MC74AC02, MC74ACT02 Quad 2-Input NOR Gate High-Performance Silicon-Gate CMOS Features * Outputs Source/Sink 24 mA * ACT02 Has TTL Compatible Inputs * These are Pb-Free Devices www.onsemi.com MARKING DIAGRAMS 14 VCC 14 13 12 11 10 9 SOIC-14 D SUFFIX CASE 751A 8 14 xxx02G AWLYWW 1 1 14 1 2 3 4 5 6 7 GND 1 Figure 1. Pinout: 14-Lead Packages Conductors (Top View) xxx 02 ALYWG G TSSOP-14 DT SUFFIX CASE 948G 14 1 xxx = AC or ACT A = Assembly Location WL or L = Wafer Lot Y = Year WW or W = Work Week G or G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. (c) Semiconductor Components Industries, LLC, 2015 January, 2015 - Rev. 8 1 Publication Order Number: MC74AC02/D MC74AC02, MC74ACT02 MAXIMUM RATINGS Symbol Parameter Value Unit *0.5 to )7.0 V *0.5 v VI v VCC )0.5 V *0.5 v VO v VCC )0.5 V DC Input Diode Current $20 mA IOK DC Output Diode Current $50 mA IO DC Output Sink/Source Current $50 mA ICC DC Supply Current per Output Pin $50 mA IGND DC Ground Current per Output Pin $50 mA TSTG Storage Temperature Range *65 to )150 C TL Lead temperature, 1 mm from Case for 10 Seconds 260 C TJ Junction temperature under Bias )150 C qJA Thermal Resistance (Note 2) SOIC TSSOP 125 170 C/W PD Power Dissipation in Still Air at 85C SOIC TSSOP 125 170 mW MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) > 2000 > 200 > 1000 V ILatch-Up Latch-Up Performance Above VCC and Below GND at 85C (Note 6) $100 mA VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK (Note 1) Level 1 Oxygen Index: 30% - 35% UL 94 V-0 @ 0.125 in Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. The package thermal impedance is calculated in accordance with JESD51-7. 3. Tested to EIA/JESD22-A114-A. 4. Tested to EIA/JESD22-A115-A. 5. Tested to JESD22-C101-A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter VCC Supply Voltage Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 1) AC Devices except Schmitt Inputs Min Typ Max AC 2.0 5.0 6.0 ACT 4.5 5.0 5.5 0 - VCC VCC @ 3.0 V - 150 - VCC @ 4.5 V - 40 - VCC @ 5.5 V - 25 - VCC @ 4.5 V - 10 - VCC @ 5.5 V - 8.0 - - - 140 Unit V V ns/V tr, tf Input Rise and Fall Time (Note 2) ACT Devices except Schmitt Inputs TJ Junction Temperature (PDIP) TA Operating Ambient Temperature Range -40 25 85 C IOH Output Current - High - - -24 mA IOL Output Current - Low - - 24 mA ns/V C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times. www.onsemi.com 2 MC74AC02, MC74ACT02 DC CHARACTERISTICS Symbol Parameter VCC (V) 74AC 74AC TA = +25C TA = -40C to +85C Typ VIH VIL VOH VOL Guaranteed Limits 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC - 0.1 V Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC - 0.1 V Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 V 3.0 4.5 5.5 - - - 2.56 3.86 4.86 2.46 3.76 4.76 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 3.0 4.5 5.5 - - - 0.36 0.36 0.36 0.44 0.44 0.44 5.5 - 0.1 5.5 - 5.5 5.5 Maximum Low Level Output Voltage Maximum Input Leakage Current IOLD Minimum Dynamic Output Current ICC Conditions Minimum High Level Input Voltage IIN IOHD Unit Maximum Quiescent Supply Current IOUT = -50 A *VIN = VIL or VIH -12 mA IOH -24 mA -24 mA V IOUT = 50 A V V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA 1.0 A VI = VCC, GND - 75 mA VOLD = 1.65 V Max - - -75 mA VOHD = 3.85 V Min - 4.0 40 A VIN = VCC or GND Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. AC CHARACTERISTICS Symbol VCC* (V) Parameter 74AC 74AC TA = +25C CL = 50 pF TA = -40C to +85C CL = 50 pF Min Typ Max Min Max Unit Fig. No. tPLH Propagation Delay 3.3 5.0 1.5 1.5 5.0 4.0 7.5 6.0 1.0 1.0 8.0 6.5 ns 3-5 tPHL Propagation Delay 3.3 5.0 1.5 1.5 5.0 4.5 7.5 6.5 1.0 1.0 8.0 7.0 ns 3-5 *Voltage Range 3.3 V is 3.3 V 0.3 V. Voltage Range 5.0 V is 5.0 V 0.5 V. www.onsemi.com 3 MC74AC02, MC74ACT02 DC CHARACTERISTICS Symbol Parameter VCC (V) 74ACT 74ACT TA = +25C TA = -40C to +85C Typ Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC - 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC - 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 V 4.5 5.5 - - 3.86 4.86 3.76 4.76 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 4.5 5.5 - - 0.36 0.36 0.44 0.44 V *VIN = VIL or VIH 24 mA IOL 24 mA VOL Maximum Low Level Output Voltage IOUT = -50 A *VIN = VIL or VIH -24 mA IOH -24 mA V IOUT = 50 A V IIN Maximum Input Leakage Current 5.5 - 0.1 1.0 A VI = VCC, GND ICCT Additional Max. ICC/Input 5.5 0.6 - 1.5 mA VI = VCC - 2.1 V IOLD Minimum Dynamic Output Current 5.5 - - 75 mA VOLD = 1.65 V Max 5.5 - - -75 mA VOHD = 3.85 V Min 5.5 - 4.0 40 A VIN = VCC or GND IOHD ICC Maximum Quiescent Supply Current Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *All outputs loaded; thresholds on input associated with output under test. Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS Symbol VCC* (V) Parameter 74ACT 74ACT TA = +25C CL = 50 pF TA = -40C to +85C CL = 50 pF Unit Fig. No. Min Typ Max Min Max tPLH Propagation Delay 5.0 1.5 - 8.5 1.0 9.0 ns 3-6 tPHL Propagation Delay 5.0 1.5 - 9.5 1.0 10 ns 3-6 *Voltage Range 5.0 V is 5.0 V 0.5 V. CAPACITANCE Symbol Parameter Value Typ Unit Test Conditions CIN Input Capacitance 4.5 pF VCC = 5.0 V CPD Power Dissipation Capacitance 30 pF VCC = 5.0 V www.onsemi.com 4 MC74AC02, MC74ACT02 DEVICE ORDERING INFORMATION Package Shipping MC74AC02DG SOIC-14 (Pb-Free) 55 Units / Rail MC74AC02DR2G SOIC-14 (Pb-Free) 2500 / Tape & Reel MC74ACT02DG SOIC-14 (Pb-Free) 55 Units / Rail MC74ACT02DR2G SOIC-14 (Pb-Free) 2500 / Tape & Reel MC74AC02DTR2G TSSOP-14 (Pb-Free) 2500 / Tape & Reel MC74ACT02DTR2G TSSOP-14 (Pb-Free) 2500 / Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com 5 MC74AC02, MC74ACT02 PACKAGE DIMENSIONS SOIC-14 NB CASE 751A-03 ISSUE K D A B 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 8 A3 E H L 1 0.25 M DETAIL A 7 B 13X M b 0.25 M C A S B S X 45 _ M A1 e DETAIL A h A C SEATING PLANE DIM A A1 A3 b D E e H h L M SOLDERING FOOTPRINT* 6.50 14X 1.18 1 1.27 PITCH 14X 0.58 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 6 MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.19 0.25 0.35 0.49 8.55 8.75 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ INCHES MIN MAX 0.054 0.068 0.004 0.010 0.008 0.010 0.014 0.019 0.337 0.344 0.150 0.157 0.050 BSC 0.228 0.244 0.010 0.019 0.016 0.049 0_ 7_ MC74AC02, MC74ACT02 PACKAGE DIMENSIONS TSSOP-14 CASE 948G ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 0.25 (0.010) 8 M B -U- L PIN 1 IDENT. F 7 1 0.15 (0.006) T U N S DETAIL E K A -V- NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. EEE CCC CCC EEE K1 J J1 DIM A B C D F G H J J1 K K1 L M SECTION N-N -W- C 0.10 (0.004) -T- SEATING PLANE D H G DETAIL E SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ MC74AC02, MC74ACT02 ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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