October 2010 Doc ID 8002 Rev 4 1/12
12
STPS30L45C
Low drop power Schottky rectifier
Features
■low forward voltage drop meaning very small
conduction losses
■low switching losses allowing high frequency
operation
■low thermal resistance
■avalanche rated
■insulated package TO-220FPAB:
– insulating voltage = 2000 V DC
– capacitance = 45 pF
■avalanche capability specified
Description
Dual center tap Schottky rectifier suited for
switched mode power supplies and high
frequency DC to DC converters.
Packaged in TO-247, TO-220AB, TO-220FPAB,
D2PAK and I2PAK this device is intended for use
in low voltage, high frequency inverters, free
wheeling and polarity protection applications.
Table 1. Device summary
IF(AV) 2 x 15 A
VRRM 45 V
Tj (max) 150 °C
VF(max) 0.5 V
A1
K
A2
K
A1
A2
K
A1
A2
K
A1
A2
K
A1
A2
A1
A2
K
TO-247
STPS30L45CW
TO-220FPAB
STPS30L45CFP
D2PAK
STPS30L45CG
TO-220AB
STPS30L45CT
I2PAK
STPS30L45CR
www.st.com
Characteristics STPS30L45C
2/12 Doc ID 8002 Rev 4
1 Characteristics
When the diodes 1 and 2 are used simultaneously:
ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
Table 2. Absolute Ratings (limiting values, per diode)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 45 V
IF(RMS) Forward rms current 30 A
IF(AV)
Average forward
current
TO-220FPAB Tc =110 °C, δ = 0.5 Per diode
Per device
15
30 A
TO-220AB, TO-247,
I2PAK, D2PA K Tc = 135 °C, δ = 0.5
IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 220 A
IRRM Repetitive peak reverse current tp = 2 µs square F = 1 kHz 1 A
IRSM Non repetitive peak reverse current tp = 100 µs square 3 A
PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 6000 W
Tstg Storage temperature range -65 to + 150 °C
TjMaximum operating junction temperature (1) 150 °C
dV/dt Critical rate of rise of reverse voltage 10000 V/µs
1. condition to avoid thermal runaway for a diode on its own heatsink
d
Ptot
dTj
-
-------------- 1
Rth j a–()
--------------------------
<
Table 3. Thermal resistances
Symbol Parameter Value Unit
Rth(j-c) Junction to case
TO-220FPAB Per diode
To t a l
4
3.2 °C/W
TO-220AB, TO-247, I2PAK, D2PA K Per diode
To t a l
1.60
0.85
Rth(c) Coupling TO-220FPAB 2.5 °C/W
TO-220AB, TO-247, I2PAK, D2PA K 0 . 1 0
STPS30L45C Characteristics
Doc ID 8002 Rev 4 3/12
Table 4. Static electrical characteristics (per diode)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
IR(1) Reverse leakage current Tj = 25 °C VR = VRRM
0.4 mA
Tj = 125 °C 100 200 mA
VF(1) Forward voltage drop
Tj = 25 °C IF = 15 A 0.55
V
Tj = 125 °C IF = 15 A 0.42 0.50
Tj = 25 °C IF = 30 A 0.74
Tj = 125 °C IF = 30 A 0.59 0.67
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.330 x IF(AV) + 0.011 IF2(RMS)
Figure 1. Average forward power dissipation
versus average forward current
(per diode)
Figure 2. Average forward current versus
ambient temperature
(δ = 0.5, per diode)
02468101214161820
0
2
4
6
8
10
12
IF(av) (A)
PF(av)(W)
T
δ=tp/T tp
δ= 0.05
δ= 0.1 δ= 0.2 δ= 0.5
δ= 1
0 25 50 75 100 125 150
0
2
4
6
8
10
12
14
16
18
Tamb(°C)
IF(av)(A)
Rth(j-a)=15°C/W
Rth(j-a)=Rth(j-c)
TO-220FPAB
TO-220AB/TO-247/I²PAK/D²PAK
T
δ=tp/T tp
Figure 3. Normalized avalanche power
derating versus pulse duration
Figure 4. Normalized avalanche power
derating versus junction
temperature
0.001
0.01
0.10.01 1
0.1
10 100 1000
1
t (µs)
p
P(t
p)
P (1 µs)
ARM
ARM
0
0.2
0.4
0.6
0.8
1
1.2
25 50 75 100 125 150
T (°C)
j
P(T
j)
P (25 °C)
ARM
ARM
Characteristics STPS30L45C
4/12 Doc ID 8002 Rev 4
Figure 5. Non repetitive surge peak forward
current versus overload duration
Figure 6. Non repetitive surge peak forward
current versus overload duration
(TO-220FPAB only)
1E-3 1E-2 1E-1 1E+0
0
20
40
60
80
100
120
140
160
180
200
t(s)
IM(A)
Tc=25°C
Tc=125°C
Tc=75°C
I
M
t
δ
=0.5
maximum values, per diode
1E-3 1E-2 1E-1 1E+0
0
20
40
60
80
100
120
140
t(s)
IM(A)
Tc=25°C
Tc=125°C
Tc=75°C
I
M
t
δ
=0.5
maximum values, per diode
Figure 7. Relative variation of thermal
impedance junction to case versus
pulse duration
Figure 8. Relative variation of thermal
impedance junction to case versus
pulse duration (TO-220FPAB)
1E-4 1E-3 1E-2 1E-1 1E+0
0.0
0.2
0.4
0.6
0.8
1.0
tp(s)
Zth(j-c)/Rth(j-c)
δ= 0.5
δ= 0.2
δ= 0.1
Single pulse
T
δ=tp/T tp
1E-3 1E-2 1E-1 1E+0 1E+
1
0.0
0.2
0.4
0.6
0.8
1.0
tp(s)
Zth(j-c)/Rth(j-c)
T
δ=tp/T tp
δ= 0.5
δ= 0.2
δ= 0.1
Single pulse
Figure 9. Reverse leakage current versus
reverse voltage applied (typical
values, per diode)
Figure 10. Junction capacitance versus
reverse voltage applied (typical
values, per diode)
0 5 10 15 20 25 30 35 40 45
1E-2
1E-1
1E+0
1E+1
1E+2
5E+2
VR(V)
IR(mA)
Tj=100°C
Tj=75°C
Tj=25°C
Tj=150°C
Tj=125°C
12 51020 50
100
200
500
1000
2000
VR(V)
C(pF)
F=1MHz
Tj=25°C
STPS30L45C Characteristics
Doc ID 8002 Rev 4 5/12
Figure 11. Forward voltage drop versus
forward current (maximum values,
per diode)
Figure 12. Thermal resistance junction to
ambient versus copper surface
under tab for D2PAK
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
1
10
100
200
VFM(V)
IFM(A)
Typical values
Tj=150°C
Tj=25°C
Tj=125°C
0 5 10 15 20 25 30 35 40
0
10
20
30
40
50
60
70
80
S(cm²)
Rth(j-a) (°C/W)
Epoxy printed circuit board FP4,
copper thickness = 35 µm
Package Information STPS30L45C
6/12 Doc ID 8002 Rev 4
2 Package Information
●Epoxy meets UL94, V0
●Cooling method: by conduction (C)
●Recommended torque (TO-220AB, TO-220FPAB): 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5. TO-220AB package dimensions
Ref
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
C 1.23 1.32 0.048 0.051
D 2.40 2.72 0.094 0.107
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034
F1 1.14 1.70 0.044 0.066
F2 1.14 1.70 0.044 0.066
G 4.95 5.15 0.194 0.202
G1 2.40 2.70 0.094 0.106
H2 10 10.40 0.393 0.409
L2 16.4 typ. 0.645 typ.
L4 13 14 0.511 0.551
L5 2.65 2.95 0.104 0.116
L6 15.25 15.75 0.600 0.620
L7 6.20 6.60 0.244 0.259
L9 3.50 3.93 0.137 0.154
M 2.6 typ. 0.102 typ.
Dia. 3.75 3.85 0.147 0.151
A
C
D
L7
Dia
L5
L6
L9
L4
F
H2
G
G1
L2
F2
F1
E
M
STPS30L45C Package Information
Doc ID 8002 Rev 4 7/12
Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount device,
IS NOT PERMITTED. A standard through-hole mounting is mandatory.
Table 6. I2PAK dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.40 2.72 0.094 0.107
b 0.61 0.88 0.024 0.035
b1 1.14 1.70 0.044 0.067
c 0.49 0.70 0.019 0.028
c2 1.23 1.32 0.048 0.052
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.195 0.203
E 10 10.40 0.394 0.409
L 13 14 0.512 0.551
L1 3.50 3.93 0.138 0.155
L2 1.27 1.40 0.050 0.055
E
L2
L1
b1
D
A1
c
c2
A
b
e
e1
L
Package Information STPS30L45C
8/12 Doc ID 8002 Rev 4
Table 7. TO-220FPAB package dimensions
Ref
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.70 0.018 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.70 0.045 0.067
F2 1.15 1.70 0.045 0.067
G 4.95 5.20 0.195 0.205
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 Typ. 0.63 Typ.
L3 28.6 30.6 1.126 1.205
L4 9.8 10.6 0.386 0.417
L5 2.9 3.6 0.114 0.142
L6 15.9 16.4 0.626 0.646
L7 9.00 9.30 0.354 0.366
Dia. 3.00 3.20 0.118 0.126
H
A
B
Dia
L7
L6
L5
F1
F2
F
D
E
L4
G1
G
L2
L3
STPS30L45C Package Information
Doc ID 8002 Rev 4 9/12
Figure 13. D2PAK footprint dimensions (in millimeters)
Table 8. D2PAK package dimensions
Ref
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.14 1.70 0.045 0.067
C 0.45 0.60 0.017 0.024
C2 1.23 1.36 0.048 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.40 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
M 2.40 3.20 0.094 0.126
R 0.40 typ. 0.016 typ.
V2 0° 8° 0° 8°
G
L
L3
L2
B
B2
E
* FLAT ZONE NO LESS THAN 2mm
A
C2
D
R
A2
M
V2
C
A1
*
16.90
10.30
8.90 3.70
5.08
1.30
Package Information STPS30L45C
10/12 Doc ID 8002 Rev 4
Table 9. TO-247 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 4.85 5.15 0.191 0.203
A1 2.20 2.60 0.086 0.102
b 1.00 1.40 0.039 0.055
b1 2.00 2.40 0.078 0.094
b2 3.00 3.40 0.118 0.133
c 0.40 0.80 0.015 0.031
D(1)
1. Dimension D plus gate protrusion does not exceed 20.5 mm
19.85 20.15 0.781 0.793
E 15.45 15.75 0.608 0.620
e 5.45 typ. 0.215 typ.
L 14.20 14.80 0.559 0.582
L1 3.70 4.30 0.145 0.169
L2 18.50 typ. 0.728 typ.
∅P(2)
2. Resin thickness around the mounting hole is not less than 0.9 mm
3.55 3.65 0.139 0.143
∅R 4.50 5.50 0.177 0.217
S 5.50 typ. 0.216 typ.
E
L2
S
D
c
A1 BACK VIEW
Heat-sink plane
L1
Lb1
b2
b
A
e
11
22
33
∅R
∅P
STPS30L45C Ordering Information
Doc ID 8002 Rev 4 11/12
3 Ordering Information
4 Revision history
Table 10. Ordering information
Order code Marking Package Weight Base qty Delivery mode
STPS30L45CT STPS30L45CT TO-220AB 2g 50 Tube
STPS30L45CG STPS30L45CG D2PA K 1.8g 50 Tube
STPS30L45CG-TR STPS30L45CG D2PA K 1.8g 500 Tape and reel
STPS30L45CW STPS30L45CW TO-247 4.4g 30 Tube
STPS30L45CR STPS30L45CR I2PA K 1.4g 50 Tube
STPS30L45CFP STPS30L45CFP TO-220FPAB 1.9 g 50 Tube
Table 11. Document revision history
Date Revision Changes
Jul-2003 3B Previous issue
13-Oct-2010 4 Added paragraph above Ta b l e 6 and updated I2PAK dimensions in
Ta b l e 6 . Updated TO-247 dimensions in Ta b l e 9 .
STPS30L45C
12/12 Doc ID 8002 Rev 4
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