IE-703102-MC-EM1 - NEC Electronics

User’s Manual

Target device

V850E/MS1TM

IE-703102-MC-EM1,

IE-703102-MC-EM1-A

In-circuit Emulator Optional Board

1991©

Document No. U13876EJ1V0UM00 (1st edition)

Date Published December 1998 N CP(K)

Printed in Japan

1998

[MEMO]

V850E/MS1 is a trademark of NEC Corporation.

Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States

and/or other countries.

PC/AT is a trademark of International Business Machines Corporation.

Ethernet is a trademark of Xerox Corporation.

UNIX is a registered trademark in the United States and other countries, licensed exclusively through

X/Open Company Limited.

The information in this document is subject to change without notice.

No part of this document may be copied or reproduced in any form or by any means without the prior written

consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in

this document.

NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual

property rights of third parties by or arising from use of a device described herein or any other liability arising

from use of such device. No license, either express, implied or otherwise, is granted under any patents,

copyrights or other intellectual property rights of NEC Corporation or of others.

M7A 96. 10

Regional Information

Some information contained in this document may vary from country to country. Before using any NEC

product in your application, pIease contact the NEC office in your country to obtain a list of authorized

representatives and distributors. They will verify:

•

Device availability

•

Ordering information

•

Product release schedule

•

Availability of related technical literature

•

Development environment specifications (for example, specifications for third-party tools and

components, host computers, power plugs, AC supply voltages, and so forth)

•

Network requirements

In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary

from country to country.

NEC Electronics Inc. (U.S.)

Santa Clara, California

Tel: 408-588-6000

800-366-9782

Fax: 408-588-6130

800-729-9288

NEC Electronics (Germany) GmbH

Duesseldorf, Germany

Tel: 0211-65 03 02

Fax: 0211-65 03 490

NEC Electronics (UK) Ltd.

Milton Keynes, UK

Tel: 01908-691-133

Fax: 01908-670-290

NEC Electronics Italiana s.r.l.

Milano, Italy

Tel: 02-66 75 41

Fax: 02-66 75 42 99

NEC Electronics (Germany) GmbH

Benelux Office

Eindhoven, The Netherlands

Tel: 040-2445845

Fax: 040-2444580

NEC Electronics (France) S.A.

Velizy-Villacoublay, France

Tel: 01-30-67 58 00

Fax: 01-30-67 58 99

NEC Electronics (France) S.A.

Spain Office

Madrid, Spain

Tel: 01-504-2787

Fax: 01-504-2860

NEC Electronics (Germany) GmbH

Scandinavia Office

Taeby, Sweden

Tel: 08-63 80 820

Fax: 08-63 80 388

NEC Electronics Hong Kong Ltd.

Hong Kong

Tel: 2886-9318

Fax: 2886-9022/9044

NEC Electronics Hong Kong Ltd.

Seoul Branch

Seoul, Korea

Tel: 02-528-0303

Fax: 02-528-4411

NEC Electronics Singapore Pte. Ltd.

United Square, Singapore 1130

Tel: 65-253-8311

Fax: 65-250-3583

NEC Electronics Taiwan Ltd.

Taipei, Taiwan

Tel: 02-2719-2377

Fax: 02-2719-5951

NEC do Brasil S.A.

Electron Devices Division

Rodovia Presidente Dutra, Km 214

07210-902-Guarulhos-SP Brasil

Tel: 55-11-6465-6810

Fax: 55-11-6465-6829

J98. 11

INTRODUCTION

Readers This manual is intended for users who design and develop application systems

using the V850E/MS1TM.

Purpose The purpose of this manual is to describe the proper operation of the IE-703102-MC-

EM1 and IE-703102-MC-EM1-A, and their basic specifications.

Organization This manual is broadly divided into the following parts.

• Overview

• Name and function of components

• Cautions

How to Read This Manual It is assumed that the reader of this manual has general knowledge of electrical

engineering, logic circuits, and microcontrollers.

The IE-703102-MC-EM1 and IE-703102-MC-EM1-A are used connected to the

IE-703102-MC in-circuit emulator. This manual explains the basic setup

procedure and switch settings of the IE-703102-MC-EM1 and IE-703102-MC-

EM1-A. For the names and functions, and the connection of parts, refer to the

IE-703102-MC User’s Manual, which is a separate volume.

To understand the basic specifications and operation methods broadly

→Read this manual in the order listed in CONTENTS.

To know the operation methods and command functions of the IE-703102-MC, IE-

703102-MC-EM1, and IE-703102-MC-EM1-A

→Read the user’s manual of the debugger (separate volume) that is used.

Conventions Note: Footnote for item marked with Note in the text

Caution: Information requiring particular attention

Remark: Supplementary information

Numeral representations: Binary … ×××× or ××××B

Decimal … ××××

Hexadecimal … ××××H

Prefixes representing the powers of 2 (address space, memory capacity):

K (kilo): 210 = 1024

M (mega): 220 = 10242

Terminology The meanings of terms used in this manual are listed below.

Target device Device t hat is emulat ed.

Target

system The system (user-built system) to be debugged. This inc ludes the target

program and user-configured hardware.

Product Names Unless otherwise specified, the IE-703102-MC-EM1 is treated as the representative model

in this manual. When using the IE-703102-MC-EM1-A, read IE-703102-MC-EM1 as IE-

703102-MC-EM1-A. For functional differences between IE-703102-MC-EM1 and IE-

703102-MC-EM1-A, refer to CHAPTER 1 OVERVIEW.

Related Documents The related documents indicated in this publication may include preliminary versions.

However, preliminary versions are not marked as such.

{Documents related to V850E/MS1

Document Nam e Document Num ber

V850E/M S1 User’s Manual -Hardware U12688E

V850E/××× User’s Manual-A rchitect ure U12197E

PD703100-40, 703101-33, 703102-33 Dat a Sheet To be prepared

PD703100-A40, 703101-A 33, 703102-A33 Data Sheet To be prepared

PD70F3102-33 Data Sheet U13844E

PD70F3102-A33 Data S heet U13845E

{Documents related to development tools (User’s Manual)

Product Nam e Document Num ber

IE-703102-MC (I n-circuit em ul ator) U13875E

IE-703102-MC-E M 1, IE-703102-MC-EM 1-A (In-circ ui t em ul ator optional board) This manual

Operation UNIX TM bas ed U12839E

Operation Windows TM bas ed U12827E

C language U12840E

CA850 (C Compil er package)

Assembly Language U10543E

ID850 (Integrated debugger) Operation Windows based U13716E

Basics U13430E

Technical U13431E

RX850 (Real-time OS)

Installation U13410E

Fundamental Under preparation

Technical U13772E

RX850 Pro (Real-t i m e OS )

Installation U13774E

RD850 (Task debugger)Note U11158E

RD850 (Ver. 3.0) (Task debugger) U13737E

AZ850 (Sy stem performance analyzer) Operat i on U11181E

Note Supports ID850 (Ver. 1.31 only)

CONTENTS

CHAPTER 1 OVERVIEW.........................................................................................................................11

1.1 Hardware Configuration .............................................................................................................12

1.2 Features (When Connected to IE-703102-MC)..........................................................................13

1.3 Function Specifications (When Connected to IE-703102-MC)................................................14

1.4 System Configuration.................................................................................................................15

1.5 Contents in Carton......................................................................................................................16

1.6 Connection between IE-703102-MC and IE-703102-MC-EM1 ..................................................17

CHAPTER 2 NAME AND FUNCTION OF COMPONENTS.................................................................19

2.1 Component Name and Function of IE-703102-MC-EM1 ..........................................................19

2.2 Clock Settings..............................................................................................................................21

2.3 MODE Pin Setting........................................................................................................................22

2.3.1 MODE pin setting when emulator is used as stand-alone unit...................................................... 22

2.3.2 MODE pin setting when emulator is used connected to target system ......................................... 22

2.4 Power Supply Settings ...............................................................................................................23

2.4.1 JP2 setting when the emulator operates as a stand-alone unit and target system power is off.... 23

2.4.2 JP2 setting when power of the target system is on.......................................................................23

CHAPTER 3 FACTORY SETTINGS.........................................................................................................25

CHAPTER 4 CAUTIONS..........................................................................................................................27

4.1 VDD and HVDD of Target System..................................................................................................27

4.2 X1 Signal ......................................................................................................................................27

4.3 Pin Termination ...........................................................................................................................28

4.4 Internal RAM and ROM ...............................................................................................................29

4.5 Port 4 to 6, A, and B ....................................................................................................................30

4.6 Bus Interface Pin.........................................................................................................................31

4.7 Emulation Memory Operation Timing Difference.....................................................................33

APPENDIX A DIMENSIONS....................................................................................................................35

APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION....................41

APPENDIX C CONNECTORS FOR TARGET CONNECTION.............................................................43

C.1 Use................................................................................................................................................43

C.2 Cautions on Handling Connectors............................................................................................45

APPENDIX D MOUNTING OF PLASTIC SPACER..............................................................................47

LIST OF FIGURES

Figure No. Title Page

1-1. System Configuration.......................................................................................................................................15

1-2. Contents in Carton............................................................................................................................................16

1-3. Connection between IE-703102-MC and IE-703102-MC-EM1.........................................................................17

2-1. IE-703102-MC-EM1..........................................................................................................................................19

2-2. Power Supply Settings (When the Emulator Operates as a Stand-Alone Unit and Target System Power is Off)

..........................................................................................................................................................................23

2-3. Power Supply Setting (When Power of the Target System is On)....................................................................23

4-1. Schematic Diagram of Power Supply Flow.......................................................................................................27

4-2. Diagram of X1 Signal Flow...............................................................................................................................28

4-3. Circuit Diagram of CKSEL Pin..........................................................................................................................28

4-4. Circuit Diagram of Port 4 to 6, A, and B ...........................................................................................................30

C-1. Mounting of NQPACK144SD............................................................................................................................43

C-2. Mounting Device...............................................................................................................................................44

C-3. NQPACK100SD and Device Pin ......................................................................................................................44

D-1. Mounting Method of Plastic Spacer..................................................................................................................47

LIST OF TABLES

Table No. Title Page

2-1. Clock Setting (When the Emulator is Used as a Stand-Alone Unit).................................................................21

2-2. Clock Setting (When the Emulator is Used in Target System Connection)......................................................21

2-3. MODE Pin Setting when Emulator is Used as Stand-Alone Unit .....................................................................22

2-4. MODE Pin Setting when Emulator is Used Connected to Target System........................................................22

4-1. Memory Capacity Limitation List ......................................................................................................................29

4-2. Bus Interface Pin Operation List.......................................................................................................................31

[MEMO]

CHAPTER 1 OVERVIEW

The IE-703102-MC-EM1 is an optional board for the in-circuit emulator IE-703102-MC. By connecting the IE-

703102-MC-EM1 to IE-703102-MC, hardware and software can be debugged efficiently in system development using

the V850E/MS1.

IE-703102-MC-EM1 is an optional board when HVDD = 5 V

IE-703102-MC-EM1-A is an optional board when HVDD = 3.3 V

In this manual, the basic setup sequences and switch settings of the IE-703102-MC-EM1 when connecting it to

the IE-703102-MC are described. For the names and functions of the parts of the IE-703102-MC, and for the

connection of elements, refer to the IE-703102-MC User’s Manual (U13875E) which is a separate volume.

CHAPTER 1 OVERVIEW

Optional board

IE-703102-MC-E M 1

IE-703102-MC-EM1-A

IE-703102-MC c an be used as in-circuit emulat or for V850E/MS1 by

adding these boards.

Extension probe

(SC-×××SDANote 1)General-purpose ext ension probe made by TOKY O E LETECH

CORPORATION.

PC interf ace board

IE-70000-××-IF-B

IE-70000-××-IF-C

IE-70000-PCI -IF

IE-70000-CD-I F -A

These boards are us ed t o connect the IE-703102-MC to a personal

computer. These boards are ins erted in the expans i on s l ot of the

personal com puter.

××: 98 (for PC-9800 seri es C bus)Note 2

PC (for IBM PC/ATTM compatible ISA bus)Note 2

IE-70000-PCI -IF : for PCI bus

IE-70000-CD-I F -A : for PCMCI A sock et

Network modul e

(IE-70000-MC-SV3) The module is used when a workstat i on controls t he IE-703102-MC via

ethernetTM.

Power adapter

(IE-70000-MC-PS-B) AC adapter dedicated to the NE C’ s in-circui t emulator

Separatel

sold hardware

1.1 Hardware Configuration

Notes 1. For further information, contact Daimaru Kogyo Co., Ltd.

Tokyo Electronic Components Division (TEL +81-3-3820-7112)

Osaka Electronic Components Division (TEL +81-6-244-6672)

2. These interface boards cannot be used for the PC98-NX series.

Optional hardware

Separatel

sold hardware

In-circ ui t emulator (IE-703102-MC)

CHAPTER 1 OVERVIEW

1.2 Features (When Connected to IE-703102-MC)

{Maximum operation frequency: 40 MHz (HVDD = 3.3 V or 5.0 V operation)

{Extremely lightweight and compact

{Higher equivalence with target device can be achieved by omitting buffer between signal cables.

{Following pins can be masked.

RESET, NMI, WAIT, HLDRQ

{Two methods of connection to target system:

• Direct connection of the IE-703102-MC-EM1

• Attach an extension probe (sold separetely) to the connection tab of the IE-703102-MC-EM1.

{Dimensions of the IE-703102-MC-EM1 are as follows.

Parameter Value

Power diss i pation 0.4 W (at 40-MHz operation frequency )Note

Height 15 mm

Length 207 mm

External di m ensions

(Refer to AP PENDIX A DIMENSIONS)

Width 96 mm

Weight 170 g

Note The power dissipation is 11.4 W when IE-703102-MC + IE-703102-MC-EM1.

CHAPTER 1 OVERVIEW

1.3 Function Specifications (When Connected to IE-703102-MC)

Parameter Specification

Internal ROM 128 KbytesEmulat i on m em ory capacit y

External m emory 2 Mbytes

Internal ROM 128 Kbytes

In ROM-less

mode 2 Mbyt es

Execution/pass detection

Coverage memory capacity External

memory

When using iROM 1 Mby te

Memory ac cess detection

Coverage memory capacity External memory 1 Mbyte

Trace memory capacity 168 bits × 32 K frames

Time measurement function Can be measured with time tag and timers (3

lines)

8-bit ext ernal trace is pos sibleExternal l ogi c probe

Event setting f or trace/break is possibl e

Event break

Step execution break

Forced break

Break function

Fail safe break

• Illegal access to peripheral I/O

• Access to guard space

• Write to t he ROM space

Caution Some of the functions may not be supported depending on the debugger used.

CHAPTER 1 OVERVIEW

1.4 System Configuration

The system configuration when connecting the IE-703102-MC-EM1 to the IE-703102-MC, which is then connected

to a personal computer (PC-9800 series or PC/AT compatible) is shown below.

Figure 1-1. System Configuration

Remark

<1> Personal computer (PC-9800 series or PC/AT compatible)

<2> Debugger (sold separately)

<3> PC interface board (IE-70000-98-IF-B/IE-70000-98-IF-C, IE-70000-PC-IF-B/IE-70000-PC-IF-C

: sold separately )

<4> PC interface cable (included with IE-703102-MC)

<5> In-circuit emulator (IE-703102-MC: sold separately)

<6> In-circuit emulator option board (IE-703102-MC-EM1)

<7> External logic probe (included with IE-703102-MC)

<8> Extension probe (SC-144SD, SC-144SD PR: sold separately)

<9> Connector for emulator connection (YQPACK144SD: included)

<10> Connector for target connection (NQPACK144SD: included)

<11> Power adapter (IE-70000-MC-PS-B: sold separately)

<12> AC100-V power cable (sold separately: included with IE-70000-MC-PS-B)

<13> AC220-V power cable (sold separately: included with IE-70000-MC-PS-B)

For PC-9800 series

For PC/AT

[Magnified drawing: example of use of

connector for target connection]

Target

system

<12>

<13> <11>

<5> <6> <7>

<4>

<3>

<1>

<2>

<8>

<10>

<9>

Target system

<9>

<10>

CHAPTER 1 OVERVIEW

1.5 Contents in Carton

The carton of the IE-703102-MC-EM1 contains a main unit, guarantee card, packing list, and accessory bag.

Make sure that the accessory bag contains this manual and connector accessories. In case of missing or damaged

contents, contact an NEC sales representative or an NEC distributor.

Figure 1-2. Contents in Carton

<1> IE-703102-MC-EM1

<2> Accessory bag

<3> Guarantee card

<4> Packing list

<1> IE-703102-MC-EM1 × 1

<2> Accessory bag × 1

<3> Guarantee card × 1

<4> Packing list × 1

Make sure that the accessory bag contains this manual and an accessory list (1 sheet).

CHAPTER 1 OVERVIEW

1.6 Connection between IE-703102-MC and IE-703102-MC-EM1

The procedure for connecting the IE-703102-MC and IE-703102-MC-EM1 is described below.

Caution Connect carefully so as not to break or bend connector pins.

<1> Remove the pod cover (upper and lower) of the IE-703102-MC.

<2> Set the PGA socket lever of the IE-703102-MC-EM1 to the OPEN position as shown in Figure 1-3 (b).

<3> Connect the IE-703102-MC-EM1 to the PGA socket at the back of the pod (refer to Figure 1-3 (c)). When

connecting, position the IE-703102-MC and IE-703102-MC-EM1 so that they are horizontal.

Spacers can be connected to fix the pod. (refer to APPENDIX D MOUNTING OF PLASTIC SPACER)

<4> Set the PGA socket lever of the IE-703102-MC-EM1 to the CLOSE position as shown in Figure 1-3 (b).

<5> Fix the IE-703102-MC-EM1 between the pod covers (upper and lower) with nylon rivets.

<6> Secure the pod cover (upper) end with nylon rivets.

Figure 1-3. Connection between IE-703102-MC and IE-703102-MC-EM1 (1/2)

(a) Overview

IE-703102-MC

Nylon rivets

Upper cover

IE-703102-MC-EM1

Lower cover

Nylon rivets

CHAPTER 1 OVERVIEW

Figure 1-3. Connection between IE-703102-MC and IE-703102-MC-EM1 (2/2)

(b) PGA Socket Lever of IE-703102-MC-EM1

Pin A1 location

: Insertion guide

: IE-703102-MC insertion area

OPEN

CHAPTER 2 NAME AND FUNCTION OF COMPONENTS

This chapter describes the names, functions, and switch settings of components comprising the IE-703102-MC-

EM1. For the details of the pod, jumper, and switch positions, etc., refer to the IE-703102-MC User’s Manual.

2.1 Component Name and Function of IE-703102-MC-EM1

Figure 2-1. IE-703102-MC-EM1

(a) Top View (b) Bottom View

TP1

Connector for connection

to IE-703102-MC

SW1

DIRECT

PLL

LED

CKSEL (Green)

V850E/MS1

I/O chip

TP2

TP3

TP4

TP5

TP6

JP1

OSC

Direction of pin 1 of the connector

for target connection

Direction of pin 1 of the connector

for target connection

Connector for target

connection

JP2

CHAPTER 2 NAM E AND FUNCTION OF COM PONENTS

(1) Test pin (TP1 to TP6)

To leave the DMA cycle or refresh cycle in the tracer, or break these cycles, connect these pins to the external

logic probe.

• TP1: GND

• TP2: REFRQ

• TP3: DMAAK0

• TP4: DMAAK1

• TP5: DMAAK2

• TP6: DMAAK3

(2) SW1

This is a switch for clock mode switching (for details, refer to 2.2 Clock Settings).

(3) JP1

This is a switch jumper for the clock supply source (for details, refer to 2.2 Clock Settings).

(4) JP2

This is a switch jumper for the power supply (for details, refer to 2.4 Power Supply Settings).

(5) LED (CKSEL: Green)

LED Status When Used as a Stand-Alone Unit When Used in Target S ystem Connec tion

ON SW1 = DIRECT The CKSEL signal from the target system is high

OFF SW1 = PLL The CKSEL signal from the t arget system is low

(6) Connector for IE-703102-MC connection

This is a connector for connecting the IE-703102-MC.

(7) Connector for target connection

This is a connector for connecting the target system or the extension probe.

CHAPTER 2 NAM E AND FUNCTION OF COM PONENTS

2.2 Clock Settings

This section describes the clock settings. For JP1 and SW1, refer to Figure 2-1.

Table 2-1. Clock Setting (When the Emulator is Used as a Stand-Alone Unit)

Clock S uppl y Source Setting Clock M ode Setting

Clock S uppl y Method JP1 SettingNote SW1 Setting (CKSEL Setting)

PLL mode

DIRECT

PLL

Internal clock

Direct mode

DIRECT

PLL

Note Setting any other state is prohibited.

Table 2-2. Clock Setting (When the Emulator is Used in Target System Connection)

Clock S uppl y Source Setting Clock M ode Setting

Clock S uppl y Method J P1 SettingNote 1 SW1 Setting

(CKSEL Setting) CKSEL Setting of

Target System

PLL mode

DIRECT

PLL Low levelInternal

clock/target

clockNote 2

Direct mode

DIRECT

PLL High level

Notes 1. Setting any other state is prohibited.

2. Switching the internal clock and target clock is done with the debugger.

CHAPTER 2 NAM E AND FUNCTION OF COM PONENTS

2.3 MODE Pin Setting

The emulator operation mode can be changed with the MODE pin setting.

2.3.1 MODE pin setting when emulator is used as stand-alone unit

When the emulator is used as a stand-alone unit, MODE0 and MODE1 in the emulator are set as follows.

The setting cannot be changed.

Table 2-3. MODE Pin Setting when Emulator is Used as Stand-Alone Unit

Setti ngs Inside E m ul atorEmulat or Operat i on

MODE0 MODE1

Single-c hi p m ode 0 Low-level input High-level i nput

2.3.2 MODE pin setting when emulator is used connected to target system

When the emulator is connected to a target system, set the MODE pins of the target system as follows based on

the emulator operations.

The MODE2 and MODE3 signals in the target system are not used in the emulator.

Table 2-4. MODE Pin Setting when Emulator is Used Connected to Target System

Target System Set tingEmulat or Operat i on

MODE0 MODE1

ROM-less m ode 0 Low-level i nput Low-level input

ROM-less m ode 1 High-level i nput Low-level input

Single-c hi p m ode 0 Low-level input High-level i nput

Single-c hi p m ode 1 High-level i nput High-level i nput

CHAPTER 2 NAM E AND FUNCTION OF COM PONENTS

2.4 Power Supply Settings

Using the JP2 setting, the IE-703102-MC-EM1 can switch between operation using the emulator as a stand-alone

unit (using the power of the emulator) and operation using the emulator connected to the target system (using the

power of the target system).

2.4.1 JP2 setting when the emulator operates as a stand-alone unit and target system power is off

The IE-703102-MS-EM1 operates using the emulator’s power supply when the emulator operates as a stand-

alone unit and target system power is off. Depending on the product, the condition of the power is as follows.

• IE-703102-MC-EM1 : VDD = 3.3 V, HVDD = 5.0 V

• IE-703102-MC-EM1-A : VDD = 3.3 V, HVDD = 3.3V

Figure 2-2 shows the JP2 setting.

Caution If the JP2 setting is incorrect, the emulator may be damaged.

Figure 2-2. Power Supply Settings (When the Emulator Operates as a Stand-Alone Unit and

Target System Power is Off)

JP2

Set both 1-2 and 3-4 as open

2.4.2 JP2 setting when power of the target system is on

The IE-703102-MC-EM1 operates using the target system’s power supply when the power of the target system is

on. Figure 2-3 shows the JP2 setting.

Caution If the JP2 setting is incorrect, the emulator may be damaged.

Figure 2-3. Power Supply Setting (When Power of the Target System is On)

JP2

Set 1-2 as open and 3-4 as short

[MEMO]

CHAPTER 3 FACTORY SETTINGS

Item Setting Remark

JP1

8All s et tings other t han those set i n t he factory are

prohibited.

JP2

Setti ng that supplies the IE-703102-M C-E M 1 wi th

the power of the em ul ator (when the emulator

operates as a s tand-alone unit and target system

power is off).

SW1

DIRECT

PLL Set to PLL mode.

Crystal oscillator 8.000-MHz cry stal oscillat or is mounted. If SW1 is set to the factory set t i ng, the CPU

operates at 40 MHz.

[MEMO]

CHAPTER 4 CAUTIONS

4.1 VDD and HVDD of Target System

(1) VDD and HVDD in the target system are used to operate the circuit in the emulator.

(2) When JP2 is set as 1-2 : open and 3-4 : short, the evaluation chip in the emulator operates on VDD and HVDD

from the target system.

(3) When JP2 is set as 1-2 : open and 3-4 : open, the emulator recognizes the target system power is off and

operates with the 3.3 V power supply.

Figure 4-1. Schematic Diagram of Power Supply Flow

IE-703102-MC-EM1

I/O chip

Target system

Relay Power supply

circuit

Evaluation

chip

IE-703102-MC

JP2

4.2 X1 Signal

The input signal (X1 signal) from the target system is delayed (for tpLH = tpHL = 13.2 ns (MAX.)) because it passes

through VHC157 before it is input to the I/O chip of the emulator.

In addition, the DC characteristics change. The input voltage becomes VIH = 2.31 V (MIN.) and VIL = 0.99 V

(MAX.). The input current becomes IIN = ±1.0

A (MAX.).

CHAPTER 4 CAUT IONS

Figure 4-2. Diagram of X1 Signal Flow

I/O chip

IE-703102-MC-EM1

X1 signal

Target System

X1 pin VHC157

4.3 Pin Termination

(1) MODE0 to MODE3 pins

When the emulator operates as a stand-alone unit, the operation mode of the emulator is single-chip mode 0.

The MODE0 to MODE3 pins are connected as follows.

•MODE0: Connected to VSS via a resistor (33 kΩ). (Pull-down)

•MODE1: Connected to VDD via a resistor (5.1 kΩ). (Pull-up)

•MODE2: Unconnected

•MODE3: Unconnected

(2) RESET pin

This pin is connected to VDD via a resistor (5.1 kΩ). (Pull-up)

(3) CKSEL pin

Pull-up/pull-down switching is possible with SW1.

Figure 4-3. Circuit Diagram of CKSEL Pin

VHCT541

I/O chip

SW1 CKSEL

CKSEL pi n

33 kΩ

100 Ω

HVDD

CHAPTER 4 CAUT IONS

4.4 Internal RAM and ROM

Because the internal RAM (iRAM) and internal ROM (iROM) capacities of the emulator are set in steps, the

memory capacity is different from that of the target device. If access is performed to addresses that exceed the

target device capacity, the memory of the emulator is accessed. Memory capacities are as follows.

Table 4-1. Memory Capacity Limitation List

(a) iRAM capaci ty (Unit: byte) (b) iROM capacity (Unit: byte)

Target Device Emulat or Target Device Emulat or

(Emulation Memory)

1 K 1 K 1 K to 32 K 32 K

2 K 2 K 33 K to 64 K 64 K

3 K 3 K 65 K to 128 K(V 850E/MS1) 128 K

4 K (V850E/ M S1) 4 K 129 K to 256 K 256 K

5 K to 6 K 6 K 257 K to 512 K 512 KNote

7 K to 8 K 8 K

9 K to 10 K 10 K

11 K to 12 K 12 K

13 K to 16 K 16 K

17 K to 20 K 20 K

21 K to 24 K 24 K

25 K to 28 K 28 K

29 K to 36 K 36 K

37 K to 44 K 44 K

45 K to 52 K 52 K

53 K to 60 K 60 K

Note The emulator is mounted iROM

emulation memory of 512 Kbytes.

CHAPTER 4 CAUT IONS

4.5 Port 4 to 6, A, and B

Ports 4 to 6, A, and B are connected to VHCT541, VHC541, and VHCT00, respectively.

Figure 4-4. Circuit Diagram of Port 4 to 6, A, and B

Evaluation chip

Port

BVHCT541

VHC541

VHCT541

VHC541

VHCT00

VHCT541

Emulation memory

(2 Mbytes)

Target system

CHAPTER 4 CAUT IONS

4.6 Bus Interface Pin

There are the following differences between the emulator and the target device in the operation of the pins for bus

interface.

Table 4-2. Bus Interface Pin Operation List (1/3)

(a) During break

Internal Memory External Memory

Internal

ROM Internal RA M Internal

Peripheral I/O Emul ation RAM Target Sy stem

Pin Name Waiting f or E mulator

Command

RRWRWRWRW

A0 to A23 Note Note Note Note

D0 to D15 Hi-Z Hi-Z Note Note

WE H H H Note

OE H H H Note

RD H H H Note

ADV/BCYST Note HNote Note

UWR/UCAS H H H Note

LWR/LCAS H H H Note

IORD H H H Note

IOWR H H H Note

CS0 to CS 7 H H H Note

RAS0 to RAS7

HH H

Note

REFRQ H H H Note

WAIT Invalid Note Maskable

HLDRQ Maskable Maskable Maskable

HLDAK Note Note Note

Note Performs the same operation as the cycle that is generated by the target device program execution.

Remarks 1. R : Read

W: Write

2. H : High-level output

Hi-Z: High-impedance

CHAPTER 4 CAUT IONS

Table 4-2. Bus Interface Pin Operation List (2/3)

(b) During user program execution

Internal Memory External Memory

Internal ROM Internal RA M Internal

Peripheral I/O Emulat i on RA M Target Sy stem

Pin Name

FRFRWRWFRWFRW

A0 to A23

Note Note Note

D0 to D15

Hi-Z Note Note

WE H H Note

OE H H Note

RD H H Note

ADV/

BCYST HNote Note

UWR/

UCAS HH

Note

LWR/

LCAS HH

Note

IROD H H Note

IOWR H H Note

CS0 to CS7

Note

RAS0 to

RAS7 HH

Note

REFRQ H H Note

WAIT Note Maskable

HLDRQ Maskable Maskable

HLDAK Note Note

Note Performs the same operation as the cycle that is generated by the target device program execution.

Remarks 1. F : Fetch

R : Read

W: Write

2. H : High-level output

Hi-Z: High-impedance

CHAPTER 4 CAUT IONS

Table 4-2. Bus Interface Pin Operation List (3/3)

Pin Name Operation

A0 to A23 Note

D0 to D15 Note

WE Note

OE Note

RD Note

ADV/BCYST Note

UWR/UCAS Note

LWR/LCAS Note

IORD Note

IOWR Note

CS0 to CS 7 Note

RAS0 to RAS7 Note

REFRQ Note

WAIT Maskable

HLDRQ Maskable

HLDAK Note

Note Performs the same operation as the cycle that is generated by the target device program execution.

4.7 Emulation Memory Operation Timing Difference

When the area of the DRAM, synchronous flash memory, or page ROM in the target system has been allocated to

the emulation memory, the operation timing is the SRAM access timing.

When measuring the performance by using the emulation memory, adjust the setting so that the wait set matches

the memory access timing that is actually used.

[MEMO]

APPENDIX A DIMENSIONS

(1) IE-703102-MC + IE-703102-MC-EM1 (Unit: mm)

461

55166

58.8

9027

240

Top View

Side View

IE-703102-MC-EM1

IE-703102-MC

Bottom View

Top View

15.88

207

29.0

37.5

29.0

Pin 1 direction

APPE NDIX A DIMENSIONS

(2) SC-144SD (Unit: mm)

109144

7237

1081

7336

40 130 43

213

APPE NDIX A DIMENSIONS

(3) NQPACK144SD (Unit: mm)

[Top View]

[Side View]

[Bottom View]

5.5

1.85

0.2

21.050.5 0.5

0.18

3.93.7

1.2

9.45

108

3772

144109

23.0

12.0

20.1

2.0 Height of projection 1.8

0.2

109144

108

7.0

27.0

0.5 × 35 = 17.5

0.5

18.9

26.2

20.1

2.5 2.5

22.65

3-R1.5

1.0

C1.5 0.3

APPE NDIX A DIMENSIONS

(4) YQPACK144SD (Unit: mm)

[Top View]

[Side View]

[Bottom View]

3.7 3.1 2.5

9.0

2.2

3.9 1.2

7.4

2.3

0.3

0.25

0.25 × 0.3

144109

108

72 37

22.8

19.6 C1.5

20.8

0.2

109144 7.0

22.65

0.5 × 35 = 17.5

0.5 4-

2.2

C2.0

108

7.0

27.0

29.0

19.4

7237 4-R1.53-R2.5

16.4

18.8

21.2

23.6

1.0

APPE NDIX A DIMENSIONS

(5) HQPACK144SD (Unit: mm)

[Top View]

[Side View]

[Bottom View]

7.0±0.1

22.65±0.15

0.5 × 35 = 17.5±0.1

7.0

27.0

29.0

19.4

2.2

C2.0

18.4

16.0

23.9

2.752.75 3.953.95

4-R1.53-R2.5

109144

108

7237

1.0

3.9 1.2

7.4

2.3

3.1

2.25 1.6

0.25

0.2

22.8

19.6 C1.5

144109

108

72 37

21.4±0.2

[MEMO]

APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION

(1) When directly connecting device to target system (Connector for target connection is not used)

(2) When equipping device by using connector for target connection

Fastening screws

HQPACK144SD

NQPACK144SD

Target system

Device

(3) Connection between emulator and target system

(a) When extension probe is not used

Note Connector for emulator connection (YQSOCKET144SDN) can be i nserted at thi s position f or hei ght adjustment.

Target system

Device

Target system

NQPACK144SD

YQPACK144SD

Note

APPENDIX B EXAM PLE OF USE OF CONNECTOR FOR TARGET CONNECTION

(b) Example of use of extension probe

Note Connector for emulator connection (YQSOCKET144SDN) can be i nserted at thi s position f or hei ght adjustment.

Target system

NQPACK144SD

YQPACK144SD

Note

Extension probe

APPENDIX C CONNECTORS FOR TARGET CONNECTION

C.1 Use

(1) When mounting NQPACK144SD to target system

<1> Coat the tip of four projections (points) at the bottom of the NQPACK144SD with two-component type

epoxy adhesive (cure time longer than 30 min.) and bond the NQPACK144SD to the target system. If not

bonded properly, the pad of the printed circuit board may peel off when the emulator is removed from the

target system. If the lead of the NQPACK144SD does not coincide with the pad of the target system

easily, perform step <2> to adjust the position.

<2> To adjust the position, insert the guide pins for position-adjustment (NQGUIDE) provided with

NQPACK144SD into the pin holes at the upper side of NQPACK144SD (refer to Figure C-1).

The diameter of a hole is

= 1.0 mm. There are three non-through holes (refer to APPENDIX A

DIMENSIONS).

<3> After setting the HQPACK144SD, solder NQPACK144SD to the target system. By following this

sequence, adherence of flux or solder sputtering to contact pins of the NQPACK144SD can be avoided.

Recommended soldering condition… Reflow : 240°C, 20 sec. max.

Partial heating : 240°C, 10 sec. max. (per pin row)

<4> Remove the guide pins.

Figure C-1. Mounting of NQPACK144SD

Remark NQPACK144SD: Connector for target connection

HQPACK144SD: Cover for device installation

NQPACK144SD

Guide pins

(NQGUIDE)

HQPACK144SD

Target system

APPENDIX C CONNECTORS F OR T ARGET CONNECTIO N

(2) When setting device

Caution Check for abnormal conditions such as resin burr or bent pins before setting a device to the

NQPACK144SD. Moreover, check that the hold pins of the HQPACK144SD are not broken or

bent before setting HQPACK144SD. If there are broken or bent pins, fix them with a thin, flat

plate such as a blade.

<1> Make sure that the NQPACK144SD is clean and the device pins are parallel (flat) before setting a device

to the NQPACK144SD. Then, after mounting the NQPACK144SD to the target board, set the device and

HQPACK144SD (refer to Figure C-2).

<2> Using the screws provided with the HQPACK144SD (four locations: M2 × 6 mm), secure the

HQPACK144SD, device, and NQPACK144SD.

Tighten the screws in a crisscross pattern with the provided screwdriver or driver with torque gauge (avoid

tightening strongly only one screw). Tighten the screws with 0.55 kg⋅f⋅cm (0.054 N⋅m) max. torque.

Excessive tightening may diminish conductivity.

At this time, each pin is fixed inside the plastic wall dividers by the contact pin of the NQPACK144SD and

the hold pin of the HQPACK144SD (refer to Figure C-3). Thus, pins cannot cause a short with pins of

neighboring devices.

Figure C-2. Mounting Device

Fastening screws

HQPACK144SD

NQPACK144SD

Target system

Device

Figure C-3. NQPACK100SD and Device Pin

Hold pin of HQPACK144SD

Divider

Device

Contact pin of NQPACK144SD

APPENDIX C CONNECTORS F OR T ARGET CONNECTIO N

C.2 Cautions on Handling Connectors

(1) When taking connectors out of the case, remove the sponge while holding the main unit.

(2) When soldering the NQPACK144SD to the target system, cover the HQPACK144SD to protect it against

splashing flux.

Recommended soldering conditions… Reflow : 240°C, 20 sec. max.

Partial heating : 240°C, 10 sec. max. (per pin row)

(3) Check for abnormal conditions such as resin burr or bent pins before setting a device to the NQPACK144SD.

Moreover, check that the hold pins of the HQPACK144SD are not broken or bent before setting HQPACK144SD.

If there are broken or bent pins, fix them with a thin, flat plate such as a blade.

(4) When securing the YQPACK144SD (connector for emulator connection) or HQPACK144SD to the

NQPACK144SD with screws, tighten the four screws temporarily with the provided screwdriver or driver with

torque gauge, then tighten the screws in a crisscross pattern (with 0.054 N⋅m max. torque).

Excessive tightening of only one screw may diminish conductivity.

If the conductivity is diminished after screw-tightening, stop tightening, remove the screws and check whether the

NQPACK144SD is stained and make sure the device pins are parallel.

(5) Device pins do not have high strength. Repeatedly connecting to the NQPACK144SD may cause pins to bend.

When setting a device to the NQPACK144SD, check and adjust bent pins.

[MEMO]

APPENDIX D MOUNTING OF PLASTIC SPACER

This chapter describes the mounting method for the plastic spacer supplied with the IE-703102-MC.

When using the emulator connected to the target system, mount the plastic spacer as shown in Figure D-1 to fix

the pod horizontally.

(1) Mounting IE-703102-MC to plastic spacer

<1> Remove the nylon rivet from the rear part of the pod.

<2> Tighten the plastic spacer with the supplied plastic screw.

<3> To adjust the height, use a user spacer or stand.

Figure D-1. Mounting Method of Plastic Spacer

Target system

Plastic spacer

[MEMO]

Although NEC has taken all possible steps

to ensure that the documentation supplied

to our customers is complete, bug free

and up-to-date, we readily accept that

errors may occur. Despite all the care and

precautions we've taken, you may

encounter problems in the documentation.

Please complete this form whenever

you'd like to report errors or suggest

improvements to us.

Hong Kong, Philippines, Oceania

NEC Electronics Hong Kong Ltd.

Fax: +852-2886-9022/9044

Korea

NEC Electronics Hong Kong Ltd.

Seoul Branch

Fax: 02-528-4411

Taiwan

NEC Electronics Taiwan Ltd.

Fax: 02-2719-5951

Address

North America

NEC Electronics Inc.

Corporate Communications Dept.

Fax: 1-800-729-9288

1-408-588-6130

Europe

NEC Electronics (Europe) GmbH

Technical Documentation Dept.

Fax: +49-211-6503-274

South America

NEC do Brasil S.A.

Fax: +55-11-6465-6829

Asian Nations except Philippines

NEC Electronics Singapore Pte. Ltd.

Fax: +65-250-3583

Japan

NEC Semiconductor Technical Hotline

Fax: 044-548-7900

I would like to report the following error/make the following suggestion:

Document title:

Document number: Page number:

Thank you for your kind support.

If possible, please fax the referenced page or drawing.

Excellent Good Acceptable PoorDocument Rating

Clarity

Technical Accuracy

Organization

CS 98.8

Name

Company

From:

Tel. FAX

Facsimile

Message