core Type Arm Cortex-A72 Core: Number of cores (SPEC) 16 Operating Frequency [Max] (MHz) 2000 Typical Power 20 Cache (KB) 80 L1 Cache (KB) 80 L2 Cache (Max) (KB) 8000 SRAM (kB) 10000 DRAM frequency (max)(MHz) 3200 Parameter Value Parameter Value SPI 3 UART 4 I 2C 8 USB Controllers 2 CAN 1 PCIe 6 SATA 4 x SATA 3.0 Encryption Y Watchdog timer Y Timers 4 Junction Temperature (Min to Max) () -40 to 105 Environmental Information Material Declaration PbFree EU RoHS Halogen Free RHF Indicator REACH SVHC Weight (mg) LX2160XE72029B( 935402524557) Yes Yes Certificate Of Analysis (CoA) Yes D REACH SVHC 19291.7 Quality Information Material Declaration Safe Assure Functional Safety LX2160XE72029B ( 935402524557) No Moisture Sensitivity Level (MSL) Peak Package Body Temperature (PPT) (C) Maximum Time at Peak Temperatures (s) Lead Free Soldering Lead Free Soldering Lead Free Soldering 3 245 30 Shipping Information Part Number Harmonized Tariff (US) Disclaimer Export Control Classification Number (US) CCATS LX2160XE72029B ( 935402524557) 854231 5A002A1 G168956 News 26 Jul 2020 | AP Memory Joins NXP Partner Program Read More ABOUT NXP Privacy CAREERS Terms of Use INVESTORS Terms of Sale MEDIA CONTACT Slavery and Human Trafficking Statement SUBSCRIBE Accessibility (c)2006-2020 NXP Semiconductors. All rights reserved.