  
  
       
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
Copyright 1988, Texas Instruments Incorporated
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  
       
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
  
  
       
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
  
  
       
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
  
  
       
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
  
  
       
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
6POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
JM38510/00205BCA OBSOLETE CDIP J 14 TBD Call TI Call TI
JM38510/00205BDA OBSOLETE CFP W 14 TBD Call TI Call TI
JM38510/00205BDA OBSOLETE CFP W 14 TBD Call TI Call TI
JM38510/07101BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/07101BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/07101BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/07101BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30102B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30102B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/30102BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/30102BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/30102BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30102BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30102SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/30102SCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/30102SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/30102SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN5474J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN5474J OBSOLETE CDIP J 14 TBD Call TI Call TI
SN54LS74AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN54LS74AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN54S74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN54S74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN7474DR OBSOLETE SOIC D 14 TBD Call TI Call TI
SN7474DR OBSOLETE SOIC D 14 TBD Call TI Call TI
SN7474N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7474N OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7474N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN7474N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS74AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
SN74LS74ADE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74AJ OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS74AJ OBSOLETE CDIP J 14 TBD Call TI Call TI
SN74LS74AN ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS74AN ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS74AN3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS74AN3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74LS74ANE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS74ANE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74LS74ANSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ANSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LS74ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 2
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74S74DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S74N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S74N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S74N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74S74NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S74NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74S74NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74S74NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ5474J OBSOLETE CDIP J 14 TBD Call TI Call TI
SNJ5474J OBSOLETE CDIP J 14 TBD Call TI Call TI
SNJ5474W OBSOLETE CFP W 14 TBD Call TI Call TI
SNJ5474W OBSOLETE CFP W 14 TBD Call TI Call TI
SNJ54LS74AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS74AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54LS74AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54LS74AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54LS74AW ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54LS74AW ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S74FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S74FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54S74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54S74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54S74W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNJ54S74W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 3
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 4
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS74ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LS74ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LS74ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74S74NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS74ADBR SSOP DB 14 2000 346.0 346.0 33.0
SN74LS74ADR SOIC D 14 2500 346.0 346.0 33.0
SN74LS74ANSR SO NS 14 2000 346.0 346.0 33.0
SN74S74NSR SO NS 14 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2009
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150