Features
• Small 1.6 x 0.8 mm footprint
• Diffused optics
• Operating temperature range of
–30°C to +85°C
• Compatible with reflow soldering
• Three color combinations
available: red/green, yellow/
green, orange/green
• Available in 8 mm tape on
7" (178 mm) diameter reels
Applications
• Keypad backlighting
• Symbol backlighting
• LCD backlighting
• Status indication
• Front panel indicator
Description
The HSMF-C16x series of bicolor
chip-type LEDs is designed in an
ultra small package for
miniaturization. It is the first of its
kind to achieve such small
packaging for 2 dies.
Agilent HSMF-C165, C166, C167
Miniature Bi-Color Surface Mount
Chip LEDs
Data Sheet
The small size, narrow footprint,
and low profile make this series of
LEDs excellent for backlighting,
status indication, and front panel
illumination applications.
Device Selection Guide
Part Number Color Parts per Reel
HSMF-C165 High Efficiency Red/Green 4000
HSMF-C166 Yellow/Green 4000
HSMF-C167 Orange/Green 4000
2
Package Dimensions
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
1.6
(0.063)
DIFFUSED EPOXY
PC BOARD
0.5
(0.020)
0.16
(0.006)
0.4 (0.016)
0.3
(0.012)
SOLDERING
TERMINALS
CATHODE LINE
LED DIES
0.8
(0.031)
3
1
24
0.4 (0.016)
3
1
24
GREEN
RED/YELLOW/ORANGE
POLARITY
CATHODE LINE
3
Absolute Maximum Ratings at TA = 25˚C
Parameter HSMF-C165/166/167 Units
DC Forward Current [1] 20 mA
Peak Pulsing Current[2] 100 mA
Power Dissipation 52 mW
Reverse Voltage (IR = 100 µA) 5 V
LED Junction Temperature 95 ˚C
Operating Temperature Range –30 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See reflow soldering profile (Figure 6)
Notes:
1. Derate linearly as shown in Figure 4.
2. Pulse condition of 1/10 duty and 0.1 ms width.
Electrical Characteristics at TA = 25˚C
Forward Voltage Reverse Breakdown Capacitance Thermal
VF (Volts) VR (Volts) C (pF), @ VF = 0, Resistance
@ IF = 20 mA @ IR = 100 µA f = 1 MHz RθJ–PIN (˚C/W)
Color Typ. Max. Min. Typ. Typ.
HER 2.1 2.6 5 5 325
Orange 2.2 2.6 5 7 325
Yellow 2.1 2.6 5 6 325
Green 2.2 2.6 5 9 325
Optical Characteristics at TA = 25˚C
Color,
Luminous Intensity Peak Dominant Viewing Angle
IV (mcd) Wavelength Wavelength 2 θ1/2
@ 20 mA[1] λpeak (nm) λd[2] (nm) Degrees[3]
Color Min. Typ. Typ. Typ. Typ.
HER 2.5 10.0 630 626 120
Orange 2.5 8.0 605 604 120
Yellow 2.5 8.0 589 586 120
Green 4.0 15.0 570 572 120
Notes:
1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp
package.
2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
4
Light Intensity (Iv) Bin Limits[1]
Intensity (mcd) Intensity (mcd)
Bin ID Min. Max. Bin ID Min. Max.
A 0.10 0.20 K 6.30 12.50
B 0.16 0.32 L 10.00 20.00
C 0.25 0.50 M 16.00 32.00
D 0.40 0.80 N 25.00 50.00
E 0.63 1.25 P 40.00 80.00
F 1.00 2.00 Q 63.00 125.00
G 1.60 3.20 R 100.00 200.00
H 2.50 5.00 S 160.00 320.00
J 4.00 8.00 T 250.00 500.00
Note:
1. Bin categories are established for classification of products. Products may not be available in all
categories. Please contact your Agilent representative for information on currently available bins.
Orange Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 596.0 601.0
B 599.0 604.0
C 602.0 607.0
D 605.0 610.0
E 608.0 613.0
F 611.0 616.0
Yellow/Amber Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 581.5 585.0
B 584.0 587.5
C 586.5 590.0
D 589.5 592.5
E 591.5 595.0
F 594.0 597.5
Color Bin Limits
Green Color Bins[1]
Dom. Wavelength (nm)
Bin ID Min. Max.
A 561 565
B 564 568
C 567 571
D 570 574
E 573 577
5
Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage.
Figure 3. Luminous intensity vs. forward
current.
Figure 4. Maximum forward current vs.
ambient temperature.
Figure 5. Relative intensity vs. angle.
GREEN
YELLOW
ORANGE HER
500 550 600 650 700 750
WAVELENGTH - nm
RELATIVE INTENSITY
1.0
0.5
0
1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
100
10
1
0
HER
ORANGE
YELLOW
GREEN
05 15
I
F
– FORWARD CURRENT – mA
0
0.4
1.0
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
20
0.6
0.2
0.8
10 30
1.4
25
1.2
Rθ = 800˚C/W
J-A
Rθ = 600˚C/W
J-A
I
F MAX
– MAXIMUM FORWARD CURRENT – mA
25
20
15
10
5
00 20 40 60 80 100
T
A
– AMBIENT TEMPERATURE – °C
RELATIVE INTENSITY – %
ANGLE
-70 -50 -30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
100
90
80
70
60
50
40
30
20
10
0
6
Figure 6. Recommended reflow soldering profile. Figure 7. Recommended soldering pad pattern.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 8. Reeling orientation.
Figure 9. Reel dimensions.
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
–3°C/SEC. MAX.
0.30
(0.012)
0.60
(0.024)
0.40
(0.016)
0.40
(0.016)
0.70
(0.028) 0.70
(0.028)
CATHODE SIDE
PRINTED LABEL
USER FEED DIRECTION
10.50 ± 1.0 (0.413 ± 0.039)
59.60 ± 1.00
(2.346 ± 0.039)
Ø 20.20 MIN.
(Ø 0.795 MIN.)
6
PS






178.40 ± 1.00
(7.024 ± 0.039)
3.0 ± 0.5
(0.118 ± 0.020)
4.0 ± 0.5
(0.157 ± 0.020) 5.0 ± 0.5
(0.197 ± 0.020)
Ø 13.1 ± 0.5
(Ø 0.516 ± 0.020)
8.0 ± 1.0 (0.315 ± 0.039)
7
Figure 10. Tape dimensions.
Figure 11. Tape leader and trailer dimensions.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.





8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1) 0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157) 1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (± 0.004) DIM. B
± 0.10 (± 0.004)PART NUMBER DIM. C
± 0.10 (± 0.004)
HSMF-C16x SERIES 1.80 (0.071)  0.95 (0.037) 0.60 (0.024)
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR 
COVER TAPE.
Reflow Soldering
For more information on
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
Storage Condition:
5 to 30°C @ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been open for
more than 1 week
Baking recommended condition:
60 ± 5°C for 20 hours.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
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Hong Kong: (+65) 6271 2451
India, Australia, New Zealand: (+65) 6271 2394
Japan: (+81 3) 3335-8152(Domestic/Interna-
tional), or 0120-61-1280(Domestic Only)
Korea: (+65) 6271 2194
Malaysia, Singapore: (+65) 6271 2054
Taiwan: (+65) 6271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes 5988-4258EN
April 6, 2002
5988-6146EN