GS72116ATP/T/U
128K x 16
2Mb Asynchronous SRAM
7, 8, 10, 12 ns
3.3 V VDD
Center VDD and VSS
TSOP, FP-BGA, TQFP
Commercial Temp
Industrial Temp
Rev: 1.09a 4/2009 1/16 © 2001, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Features
• Fast access time: 7, 8, 10, 12 ns
• CMOS low power operation: 145/125/100/85 mA at
minimum cycle time
• Single 3.3 V power supply
• All inputs and outputs are TTL-compatible
• Byte control
• Fully static operation
• Industrial Temperature Option: 40° to 85°C
• Package line up
TP: 400 mil, 44-pin TSOP Type II package
GP: RoHS-compliant 400 mil, 44-pin TSOP Type II
package
T: 10 mm x 10 mm, 44-pin TQFP
GT: RoHS-compliant 10 mm x 10 mm, 44-pin TQFP
U: 6 mm x 8 mm Fine Pitch Ball Grid Array package
GU: RoHS-compliant 6 mm x 8 mm Fine Pitch Ball Grid
Array package
Description
The GS72116A is a high speed CMOS Static RAM organized
as 131,072 words by 16 bits. Static design eliminates the need
for external clocks or timing strobes. The GS operates on a
single 3.3 V power supply and all inputs and outputs are TTL-
compatible. The GS72116A is available in a 6 mm x 8 mm
Fine Pitch BGA package, a 10 mm x 10 mm TQFP package,
and 400 mil TSOP Type-II packages.
44-Pin TQFP 128K x 16-Pin Configuration
Package T
Pin Descriptions
Symbol Description
A0A16 Address input
DQ1DQ16 Data input/output
CE Chip enable input
LB Lower byte enable input
(DQ1 to DQ8)
UB Upper byte enable input
(DQ9 to DQ16)
WE Write enable input
OE Output enable input
VDD +3.3 V power supply
VSS Ground
NC No connect
A16 A15 A14 A13 A12 A11 A10 A9OE UB LB
DQ15
DQ14
DQ13
VSS
VDD
DQ12
DQ11
DQ10
DQ9
NC
CE
DQ1
DQ2
DQ3
DQ4
VDD
VSS
DQ5
DQ6
DQ7
DQ8
DQ16
WE A0A1A2A3A4NC A5A6A7A8
1
2
3
4
5
6
7
8
9
10
11
33
32
31
30
29
28
27
26
25
24
23
44 43 42 41 40 39 38 37 36 35 34
12 13 14 15 16 17 18 19 20 21 22
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 2/16 © 2001, GSI Technology
Fine Pitch BGA 128K x 16-Bump Configuration
6 mm x 8 mm, 0.75 mm Bump Pitch
Top View
Package U
TSOP-II 128K x 16-Pin Configuration
Package TP
1 2 3 4 5 6
ALB OE A0A1A2NC
BDQ16 UB A3A4CE DQ1
CDQ14 DQ15 A5A6DQ2DQ3
DVSS DQ13 NC A7DQ4VDD
EVDD DQ12 NC A16 DQ5VSS
FDQ11 DQ10 A8A9DQ7DQ6
GDQ9NC A10 A11 WE DQ8
HNC A12 A13 A14 A15 NC
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
A4
A3
A2
A1
A0
CE
DQ1
DQ2
DQ3
DQ4
VDD
VSS
DQ5
DQ6
DQ7
DQ8
WE
A15
A14
A13
A5
A6
A7
OE
UB
LB
DQ16
DQ15
DQ14
DQ13
VSS
VDD
DQ12
DQ11
DQ10
DQ9
NC
A8
A9
A10
Top view
21
22
24
23
A12 A11
44-pin
TSOP II
NCA16
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 3/16 © 2001, GSI Technology
Block Diagram
Note:
X: “H” or “L”
Truth Table
CE OE WE LB UB DQ1 to DQ8DQ9 to DQ16 VDD Current
H X X X X Not Selected Not Selected ISB1, ISB2
L L H
L L Read Read
IDD
L H Read High Z
H L High Z Read
L X L
L L Write Write
L H Write Not Write, High Z
H L Not Write, High Z Write
L H H X X High Z High Z
L X X H H High Z High Z
Memory Array
Row
Decoder
Column
Decoder
Address
Input
Buffer
Control I/O Buffer
A0
CE
WE
OE
DQ1
A16
DQ16
UB _____
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 4/16 © 2001, GSI Technology
Note:
Permanent device damage may occur if Absolute Maximum Ratings are exceeded. Functional operation shall be restricted to Recommended
Operating Conditions. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
Notes:
1. Input overshoot voltage should be less than VDD +2 V and not exceed 20 ns.
2. Input undershoot voltage should be greater than 2 V and not exceed 20 ns.
Notes:
1. Tested at TA = 25°C, f = 1 MHz
2. These parameters are sampled and are not 100% tested.
Absolute Maximum Ratings
Parameter Symbol Rating Unit
Supply Voltage VDD 0.5 to +4.6 V
Input Voltage VIN
0.5 to VDD +0.5
(4.6 V max.) V
Output Voltage VOUT
0.5 to VDD +0.5
(4.6 V max.) V
Allowable power dissipation PD 0.7 W
Storage temperature TSTG 55 to 150 oC
Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit
Supply Voltage for -7/-8/-10/12 VDD 3.0 3.3 3.6 V
Input High Voltage VIH 2.0 VDD +0.3 V
Input Low Voltage VIL 0.3 0.8 V
Ambient Temperature,
Commercial Range TAc 070 oC
Ambient Temperature,
Industrial Range TAI40 85 oC
Capacitance
Parameter Symbol Test Condition Max Unit
Input Capacitance CIN VIN = 0 V 5pF
Output Capacitance COUT VOUT = 0 V 7pF
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 5/16 © 2001, GSI Technology
DC I/O Pin Characteristics
Parameter Symbol Test Conditions Min Max
Input Leakage
Current IIL VIN = 0 to VDD 1 uA 1 uA
Output Leakage
Current ILO Output High Z
VOUT = 0 to VDD
1 uA 1 uA
Output High Voltage VOH IOH = 4mA 2.4
Output Low Voltage VOL ILO = +4mA 0.4 V
Power Supply Currents
Parameter Symbol Test Conditions
0 to 70°C 40 to 85°C
7 ns 8 ns 10 ns 12 ns 7 ns 8 ns 10 ns 12 ns
Operating
Supply
Current
IDD (max)
CE VIL
All other inputs
VIH or VIL
Min. cycle time
IOUT = 0 mA
145 mA 125 mA 100 mA 85 mA 150 mA 130 mA 105 mA 90 mA
Standby
Current
ISB1
(max)
CE VIH
All other inputs
VIH or VIL
Min. cycle time
25 mA 20 mA 20 mA 15 mA 30 mA 25 mA 25 mA 20 mA
Standby
Current
ISB2
(max)
CE VDD 0.2 V
All other inputs
VDD 0.2 V or
0.2 V
5 mA 10 mA
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 6/16 © 2001, GSI Technology
AC Test Conditions
DQ
VT = 1.4 V
5030pF1
DQ
3.3 V
Output Load 1
Output Load 2
589
434
5pF1
Notes:
1. Include scope and jig capacitance.
2. Test conditions as specified with output loading as shown in Fig. 1
unless otherwise noted.
3. Output load 2 for tLZ, tHZ, tOLZ and tOHZ
Parameter Conditions
Input high level VIH = 2.4 V
Input low level VIL = 0.4 V
Input rise time tr = 1 V/ns
Input fall time tf = 1 V/ns
Input reference level 1.4 V
Output reference level 1.4 V
Output load Fig. 1& 2
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 7/16 © 2001, GSI Technology
AC Characteristics
* These parameters are sampled and are not 100% tested.
Read Cycle 1: CE = OE = VIL, WE = VIH, UB and, or LB = VIL
Read Cycle
Parameter Symbol
-7 -8 -10 -12
Unit
Min Max Min Max Min Max Min Max
Read cycle time tRC 7 8 10 12 ns
Address access time tAA 7 810 12 ns
Chip enable access time (CE) tAC 7 810 12 ns
Byte enable access time (UB, LB) tAB 3 3.5 45ns
Output enable to output valid (OE) tOE 3 3.5 45ns
Output hold from address change tOH 3 3 33ns
Chip enable to output in low Z (CE)tLZ*3 3 33ns
Output enable to output in low Z (OE)tOLZ*0 0 00ns
Byte enable to output in low Z (UB, LB)tBLZ*0 0 00ns
Chip disable to output in High Z (CE)tHZ*3.5 456ns
Output disable to output in High Z (OE)tOHZ* 3 3.5 45ns
Byte disable to output in High Z (UB, LB)tBHZ* 3 3.5 45ns
tAA
tOH
tRC
Address
Data Out Previous Data Data valid
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 8/16 © 2001, GSI Technology
Read Cycle 2: WE = VIH
* These parameters are sampled and are not 100% tested.
Write Cycle
Parameter Symbol
-7 -8 -10 -12 Unit
Min Max Min Max Min Max Min Max
Write cycle time tWC 7— 810 12 ns
Address valid to end of write tAW 5 5.5 78ns
Chip enable to end of write tCW 5 5.5 78ns
Byte enable to end of write tBW 5 5.5 78ns
Data set up time tDW 3.5 4 56ns
Data hold time tDH 0— 000ns
Write pulse width tWP 5 5.5 78ns
Address set up time tAS 0— 000ns
Write recovery time (WE)tWR 0— 000ns
Write recovery time (CE)tWR1 0— 000ns
Output Low Z from end of write tWLZ*3— 333ns
Write to output in High Z tWHZ* 3 3.5 45ns
tAA
tRC
Address
tAC
tLZ
tAB
tBLZ
tOE
tOLZ
CE
UB, LB
OE
Data Out
tHZ
tBHZ
tOHZ
Data valid
High impedance
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 9/16 © 2001, GSI Technology
Write Cycle 1: WE control
Write Cycle 2: CE control
tWC
Address
CE
UB, LB
WE
Data In
OE
Data Out
tAW
tCW
tBW
tAS tWP
tWR
tDW tDH
tWLZtWHZ
Data valid
High impedance
tWC
Address
CE
UB, LB
WE
Data In
OE
Data Out
tAW
tWP
tAS tCW
tWR1
tDW tDH
Data valid
High impedance
tBW
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 10/16 © 2001, GSI Technology
Write Cycle 3: UB, LB control
tWC
Address
CE
UB, LB
WE
Data In
OE
Data Out
tAW
tWP
tAS tCW
tWR1
tDW tDH
Data valid
High impedance
tBW
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 11/16 © 2001, GSI Technology
44-Pin, 400 mil TSOP-II
D
122
2344
eB
Q
A
A1 A2
y
c
Detail A
E
HE
L
L1
A
Notes:
1. Dimension D& E do not include interlead flash.
2. Dimension B does not include dambar protrusion/intrusion.
3. Controlling dimension: mm
Symbol
Dimension in inch Dimension in mm
min nom max min nom max
A——0.047 ——1.20
A1 0.002 ——0.05 ——
A2 0.037 0.039 0.041 0.95 1.00 1.05
B 0.01 0.014 0.018 0.25 0.35 0.45
c0.006 ——0.15
D 0.721 0.725 0.729 18.31 18.41 18.51
E 0.396 0.400 0.404 10.06 10.16 10.26
e0.031 ——0.80
HE0.455 0.463 0.471 11.56 11.76 11.96
L 0.016 0.020 0.024 0.40 0.50 0.60
L1 0.031 ——0.80
y——0.004 ——0.10
Q0o5o0o5o
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 12/16 © 2001, GSI Technology
44-Pin TQFP (LQFP) Package
Units: mm
Body Size Lead Count Standoff Body Thickness Lead Length Lead Width Lead Thickness Lead Pitch
E1 D1 A1 A2 L1 b c e
10 10 44 0.1 1.4 1.0 0.3 0.127 0.8
e
L1
C
b
D1 A2
A1
E1
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 13/16 © 2001, GSI Technology
6 mm x 8 mm Fine Pitch BG
C
5.25
0.75(typ).
3.75
pin A1 index
654321
A
B
D
E
F
G
H
0.22 ± 0.05
1.20(max)
0.36(typ)
Ball Dia. 0.35
Pitch 0.75
D
0.10
pin A1 index
Bottom View Top View
6.00 ± 0.10
8.00 ± 0.10
units: mm
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 14/16 © 2001, GSI Technology
Ordering Information
Part Number*Package Access Time Temp. Range
GS72116ATP-7 400 mil TSOP-II 7 ns Commercial
GS72116ATP-8 400 mil TSOP-II 8 ns Commercial
GS72116ATP-10 400 mil TSOP-II 10 ns Commercial
GS72116ATP-12 400 mil TSOP-II 12 ns Commercial
GS72116ATP-7I 400 mil TSOP-II 7 ns Industrial
GS72116ATP-8I 400 mil TSOP-II 8 ns Industrial
GS72116ATP-10I 400 mil TSOP-II 10 ns Industrial
GS72116ATP-12I 400 mil TSOP-II 12 ns Industrial
GS72116AGP-7 RoHS-compliant 400 mil TSOP-II 7 ns Commercial
GS72116AGP-8 RoHS-compliant 400 mil TSOP-II 8 ns Commercial
GS72116AGP-10 RoHS-compliant 400 mil TSOP-II 10 ns Commercial
GS72116AGP-12 RoHS-compliant 400 mil TSOP-II 12 ns Commercial
GS72116AGP-7I RoHS-compliant 400 mil TSOP-II 7 ns Industrial
GS72116AGP-8I RoHS-compliant 400 mil TSOP-II 8 ns Industrial
GS72116AGP-10I RoHS-compliant 400 mil TSOP-II 10 ns Industrial
GS72116AGP-12I RoHS-compliant 400 mil TSOP-II 12 ns Industrial
GS72116AT-7 44-pin TQFP 7 ns Commercial
GS72116AT-8 44-pin TQFP 8 ns Commercial
GS72116AT-10 44-pin TQFP 10 ns Commercial
GS72116AT-12 44-pin TQFP 12 ns Commercial
GS72116AT-7I 44-pin TQFP 7 ns Industrial
GS72116AT-8I 44-pin TQFP 8 ns Industrial
GS72116AT-10I 44-pin TQFP 10 ns Industrial
GS72116AT-12I 44-pin TQFP 12 ns Industrial
GS72116AGT-7 RoHS-compliant 44-pin TQFP 7 ns Commercial
GS72116AGT-8 RoHS-compliant 44-pin TQFP 8 ns Commercial
GS72116AGT-10 RoHS-compliant 44-pin TQFP 10 ns Commercial
GS72116AGT-12 RoHS-compliant 44-pin TQFP 12 ns Commercial
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. For example: GS72116TP-8T.
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 15/16 © 2001, GSI Technology
GS72116AGT-7I RoHS-compliant 44-pin TQFP 7 ns Industrial
GS72116AGT-8I RoHS-compliant 44-pin TQFP 8 ns Industrial
GS72116AGT-10I RoHS-compliant 44-pin TQFP 10 ns Industrial
GS72116AGT-12I RoHS-compliant 44-pin TQFP 12 ns Industrial
GS72116AU-7 6 mm x 8 mm Fine Pitch BGA 7 ns Commercial
GS72116AU-8 6 mm x 8 mm Fine Pitch BGA 8 ns Commercial
GS72116AU-10 6 mm x 8 mm Fine Pitch BGA 10 ns Commercial
GS72116AU-12 6 mm x 8 mm Fine Pitch BGA 12 ns Commercial
GS72116AU-7I 6 mm x 8 mm Fine Pitch BGA 7 ns Industrial
GS72116AU-8I 6 mm x 8 mm Fine Pitch BGA 8 ns Industrial
GS72116AU-10I 6 mm x 8 mm Fine Pitch BGA 10 ns Industrial
GS72116AU-12I 6 mm x 8 mm Fine Pitch BGA 12 ns Industrial
GS72116AGU-7 RoHS-compliant 6 mm x 8 mm Fine Pitch BGA 7 ns Commercial
GS72116AGU-8 RoHS-compliant 6 mm x 8 mm Fine Pitch BGA 8 ns Commercial
GS72116AGU-10 RoHS-compliant 6 mm x 8 mm Fine Pitch BGA 10 ns Commercial
GS72116AGU-12 RoHS-compliant 6 mm x 8 mm Fine Pitch BGA 12 ns Commercial
GS72116AGU-7I RoHS-compliant 6 mm x 8 mm Fine Pitch BGA 7 ns Industrial
GS72116AGU-8I RoHS-compliant 6 mm x 8 mm Fine Pitch BGA 8 ns Industrial
GS72116AGU-10I RoHS-compliant 6 mm x 8 mm Fine Pitch BGA 10 ns Industrial
GS72116AGU-12I RoHS-compliant 6 mm x 8 mm Fine Pitch BGA 12 ns Industrial
Ordering Information
Part Number*Package Access Time Temp. Range
Notes:
1. Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. For example: GS72116TP-8T.
GS72116ATP/T/U
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.09a 4/2009 16/16 © 2001, GSI Technology
2Mb Asynchronous Datasheet Revision History
Rev. Code: Old;
New
Types of Changes
Format or Content Revisions
72116A_r1 • Creation of new datasheet
72116A_r1; 72116A_r1_01 Content • Added 6 ns speed bin to entire document
72116A_r1_01; 72116A_r1_02 Content • Updated all power numbers
• Changed 6 mm x 10 mm FP_BGA package designator from U to X
72116A_r1_02; 72116A_r1_03 Content
• Updated Recommended Operating Conditions table on page 5
• Removed 15 ns bin
• Changed FPBGA package from 6 x 10 to 6 x 8 (package U)
72116A_r1_03; 72116A_r1_04 Content • Removed 6 ns speed bin from entire document
• Added 7 ns speed bin to entire document
72116A_r1_04; 72116A_r1_05 Content • Corrected title of 6 x 8 FPBGA mechanical drawing
72116A_r1_05; 72116A_r1_06 Content/Format • Updated format
• Added RoHS-compliant information for TSOP-II package
72116A_r1_06; 72116A_r1_07 Content • Added RoHS-compliant information for TQFP and FP-BGA packages
72116A_r1_07; 72116A_r1_08 Content • Added RoHS-compliant 400 mil SOJ
72116A_r1_08; 72116A_r1_09 Content
• Updated to MP in ordering information table
• Removed Status Column from Ordering Information table, removed
references to SOJ