XC68HC58EGAR2 Information General information Package information Environmental and Compliance information Manufacturing and Qualification information Ordering information Product/Process Change Notice (PCN) General Information Parameter Value Part Number XC68HC58EGAR2 Description HC58DLC SOIC TSC6 PBFREE Material Type Tested Packaged Device Life Cycle Description (code) PRODUCT MATURITY/SATURATION(4) Status Active Package Information Parameter Value Package Description SOIC 28W JEDEC Pkg Description E-PDSO-G28 Pin/Lead/Ball Count 28 Package Material Plastic Mounting Style Surface Mount Tape & Reel Yes Environmental and Compliance Information Parameter Value Pb-Free RoHS Compliant Halogen Free Yes Product Content Report Product Content Report 2nd Level Interconnect e3 Moisture Sensitivity Level (MSL) 3 Floor Life 168 HOURS Package Peak Temperature (C) 260 Manufacturing and Qualification information Parameter Value Micron Size ?(m) 1.2 Application/Qualification Tier COMMERCIAL, INDUSTRIAL, AUTOMOTIVE Ordering Information Parameter Value Last Order Date Last Ship Date Minimum Package Quantity (MPQ) 1000 MPQ Container REEL Preferred Order Quantity (POQ) POQ Container Leadtime (weeks) 10 Export Control Classification Number (US) EAR99 Harmonized Tariff (US) disclaimer 8542.31.0000 Budgetary Price QTY 1000+ ($US) $2.90 Order Product/Process Change Notice (PCN) Number Type Title Issue Date Effectivity Date 11571 Product Change Notice TSPG MCD32 MOLD COMPOUND CHANGE 28 Nov 2005 26 Feb 2006 FOR ROHS 11462 Product Bulletin TSPG MCD ROHS COMPLIANT DEVICE MIGRATION 14 Oct 2005 15 Oct 2005 11431 Product Bulletin TSPG MCD ROHS COMPLIANT DEVICE MIGRATION 04 Oct 2005 05 Oct 2005