ACT102H-600D,118 - NXP - Datasheet.Directory

1. Product profile

1.1 General description

An AC Thyristor power switch with very high noise immunity and over-voltage protection

configured for negative gate triggering in a SOT96-1 (SO8) small surface-mountable

plastic package

1.2 Features and benefits

Exclusive negativ e ga te trigge rin g

Full cycle AC conduction

High noise immunity

Remote gate separates the gate driver

from the effects of the load current

Safe clamping of low energy

over-voltage transients

Self-protectiv e tu rn -o n du rin g high

energy voltage transients

Surface-mountable package

Very sensitive gate for lowest gate

trigger current

1.3 Applications

Fan motor circuits

Lower-power highly inductive, resistive

and safety loads

Pump motor circuits

1.4 Quick reference data

ACT102H-600D

AC Thyristor power switch

Rev. 1 — 23 December 2010 Product data sheet

SO8

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VDRM repetitive peak

off-state voltage --600V

IGT gate trigger

current VD=12V; I

T= 100 mA; LD+

G-; Tj=25°C; see Figure 7 0.5 - 5 mA

VD=12V; I

T= 100 mA; LD-

G-; Tj=25°C; see Figure 7 0.5 - 5 mA

IT(RMS) RMS on-state

current full sine wave; Tamb ≤100 °C;

see Figure 3; see Figure 1 --0.2A

dVD/dt rate of rise of

off-state voltage VDM =402V; T

j= 125 °C; gate

open circuit; exponential

waveform; see Figure 11

300--V/µs

Product data sheet Rev. 1 — 23 December 2010 2 of 14

NXP Semiconductors ACT102H-600D

AC Thyristor power switch

2. Pinning information

3. Ordering information

VCL clamping voltage ICL = 100 µA; tp=1ms;

Tj≤125 °C; see Figure 14 650--V

VPP peak pulse

voltage Tj≤25 °C; non-repetitive,

off-state; see Figure 2 --2kV

VTon-state voltage IT= 0.3 A; see Figure 10 --1.2V

Table 1. Quick reference data …continued

Symbol Parameter Conditions Min Typ Max Unit

Tabl e 2. Pinning information

Pin Symbol Description Simplified outline Graphi c sy mbol

1 n.c. not connected

SOT96-1 (SO8)

2 LD Load

3 n.c. not connected

4 n.c. not connected

5GGate

6 CM Common

7 CM Common

8 n.c. not connected

001aaj92

Table 3. Ordering information

Type number Package

Name Description Version

ACT102H-600D SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

Product data sheet Rev. 1 — 23 December 2010 3 of 14

NXP Semiconductors ACT102H-600D

AC Thyristor power switch

4. Limiting values

Table 4. Limiting values

In accordance with the Absolute Maxi mum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDRM repetitive peak off-state voltage - 600 V

IT(RMS) RMS on-state current full sine wave; Tamb ≤100 °C;

see Figure 3; see Figure 1 -0.2A

ITSM non-repetitive peak on-state

current full sine wave; Tj(init) =25°C;

tp=16.7ms -8.8A

full sine wave; Tj(init) =25°C;

tp= 20 ms; see Figure 4; see Figure 5 -8A

I2tI

2t for fusing tp= 10 ms; sine-wave pulse - 0.32 A2s

dIT/dt rate of rise of on-state current IT=1A; I

G=20mA; dI

G/dt = 0.2 A/µs - 50 A/µs

IGM peak gate current t = 20 μs-1A

VGM peak gate voltage positive applied gate voltage - 15 V

PGM peak gate power - 2 W

PG(AV) a v erage gate power over any 20 ms period - 0.1 W

Tstg storage temperature -40 150 °C

Tjjunction temperature - 125 °C

VPP peak pulse voltage Tj≤25 °C; non-repetitive, off-state;

see Figure 2 -2kV

Fig 1. RMS on-state current as a function of solder

point temperature; maximum values Fig 2. Test circuit for inductive and resistive loads

with conditions equivale nt to IEC 61000-4-5

Ta (°C)

−50 150100050

003aaf740

0.08

0.16

0.24

IT(RMS)

(A)

0.04

0.12

0.20

003aad07

150 Ω5 μH

2 Ω

220 Ω

Surge Generator

Surge pulse

IEC 61000-4-5 Standards

RGen

Open Circuit Voltage

DUT

Load Model

1.2 μs/50 μs waveform

Product data sheet Rev. 1 — 23 December 2010 4 of 14

NXP Semiconductors ACT102H-600D

AC Thyristor power switch

Fig 3. Total power dissipation as a function of RM S on-state current; maximum values

f = 50 Hz

Fig 4. Non-repetitive peak on-state current as a function of the number of sinusoid al current cycles; maximum

values

003aaf739

0.08

0.12

0.04

0.16

0.20

Ptot

(W)

IT(RMS) (A)

0 0.200.160.08 0.120.04

α = 180°

003aac804

11010

2103

number of cycles

ITSM

(A)

ITSM

Tj(init) = 25 °C max

1/f

Product data sheet Rev. 1 — 23 December 2010 5 of 14

NXP Semiconductors ACT102H-600D

AC Thyristor power switch

5. Thermal characteristics

Fig 5. Non-repetitive peak on-state current as a function of pulse width ; maxi mum va lues

003aaf756

tp (s)

10−510−1

10−2

10−410−3

102

103

ITSM

(A)

ITSM

Tj(init) = 25 °C max

Table 5. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient full cycle; see Figure 6 - 150 - K/W

Fig 6. Transient thermal impedance from junction to lead as a function of pulse width

003aaf741

tp (s)

10−3102103

10110−210−1

102

103

Zth(j-a)

(K/W)

Product data sheet Rev. 1 — 23 December 2010 6 of 14

NXP Semiconductors ACT102H-600D

AC Thyristor power switch

6. Characteristics

Table 6. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

IGT gate trigger current VD=12V; I

T= 100 mA; LD+ G-;

Tj=25°C; see Figure 7 0.5 - 5 mA

VD=12V; I

T= 100 mA; LD- G-;

Tj=25°C; see Figure 7 0.5 - 5 mA

ILlatching current VD=12V; I

G=12mA; T

j=25°C;

see Figure 8 --25mA

IHholding current VD=12V; T

j=25°C; see Figure 9 --20mA

VTon-stat e vo ltage IT= 0.3 A; see Figure 10 --1.2V

VGT gate trigger voltage VD=12V; I

T=100mA; T

j=25°C --0.9V

VD=12V; I

T=100mA; T

j≤125 °C 0.15 - - V

IDoff-state current VD=600V; T

j≤125 °C - - 0.2 mA

VD=600V; T

j≤25 °C - - 2 µA

dVD/dt rate of rise of off-state

voltage VDM =402V; T

j= 125 °C; gate open

circuit; exponentia l waveform;

see Figure 11

300 - - V/µs

dIcom/dt rate of change of

commutating current VD=400V; T

j= 125 °C; IT(RMS) =1A;

dVcom/dt = 15 V/µs; gate open circuit;

see Figure 12 ; see Figure 13

0.15 - - A/ms

VCL clamping voltage ICL = 100 µA; tp=1ms; T

j≤125 °C;

see Figure 14 650 - - V

(1) LD+ G-

(2) LD- G-

Fig 7. Normalized gate trigger cu rrent as a function of

junction temperature Fig 8. Normalized latching current as a function of

junction temperature

IGT

IGT(25°C)

Tj (°C)

−50 0 150

100

003aac809

(1)

(2)

(1)

(2)

Tj (°C)

−50 150100050

003aac811

IL(25°C)

Product data sheet Rev. 1 — 23 December 2010 7 of 14

NXP Semiconductors ACT102H-600D

AC Thyristor power switch

Fig 9. Normalized holding current as a function of

junction temperature Fig 10. On-state current as a function of on-state

voltage

A is dVD/dt at condition Tj °C

B is dVD/dt at condition Tj 125 °C A is dIcom/dt at condition Tj °C

B is dIcom/dt at condition Tj 125 °C

VD = 400 V

Fig 11. Normalized rate of rise of off-state voltage as a

function of junctio n temp erat u re Fi g 12 . Normalized critical rate of ris e of co mmu t a tin g

current as a function of junction temperature

Tj (°C)

−50 150100050

003aac810

IH(25°C)

003aaf722

0.0

0.5

1.0

1.5

2.0

0.0 0.5 1.0 1.5 2.0

VT (V)

(A)

(1) (2) (3)

Tj (°C)

25 12510050 75

003aac813

(°C)

25 12510050 75

003aac814

Product data sheet Rev. 1 — 23 December 2010 8 of 14

NXP Semiconductors ACT102H-600D

AC Thyristor power switch

A[B] is dIcom/dt at condition B, dVcom/dt

A[spec] is the specified data sheet value of dIcom/dt

turn-off time < 20 ms

Fig 13. Normalized critical rate of change of

commutating current as a fun ctio n o f cr itical

rate of change of commutating volta g e;

minimum values

Fig 14. Normalized clamping voltage (upper limit) as a

function of junction temp erat ure; minimum

values

003aac815

0.5

1.0

1.5

2.0

10−111010

B (V/μs)

A [B]

A [spec]

Tj (°C)

−50 150100050

003aac817

0.4

0.8

1.2

VCL

VCL(25°C)

Product data sheet Rev. 1 — 23 December 2010 9 of 14

NXP Semiconductors ACT102H-600D

AC Thyristor power switch

7. Package outline

Fig 15. Package outline SOT96-1 (SO8)

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10

1.45

1.25 0.25 0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6

0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004

0.057

0.049 0.01 0.019

0.014

0.0100

0.0075

0.20

0.19

0.16

0.15 0.05 0.244

0.228

0.028

0.024

0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

O8: plastic small outline package; 8 leads; body width 3.9 mm SOT96

-1

99-12-27

03-02-18

Product data sheet Rev. 1 — 23 December 2010 10 of 14

NXP Semiconductors ACT102H-600D

AC Thyristor power switch

8. Soldering

Fig 16. Reflow soldering footprint for SOT96-1 (SO8)

Fig 17. Wave soldering footprint for SOT96-1 (SO8)

sot096-1_

occupied area

solder lands

Dimensions in mm

placement accuracy ± 0.25

1.30

0.60 (8×)

1.27 (6×)

4.00 6.60

5.50

7.00

sot096-1_

solder resist

occupied area

solder lands

Dimensions in mm

board direction

placement accurracy ± 0.25

4.00

5.50

1.30

0.3 (2×)

0.60 (6×)

1.20 (2×)

1.27 (6×)

7.00

6.60

enlarged solder land

Product data sheet Rev. 1 — 23 December 2010 11 of 14

NXP Semiconductors ACT102H-600D

AC Thyristor power switch

9. Revision history

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

ACT102H-600D v.1 20101223 Product data sheet - -

Product data sheet Rev. 1 — 23 December 2010 12 of 14

NXP Semiconductors ACT102H-600D

AC Thyristor power switch

10. Legal information

10.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The p r oduct status of device(s) described in t his document may have changed since this documen t was published and may differ in case of multiple devices. The latest product

status information is available on the Internet at URL http://www.nxp.com.

10.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specifica t io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed be tween

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

10.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whethe r or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-crit ical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reaso nably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Char acteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the applicatio n or use by custo m er’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective sp ecification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product spe cification.

Product data sheet Rev. 1 — 23 December 2010 13 of 14

NXP Semiconductors ACT102H-600D

AC Thyristor power switch

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document ma y be interpret ed or

construed as an of fer to se ll product s that is op en for accept ance or the grant ,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) d escribed herein may

be subject to export control regulat i ons. Export might require a prior

authorization from national authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automo tive use. It i s neither qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product claims resulting from customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

10.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,

FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,

ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,

QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,

TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

11. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors ACT102H-600D

AC Thyristor power switch

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 23 December 2010

Document identifier: ACT102H-600D

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

12. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.1 General description . . . . . . . . . . . . . . . . . . . . . .1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2

4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3

5 Thermal characteristics . . . . . . . . . . . . . . . . . . .5

6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6

7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9

8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

9 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .11

10 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12

10.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12

10.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

10.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .12

10.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13

11 Contact information. . . . . . . . . . . . . . . . . . . . . .13