XC68HC58EGAR2 Information
General information
Package information
Environmental and Compliance information
Manufacturing and Qualification information
Ordering information
Product/Process Change Notice (PCN)
General Information
Parameter Value
Part Number XC68HC58EGAR2
Description HC58DLC SOIC TSC6 PBFREE
Material Type Tested Packaged Device
Life Cycle Description (code) PRODUCT MATURITY/SATURATION(4)
Status Active
Package Information
Parameter Value
Package Description SOIC 28W
JEDEC Pkg Description E-PDSO-G28
Pin/Lead/Ball Count 28
Package Material Plastic
Mounting Style Surface Mount
Tape & Reel Yes
Environmental and Compliance Information
Parameter Value
Pb-Free
RoHS Compliant
Halogen Free Yes
Product Content Report Product Content Report
2nd Level Interconnect e3
Moisture Sensitivity Level (MSL) 3
Floor Life 168 HOURS
Package Peak Temperature (°C) 260
Manufacturing and Qualification information
Parameter Value
Micron Size (?m) 1.2
Application/Qualification Tier COMMERCIAL, INDUSTRIAL, AUTOMOTIVE
Ordering Information
Parameter Value
Last Order Date
Last Ship Date
Minimum Package Quantity (MPQ) 1000
MPQ Container REEL
Preferred Order Quantity (POQ)
POQ Container
Leadtime (weeks) 10
Export Control Classification Number (US) EAR99
Harmonized Tariff (US) disclaimer 8542.31.0000
Budgetary Price QTY 1000+ ($US) $2.90
Order
Product/Process Change Notice (PCN)
Number Type Title Issue Date Effectivity
Date
11571 Product Change
Notice TSPG MCD32 MOLD COMPOUND CHANGE
FOR ROHS 28 Nov 2005 26 Feb 2006
11462 Product Bulletin TSPG MCD ROHS COMPLIANT DEVICE
MIGRATION 14 Oct 2005 15 Oct 2005
11431 Product Bulletin TSPG MCD ROHS COMPLIANT DEVICE
MIGRATION 04 Oct 2005 05 Oct 2005
