BC857AT, BT, CT
PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Die Construction
• Complementary NPN Types Available (BC847AT,BT,CT)
• Ultra-Small Surface Mount Package
• Lead Free/RoHS Compliant (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
• "Green" Device (Note 4 and 5)
Mechanical Data
• Case: SOT-523
• Case Material - Molded Plastic. UL Flammability
Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy
42 leadframe).
• Terminal Connections: See Diagram
• Marking Code: See Table Below & Diagram on Page 2
• Ordering & Date Code Information: See Page 2
• Weight: 0.002 grams (approximate)
DS30275 Rev. 9 - 2
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BC857AT, BT, CT
© Diodes Incorporated
Type Marking
BC857AT 3V
BC857BT 3W
BC857CT 3G
SOT-523
Dim Min Max Typ
A 0.15 0.30 0.22
B 0.75 0.85 0.80
C 1.45 1.75 1.60
D ⎯ ⎯ 0.50
G 0.90 1.10 1.00
H 1.50 1.70 1.60
J 0.00 0.10 0.05
K 0.60 0.80 0.75
L 0.10 0.30 0.22
M 0.10 0.20 0.12
N 0.45 0.65 0.50
α 0° 8° ⎯
All Dimensi mm ons in
A
M
JL
D
BC
H
K
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage VCBO -50 V
Collector-Emitter Voltage VCEO -45 V
Emitter-Base Voltage VEBO -5.0 V
Collector Current IC -100 mA
Power Dissipation (Note 1) Pd 150 mW
Thermal Resistance, Junction to Ambient (Note 1) RθJA 833 °C/W
Operating and Storage Temperature Range Tj, TSTG -55 to +150 °C
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic Symbol Min Typ Max Unit Test Condition
Collector-Base Breakdown Voltage (Note 3) V(BR)CBO -50 — — V IC = 10μA, IB = 0
Collector-Emitter Breakdown Voltage (Note 3) V(BR)CEO -45 — — V IC = 10mA, IB = 0
Emitter-Base Breakdown Voltage (Note 3) V(BR)EBO -5 — — V IE = 1μA, IC = 0
DC Current Gain (Note 3) Current Gain A
B
C hFE 125
220
420
—
290
520
250
475
800 —
VCE = -5.0V, IC = -2.0mA
Collector-Emitter Saturation Voltage (Note 3) VCE(SAT) — —
— -300
-650 mV IC = -10mA, IB = -0.5mA
IC = -100mA, IB = -5.0mA
Base-Emitter Saturation Voltage (Note 3) VBE(SAT) —
— -700
-900 —
— mV IC = -10mA, IB = -0.5mA
IC = -100mA, IB = -5.0mA
Base-Emitter Voltage (Note 3) VBE(ON) -600
— —
— -750
-820 mV VCE = -5.0V, IC = -2.0mA
VCE = -5.0V, IC = -10mA
Collector-Cutoff Current (Note 3)
ICBO —
— —
— -15
-4.0 NA
µA VCB = -30V
VCB = -30V, TA = 150°C
Gain Bandwidth Product fT 100 — — MHz VCE = -5.0V, IC = -10mA, f = 100MHz
Output Capacitance COB — — 4.5 pF VCB = -10V, f = 1.0MHz
Noise Figure NF — — 10 dB IC = -0.2mA, VCE = -5.0Vdc,
RS = 2.0KΩ, f = 1.0KHz,
BW = 200Hz
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead
3. Short duration pulse test used to minimize self-heating effect.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Da te
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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TOP VIEW
C
E
B
N