HV2601 / HV2701 Low-Charge Injection, 16-Channel, High-Voltage Analog Switch Features Description * High-Voltage CMOS technology for high performance * 16-channel high voltage analog switch * 3.3V input logic level compatible * 20 MHz data shift clock frequency * Very low quiescent power dissipation (-10 A) * Low parasitic capacitance * DC to 50 MHz small signal frequency response * -60dB typical OFF-isolation at 5.0 MHz * CMOS logic circuitry for low power * Excellent noise immunity * Cascadable serial data register with latches * Flexible operating supply voltages * Integrated bleed resistors on the outputs (HV2701 only) HV2601/HV2701 are low-charge injection, 16-channel, high-voltage analog switch integrated circuits (ICs). These devices are designed for use in applications requiring high-voltage switching controlled by low-voltage control signals, such as medical ultrasound imaging and other piezoelectric transducer drivers. HV2701 has integrated bleed resistors which eliminate voltage build-up on capacitive loads such as piezoelectric transducers. Applications * * * * Medical ultrasound imaging NDT metal flaw detection Piezoelectric transducer drivers Optical MEMS modules These ICs shift input data into a 16-bit shift register that can then be retained in a 16-bit latch. To reduce any possible clock feed-through noise, the latch enable bar should be left high until all bits are clocked in. Data is clocked in during the rising edge of the clock. Using High-Voltage CMOS technology, this device combines high-voltage, bilateral DMOS switches and low power CMOS logic to provide efficient control of high voltage analog signals. The device is suitable for various combinations of high voltage supplies, e.g., VPP/VNN: +40V/-160V, +100V/100V, and +160V/-40V. Package Types 48 3 2 1 6 7 13 12 5 10 11 16 1 4 9 8 15 14 18 17 22 21 20 19 26 25 24 23 34 33 32 31 30 29 28 27 42 41 40 39 38 37 36 35 42-Ball Bumped Die (Top View) 48-Lead LQFP (Top View) See Table 2-1 and Table 2-2 for pin information 2015-2016 Microchip Technology Inc. DS20005391B-page 1 HV2601 / HV2701 Block Diagram Level Shifters Latches D LE CLR Output Switches Bleed Resistors SW0 D LE CLR SW1 D LE CLR SW2 D LE CLR SW14 D LE CLR SW15 DIN CLK 16-Bit Shift Register DOUT VDD GND LE CLR VNN VPP RGND HV2701 only Note: Bleed resistors and RGND apply to HV2701 only. DS20005391B-page 2 2015-2016 Microchip Technology Inc. HV2601 / HV2701 1.0 ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS VDD logic supply ........................................................................................................................................-0.5V to +7.0V VPP - VNN differential supply.................................................................................................................................... 220V VPP positive supply ......................................................................................................................... -0.5V to VNN + 200V VNN negative supply.................................................................................................................................+0.5V to -200V Logic input voltage ........................................................................................................................... -0.5V to VDD + 0.3V Analog signal range ....................................................................................................................................... VNN to VPP Peak analog signal current/channel ......................................................................................................................... 3.0A Storage temperature ............................................................................................................................. -65C to +150C Power dissipation 42-Ball Bumped Die ................................................................................................................... 1.5W Power dissipation 48-Lead LQFP ........................................................................................................................... 1.0W Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS (Notes 1 - 3) Symbol Parameter Value VDD Logic power supply voltage 3.0V to 5.5V VPP Positive high voltage supply +40V to VNN +200V VNN Negative high voltage supply -40V to -160V VIH High level input voltage 0.9VDD to VDD VIL Low level input voltage 0V to 0.1 VDD Analog signal voltage peak-to-peak VNN +10V to VPP -10V Operating free air temperature 0C to 70C VSIG TA Note 1: Power up/down sequence is arbitrary except GND must be powered-up first and powered-down last. 2: VSIG must be VNN and VPP or floating during power up/down transition. 3: Rise and fall times of power supplies VDD, VPP, and VNN should not be less than 1.0msec. 2015-2016 Microchip Technology Inc. DS20005391B-page 3 HV2601 / HV2701 DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Over recommended operating conditions unless otherwise noted. Parameter Symbol 0C 25C 70C Min Max Min Typ Max Min Max Units Conditions - 30 - 26 38 - 48 - 25 - 22 27 - 32 - 25 - 22 27 - 30 - 18 - 18 24 - 27 - 23 - 20 25 - 30 - 22 - 16 25 - 27 Small signal switch ON-resistance RONS matching - 20 - 5.0 20 - 20 % ISIG= 5.0mA, VPP= +100V, VNN= -100V Large signal switch ON-resistance RONL - - - 15 - - - VSIG= VPP-10V, ISIG= 1.0A Value of output bleed resistor (HV2701 only) RINT - - 20 35 50 - - k Output Switch to RGND IRINT= 0.5 mA Switch OFF leakage per switch ISOL - 5.0 - 1.0 10 - 15 A VSIG= VPP-10V and VNN+10V (Note 1) - 300 - 100 300 - 300 mV - 500 - 100 500 - 500 mV HV2601:100 k load HV2701: no load (Note 1) Small signal switch ON-resistance DC offset switch OFF DC offset switch ON RONS ISIG= 5.0 mA VPP= +40V ISIG= 200 mA VNN= -160V ISIG= 5.0 mA VPP= +100V ISIG= 200 mA VNN= -100V ISIG= 5.0 mA VPP= +160V ISIG= 200 mA VNN= -40V VOS Quiescent VPP supply current IPPQ - - - 10 50 - - A All switches OFF Quiescent VNN supply current INNQ - - - -10 -50 - - A All switches OFF Quiescent VPP supply current IPPQ - - - 10 50 - - A All switches ON, ISW= 5.0 mA Quiescent VNN supply current INNQ - - - -10 -50 - - A All switches ON, ISW= 5.0 mA Switch output peak current ISW - 3.0 - 3.0 2.0 - 2.0 A VSIG duty cycle < 0.1% Output switching frequency fSW - - - - 50 - - kHz Duty cycle = 50% - 6.5 - - 7.0 - 8.0 VPP= +40V VNN= -160V - 4.0 - - 5.5 - 5.5 - 4.0 - - 5.0 - 5.5 VPP= +160V VNN= -40V - 6.5 - - 7.0 - 8.0 VPP= +40V VNN= -160V - 4.0 - - 5.0 - 5.5 - 4.0 - - 5.0 - 5.5 - 4.0 - - 4.0 - 4.0 Average VPP supply current Average VNN supply current Average VDD supply current DS20005391B-page 4 IPP INN IDD mA mA VPP= +100V VNN= -100V VPP= +100V VNN= -100V VPP= +160V VNN= -40V mA All output switches are turning ON and OFF at 50 kHz with no load. All output switches are turning ON and OFF at 50 kHz with no load. fCLK= 5.0 MHz, VDD= 5.0V 2015-2016 Microchip Technology Inc. HV2601 / HV2701 DC ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Specifications: Over recommended operating conditions unless otherwise noted. Parameter Symbol 0C 25C 70C Min Max Min Typ Max Min Max Units Conditions Quiescent VDD supply current IDDQ - 10 - - 10 - 10 A All logic inputs are static Data out source current ISOR 0.45 - 0.45 0.70 - 0.40 - mA VOUT= VDD- 0.7V Data out sink current ISINK 0.45 - 0.45 0.70 - 0.40 - mA VOUT= 0.7V CIN - 10 - - 10 - 10 pF - Logic input capacitance Note 1: See Figure 3-1. 2015-2016 Microchip Technology Inc. DS20005391B-page 5 HV2601 / HV2701 AC ELECTRICAL CHARACTERISTICS Electrical Specifications: VDD=5.0V, tR = tF5.0 ns, 50% duty cycle, CLOAD = 20 pF, unless otherwise noted. Parameter Symbol Set up time before LE rises tSD 0C 25C 70C Min Max Min Typ Max Min Max 25 - 25 - - 25 - 56 12 50 15 55 21 7.0 100 40 - 50 15 55 - 56 12 78 30 21 7.0 100 40 - 56 12 50 15 55 21 7.0 100 40 - Units Conditions ns - VDD= 3.0V VDD= 5.0V VDD= 3.0V VDD= 5.0V - VDD= 3.0V VDD= 5.0V Time width of LE tWLE Clock delay time to data out tDO Time width of CLR tWCLR Set up time data to clock tSU Hold time data from clock tH 2.0 - 2.0 - - 2.0 - ns Clock frequency fCLK - 8.0 20 - - 8.0 20 - 8.0 20 MHz Clock rise and fall times tR,tF - 50 - - 50 - 50 ns Turn ON time TON - 5.0 - - 5.0 - 5.0 Turn OFF time TOFF - 5.0 - - 5.0 - 5.0 dv/dt - 20 20 20 - - 20 20 20 - 20 20 20 -30 - -30 -33 - -30 - KCR -58 -60 - -58 -60 -70 - -58 -60 - dB IID - 300 - - 300 - 300 mA 300ns pulse width, 2.0% duty cycle (Note 1) CSG(OFF) 5.0 17 5.0 12 17 5.0 17 pF 0V, f = 1.0MHz CSG(ON) 25 50 25 38 50 25 50 pF 0V, f = 1.0MHz +VSPK -VSPK - - - - 150 - - +VSPK -VSPK - - - - 150 - - +VSPK -VSPK - - - - 150 - - - - - 820 - - - - - - 600 - - - - - - 350 - - - Maximum VSIG slew rate OFF isolation Switch crosstalk Output switch isolation diode current OFF capacitance SW to GND ON capacitance SW to GND Output voltage spike Charge injection KO QC ns ns ns ns VDD= 3.0 or 5.0V VDD= 3.0V VDD= 5.0V - VSIG= VPP-10V, RLOAD= 10k (Note 1) VSIG= VPP-10V, RLOAD= s 10k (Note 1) VPP= +40V, VNN= -160V v/ns VPP= +100V, VNN= -100V VPP= +160V, VNN= -40V s dB f = 5.0MHz, 1.0k//15pF load (Note 1) f = 5.0MHz, 50 load (Note 1) f = 5.0MHz, 50 load (Note 1) VPP= +40V, VNN= -160V, RLOAD= 50 (Note 1) mV VPP= +100V, VNN= -100V, RLOAD= 50 (Note 1) VPP= +160V, VNN= -40V, RLOAD= 50 (Note 1) pC VPP= +40V, VNN= -160V, VSIG= 0V (Note 1) VPP= +100V, VNN= -100V, VSIG= 0V (Note 1) VPP= +160V, VNN= -40V, VSIG= 0V (Note 1) Note 1: See Figure 3-1. DS20005391B-page 6 2015-2016 Microchip Technology Inc. HV2601 / HV2701 2.0 PIN DESCRIPTION The locations of the pads/balls are listed in Package Types. TABLE 2-1: Pin # PIN DESCRIPTION: 42-BALL BUMPED DIE PACKAGE HV2601 HV2701 Description 1 NC RGND 2 VPP VPP Positive supply voltage No connect/Ground for bleed resistor 3 VNN VNN Negative supply voltage 4 DOUT DOUT Data out logic output 5 CLR CLR Latch clear logic input 6 CLK CLK Clock logic input for shift register Ground 7 GND GND 8 SW15A SW15A 9 SW15B SW15B 10 LE LE Analog switch 15 terminal A Analog switch 15 terminal B Latch-enable logic input, low active 11 VDD VDD 12 SW0A SW0A Analog switch 0 terminal A Logic supply voltage 13 SW0B SW0B Analog switch 0 terminal B 14 SW14A SW14A Analog switch 14 terminal A 15 SW14B SW14B 16 DIN DIN 17 SW1A SW1A Analog switch 1 terminal A 18 SW1B SW1B Analog switch 1 terminal B 19 SW13A SW13A Analog switch 13 terminal A 20 SW13B SW13B Analog switch 13 terminal B 21 SW2A SW2A Analog switch 2 terminal A 22 SW2B SW2B Analog switch 2 terminal B 23 SW12A SW12A Analog switch 12 terminal A 24 SW12B SW12B Analog switch 12 terminal B 25 SW3A SW3A Analog switch 3 terminal A 26 SW3B SW3B Analog switch 3 terminal B 27 SW11A SW11A Analog switch 11 terminal A 28 SW11B SW11B Analog switch 11 terminal B 29 SW9B SW9B Analog switch 9 terminal B 30 SW8B SW8B Analog switch 8 terminal B 31 SW7A SW7A Analog switch 7 terminal A 32 SW6A SW6A Analog switch 6 terminal A 33 SW4A SW4A Analog switch 4 terminal A 34 SW4B SW4B Analog switch 4 terminal B 35 SW10B SW10B Analog switch 10 terminal B 36 SW10A SW10A Analog switch 10 terminal A 37 SW9A SW9A Analog switch 9 terminal A 38 SW8A SW8A Analog switch 8 terminal A 39 SW7B SW7B Analog switch 7 terminal B 40 SW6B SW6B Analog switch 6 terminal B 41 SW5B SW5B Analog switch 5 terminal B 42 SW5A SW5A Analog switch 5 terminal A 2015-2016 Microchip Technology Inc. Analog switch 14 terminal B Data in logic input DS20005391B-page 7 HV2601 / HV2701 TABLE 2-2: PIN DESCRIPTION: 48-LEAD LQFP Pin # HV2601 HV2701 Description 1 NC NC No connect 2 NC NC No connect 3 SW4B SW4B Analog switch 4 terminal B 4 SW4A SW4A Analog switch 4 terminal A 5 SW3B SW3B Analog switch 3 terminal B 6 SW3A SW3A Analog switch 3 terminal A 7 SW2B SW2B Analog switch 2 terminal B 8 SW2A SW2A Analog switch 2 terminal A 9 SW1B SW1B Analog switch 1 terminal B 10 SW1A SW1A Analog switch 1 terminal A 11 SW0B SW0B Analog switch 0 terminal B 12 SW0A SW0A 13 VNN VNN Negative supply voltage 14 NC NC No connect 15 VPP VPP Positive supply voltage 16 NC NC No connect 17 GND GND Ground 18 VDD VDD Logic supply voltage 19 DIN DIN Data in logic input 20 CLK CLK Clock logic input for shift register Analog switch 0 terminal A 21 LE LE 22 CLR CLR Latch clear logic input 23 DOUT DOUT Data out logic output Latch-enable logic input, low active 24 NC RGND No connect/Ground for bleed resistor 25 SW15B SW15B Analog switch 15 terminal B 26 SW15A SW15A Analog switch 15 terminal A 27 SW14B SW14B Analog switch 14 terminal B 28 SW14A SW14A Analog switch 14 terminal A 29 SW13B SW13B Analog switch 13 terminal B 30 SW13A SW13A Analog switch 13 terminal A 31 SW12B SW12B Analog switch 12 terminal B 32 SW12A SW12A Analog switch 12 terminal A 33 SW11B SW11B Analog switch 11 terminal B 34 SW11A SW11A Analog switch 11 terminal A 35 NC NC No connect No connect 36 NC NC 37 SW10B SW10B 38 SW10A SW10A Analog switch 10 terminal A 39 SW9B SW9B Analog switch 9 terminal B 40 SW9A SW9A Analog switch 9 terminal A 41 SW8B SW8B Analog switch 8 terminal B 42 SW8A SW8A Analog switch 8 terminal A 43 SW7B SW7B Analog switch 7 terminal B DS20005391B-page 8 Analog switch 10 terminal B 2015-2016 Microchip Technology Inc. HV2601 / HV2701 TABLE 2-2: PIN DESCRIPTION: 48-LEAD LQFP Pin # HV2601 HV2701 44 SW7A SW7A Analog switch 7 terminal A 45 SW6B SW6B Analog switch 6 terminal B 46 SW6A SW6A Analog switch 6 terminal A 47 SW5B SW5B Analog switch 5 terminal B 48 SW5A SW5A Analog switch 5 terminal A 2015-2016 Microchip Technology Inc. Description DS20005391B-page 9 HV2601 / HV2701 3.0 DETAILED DESCRIPTION 3.1 Application Information FIGURE 3-1: TEST CIRCUITS VPP -10V VPP -10V ISOL 10k RLOAD VOUT VOUT Open RLOAD Open (HV2601 only) RGND VPP VPP VDD VNN VNN GND 5V RGND RGND VPP VPP VDD VNN VNN GND Switch Off Leakage per Switch 5V VPP VPP VDD VNN VNN GND 5V TON/TOFF Test Circuit DC Offset Switch ON/OFF VIN = 10VP-P @5MHz VIN = 10VP-P @5MHz VSIG IID VOUT VNN RLOAD NC 50 50 RGND RGND VPP VNN RGND VPP VDD VNN VPP 5V 5V GND VPP VDD VNN VNN GND VOUT KCR = 20Log VIN Output Switch Isolation Diode Current OFF Isolation 5V VOUT VIN Switch Crosstalk +VSPK VOUT VOUT VOUT -VSPK 1000pF RLOAD VSIG 50 RGND RGND 1k VPP VPP VDD VNN VNN GND Q = 1000pF x VOUT Charge Injection DS20005391B-page 10 VDD VNN VNN GND KO = 20Log VPP VPP 5V VPP VPP VDD VNN VNN GND 5V Output Voltage Spike 2015-2016 Microchip Technology Inc. HV2601 / HV2701 TABLE 3-1: D0 D1 L LOGIC FUNCTION TABLE ... D7 D8 ... D15 LE CLR SW0 SW1 - - - - L L OFF H - - L - - - L L - - - L L - H - - - L - - - - L - - - - - L L - - - L - - L L - - - - L L - - - - - L L - - - ... SW7 SW8 ... SW15 - - - - ON - - - - - OFF - - - L - ON - - - L - - - - - - - - - - OFF - - H - - L - - H - L L - - - - - L L - - - - - - L L - - - - - L L - - - - - L L - - - - - - - - - L L L - - - - OFF - - - - ON ... ... ON - - OFF - - ON - - - - - - - - - - - - - - - ... - - - - H L L X X X X X X X H L HOLD PREVIOUS STATE X X X X X X X X H ALL SWITCHES OFF ... - Note 1: The 16 switches operate independently. 2: Serial data is clocked in on the L to H transition of the CLK. 3: All 16 switches go to a state retaining their latched condition at the rising edge of LE. When LE is low the shift registers data flow through the latch. 4: DOUT is high when data in the shift register 15 is high. 5: Shift registers clocking has no effect on the switch states if LE is high. 6: The CLR clear input overrides all other inputs. FIGURE 3-2: LOGIC TIMING WAVEFORMS DN+1 DN DATA IN DIN 50% LE 50% DN-1 50% 50% tWLE tSD CLOCK CLK 50% tSU tDO DATA OUT DOUT VOUT (typ) th DO 50% tOFF OFF tON 90% 10% ON CLR 50% 50% 2015-2016 Microchip Technology Inc. tWCL 50% DS20005391B-page 11 HV2601 / HV2701 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 42-ball Bumped Die Example XXXXXXX XXXXX e1 YYWWNNN HV2601 BD e1 1550343 48-lead LQFP XXX XXXXXXX e3 YYWW NNN Legend: XX...X Y YY WW NNN e3 * Note: DS20005391B-page 12 Example HV 2601FG e3 1550 343 Product Code or Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC(R) designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator (e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo. 2015-2016 Microchip Technology Inc. HV2601 / HV2701 42-Ball Bumped Die Package Outline (BD) 5.29x5.30mm body, 1.0mm height (max), 0.52 / 0.60mm pitch D1 e 42 C/L 42 e 0,0 E Note 1 (Ball 1 Index Area D/4 x E/4) C/L E2 E1 e1 e1 e1 1 1 e D View B Top View Bottom View Side View View A b A2 A A1 Seating Plane View A View B 1RWHV)RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJV6HHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQDWZZZPLFURFKLSFRPSDFNDJLQJ Notes: 1. %DOOLGHQWLHUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG%DOOLGHQWLHUFDQEHDPROGHGPDUNLGHQWLHUDQHPEHGGHGPHWDOPDUNHURUD printed indicator. Symbol Dimension (mm) Note: A A1 A2 b D MIN 0.9 0.21 0. 0.29 5.19 NOM 0.95 0.24 0.7 0.32 5.29 MAX 1.0 0.27 0.7 0.35 5.39 D1 E 4.20 BSC 5.30 5.20 5.40 E1 E2 e e1 4.04 BSC 0.68 BSC 0.60 BSC 0.52 BSC For more information about ball coordinates, contact Microchip sales. 2015-2016 Microchip Technology Inc. DS20005391B-page 13 HV2601 / HV2701 48-Lead LQFP Package Outline (FG) 7.00x7.00mm body, 1.60mm height (max), 0.50mm pitch D D1 E1 E Note 1 (Index Area D1/4 x E1/4) 48 1 e b Top View View B L2 A A2 Seating Plane L L1 A1 Gauge Plane Seating Plane View B Side View Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. Note: 1. $3LQLGHQWLHUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWLHUFDQEHDPROGHGPDUNLGHQWLHUDQHPEHGGHGPHWDOPDUNHURU a printed indicator. Symbol MIN Dimension NOM (mm) MAX A A1 A2 b D D1 E E1 1.40* 0.05 1.35 0.17 8.80* 6.80* 8.80* 6.80* - - 1.40 0.22 9.00 7.00 9.00 7.00 1.60 0.15 1.45 0.27 9.20* 7.20* 9.20* 7.20* e L L1 L2 0.45 0.50 BSC 0.60 0.75 0O 1.00 REF 0.25 BSC 3.5O 7O JEDEC Registration MS-026, Variation BBC, Issue D, Jan. 2001. 7KLVGLPHQVLRQLVQRWVSHFLHGLQWKH-('(&GUDZLQJ Drawings are not to scale. DS20005391B-page 14 2015-2016 Microchip Technology Inc. HV2601 / HV2701 APPENDIX A: REVISION HISTORY Revision A (December 2015) * Converted Supertex Doc #s DSFP-HV2601 and DSFP-HV2701 to Microchip DS20005391B. * Combined HV2601/HV2701 into one document. * Revised Section 4.0 "Packaging Information" * Removed package GA from the data sheet. * Made minor text changes throughout. Revision B (March 2016) * Moved "Block Diagram" to page 2 and made a minor change for clarity. * Removed Confidential status from document. 2015-2016 Microchip Technology Inc. DS20005391B-page 15 HV2601 / HV2701 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. - XX Device X - Package Environmental Device: X Media Type HV2601 = 16-Channel HV Analog Switch HV2701 = 16-Channel HV Analog Switch with Bleed Resistors Package: BD = 42-Ball Bumped Die FG = 48-lead LQFP Environmental G = Lead (Pb)-free/ROHS-compliant package (not used for BD packages) Media Type: (blank) M931 M936 = 250/Tray for FG package = 1000/Reel for FG package = 2500/Reel for BD package Note: Examples: a) HV2601FG-G: 48-lead LQFP package, 250/Tray b) HV2601FG-G-M931: c) HV2701BD-M936 48-lead LQFP package, 1000/Reel 42-ball Bumped Die, 2500/Reel HV2601BD and HV2701BD are RoHS-compliant products DS20005391B-page 16 2015-2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2015-2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 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