June 2005 / A
Page 1
SEMICONDUCTOR
TAK CHEONG
®
500 mW LL-34 Hermetically
Sealed Glass Fast Switching
Diodes
Absolute Ma ximum Ra tings TA = 25°C unless otherwise noted
Symbol Parameter Value Units
PD Power Dissipation 500 mW
TSTG Storage Temperature Range -65 to +200 °C
TJ Operating Junction Temperature +175 °C
WIV Working Inverse Voltage 75 V
IO Average Rectified Current 150 mA
IFM Non-repetitive Peak Forward Current 450 mA
IFSURGE Peak Forward Surge Current 2 A
These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
Fast Switching Device (TRR <4.0 nS)
LL-34 (Mini-MELF) Package
Surface Device Type Mounting
Hermetically Sealed Glass
Compression Bonded Construction
All external surfaces are corrosion resistant and leads are readily solderable
1st band indicates negative polarity
Electrical Characteristics TA = 25°C unless otherwise noted Limits
Symbol Parameter Test Condition
Min Max Unit
BV Breakdown Voltage IR=5µA 75 Volts
IR Reverse Leakage Current VR=50V 50 nA
VF Forward Voltage IF=50mA 1 Volts
TRR Reverse Recovery Time IF=IR=10mA
RL=100Ω
IRR=1mA
4 nS
C Capacitance VR=0V, f=1MHZ 2 pF
Cathode Anode
ELECTRICAL SYMBOL
TCLL4151
DEVICE MARKING DIAGRAM
Cathode Band Color : Black
SURFACE MOUNT
LL34