PCA82C251T/N3 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 1997 Mar 14

File under Integrated Circuits, IC18

2000 Jan 13

INTEGRATED CIRCUITS

PCA82C251

CAN transceiver for 24 V systems

2000 Jan 13 2

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

FEATURES

•Fully compatible with the

“ISO 11898-24 V”

standard

•Slope control to reduce RFI

•Thermally protected

•Short-circuit proof to battery and ground in 24 V

powered systems

•Low-current standby mode

•An unpowered node does not disturb the bus lines

•At least 110 nodes can be connected

•High speed (up to 1 Mbaud)

•High immunity against electromagnetic interference.

GENERAL DESCRIPTION

The PCA82C251 is the interface between the CAN

protocol controller and the physical bus. It is primarily

intended for applications (up to 1 Mbaud) in trucks and

buses. The device provides differential transmit capability

to the bus and differential receive capability to the CAN

controller.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC supply voltage 4.5 5.5 V

ICC supply current standby mode −275 µA

1/tbit maximum transmission speed non-return-to-zero 1 −Mbaud

VCAN CANH, CANL input/output voltage −36 +36 V

Vdiff differential bus voltage 1.5 3.0 V

Tamb ambient temperature −40 +125 °C

TYPE

NUMBER PACKAGE

NAME DESCRIPTION CODE

PCA82C251 DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

PCA82C251T SO8 plastic small outline package; 8 leads body width 3.9 mm SOT96-1

PCA82C251U −bare die; 2840 ×1780 ×380 µm−

2000 Jan 13 3

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

MBG613

SLOPE/

STANDBY

RECEIVER

REFERENCE

VOLTAGE

DRIVER

PROTECTION

VCC

CANH

CANL

GND

Vref

RXD

TXD

PCA82C251

PINNING

SYMBOL PIN DESCRIPTION

TXD 1 transmit data input

GND 2 ground

VCC 3 supply voltage

RXD 4 receive data output

Vref 5 reference voltage output

CANL 6 LOW-level CAN voltage

input/output

CANH 7 HIGH-level CAN voltage

input/output

Rs 8 slope resistor input Fig.2 Pin configuration.

handbook, halfpage

1TXD

8Rs

GND CANH

VCC CANL

RXD Vref

MBG612

PCA82C251

2000 Jan 13 4

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

FUNCTIONAL DESCRIPTION

The PCA82C251 is the interface between the CAN

protocol controller and the physical bus. It is primarily

intended for applications up to 1 Mbaud in trucks and

buses. The device provides differential transmit capability

to the bus and differential receive capability to the CAN

controller. It is fully compatible with the

“ISO 11898-24 V”

standard.

A current limiting circuit protects the transmitter output

stage against short-circuit to positive and negative battery

voltage. Although the power dissipation is increased

during this fault condition, this feature will prevent

destruction of the transmitter output stage.

If the junction temperature exceeds a value of

approximately 160 °C, the limiting current of both

transmitter outputs is decreased. Because the transmitter

is responsible for the major part of the power dissipation,

this will result in a reduced power dissipation and hence a

lower chip temperature. All other parts of the IC will remain

operating. The thermal protection is particularly needed

when a bus line is short-circuited.

The CANH and CANL lines are also protected against

electrical transients which may occur in an automotive

environment.

Pin 8 (Rs) allows three different modes of operation to be

selected: high-speed, slope control or standby.

For high-speed operation, the transmitter output

transistors are simply switched on and off as fast as

possible. In this mode, no measures are taken to limit the

rise and fall slope. Use of a shielded cable is

recommended to avoid RFI problems. The high-speed

mode is selected by connecting pin 8 to ground.

The slope control mode allows the use of an unshielded

twisted pair or a parallel pair of wires as bus lines.

To reduce RFI, the rise and fall slope should be limited.

The rise and fall slope can be programmed with a resistor

connected from pin 8 to ground. The slope is proportional

to the current output at pin 8.

If a HIGH level is applied to pin 8, the circuit enters a low

current standby mode. In this mode, the transmitter is

switched off and the receiver is switched to a low current.

If dominant bits are detected (differential bus voltage

>0.9 V), RXD will be switched to a LOW level.

The microcontroller should react to this condition by

switching the transceiver back to normal operation

(via pin 8). Because the receiver is slower in standby

mode, the first message will be lost at higher bit rates.

Table 1 Truth table of the CAN transceiver

Notes

1. X = don’t care.

2. If another bus node is transmitting a dominant bit, then RXD is logic 0.

Table 2 Pin Rs summary

VCC TXD CANH CANL BUS STATE RXD

4.5 to 5.5 V 0 HIGH LOW dominant 0

4.5 to 5.5 V 1 (or ﬂoating) ﬂoating ﬂoating recessive 1(2)

4.5<V

CC < 5.5 V X(1) ﬂoating if

VRs > 0.75VCC

ﬂoating if

VRs > 0.75VCC

ﬂoating 1(2)

0<V

CC < 4.5 V ﬂoating ﬂoating ﬂoating ﬂoating X(1)

CONDITION FORCED AT PIN Rs MODE RESULTING VOLTAGE OR CURRENT AT PIN Rs

VRs > 0.75VCC standby −IRs <10µA

10 µA<−I

Rs < 200 µA slope control 0.4VCC <V

Rs < 0.6VCC

VRs < 0.3VCC high-speed −IRs < 500 µA

2000 Jan 13 5

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2;

positive input current.

Notes

1. TXD is LOW. Short-circuit protection provided for slew rates up to 5 V/µs for voltages above +30 V.

2. Short-circuit applied when TXD is HIGH, followed by TXD switched to LOW.

3. In accordance with

“IEC 60747-1”

. An alternative definition of virtual junction temperature is:

Tvj =T

amb +P

d×R

th(vj-a), where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits

the allowable combinations of power dissipation (Pd) and ambient temperature (Tamb).

4. Classification A: human body model; C = 100 pF; R = 1500 Ω; V = ±2500 V.

5. Classification B: machine model; C = 200 pF; R = 0 Ω; V = ±250 V.

THERMAL CHARACTERISTICS

QUALITY SPECIFICATION

According to

“SNW-FQ-611 part E”

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCC supply voltage −0.3 +7.0 V

VnDC voltage at pins 1, 4, 5 and 8 −0.3 VCC + 0.3 V

V6DC voltage at pin 6 (CANL) 0V<V

CC < 5.5 V; TXD HIGH

or ﬂoating −36 +36 V

0V<V

CC < 5.5 V; no time

limit; note 1 −36 +36 V

0V<V

CC < 5.5 V; no time

limit; note 2 −36 +36 V

V7DC voltage at pin 7 (CANH) 0V<V

CC < 5.5 V; no time limit −36 +36 V

Vtr transient voltage on pins 6 and 7 see Fig.8 −200 +200 V

Tstg storage temperature −55 +150 °C

Tamb ambient temperature −40 +125 °C

Tvj virtual junction temperature note 3 −40 +150 °C

Vesd electrostatic discharge voltage note 4 −2500 +2500 V

note 5 −250 +250 V

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-a) thermal resistance from junction to ambient in free air

PCA82C251 100 K/W

PCA82C251T 160 K/W

2000 Jan 13 6

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

CHARACTERISTICS

VCC = 4.5 to 5.5 V; Tamb =−40 to + 125 °C; RL=60Ω; I8>−10 µA; unless otherwise speciﬁed; all voltages referenced

to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design,

but only 100% tested at +25 °C.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

I3supply current dominant; V1=1V;

CC <5.1 V −−78 mA

dominant; V1=1V;

CC <5.25 V −−80 mA

dominant; V1=1V;

CC <5.5 V −−85 mA

recessive; V1=4V;

8=47kΩ−−10 mA

standby; note 1 −−275 µA

DC bus transmitter

VIH HIGH-level input voltage output recessive 0.7VCC −VCC + 0.3 V

VIL LOW-level input voltage output dominant −0.3 −0.3VCC V

IIH HIGH-level input current V1=4V −200 −+30 µA

IIL LOW-level input current V1=1V −100 −−600 µA

V6, 7 recessive bus voltage V1= 4 V; no load 2.0 −3.0 V

ILO off-state output leakage

current −2V<(V

)<7V −2−+2 mA

−5V<(V

) < 36 V −10 −+10 mA

V7CANH output voltage V1=1V; V

CC = 4.75 to 5.5 V 3.0 −4.5 V

V1=1V; V

CC = 4.5 to 4.75 V 2.75 −4.5 V

V6CANL output voltage V1=1V 0.5 −2.0 V

∆V6,7 difference between output

voltage at pins 6 and 7 V1=1V 1.5 −3.0 V

V1=1V; R

L=45Ω1.5 −−V

= 4 V; no load −500 −+50 mV

Isc7 short-circuit CANH current V7=−5V −−−200 mA

V7=−36 V −−100 −mA

Isc6 short-circuit CANL current V6=36V −−200 mA

DC bus receiver [V1= 4 V; pins 6 and 7 externally driven; −2V<(V

) < 7 V; unless otherwise speciﬁed]

Vdiff(r) differential input voltage

(recessive) note 2 −1.0 −+0.5 V

−7V<(V

6, V7) < 12 V; note 2 −1.0 −+0.4 V

Vdiff(d) differential input voltage

(dominant) 0.9 −5.0 V

−7V<(V

6, V7) < 12 V; not

standby mode 1.0 −5.0 V

standby mode 0.97 −5.0 V

standby mode;

VCC = 4.5 to 5.10 V 0.91 −5.0 V

Vdiff(hys) differential input hysteresis see Fig.5 −150 −mV

2000 Jan 13 7

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

Notes

1. I1=I

4=I

5= 0 mA; 0 V < V6<V

CC; 0V<V

7<V

CC; V8=V

CC; Tamb <90°C.

2. This is valid for the receiver in all modes: high-speed, slope control and standby.

VOH HIGH-level output voltage

(pin 4) I4=−100 µA 0.8VCC −VCC V

VOL LOW-level output voltage

(pin 4) I4=1mA 0 −0.2VCC V

I4=10mA 0 −1.5 V

RiCANH, CANL input

resistance 5−25 kΩ

Rdiff differential input resistance 20 −100 kΩ

Reference output

Vref reference output voltage V8=1V;I

<50µA 0.45VCC −0.55VCC V

V8=4V;I

<5µA 0.4VCC −0.6VCC V

Timing (RL=60Ω; CL= 100 pF; unless otherwise speciﬁed. See Figs 3 and 4)

tbit minimum bit time R8=0Ω−−1µs

onTXD delay TXD to bus active R8=0Ω−−50 ns

toffTXD delay TXD to bus inactive R8=0Ω−40 80 ns

tonRXD delay TXD to receiver

active R8=0Ω−55 120 ns

toffRXD delay TXD to receiver

inactive R8=0Ω; Tamb < +85 °C;

VCC = 4.5 to 5.1 V −80 150 ns

R8=0Ω; VCC = 4.5 to 5.1 V −80 170 ns

R8=0Ω; Tamb < +85 °C−90 170 ns

R8=0Ω−90 190 ns

R8=47kΩ−290 400 ns

tonRXD delay TXD to receiver

active R8=47kΩ−440 550 ns

SRCANH, CANL slew rate R8=47kΩ−7−V/µs

tWAKE wake-up time from standby

(via pin 8) see Fig.6 −−20 µs

tdRXDL bus dominant to RXD LOW V8= 4 V; see Fig.7 −−3µs

Standby/slope control (pin 8)

Vstb input voltage for standby

mode 0.75VCC −−V

slope slope control mode current −10 −−200 µA

Vslope slope control mode voltage 0.4VCC −0.6VCC V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

2000 Jan 13 8

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

TEST AND APPLICATION INFORMATION

Fig.3 Test circuit for dynamic characteristics.

handbook, full pagewidth

MBG614

VCC

Vref

RXD

PCA82C251 60 Ω 100 pF

CANH

CANL

GND Rs

30 pF

TXD 13

100 nF

+5 V

Fig.4 Timing diagram for dynamic characteristics.

handbook, full pagewidth

MBG615

tonTXD tonRXD

toffTXD toffRXD

VTXD

Vdiff

VRXD

0.9 V

0.3VCC

0.7VCC

0.5 V

0 V

VCC

2000 Jan 13 9

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

Fig.5 Hysteresis.

handbook, full pagewidth

MBG616

HIGH

LOW

hysteresis

0.5 0.9 Vdiff (V)

VRXD

handbook, full pagewidth

MBG617

VCC

0 V

tWAKE

VRs

VRXD

Fig.6 Timing diagram for wake up from standby.

VTXD =1V.

handbook, full pagewidth

MBG618

0 V

1.5 V

tdRXDL

Vdiff

VRXD

Fig.7 Timing diagram for bus dominant to RXD low.

VRs = 4 V; VTXD =4V.

2000 Jan 13 10

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

Fig.8 Test circuit for automotive transients.

The waveforms of the applied transients shall be in accordance with

“ISO 7637 part 1”

, test pulses 1, 2, 3a and 3b.

handbook, full pagewidth

MBG619

VCC

Vref

RXD

PCA82C251 60 Ω

47 kΩ

500 pF

CANH

CANL

GND Rs

TXD 13

100 nF

+5 V

500 pF

SCHAFFNER

GENERATOR

Fig.9 Application of the PCA82C251 CAN Transceiver.

(1) The output control register of the P8xC592 should be programmed to 1AH (push-pull operation, dominant = LOW).

(2) If no slope control is desired: Rext =0.

handbook, full pagewidth

MBG620

Vref

RXD

CANH CANL

TXD +5 V

CRX1CRX0 PX,YCTX0

P8xC592

CAN-CONTROLLER

Rext

VCC

GND

120 Ω120 Ω

CAN BUS

LINE

100 nF

PCA82C251

CAN-TRANSCEIVER

2000 Jan 13 11

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

BONDING PAD LOCATIONS

Note

1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of

the die (x/y = 0).

SYMBOL PAD COORDINATES(1)

TXD 1 196 137

GND 2 1080 137

VCC 3 1567 137

RXD 4 2644 137

Vref 5 2644 1644

CANL 6 1490 1644

CANH 7 748 1644

Rs 8 200 1610

handbook, full pagewidth

PCA82C251U

TXD

CANH

CANL

Vref

VCC

GND

RXD

MGL944

y2.84 mm

1.78

Fig.10 Bonding pad locations.

2000 Jan 13 12

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

PACKAGE OUTLINES

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

SOT97-1 95-02-04

99-12-27

UNIT A

max. 12 b

1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.14 0.53

0.38 0.36

0.23 9.8

9.2 6.48

6.20 3.60

3.05 0.2542.54 7.62 8.25

7.80 10.0

8.3 1.154.2 0.51 3.2

inches 0.068

0.045 0.021

0.015 0.014

0.009

1.07

0.89

0.042

0.035 0.39

0.36 0.26

0.24 0.14

0.12 0.010.10 0.30 0.32

0.31 0.39

0.33 0.0450.17 0.020 0.13

050G01 MO-001 SC-504-8

(e )

seating plane

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

pin 1 index

DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1

2000 Jan 13 13

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.050 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

97-05-22

99-12-27

2000 Jan 13 14

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

SOLDERING

Introduction

Thistextgivesavery briefinsightto acomplextechnology.

A more in-depth account of soldering ICs can be found in

our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-holeandsurfacemountcomponentsaremixedon

one printed-circuit board. However, wave soldering is not

always suitable for surface mount ICs, or for printed-circuit

boards with high population densities. In these situations

reflow soldering is often used.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joints for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (Tstg(max)). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

MANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

300 and 400 °C, contact may be up to 5 seconds.

Surface mount packages

REFLOW SOLDERING

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

totheprinted-circuit board by screen printing,stencillingor

pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

WAVE SOLDERING

Conventional single wave soldering is not recommended

forsurface mountdevices(SMDs)orprinted-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

•Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

•For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The footprint must incorporate solder thieves at the

downstream end.

•Forpackages withleadsonfoursides, thefootprintmust

be placed at a 45°angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

MANUAL SOLDERING

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

2000 Jan 13 15

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

Suitability of IC packages for wave, reﬂow and dipping soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

MOUNTING PACKAGE SOLDERING METHOD

WAVE REFLOW(1) DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable(2) −suitable

Surface mount BGA, LFBGA, SQFP, TFBGA not suitable suitable −

HBCC, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, SMS not suitable(3) suitable −

PLCC(4), SO, SOJ suitable suitable −

LQFP, QFP, TQFP not recommended(4)(5) suitable −

SSOP, TSSOP, VSO not recommended(6) suitable −

2000 Jan 13 16

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

BARE DIE DISCLAIMER

All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of

ninety (90) days from the date of Philips’ delivery. If there are data sheet limits not guaranteed, these will be separately

indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors

has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips

Semiconductorsassumesnoliabilityfordevicefunctionality or performance of the die or systems after thirdpartysawing,

handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in

which the die is used.

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development.

Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later.

Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

2000 Jan 13 17

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

NOTES

2000 Jan 13 18

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

NOTES

2000 Jan 13 19

Philips Semiconductors Productspeciﬁcation

CAN transceiver for 24 V systems PCA82C251

NOTES

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

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Internet: http://www.semiconductors.philips.com

2000 69

Philips Semiconductors – a world wide company

For all other countries apply to: Philips Semiconductors,

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,

5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 68 9211, Fax. +359 2 68 9102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. +45 33 29 3333, Fax. +45 33 29 3905

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PTPhilipsDevelopment Corporation,SemiconductorsDivision,

Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,

Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),

Tel. +39 039 203 6838, Fax +39 039 203 6800

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,

Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,

Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,

ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 3341 299, Fax.+381 11 3342 553

Printed in The Netherlands 285002/03/pp20 Date of release: 2000 Jan 13 Document order number: 9397 750 06611