Compact IGBT Modules
& Compact IPM
NEW PRODUCT GUIDE
New Product Guide
Compact IGBT Modules
Features
•The new package technology achieved small and compact size.
•
The new generation IGBT and FRD chips achieved low loss and low emission noise.
•Fault-signal output circuit (short circuit and overtemperature) is included.
•UL recognized: File No. E87989 (Package A, B', C, D type)
Item
IGBT
Circuit Package Product No.
Rating Function
Voltage
600 V
1200 V
1700 V
Current
150 A
200 A
400 A
600 A
800 A
200 A
300 A
400 A
600 A
400 A
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
(#)
(#)
-
(#)
(#)
(#)
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
7 in 1
6 in 1
2 in 1
2 in 1
2 in 1
A
B'
D
E
D
E
E
MG150J7KS60
MG200J6ES60
MG400J2YS60A
MG600J2YS60A
MG800J2YS50A
MG200Q2YS60A
MG300Q2YS60A
MG400Q2YS60A
MG600Q2YS60A
MG400V2YS60A
OC SC UV OT
Tc-M H-Fo L-Fo
Applications
■Compact IGBT Series
■Equivalent Circuit (2 in 1 & Package D type )
•Inverters
•Servo
•UPS
•Elevators, etc.
OC : Overcurrent protection SC : Short-circuit protection UV : Low supply voltage protection
OT : Overtemperature protection Tc-M: Cu-base temperature detector H-Fo : High-side error output
L-Fo : Low-side error output (#):Low-side error output without protection : Under approval for UL recognition
C1
F
O
FO
OT
E2
E1/C2
5
6
7
4
1
2
3
Signal terminal
1. G (L) 2. FO (L) 3. E (L) 4. VD
5. G (H) 6. FO (H) 7. E (H) 8. Open
*
*
*
*
Compact IPM
Features
•The new package technology achieved small and compact size.
•
The new generation IGBT and FRD chips achieved low loss and low emission noise.
•50 A to 600 A for 600 V rating , 50 A to 400 A for 1200 V rating.
•UL recognized: File No. E87989
Item
IPM
Circuit Package Product No.
Rating Function
Voltage
600 V
1200 V
Current
50 A
75 A
100 A
150 A
200 A
300 A
400 A
600 A
50 A
75 A
100 A
150 A
200 A
300 A
400 A
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
7 in 1
6 in 1
2 in 1
7 in 1
6 in 1
2 in 1
A
B
C
D
A
B
C
D
MIG50J7CSB1W
MIG75J7CSB1W
MIG100J7CSB1W
MIG150J7CSB1W
MIG200J6CMB1W
MIG300J2CSB1W
MIG400J2CSB1W
MIG600J2CMB1W
MIG50Q7CSB1X
MIG75Q7CSB1X
MIG100Q6CMB1X
MIG150Q6CMB1X
MIG200Q2CSB1X
MIG300Q2CMB1X
MIG400Q2CMB1X
OC SC UV OT
Tc-M H-Fo L-Fo
Applications
■Compact IPM Series
■Equivalent Circuit (7 in 1 type )
•Inverters
•Servo
•UPS
•Elevators, etc.
OC : Overcurrent protection SC : Short-circuit protection UV : Low supply voltage protection
OT : Overtemperature protection Tc-M: Cu-Base temperature detector H-Fo : High-side error output
L-Fo : Low-side error output
15
B P
1234567812 11 10 920 16 1314171819
GND
GND OUTVS
GND OUTVS
GND OUTVS
GND OUTVS
IN FO VD
GNDIN FO VD
GNDGND ININ FOFO VD
VD
GND OUTVS
GNDINFO VD
GND OUTVS
GND OUTVS
GNDINFO VD
GNDINFO VD
NUVW
1. VD (U) 2. FO (U) 3. IN (U)
4. GND (U) 5. VD (V) 6. FO (V)
7. IN (V) 8. GND (V) 9. VD (W)
10. FO (W) 11. IN (W) 12. GND (W)
13. VD (L) 14. FO (L) 15. Open
16. IN (B) 17. IN (X) 18. IN (Y)
19. IN (Z) 20.GND (L)
Signal terminal
Package Dimensions
Package type A
Unit: mm
Package type B
Unit: mm
Package type B'
Unit: mm
104 ± 0.5
27.94
2.54
2.54
(11.2)
15.24 ± 0.6
52 ± 0.5
19 ± 0.8 19 ± 0.8 8.5
± 0.8
8.5
± 0.8
55 ± 1.0
107 ± 1.0±
93 ± 0.3
7.5 ± 0.8
20 ± 0.8 20 ± 0.8 18 ± 0.8
15.24 ± 0.8
11
7
2.54 2.54
2–ø5.5
20– 0.64
6–M4
2–ø3.0
87
18.5±
0.8
31.5±
0.8
22
+1.0
–0.3
22
+1.0
–0.3
33.5
+1.0
–0.5
3
14
2
7
5
20
18
16
14
19
17
15
13
11
9
JAPAN
12
10
8
6
U
N
V
P
W
B
27.94
15.24 ± 0.6
59 ± 0.5
62 ± 1.0
50 ± 0.3
8.2
3
14
2
7
5
20
18
16
14
19
17
15
13
11
912
10
8
6
NP
WVU
37.5 +1.0
–0.5
26 +1.0
–0.3
21 ± 0.821 ± 0.8
10 ± 0.8 10 ± 0.8
119 ± 0.5
20 ± 0.8
35.5 ± 0.8
26 +1.0
–0.3
20 ± 0.8
(13.6)
JAPAN
22 ± 0.820 ± 0.8 15.24 ± 0.8
5–M5 22 ± 0.8 29.49 ± 0.8
2.54
2.54
2.54
2.54
614
10
122 ± 1.0
110 ± 0.3
2–ø3.0
4–ø5.5
20- 0.64
59 ± 0.5
62 ± 1.0
50 ± 0.3
20.5 ± 0.8
22.5
NP
WVU
42 ± 0.8
10 ± 0.8 10 ± 0.8
119 ± 0.5
28.5 ± 0.8
26 +1.0
–0.3
20 ± 0.8
8.2
(13.6)
JAPAN
22 ± 0.820 ± 0.8 13.9 ± 0.8
5–M5 22 ± 0.8 28.5 ± 0.8
5.35
10.7
614
10
122 ± 1.0
110 ± 0.3
4–ø5.5
Package Dimensions
Package type C
Unit: mm
Package type D
Unit: mm
Package type E
Unit: mm
C2E1
3–M5
8–
0.64
31.5 ± 0.8
2–ø3.0
2.54
E2 C1
22 +1.0
–0.6
33.5 +1.0
–0.5
104 ± 0.5
22 +1.0
–0.3
18
±
0.818
±
0.8
9.5 ± 0.8
18.5
± 0.8 9.5 ± 0.8
2.54
(13.9)
12
9
JAPAN
15.24
25.4 ± 0.6
52 ± 0.5
55 ± 1.0
29.24 ± 0.822 ± 0.822 ± 0.8
7.5
± 0.8
7
107 ± 1.0
93 ± 0.3
2–ø5.5
7
4
2
7
58
6
3
1
25.4
±
0.6
59
±
0.5
62
±
1.0
37.5 +1.0
–0.5
26 +1.0
–0.3
119
±
0.5
20
±
0.8
26 +1.0
–0.3
2
–ø
3.0
20
±
0.8
C2 E1
10.5
±
0.8 10.5
±
0.8
(15.3)
20.5
±
0.8
2.54
20.5
±
0.8
26
±
0.8
16
9
13
E2 C1
JAPAN
7
5
3
1
8
6
4
2
2.54
26
±
0.8 36.7
±
0.8
3–M6
4
–ø
5.5
4–R6
6 110
±
0.3
122
±
1.0
36
±
0.8
50
±
0.3
15.24
8– 0.64
8-FAST-ON-TAB
#110
JAPAN
TH1
Fo1
E1
G2
Fo2
E2
G2
TH2
C2E1
37 ± 1.0
46 ± 1.0 113 ± 0.8
31.5
+ 2
- 1.0
5.6 ± 1.05.6 ± 1.0
5.6 ± 1.0 5.6 ± 1.0
5.6 ± 1.0
84 ± 0.8
96 ± 1.0
4-ø5.5
15 ± 1.015 ± 1.0
125 ± 1.0
125 ± 1.0
37 ± 1.0
E2 C1
OVERSEAS SUBSIDIARIES AND AFFILIATES
Toshiba America
Electronic Components, Inc.
Headquarters-Irvine, CA
9775 Toledo Way, Irvine, CA 92618, U.S.A.
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Electronic Component Div.
Estrada Dos Alvarengas 5500,
09850-550, Brasil São Bernardo do campo, S.P.
Tel: (011)4358-7144 Fax: (011)4358-7179
Website: http://www.semicon.toshiba.co.jp/eng/index.html
The information contained herein is subject to change without notice.
The information contained herein is presented only as a guide for the applications of our products.
No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
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conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc..
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equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).
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reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended
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©2002 TOSHIBA CORPORATION
Printed in Japan
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(As of August, 2001)
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E-mail: semicon@toshiba.co.jp
020220 (D)
