LT3023
1
3023fa
TYPICAL APPLICATION
FEATURES
APPLICATIONS
DESCRIPTION
Dual 100mA,
Low Dropout, Low Noise,
Micropower Regulator
The LT
®
3023 is a dual, micropower, low noise, low drop-
out regulator. With an external 0.01μF bypass capacitor,
output noise drops to 20μVRMS over a 10Hz to 100kHz
bandwidth. Designed for use in battery-powered systems,
the low 20μA quiescent current per channel makes it an
ideal choice. In shutdown, quiescent current drops to less
than 0.1μA. Shutdown control is independent for each
channel, allowing for fl exibility in power management. The
device is capable of operating over an input voltage from
1.8V to 20V, and can supply 100mA of output current from
each channel with a dropout voltage of 300mV. Quiescent
current is well controlled in dropout.
The LT3023 regulator is stable with output capacitors as
low as 1μF. Small ceramic capacitors can be used without
the series resistance required by other regulators.
Internal protection circuitry includes reverse battery
protection, current limiting, thermal limiting and reverse
current protection. The device is available as an adjust-
able device with a 1.22V reference voltage. The LT3023
regulator is available in the thermally enhanced 10-lead
MSOP and DFN packages.
n Low Noise: 20μVRMS (10Hz to 100kHz)
n Low Quiescent Current: 20μA/Channel
n Wide Input Voltage Range: 1.8V to 20V
n Output Current: 100mA/Channel
n Very Low Shutdown Current: <0.1μA
n Low Dropout Voltage: 300mV at 100mA
n Adjustable Output from 1.22V to 20V
n Stable with 1μF Output Capacitor
n Stable with Aluminum, Tantalum or
Ceramic Capacitors
n Reverse Battery Protected
n No Reverse Current
n No Protection Diodes Needed
n Overcurrent and Overtemperature Protected
n Thermally Enhanced 10-Lead MSOP and DFN
Packages
n Cellular Phones
n Pagers
n Battery-Powered Systems
n Frequency Synthesizers
n Wireless Modems
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other
trademarks are the property of their respective owners.
10Hz to 100kHz Output Noise
3.3V/2.5V Low Noise Regulators
IN
SHDN2
0.01μF
0.01μF
10μF
3023 TA01
OUT1
VIN
3.7V TO
20V BYP1
ADJ1
OUT2
BYP2
ADJ2
GND
LT3023
3.3V AT100mA
20μVRMS NOISE
2.5V AT100mA
20μVRMS NOISE
F SHDN1
10μF
422k
249k
261k
249k
VOUT
100μV/DIV 20μVRMS
3023 TA01b
LT3023
2
3023fa
ABSOLUTE MAXIMUM RATINGS
IN Pin Voltage .........................................................±20V
OUT1, OUT2 Pin Voltage .........................................±20V
Input to Output Differential Voltage .........................±20V
ADJ1, ADJ2 Pin Voltage ............................................±7V
BYP1, BYP2 Pin Voltage ........................................±0.6V
SHDN1, SHDN2 Pin Voltage ...................................±20V
(Note 1)
TOP VIEW
DD PACKAGE
10-LEAD
(
3mm s 3mm
)
PLASTIC DFN
10
9
6
7
8
4
5
3
2
1OUT2
SHDN2
IN
SHDN1
OUT1
BYP2
ADJ2
GND
ADJ1
BYP1
11
TJMAX = 125°C, θJA = 40°C/W, θJC = 10°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
1
2
3
4
5
BYP2
ADJ2
GND
ADJ1
BYP1
10
9
8
7
6
OUT2
SHDN2
IN
SHDN1
OUT1
TOP VIEW
MSE PACKAGE
10-LEAD PLASTIC MSOP
11
TJMAX = 150°C, θJA = 40°C/W, θJC = 10°C/W
EXPOSED PAD (PIN 11) IS GND, MUST BE SOLDERED TO PCB
PIN CONFIGURATION
ORDER INFORMATION
LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LT3023EDD#PBF LT3023EDD#TRPBF LAJA 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT3023IDD#PBF LT3023IDD#TRPBF LAJA 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT3023EMSE#PBF LT3023EMSE#TRPBF LTAHZ 10-Lead Plastic MSOP –40°C to 125°C
LT3023IMSE#PBF LT3023IMSE#TRPBF LTAHZ 10-Lead Plastic MSOP –40°C to 125°C
LEAD BASED FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LT3023EDD LT3023EDD#TR LAJA 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT3023IDD LT3023IDD#TR LAJA 10-Lead (3mm × 3mm) Plastic DFN –40°C to 125°C
LT3023EMSE LT3023EMSE#TR LTAHZ 10-Lead Plastic MSOP –40°C to 125°C
LT3023IMSE LT3023IMSE#TR LTAHZ 10-Lead Plastic MSOP –40°C to 125°C
Consult LTC Marketing for parts specifi ed with wider operating temperature ranges. *The temperature grade is identifi ed by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifi cations, go to: http://www.linear.com/tapeandreel/
Output Short-Circut Duration ........................... Indefi nite
Operating Junction Temperature Range
(Note 2) ............................................. –40°C to 125°C
Storage Temperature Range ................... –65°C to 150°C
Lead Temperature (Soldering, 10 sec) .................. 300°C
(MSE package only)
ELECTRICAL CHARACTERISTICS
The l denotes the specifi cations which apply over the full operating
temperature range, otherwise specifi cations are at TA = 25°C. (Note 2)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Minimum Input Voltage
(Notes 3, 11)
ILOAD = 100mA l1.8 2.3 V
ADJ1, ADJ2 Pin Voltage
(Note 3, 4)
VIN = 2V, ILOAD = 1mA
2.3V < VIN < 20V, 1mA < ILOAD < 100mA l
1.205
1.190
1.220
1.220
1.235
1.250
V
V
LT3023
3
3023fa
ELECTRICAL CHARACTERISTICS
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: The LT3023 is tested and specifi ed under pulse load conditions
such that TJ TA. The LT3023E is 100% tested at TA = 25°C. Performance
at –40°C and 125°C is assured by design, characterization and correlation
with statistical process controls. The LT3023I is guaranteed over the full
–40°C to 125°C operating junction temperature range.
Note 3: The LT3023 is tested and specifi ed for these conditions with the
ADJ1/ADJ2 pin connected to the corresponding OUT1/OUT2 pin.
Note 4: Operating conditions are limited by maximum junction
temperature. The regulated output voltage specifi cation will not apply
for all possible combinations of input voltage and output current. When
operating at maximum input voltage, the output current range must be
limited. When operating at maximum output current, the input voltage
range must be limited.
Note 5: To satisfy requirements for minimum input voltage, the LT3023 is
tested and specifi ed for these conditions with an external resistor divider
(two 250k resistors) for an output voltage of 2.44V. The external resistor
divider will add a 5μA DC load on the output.
The l denotes the specifi cations which apply over the full operating
temperature range, otherwise specifi cations are at TA = 25°C. (Note 2)
PARAMETER CONDITIONS MIN TYP MAX UNITS
Line Regulation (Note 3) ΔVIN = 2V to 20V, ILOAD = 1mA l110 mV
Load Regulation (Note 3) VIN = 2.3V, ΔILOAD = 1mA to 100mA
VIN = 2.3V, ΔILOAD = 1mA to 100mA l
112
25
mV
mV
Dropout Voltage
VIN = VOUT(NOMINAL) (Notes 5, 6, 11)
ILOAD = 1mA
ILOAD = 1mA l
0.10 0.15
0.19
V
V
ILOAD = 10mA
ILOAD = 10mA l
0.17 0.22
0.29
V
V
ILOAD = 50mA
ILOAD = 50mA l
0.24 0.28
0.38
V
V
ILOAD = 100mA
ILOAD = 100mA l
0.30 0.35
0.45
V
V
GND Pin Current (Per Channel)
VIN = VOUT(NOMINAL) (Notes 5, 7)
ILOAD = 0mA
ILOAD = 1mA
ILOAD = 10mA
ILOAD = 50mA
ILOAD = 100mA
l
l
l
l
l
20
55
230
1
2.2
45
100
400
2
4
μA
μA
μA
mA
mA
Output Voltage Noise COUT = 10μF, CBYP = 0.01μF, ILOAD = 100mA, BW = 10Hz to 100kHz 20 μVRMS
ADJ1/ADJ2 Pin Bias Current (Notes 3, 8) 30 100 nA
Shutdown Threshold VOUT = Off to On
VOUT = On to Off
l
l0.25
0.8
0.65
1.4 V
V
SHDN1/SHDN2 Pin Current
(Note 9)
VSHDN = 0V
VSHDN = 20V
l
l
0
1
0.5
3
μA
μA
Quiescent Current in Shutdown VIN = 6V, VSHDN = 0V (Both SHDN Pins) 0.01 0.1 μA
Ripple Rejection (Note 3) VIN = 2.72V (Avg), VRIPPLE = 0.5VP-P, fRIPPLE = 120Hz,
ILOAD = 50mA
55 65 dB
Current Limit VIN = 7V, VOUT = 0V
VIN = 2.3V, ΔVOUT = –5% l110
200 mA
mA
Input Reverse Leakage Current VIN = –20V, VOUT = 0V l1mA
Reverse Output Current (Notes 3,10) VOUT = 1.22V, VIN < 1.22V 5 10 μA
Note 6: Dropout voltage is the minimum input to output voltage differential
needed to maintain regulation at a specifi ed output current. In dropout, the
output voltage will be equal to: VIN – VDROPOUT
.
Note 7: GND pin current is tested with VIN = 2.44V and a current source
load. This means the device is tested while operating in its dropout region
or at the minimum input voltage specifi cation. This is the worst-case GND
pin current. The GND pin current will decrease slightly at higher input
voltages.
Note 8: ADJ1 and ADJ2 pin bias current fl ows into the pin.
Note 9: SHDN1 and SHDN2 pin current fl ows into the pin.
Note 10: Reverse output current is tested with the IN pin grounded and the
OUT pin forced to the rated output voltage. This current fl ows into the OUT
pin and out the GND pin.
Note 11: For the LT3023 dropout voltage will be limited by the minimum
input voltage specifi cation under some output voltage/load conditions.
See the curve of Minimum Input Voltage in the Typical Performance
Characteristics.
LT3023
4
3023fa
OUTPUT CURRENT (mA)
500
450
400
350
300
250
200
150
100
50
0
DROPOUT VOLTAGE (mV)
3023 G01
0 10203040 50 60 70 80 90 100
TJ = 125°C
TJ = 25°C
OUTPUT CURRENT (mA)
500
450
400
350
300
250
200
150
100
50
0
DROPOUT VOLTAGE (mV)
3023 G02
0 10203040 50 60 70 80 90 100
TJ ≤ 125°C
TJ ≤ 25°C
= TEST POINTS
TEMPERATURE (°C)
–50
DROPOUT VOLTAGE (mV)
050 75
3023 G03
–25 25 100 125
IL = 100mA
IL = 50mA
IL = 10mA
IL = 1mA
500
450
400
350
300
250
200
150
100
50
0
TYPICAL PERFORMANCE CHARACTERISTICS
Typical Dropout Voltage Guaranteed Dropout Voltage Dropout Voltage
Quiescent Current ADJ1 or ADJ2 Pin Voltage Quiescent Current
GND Pin Current GND Pin Current vs ILOAD
SHDN1 or SHDN2 Pin Threshold
(On-to-Off)
TEMPERATURE (°C)
–50
QUIESCENT CURRENT (μA)
100
3023 G03
050
40
35
30
25
20
15
10
5
0–25 25 75 125
VIN = 6V
RL = 250k
IL = 5μA
VSHDN = VIN
VSHDN = 0V
TEMPERATURE (°C)
–50
ADJ PIN VOLTAGE (V)
100
3023 G05
050
1.240
1.235
1.230
1.225
1.220
1.215
1.210
1.205
1.200 –25 25 75 125
IL = 1mA
INPUT VOLTAGE (V)
02 6 10 14 18
QUIESCENT CURRENT (μA)
30
25
20
15
10
5
04 8 12 16
3023 G06
20
TJ = 25°C
RL = 250k
IL = 5μA
VSHDN = VIN
VSHDN = 0V
INPUT VOLTAGE (V)
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0
GND PIN CURRENT (mA)
3023 G07
012345678910
TJ = 25°C
*FOR VOUT = 1.22V
RL = 12.2Ω
IL = 100mA*
RL = 24.4Ω
IL = 50mA*
RL = 122Ω
IL = 10mA*
RL = 1.22k
IL = 1mA*
OUTPUT CURRENT (mA)
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0
GND PIN CURRENT (mA)
3023 G08
0 10203040 50 60 70 80 90 100
VIN = VOUT(NOMINAL) + 1V
TEMPERATURE (°C)
–50
SHDN PIN THRESHOLD (V)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0050 75
3023 G09
–25 25 100 125
IL = 1mA
LT3023
5
3023fa
TYPICAL PERFORMANCE CHARACTERISTICS
SHDN1 or SHDN2 Pin Threshold
(Off-to-On)
SHDN1 or SHDN2 Pin Input
Current
SHDN1 or SHDN2 Pin Input
Current
ADJ1 or ADJ2 Pin Bias Current Current Limit Current Limit
Reverse Output Current Reverse Output Current Input Ripple Rejection
TEMPERATURE (°C)
–50
SHDN PIN THRESHOLD (V)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0050 75
3023 G10
–25 25 100 125
IL = 100mA
IL = 1mA
SHDN PIN VOLTAGE (V)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
SHDN PIN INPUT CURRENT (μA)
3023 G11
012345678910
TEMPERATURE (°C)
–50
SHDN PIN INPUT CURRENT (μA)
050 75
3023 G12
–25 25 100 125
VSHDN = 20V
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
TEMPERATURE (°C)
–50
ADJ PIN BIAS CURRENT (nA)
100
90
80
70
60
50
40
30
20
10
0050 75
3023 G13
–25 25 100 125
INPUT VOLTAGE (V)
0
SHORT-CIRCUIT CURRENT (mA)
245
3023 G14
1367
350
300
250
200
150
100
50
0
VOUT = 0V
TJ = 25°C
TEMPERATURE (°C)
–50
CURRENT LIMIT (mA)
050 75
3023 G15
–25 25 100 125
350
300
250
200
150
100
50
0
VIN = 7V
VOUT = 0V
OUTPUT VOLTAGE (V)
100
90
80
70
60
50
40
30
20
10
0
REVERSE OUTPUT CURRENT (μA)
3023 G16
012345678910
TA = 25°C
VIN = 0V
VOUT = VADJ
CURRENT FLOWS
INTO OUTPUT PIN
TEMPERATURE (°C)
–50
REVERSE OUTPUT CURRENT (μA)
18
15
12
9
6
3
025 75
3023 G17
–25 0 50 100 125
VIN = 0V
VOUT = VADJ = 1.22V
FREQUENCY (kHz)
RIPPLE REJECTION (dB)
80
70
60
50
40
30
20
10
0
0.01 1 10 1000
3023 G18
0.1 100
IL = 100mA
VIN = 2.3V + 50mVRMS RIPPLE
CBYP = 0
COUT = 10μF
COUT = 1μF
LT3023
6
3023fa
TYPICAL PERFORMANCE CHARACTERISTICS
Input Ripple Rejection Input Ripple Rejection Channel-to-Channel Isolation
Channel-to-Channel Isolation Minimum Input Voltage Load Regulation
Output Noise Spectral Density Output Noise Spectral Density
RMS Output Noise vs
Bypass Capacitor
FREQUENCY (kHz)
RIPPLE REJECTION (dB)
80
70
60
50
40
30
20
10
0
0.01 1 10 1000
3023 G19
0.1 100
IL = 100mA
VIN = 2.3V + 50mVRMS RIPPLE
COUT = 10μF
CBYP = 0.01μF
CBYP = 1000pF
CBYP = 100pF
TEMPERATURE (°C)
–50
RIPPLE REJECTION (dB)
100
3023 G20
050
80
70
60
50
40
30
20
10
0–25 25 75 125
VIN = VOUT (NOMINAL) +
1V + 0.5VP-P RIPPLE
AT f = 120Hz
IL = 50mA
50μs/DIV
COUT1, COUT2 = 10μF
CBYP1, CBYP2 = 0.01μF
ΔIL1 = 10mA to 100mA
ΔIL2 = 10mA to 100mA
VIN = 6V, VOUT1 = VOUT2 = 5V
VOUT1
20mV/DIV
VOUT2
20mV/DIV
3023 G21a
FREQUENCY (kHz)
CHANNEL-TO-CHANNEL ISOLATION (dB)
100
90
80
70
60
50
40
30
20
10
0
0.01 1 10 1000
3023 G21b
0.1 100
ILOAD = 100mA PER CHANNEL
TEMPERATURE (°C)
–50
MINIMUM INPUT VOLTAGE (V)
2.5
2.0
1.5
1.0
0.5
0050 75
3023 G22
–25 25 100 125
IL = 100mA
IL = 50mA
TEMPERATURE (°C)
–50
LOAD REGULATION (mV)
0
–1
–2
–3
–4
–5
–6
–7
–8
–9
–10 05075
3023 G23
–25 25 100 125
ΔIL = 1mA TO 100mA
FREQUENCY (kHz)
OUTPUT NOISE SPECTRAL DENSITY (μV/√Hz)
0.01 1 10 100
3023 G24
0.1
10
1
0.1
0.01
VOUT SET FOR 5V
VOUT =VADJ
COUT = 10μF
CBYP = 0
IL = 100mA
FREQUENCY (kHz)
OUTPUT NOISE SPECTRAL DENSITY (μV/√Hz)
0.01 1 10 100
3023 G25
0.1
10
1
0.1
0.01
VOUT SET FOR 5V
VOUT =VADJ
COUT = 10μF
IL = 100mA
CBYP = 1000pF
CBYP = 100pF
CBYP = 0.01μF
CBYP (pF)
10
OUTPUT NOISE (μVRMS)
160
140
120
100
80
60
40
20
0100 1k 10k
3023 G26
VOUT SET FOR 5V
VOUT =VADJ
COUT = 10μF
IL = 100mA
f = 10Hz TO 100kHz
LT3023
7
3023fa
TYPICAL PERFORMANCE CHARACTERISTICS
RMS Output Noise vs
Load Current (10Hz to 100kHz)
10Hz to 100kHz Output Noise
CBYP = 0
10Hz to 100kHz Output Noise
CBYP = 100pF
10Hz to 100kHz Output Noise
CBYP = 1000pF
10Hz to 100kHz Output Noise
CBYP = 0.01μF
Transient Response
CBYP = 0
Transient Response
CBYP = 0.01μF
LOAD CURRENT (mA)
0.01
OUTPUT NOISE (μVRMS)
160
140
120
100
80
60
40
20
00.1 1 10010
3023 G27
VOUT SET FOR 5V
VOUT SET FOR 5V
VOUT =VADJ
VOUT =VADJ
COUT = 10μF
C
BYP = 0μF
C
BYP = 0.01μF
TIME (μs)
0.2
0.1
0
–0.1
–0.2
OUTPUT VOLTAGE
DEVIATION (V)
100
50
0
LOAD CURRENT
(mA)
3023 G32
0 400 800 1200 1600 2000
VIN = 6V
CIN = 10μF
COUT = 10μF
VOUT SET FOR 5V OUT
TIME (μs)
0.04
0.02
0
–0.02
–0.04
OUTPUT VOLTAGE
DEVIATION (V)
100
50
0
LOAD CURRENT
(mA)
3023 G33
0 40 60 10020 80 120 140 180160 200
VIN = 6V
CIN = 10μF
COUT = 10μF
VOUT SET FOR 5V OUT
1ms/DIV
COUT = 10μF
IL = 100mA
VOUT SET FOR 5V OUT
VOUT
100μV/DIV
3023 G28 1ms/DIV
COUT = 10μF
IL = 100mA
VOUT SET FOR 5V OUT
VOUT
100μV/DIV
3023 G29
1ms/DIV
COUT = 10μF
IL = 100mA
VOUT SET FOR 5V OUT
VOUT
100μV/DIV
3023 G30 1ms/DIV
COUT = 10μF
IL = 100mA
VOUT SET FOR 5V OUT
VOUT
100μV/DIV
3023 G31
LT3023
8
3023fa
PIN FUNCTIONS
GND (Pin 3): Ground.
ADJ1/ADJ2 (Pins 4/2): Adjust Pin. These are the inputs to
the error amplifi ers. These pins are internally clamped to
±7V. They have a bias current of 30nA which fl ows into the
pin (see curve of ADJ1/ADJ2 Pin Bias Current vs Tempera-
ture in the Typical Performance Characteristics section).
The ADJ1 and ADJ2 pin voltage is 1.22V referenced to
ground and the output voltage range is 1.22V to 20V.
BYP1/BYP2 (Pins 5/1): Bypass. The BYP1/BYP2 pins are
used to bypass the reference of the LT3023 regulator to
achieve low noise performance from the regulator. The
BYP1/BYP2 pins are clamped internally to ±0.6V (one VBE)
from ground. A small capacitor from the corresponding
output to this pin will bypass the reference to lower the
output voltage noise. A maximum value of 0.01μF can
be used for reducing output voltage noise to a typical
20μVRMS over a 10Hz to 100kHz bandwidth. If not used,
this pin must be left unconnected.
OUT1/OUT2 (Pins 6/10): Output. The outputs supply power
to the loads. A minimum output capacitor of 1μF is required
to prevent oscillations. Larger output capacitors will be
required for applications with large transient loads to limit
peak voltage transients. See the Applications Information
section for more information on output capacitance and
reverse output characteristics.
SHDN1/SHDN2 (Pins 7/9): Shutdown. The SHDN1/SHDN2
pins are used to put the corresponding channel of the
LT3023 regulator into a low power shutdown state. The
output will be off when the pin is pulled low. The SHDN1/
SHDN2 pins can be driven either by 5V logic or open-col-
lector logic with pull-up resistors. The pull-up resistors
are required to supply the pull-up current of the open-
collector gates, normally several microamperes, and the
SHDN1/SHDN2 pin current, typically 1μA. If unused, the
pin must be connected to VIN. The device will not function
if the SHDN1/SHDN2 pins are not connected.
IN (Pin 8): Input. Power is supplied to the device through
the IN pin. A bypass capacitor is required on this pin if
the device is more than six inches away from the main
input fi lter capacitor. In general, the output impedance of
a battery rises with frequency, so it is advisable to include
a bypass capacitor in battery-powered circuits. A bypass
capacitor in the range of 1μF to 10μF is suffi cient. The
LT3023 regulator is designed to withstand reverse volt-
ages on the IN pin with respect to ground and the OUT
pin. In the case of a reverse input, which can happen if
a battery is plugged in backwards, the device will act as
if there is a diode in series with its input. There will be
no reverse current fl ow into the regulator and no reverse
voltage will appear at the load. The device will protect both
itself and the load.
Exposed Pad (Pin 11): Ground. This pin must be soldered
to the PCB and electrically connected to ground.
LT3023
9
3023fa
The LT3023 is a dual 100mA low dropout regulator with
micropower quiescent current and shutdown. The device
is capable of supplying 100mA per channel at a dropout
voltage of 300mV. Output voltage noise can be lowered
to 20μVRMS over a 10Hz to 100kHz bandwidth with the
addition of a 0.01μF reference bypass capacitor. Addition-
ally, the reference bypass capacitor will improve transient
response of the regulator, lowering the settling time for
transient load conditions. The low operating quiescent
current (20μA per channel) drops to less than 1μA in
shutdown. In addition to the low quiescent current, the
LT3023 regulator incorporates several protection features
which make it ideal for use in battery-powered systems.
The device is protected against both reverse input and
reverse output voltages. In battery backup applications
where the output can be held up by a backup battery when
the input is pulled to ground, the LT3023 acts like it has a
diode in series with its output and prevents reverse current
ow. Additionally, in dual supply applications where the
regulator load isreturned to a negative supply, the output
can be pulled below ground by as much as 20V and still
allow the device to start and operate.
Adjustable Operation
The LT3023 has an output voltage range of 1.22V to 20V.
The output voltage is set by the ratio of two external resis-
tors as shown in Figure 1. The device servos the output
to maintain the corresponding ADJ1/ADJ2 pin voltage
at 1.22V referenced to ground. The current in R1 is then
equal to 1.22V/R1 and the current in R2 is the current in
R1 plus the ADJ1/ADJ2 pin bias current. The ADJ1/ADJ2
pin bias current, 30nA at 25°C, fl ows through R2 into the
ADJ1/ADJ2 pin. The output voltage can be calculated us-
ing the formula in Figure 1. The value of R1 should be no
greater than 250k to minimize errors in the output voltage
caused by the ADJ1/ADJ2 pin bias current. Note that in
shutdown the output is turned off and the divider current will
be zero. Curves of ADJ1/ADJ2 Pin Voltage vs Temperature
and ADJ1/ADJ2 Pin Bias Current vs Temperature appear
in the Typical Performance Characteristics.
The device is tested and specifi ed with the ADJ1/ADJ2
pin tied to the corresponding OUT1/OUT2 pin for an out-
put voltage of 1.22V. Specifi cations for output voltages
greater than 1.22V will be proportional to the ratio of the
desired output voltage to 1.22V: VOUT/1.22V. For example,
load regulation for an output current change of 1mA to
100mA is –1mV typical at VOUT = 1.22V. At VOUT = 12V,
load regulation is:
(12V/1.22V)(–1mV) = –9.8mV
Bypass Capacitance and Low Noise Performance
The LT3023 regulator may be used with the addition of a
bypass capacitor from VOUT to the corresponding BYP1/
BYP2 pin to lower output voltage noise. A good quality
low leakage capacitor is recommended. This capacitor
will bypass the reference of the regulator, providing a
low frequency noise pole. The noise pole provided by this
bypass capacitor will lower the output voltage noise to
as low as 20μVRMS with the addition of a 0.01μF bypass
capacitor. Using a bypass capacitor has the added benefi t
of improving transient response. With no bypass capacitor
and a 10μF output capacitor, a 10mA to 100mA load step
will settle to within 1% of its fi nal value in less than 100μs.
With the addition of a 0.01μF bypass capacitor, the output
will stay within 1% for a 10mA to 100mA load step (see
Transient Reponse in Typical Performance Characteristics
section). However, regulator start-up time is proportional
to the size of the bypass capacitor, slowing to 15ms with
a 0.01μF bypass capacitor and 10μF output capacitor.
Figure 1. Adjustable Operation
IN
3023 F01
R2
LT3023
OUT1/OUT2
VIN
VOUT
ADJ1/ADJ2
GND R1
+VV
R
RIR
VV
InA
OUT ADJ
ADJ
ADJ
=+
+
()()
=
122 1 2
12
122
30
.
.
AT 25 C
OUTPUT RANGE = 1.22V TO 20V
APPLICATIONS INFORMATION
LT3023
10
3023fa
APPLICATIONS INFORMATION
Output Capacitance and Transient Response
The LT3023 regulator is designed to be stable with a
wide range of output capacitors. The ESR of the out-
put capacitor affects stability, most notably with small
capacitors. A minimum output capacitor of 1μF with an
ESR of 3Ω or less is recommended to prevent oscilla-
tions. The LT3023 is a micropower device and output
transient response will be a function of output capacitance.
Larger values of output capacitance decrease the peak
deviations and provide improved transient response for
larger load current changes. Bypass capacitors, used to
decouple individual components powered by the LT3023,
will increase the effective output capacitor value. With
larger capacitors used to bypass the reference (for low
noise operation), larger values of output capacitors are
needed. For 100pF of bypass capacitance, 2.2μF of output
capacitor is recommended. With a 330pF bypass capacitor
or larger, a 3.3μF output capacitor is recommended. The
shaded region of Figure 2 defi nes the region over which
the LT3023 regulator is stable. The minimum ESR needed
is defi ned by the amount of bypass capacitance used, while
the maximum ESR is 3Ω.
Extra consideration must be given to the use of ceramic
capacitors. Ceramic capacitors are manufactured with a
variety of dielectrics, each with different behavior across
temperature and applied voltage. The most common
dielectrics used are specifi ed with EIA temperature char-
acteristic codes of Z5U, Y5V, X5R and X7R. The Z5U and
Y5V dielectrics are good for providing high capacitances
in a small package, but they tend to have strong voltage
and temperature coeffi cients as shown in Figures 3 and 4.
When used with a 5V regulator, a 16V 10μF Y5V capacitor
can exhibit an effective value as low as 1μF to 2μF for the
DC bias voltage applied and over the operating tempera-
ture range. The X5R and X7R dielectrics result in more
stable characteristics and are more suitable for use as the
output capacitor. The X7R type has better stability across
temperature, while the X5R is less expensive and is avail-
able in higher values. Care still must be exercised when
using X5R and X7R capacitors; the X5R and X7R codes
only specify operating temperature range and maximum
capacitance change over temperature. Capacitance change
due to DC bias with X5R and X7R capacitors is better than
Y5V and Z5U capacitors, but can still be signifi cant enough
to drop capacitor values below appropriate levels. Capaci-
tor DC bias characteristics tend to improve as component
Figure 2. Stability Figure 4. Ceramic Capacitor Temperature Characteristics
Figure 3. Ceramic Capacitor DC Bias Characteristics
OUTPUT CAPACITANCE (μF)
1
ESR (Ω)
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0310
3023 F02
245
678
9
STABLE REGION
CBYP = 330pF
CBYP = 100pF
CBYP = 0
CBYP > 3300pF
DC BIAS VOLTAGE (V)
CHANGE IN VALUE (%)
3023 F03
20
0
–20
–40
–60
–80
–100 04810
26 12 14
X5R
Y5V
16
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10μF
TEMPERATURE (°C)
–50
40
20
0
–20
–40
–60
–80
–100 25 75
3023 F04
–25 0 50 100 125
Y5V
CHANGE IN VALUE (%)
X5R
BOTH CAPACITORS ARE 16V,
1210 CASE SIZE, 10μF
LT3023
11
3023fa
APPLICATIONS INFORMATION
case size increases, but expected capacitance at operating
voltage should be verifi ed.
Voltage and temperature coeffi cients are not the only
sources of problems. Some ceramic capacitors have a
piezoelectric response. A piezoelectric device generates
voltage across its terminals due to mechanical stress,
similar to the way a piezoelectric accelerometer or micro-
phone works. For a ceramic capacitor the stress can be
induced by vibrations in the system or thermal transients.
The resulting voltages produced can cause appreciable
amounts of noise, especially when a ceramic capacitor is
used for noise bypassing. A ceramic capacitor produced
Figure 5’s trace in response to light tapping from a pencil.
Similar vibration induced behavior can masquerade as
increased output voltage noise.
Thermal Considerations
The power handling capability of the device will be limited
by the maximum rated junction temperature (125°C). The
power dissipated by the device will be made up of two
components (for each channel):
1. Output current multiplied by the input/output voltage
differential: (IOUT)(VIN – VOUT), and
2. GND pin current multiplied by the input voltage:
(IGND)(VIN).
The ground pin current can be found by examining the
GND Pin Current curves in the Typical Performance
Figure 5. Noise Resulting from Tapping on a Ceramic Capacitor
Characteristics section. Power dissipation will be equal
to the sum of the two components listed above. Power
dissipation from both channels must be considered during
thermal analysis.
The LT3023 regulator has internal thermal limiting de-
signed to protect the device during overload conditions.
For continuous normal conditions, the maximum junction
temperature rating of 125°C must not be exceeded. It is
important to give careful consideration to all sources of
thermal resistance from junction to ambient. Additional
heat sources mounted nearby must also be considered.
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat gener-
ated by power devices.
The following tables list thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 3/32" FR-4 board with one ounce
copper.
Table 1. MSE Package, 10-Lead MSOP
COPPER AREA
BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)TOPSIDE* BACKSIDE
2500mm22500mm22500mm240°C/W
1000mm22500mm22500mm245°C/W
225mm22500mm22500mm250°C/W
100mm22500mm22500mm262°C/W
*Device is mounted on topside.
Table 2. DD Package, 10-Lead DFN
COPPER AREA
BOARD AREA
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)TOPSIDE* BACKSIDE
2500mm22500mm22500mm240°C/W
1000mm22500mm22500mm245°C/W
225mm22500mm22500mm250°C/W
100mm22500mm22500mm262°C/W
*Device is mounted on topside.
The thermal resistance juncton-to-case (θJC), measured
at the Exposed Pad on the back of the die is 10°C/W.
100ms/DIV
VOUT
500μV/DIV
3023 F05
COUT = 10μF
CBYP = 0.01μF
ILOAD = 100mA
LT3023
12
3023fa
APPLICATIONS INFORMATION
Calculating Junction Temperature
Example: Given an output voltage on the fi rst channel of
3.3V, an output voltage of 2.5V on the second channel, an
input voltage range of 4V to 6V, output current ranges of
0mA to 100mA for the fi rst channel and 0mA to 50mA for the
second channel, with a maximum ambient temperature of
50°C, what will the maximum junction temperature be?
The power dissipated by each channel of the device will
be equal to:
I
OUT(MAX)(VIN(MAX) – VOUT) + IGND(VIN(MAX))
where (for the fi rst channel):
I
OUT(MAX) = 100mA
VIN(MAX) = 6V
IGND at (IOUT = 100mA, VIN = 6V) = 2mA
so:
P1 = 100mA(6V – 3.3V) + 2mA(6V) = 0.28W
and (for the second channel):
I
OUT(MAX) = 50mA
VIN(MAX) = 6V
IGND at (IOUT = 50mA, VIN = 6V) = 1mA
so:
P2 = 50mA(6V – 2.5V) + 1mA(6V) = 0.18W
The thermal resistance will be in the range of 40°C/W to
60°C/W depending on the copper area. So the junction
temperature rise above ambient will be approximately
equal to:
(0.28W + 018W)(60°C/W) = 27.8°C
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
T
JMAX = 50°C + 27.8°C = 77.8°C
Protection Features
The LT3023 regulator incorporates several protection
features which makes it ideal for use in battery-powered
circuits. In addition to the normal protection features
associated with monolithic regulators, such as current
limiting and thermal limiting, the devices are protected
against reverse input voltages, reverse output voltages
and reverse voltages from output to input.
Current limit protection and thermal overload protection
are intended to protect the device against current overload
conditions at the output of the device. For normal operation,
the junction temperature should not exceed 125°C.
The input of the device will withstand reverse voltages
of 20V. Current fl ow into the device will be limited to less
than 1mA (typically less than 100μA) and no negative
voltage will appear at the output. The device will protect
both itself and the load. This provides protection against
batteries which can be plugged in backward.
The output of the LT3023 can be pulled below ground
without damaging the device. If the input is left open circuit
or grounded, the output can be pulled below ground by
20V. The output will act like an open circuit; no current will
ow out of the pin. If the input is powered by a voltage
source, the output will source the short-circuit current of
the device and will protect itself by thermal limiting. In
this case, grounding the SHDN1/SHDN2 pins will turn off
the device and stop the output from sourcing the short-
circuit current.
The ADJ1 and ADJ2 pins can be pulled above or below
ground by as much as 7V without damaging the device.
If the input is left open circuit or grounded, the ADJ1 and
ADJ2 pins will act like an open circuit when pulled below
ground and like a large resistor (typically 100k) in series
with a diode when pulled above ground.
In situations where the ADJ1 and ADJ2 pins are connected
to a resistor divider that would pull the pins above their 7V
clamp voltage if the output is pulled high, the ADJ1/ADJ2
pin input current must be limited to less than 5mA. For
example, a resistor divider is used to provide a regulated
1.5V output from the 1.22V reference when the output
is forced to 20V. The top resistor of the resistor divider
must be chosen to limit the current into the ADJ pin to
less than 5mA when the ADJ1/ADJ2 pin is at 7V. The 13V
difference between output and ADJ1/ADJ2 pin divided by
the 5mA maximum current into the ADJ1/ADJ2 pin yields
a minimum top resistor value of 2.6k.
LT3023
13
3023fa
CBYP (pF)
10
0.1
STARTUP TIME (ms)
1
10
100
100 1000 10000
3023 TA02c
VSHDN1/SHDN2
1V/DIV
VOUT1
1V/DIV
VOUT2
1V/DIV
2ms/DIV 3023 TA02b
OUT1
BYP1
ADJ1
OUT2
BYP2
ADJ2
IN
SHDN1
SHDN2
LT3023
1μF
VIN
3.7V TO 20V
OFF ON
0.01μF
0.01μF
422k
261k
249k
249k
10μF
10μF
3023 TA02a
3.3V
AT 100mA
2.5V
AT 100mA
GND
TYPICAL APPLICATIONS
APPLICATIONS INFORMATION
In circuits where a backup battery is required, several
different input/output conditions can occur. The output
voltage may be held up while the input is either pulled
to ground, pulled to some intermediate voltage or is left
open circuit. Current fl ow back into the output will follow
the curve shown in Figure 6.
When the IN pin of the LT3023 is forced below the OUT1
or OUT2 pins or the OUT1/OUT2 pins are pulled above the
IN pin, input current will typically drop to less than 2μA.
This can happen if the input of the device is connected
to a discharged (low voltage) battery and the output is
held up by either a backup battery or a second regulator
circuit. The state of the SHDN1/SHDN2 pins will have no
effect on the reverse output current when the output is
pulled above the input.
Figure 6. Reverse Output Current
Noise Bypassing Slows Startup, Allows Outputs to Track
Startup Time
OUTPUT VOLTAGE (V)
100
90
80
760
60
50
40
30
20
10
0
REVERSE OUTPUT CURRENT (μA)
3023 F06
012345678910
TA = 25°C
VIN = 0V
VOUT = VADJ
CURRENT FLOWS
INTO OUTPUT PIN
LT3023
14
3023fa
PACKAGE DESCRIPTION
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
15
106
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1103
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
LT3023
15
3023fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
MSE Package
10-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev B)
MSOP (MSE) 0307 REV B
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
12345
4.90 ± 0.152
(.193 ± .006)
0.497 ± 0.076
(.0196 ± .003)
REF
8910
10
1
76
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010) 0° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ± 0.038
(.0120 ± .0015)
TYP
2.083 ± 0.102
(.082 ± .004)
2.794 ± 0.102
(.110 ± .004)
0.50
(.0197)
BSC
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.83 ± 0.102
(.072 ± .004)
2.06 ± 0.102
(.081 ± .004)
0.1016 ± 0.0508
(.004 ± .002)
LT3023
16
3023fa
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507 www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2003
LT 0208 REV A • PRINTED IN USA
VSHDN1
1V/DIV
VOUT1
1V/DIV
VOUT2
1V/DIV
2ms/DIV 3023 TA03c
OUT1
BYP1
ADJ1
OUT2
BYP2
ADJ2
IN
SHDN1
SHDN2
LT3023
F
VIN
3.7V TO 20V
OFF ON
0.01μF
0.01μF
422k
261k
249k
249k
35.7k
28k
10μF
10μF
3023 TA03a
3.3V
AT
100mA
2.5V
AT
100mA
GND
0.47μF
RELATED PARTS
TYPICAL APPLICATION
VSHDN1
1V/DIV
VOUT1
1V/DIV
VOUT2
1V/DIV
2ms/DIV 3023 TA03b
Startup Sequencing
Turn-On Waveforms
Turn-Off Waveforms
PART NUMBER DESCRIPTION COMMENTS
LT1129 700mA, Micropower, LDO VIN: 4.2V to 30V, VOUT(MIN) = 3.75V, IQ = 50μA, ISD = 16μA, DD, SOT-223, S8,TO220,
TSSOP20 Packages
LT1175 500mA, Micropower Negative LDO Guaranteed Voltage Tolerance and Line/Load Regulation, VIN: –20V to –4.3V,
VOUT(MIN) = –3.8V, IQ = 45μA, ISD = 10μA, DD,SOT-223, S8 Packages
LT1185 3A, Negative LDO Accurate Programmable Current Limit, Remote Sense, VIN: –35V to –4.2V, VOUT(MIN)
= –2.40V, IQ = 2.5mA, ISD <1μA, TO220-5 Package
LT1761 100mA, Low Noise Micropower, LDO Low Noise < 20μVRMS, Stable with 1μF Ceramic Capacitors, VIN: 1.8V to 20V,
VOUT(MIN) = 1.22V, IQ = 20μA, ISD <1μA, ThinSOT Package
LT1762 150mA, Low Noise Micropower, LDO Low Noise < 20μVRMS, VIN: 1.8V to 20V, VOUT(MIN) = 1.22V, IQ = 25μA, ISD <1μA,
MS8 Package
LT1763 500mA, Low Noise Micropower, LDO Low Noise < 20μVRMS, VIN: 1.8V to 20V, VOUT(MIN) = 1.22V, IQ = 30μA, ISD <1μA,
S8 Package
LT1764/LT1764A 3A, Low Noise, Fast Transient Response, LDO Low Noise < 40μVRMS, "A" Version Stable with Ceramic Capacitors, VIN: 2.7V to 20V,
VOUT(MIN) = 1.21V, IQ = 1mA, ISD <1μA, DD, TO220 Packages
LTC1844 150mA, Very Low Drop-Out LDO Low Noise < 30μVRMS, Stable with 1μF Ceramic Capacitors, VIN: 1.6V to 6.5V,
VOUT(MIN) = 1.25V, IQ = 40μA, ISD <1μA, ThinSOT Package
LT1962 300mA, Low Noise Micropower, LDO Low Noise < 20μVRMS, VIN: 1.8V to 20V, VOUT(MIN) = 1.22V, IQ = 30μA, ISD <1μA,
MS8 Package
LT1963/LT1963A 1.5A, Low Noise, Fast Transient Response, LDO Low Noise < 40μVRMS, "A" Version Stable with Ceramic Capacitors, VIN: 2.1V to 20V,
VOUT(MIN) = 1.21V, IQ = 1mA, ISD <1μA, DD, TO220, SOT-223, S8 Packages
LT1964 200mA, Low Noise Micropower, Negative LDO Low Noise < 30μVRMS, Stable with Ceramic Capacitors, VIN: –0.9V to –20V,
VOUT(MIN) = –1.21V, IQ = 30μA, ISD = 3μA, ThinSOT Package
LTC3407 Dual 600mA. 1.5MHz Synchronous Step Down
DC/DC Converter
VIN: 2.5V to 5.5V, VOUT(MIN) = 0.6 V, IQ = 40μA, ISD <1μA, MSE Package