FEATURES
●BALANCED OUTPUT
●LOW DISTORTION: 0.0005% at f = 1kHz
●WIDE OUTPUT SWING: 17Vrms into 600Ω
●HIGH CAPACITIVE LOAD DRIVE
●HIGH SLEW RATE: 15V/µs
●WIDE SUPPLY RANGE: ±4.5V to ±18V
●LOW QUIESCENT CURRENT: ±5.2mA
●8-PIN DIP, SO-8, AND SOL-16 PACKAGES
●COMPANION TO AUDIO DIFFERENTIAL
LINE RECEIVERS: INA134 and INA137
●IMPROVED REPLACEMENT FOR SSM2142
APPLICATIONS
●AUDIO DIFFERENTIAL LINE DRIVERS
●AUDIO MIX CONSOLES
●DISTRIBUTION AMPLIFIERS
●GRAPHIC/PARAMETRIC EQUALIZERS
●DYNAMIC RANGE PROCESSORS
●DIGITAL EFFECTS PROCESSORS
●TELECOM SYSTEMS
●HI-FI EQUIPMENT
●INDUSTRIAL INSTRUMENTATION
DESCRIPTION
The DRV134 and DRV135 are differential output ampli-
fiers that convert a single-ended input to a balanced
output pair. These balanced audio drivers consist of
high performance op amps with on-chip precision resis-
tors. They are fully specified for high performance audio
applications and have excellent ac specifications, in-
cluding low distortion (0.0005% at 1kHz) and high slew
rate (15V/µs).
The on-chip resistors are laser-trimmed for accurate gain
and optimum output common-mode rejection. Wide output
voltage swing and high output drive capability allow use in
a wide variety of demanding applications. They easily drive
the large capacitive loads associated with long audio
cables. Used in combination with the INA134 or INA137
differential receivers, they offer a complete solution for
transmitting analog audio signals without degradation.
The DRV134 is available in 8-pin DIP and SOL-16 sur-
face-mount packages. The DRV135 comes in a space-
saving SO-8 surface-mount package. Both are specified
for operation over the extended industrial temperature
range, –40°C to +85°C and operate from –55°C to +125°C.
DRV134
DRV135
AUDIO BALANCED LINE DRIVERS
DRV134
DRV135
DRV134
V
IN
Gnd
+V
O
A2
10kΩ
50Ω
50Ω
All resistors 30kΩ unless otherwise indicated.
V+
+Sense
–Sense
–V
O
V–
A3
A1
10kΩ
SBOS094A – JANUARY 1998 – REVISED APRIL 2007
www.ti.com
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 1998-2007, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
DRV134, DRV135
2SBOS094A
www.ti.com
SPECIFICATIONS: VS = ±18V
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
DRV134PA, UA
DRV135UA
PARAMETER CONDITIONS MIN TYP MAX UNITS
AUDIO PERFORMANCE
Total Harmonic Distortion + Noise THD+N f = 20Hz to 20kHz,VO = 10Vrms 0.001 %
f = 1kHz, VO = 10Vrms 0.0005 %
Noise Floor, RTO(1) 20kHz BW –98 dBu
Headroom, RTO(1) THD+N < 1% +27 dBu
INPUT
Input Impedance(2) ZIN 10 kΩ
Input Current IIN VIN = ±7.07V ±700 ±1000 µA
GAIN [(+VO) – (–VO)]/VIN
Differential VIN = ±10V
Initial 5.8 6 dB
Error ±0.1 ±2%
vs Temperature ±10 ppm/°C
Single-Ended VIN = ±5V
Initial 5.8 6 dB
Error ±0.7 ±2%
vs Temperature ±10 ppm/°C
Nonlinearity 0.0003 % of FS
OUTPUT
Common-Mode Rejection, f = 1kHz OCMR See OCMR Test Circuit, Figure 4 46 68 dB
Signal Balance Ratio, f = 1kHz SBR See SBR Test Circuit, Figure 5 35 54 dB
Output Offset Voltage
Offset Voltage, Common-Mode VOCM(3) VIN = 0 ±50 ±250 mV
vs Temperature ±150 µV/°C
Offset Voltage, Differential VOD(4) VIN = 0 ±1±10 mV
vs Temperature ±5µV/°C
vs Power Supply PSRR VS = ±4.5V to ±18V 80 110 dB
Output Voltage Swing, Positive No Load(5) (V+) – 3 (V+) – 2.5 V
Negative No Load(5) (V–) + 2 (V–) + 1.5 V
Impedance 50 Ω
Load Capacitance, Stable Operation CLCL Tied to Ground (each output) 1 µF
Short-Circuit Current ISC ±85 mA
FREQUENCY RESPONSE
Small-Signal Bandwidth 1.5 MHz
Slew Rate SR 15 V/µs
Settling Time: 0.01% VOUT = 10V Step 2.5 µs
Overload Recovery Output Overdriven 10% 3 µs
POWER SUPPLY
Rated Voltage VS±18 V
Voltage Range ±4.5 ±18 V
Quiescent Current IQIO = 0 ±5.2 ±5.5 mA
TEMPERATURE RANGE
Specification Range –40 +85 °C
Operation Range –55 +125 °C
Storage Range –55 +125 °C
Thermal Resistance
θ
JA
8-Pin DIP 100 °C/W
SO-8 Surface Mount 150 °C/W
SOL-16 Surface Mount 80 °C/W
NOTES: (1) dBu = 20log (Vr ms/ 0.7746); RTO = Referred-to-Output.
(2) Resistors are ratio matched but have ±20% absolute value.
(3) VOCM = [(+VO) + (–VO)] /2. (4) VOD = (+VO) – (–VO). (5) Ensures linear operation. Includes common-mode offset.
DRV134, DRV135 3
SBOS094A www.ti.com
PIN CONFIGURATIONS
Top View 8-Pin DIP/SO-8 Top View SOL-16
Supply Voltage, V+ to V–.................................................................... 40V
Input Voltage Range.................................................................... V– to V+
Output Short-Circuit (to ground).............................................. Continuous
Operating Temperature ..................................................–55°C to +125°C
Storage Temperature .....................................................–55°C to +125°C
Junction Temperature.................................................................... +150°C
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may affect
device reliability.
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to ob-
serve proper handling and installation procedures can
cause damage.
ESD damage can range from subtle performance deg-
radation to complete device failure. Precision integrated
circuits may be more susceptible to damage because
very small parametric changes could cause the device
not to meet its published specifications.
SPECIFIED
PACKAGE TEMPERATURE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE NUMBER MEDIA, QUANTITY
DRV134PA DIP-8 P –40°C to +85°C DRV134PA Rails, 50
DRV134UA SOL-16 Surface Mount DW –40°C to +85°C DRV134UA Rails, 48
" " " " DRV134UA/1K Tape and Reel. 1000
DRV135UA SO-8 Surface Mount D –40°C to +85°C DRV135UA Rails, 100
" " " " DRV135UA/2K5 Tape and Reel, 2500
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI wwebsite at www.ti.com.
PACKAGE/ORDERING INFORMATION(1)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
NC
NC
+V
O
+Sense
V+
V–
NC
NC
NC
NC
–V
O
–Sense
Gnd
V
IN
NC
NC
1
2
3
4
8
7
6
5
+V
O
+Sense
V+
V–
–V
O
–Sense
Gnd
V
IN
DRV134, DRV135
4SBOS094A
www.ti.com
TYPICAL PERFORMANCE CURVES
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
Frequency (Hz)
THD+N (%)
20 100 1k 10k 20k
C
0.01
0.001
0.0001
See Figure 3 for Test Circuit
A: R
1
= R
2
= R
L
= ∞ (no load)
B: R
1
= R
2
= 600Ω, R
L
= ∞
C: R
1
= R
2
= ∞, R
L
= 600Ω
Differential Mode
V
O
= 10Vrms
No Cable
DRV134 Output
A
B
TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
Frequency (Hz)
THD+N (%)
20 100 1k 10k 20k
0.01
0.001
0.0001
C
See Figure 3 for Test Circuit
A: R
1
= R
2
= R
L
= ∞ (no load)
B: R
1
= R
2
= 600Ω, R
L
= ∞
C: R
1
= R
2
= ∞, R
L
= 600Ω
Differential Mode
V
O
= 10Vrms
500 ft cable
DRV134 Output
BA
HEADROOM—TOTAL HARMONIC DISTORTION+NOISE
vs OUTPUT AMPLITUDE
Output Amplitude (dBu)
THD+N (%)
5101520 3025
1
0.1
0.01
0.001
0.0001
No Cable
R
L
= ∞
500 ft Cable
R
L
= 600Ω
Single-Ended
Mode
f = 1kHz
DRV134 Output
Differential
Mode
500 ft Cable
R
L
= 600Ω
TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
Frequency (Hz)
THD+N (%)
20 100 1k 10k 20k
0.1
0.01
0.001
0.0001
–V
O
or +V
O
Grounded
A: R
1
= 600Ω (250 ft cable)
B: R
1
= ∞ (no cable)
Single-Ended Mode
V
O
= 10Vrms
DRV134 Output
B
A
DIM INTERMODULATION DISTORTION
vs OUTPUT AMPLITUDE
Output Amplitude (dBu)
DIM (%)
5101520 3025
1
0.1
0.01
0.001
0.0001
Differential Mode
No Cable
RL = ∞
500 ft Cable
RL = 600Ω
BW = 30kHz
SYSTEM TOTAL HARMONIC DISTORTION+NOISE
vs FREQUENCY
Frequency (Hz)
THD+N (%)
20 100 1k 10k 20k
0.01
0.001
0.0001
Differential Mode
VO = 10Vrms
See Figure 3 for Test Circuit
A: R1 = R2 = RL = ∞ (no load)
B: R1 = R2 = ∞ RL = 600Ω
INA137 Output
A (no cable)
B (500ft cable)
DRV134, DRV135 5
SBOS094A www.ti.com
TYPICAL PERFORMANCE CURVES (Cont.)
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
POWER SUPPLY REJECTION vs FREQUENCY
Frequency (Hz)
Power Supply Rejection (dB)
10 100 1k 1M100k10k
120
100
80
60
40
20
0
+PSRR
–PSRR
VS = ±4.5V to ±18V
MAXIMUM OUTPUT VOLTAGE SWING
vs FREQUENCY
Frequency (Hz)
Output Voltage Swing (Vrms)
10k 20k 100k80k50k
20
16
12
8
4
0
0.1% Distortion
0.01% Distortion
R
L
= 600Ω
Diff Mode
OUTPUT VOLTAGE NOISE SPECTRAL DENSITY
vs FREQUENCY
Frequency (Hz)
Voltage Noise (nV/√Hz)
1 10 100 1k 10k 100k 1M
10k
1k
100
10
OUTPUT VOLTAGE NOISE
vs NOISE BANDWIDTH
Frequency (Hz)
Voltage Noise (µVrms)
1 10 100 1k 10k 100k
100
10
1
0.1
GAIN vs FREQUENCY
Frequency (Hz)
Voltage Gain (dB)
1k 10k 100k 10M1M
10
5
0
–5
–10
HARMONIC DISTORTION PRODUCTS
vs FREQUENCY
Frequency (Hz)
Amplitude (% of Fundamental)
20 100 1k 20k10k
0.01
0.001
0.0001
0.00001
Differential Mode
2nd Harmonic
3rd Harmonic
No Cable, R
L
= ∞
500 ft Cable,
R
L
= 600Ω
DRV134, DRV135
6SBOS094A
www.ti.com
TYPICAL PERFORMANCE CURVES (Cont.)
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
OUTPUT VOLTAGE SWING
vs OUTPUT CURRENT
Output Current (mA)
Output Voltage Swing (V)
0±20 ±40 ±60 ±80 ±100
18
16
14
12
10
8
–8
–10
–12
–14
–16
–18
–55°C
+25°C
+125°C
+125°C+25°C–55°C
SHORT-CIRCUIT CURRENT vs TEMPERATURE
Temperature (°C)
Short-Circuit Current (mA)
–75 –50 –25 0 25 50 75 125100
±120
±100
±80
±60
±40
±20
+ISC
–ISC
DIFFERENTIAL OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
Percent of Units (%)
Differential Offset Voltage (mV)
–10
–9
–8
–7
–6
–5
–4
–3
–2
–1
0
1
2
3
4
5
6
7
8
9
10
45
40
35
30
25
20
15
10
5
0
Typical production
distribution of packaged
units. All package types
included.
COMMON-MODE OFFSET VOLTAGE
PRODUCTION DISTRIBUTION
Percent of Units (%)
Common-Mode Offset Voltage (mV)
–250
–225
–200
–175
–150
–125
–100
–75
–50
–25
0
25
50
75
100
125
150
175
200
225
250
35
30
25
20
15
10
5
0
Typical production
distribution of packaged
units. All package types
included.
OUTPUT VOLTAGE SWING
vs SUPPLY VOLTAGE
Supply Voltage (V)
Differential Output Voltage (Vrms)
±4±6
THD+N ≤ 0.1%
±8±10 ±12 ±14 ±16 ±18
20
16
12
8
4
0
THD+N ≤ 0.1%
QUIESCENT CURRENT
vs SUPPLY VOLTAGE
Supply Voltage (V)
Quiescent Current (mA)
±4±18±16±14±12±10±8±6
±5.6
±5.4
±5.2
±5
±4.8
±4.6
T = –55°C
T = +25°C
T = +125°C
DRV134, DRV135 7
SBOS094A www.ti.com
TYPICAL PERFORMANCE CURVES (Cont.)
At TA = +25°C, VS = ±18V, RL = 600Ω differential connected between +VO and –VO, unless otherwise noted.
SMALL-SIGNAL STEP RESPONSE
CL = 100pF
2µs/div
50mV/div
SMALL-SIGNAL STEP RESPONSE
CL = 1000pF
2µs/div
50mV/div
LARGE-SIGNAL STEP RESPONSE
CL = 100pF
2µs/div
5V/div
LARGE-SIGNAL STEP RESPONSE
CL = 1000pF
2µs/div
5V/div
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
Load Capacitance (pF)
Overshoot (%)
10 1k100 10k
40
30
20
10
0
100mV Step
DRV134, DRV135
8SBOS094A
www.ti.com
APPLICATIONS INFORMATION
The DRV134 (and DRV135 in SO-8 package) converts a
single-ended, ground-referenced input to a floating differ-
ential output with +6dB gain (G = 2). Figure 1 shows the
basic connections required for operation. Decoupling ca-
pacitors placed close to the device pins are strongly recom-
mended in applications with noisy or high impedance power
supplies.
The DRV134 consists of an input inverter driving a cross-
coupled differential output stage with 50Ω series output
resistors. Characterized by low differential-mode output
impedance (50Ω) and high common-mode output imped-
ance (1.6kΩ), the DRV134 is ideal for audio applications.
Normally, +VO is connected to +Sense, –VO is connected to
–Sense, and the outputs are taken from these junctions as
shown in Figure 1. For applications with large dc cable
offset errors, a 10µF electrolytic nonpolarized blocking
capacitor at each sense pin is recommended as shown in
Figure 2.
FIGURE 1. Basic Connections.
FIGURE 2. Complete Audio Driver/Receiver Circuit.
VIN
Gnd
+VO
A2
10kΩ
50Ω
50Ω
All resistors 30kΩ unless otherwise indicated.
SOL-16 pin numbers in parentheses.
+Sense
–Sense
–VO
G = +6dB
V+
(12)6
A3
A1
10kΩ
1µF
V–
DRV134
DRV135
5 (11)
1µF
4
(6)
3
(5)
8
(14)
7
(13)
2
(4)
1
(3)
VIN
Gnd
A2
10kΩ
50Ω
50Ω
All resistors 30kΩ unless otherwise indicated.
Pin numbers shown for DIP and SO-8 versions.
NOTE: (1) Optional 10µF electrolytic (nonpolarized) capacitors reduce common-mode offset errors.
INA134 (G = 1): VO = 2VIN
INA137 (G = 1/2): VO = VIN
A3
A1
10kΩ
DRV134
DRV135
4
3
8
+VO
–VO+VO
–VO
7
2
1INA134, INA137
RECEIVER
DRIVER
BALANCED
CABLE PAIR
VO
5
6
1
2
3
10µF(1)
10µF(1)
DRV134, DRV135 9
SBOS094A www.ti.com
Excellent internal design and layout techniques provide low
signal distortion, high output level (+27dBu), and a low
noise floor (–98dBu). Laser trimming of thin film resistors
assures excellent output common-mode rejection (OCMR)
and signal balance ratio (SBR). In addition, low dc voltage
offset reduces errors and minimizes load currents.
For best system performance, it is recommended that a high
input-impedance difference amplifier be used as the re-
ceiver. Used with the INA134 (G = 0dB) or the INA137 (G
= ±6dB) differential line receivers, the DRV134 forms a
complete solution for driving and receiving audio signals,
replacing input and output coupling transformers commonly
used in professional audio systems (Figure 2). When used
with the INA137 (G = –6dB) overall system gain is unity.
AUDIO PERFORMANCE
The DRV134 was designed for enhanced ac performance.
Very low distortion, low noise, and wide bandwidth provide
superior performance in high quality audio applications.
Laser-trimmed matched resistors provide optimum output
common-mode rejection (typically 68dB), especially when
compared to circuits implemented with op amps and discrete
precision resistors. In addition, high slew rate (15V/µs) and
fast settling time (2.5µs to 0.01%) ensure excellent dynamic
response.
The DRV134 has excellent distortion characteristics. As
shown in the distortion data provided in the typical perfor-
mance curves, THD+Noise is below 0.003% throughout the
audio frequency range under various output conditions. Both
differential and single-ended modes of operation are shown.
In addition, the optional 10µF blocking capacitors used to
minimize VOCM errors have virtually no effect on perfor-
mance. Measurements were taken with an Audio Precision
System One (with the internal 80kHz noise filter) using the
THD test circuit shown in Figure 3.
Up to approximately 10kHz, distortion is below the mea-
surement limit of commonly used test equipment. Further-
more, distortion remains relatively constant over the wide
output voltage swing range (approximately 2.5V from the
positive supply and 1.5V from the negative supply). A
special output stage topology yields a design with minimum
distortion variation from lot-to-lot and unit-to-unit. Further-
more, the small and large signal transient response curves
demonstrate the DRV134’s stability under load.
OUTPUT COMMON-MODE REJECTION
Output common-mode rejection (OCMR) is defined as the
change in differential output voltage due to a change in
output common-mode voltage. When measuring OCMR,
VIN is grounded and a common-mode voltage, VCM, is
applied to the output as shown in Figure 4. Ideally no
differential mode signal (VOD) should appear. However, a
small mode-conversion effect causes an error signal whose
magnitude is quantified by OCMR.
FIGURE 3. Distortion Test Circuit.
FIGURE 4. Output Common-Mode Rejection Test Circuit.
( )
VOD
VCM
600Ω
VCM = 10Vp-p
300Ω(1)
300Ω(1)
OCMR = –20 Log at f = 1kHz, VOD = (+VO) – (–VO)
NOTE: (1) Matched to 0.1%.
VIN
Gnd
+VO
VOD
–VO
DRV134
1µF
+18V
68
1
7
2
1µF
–18V
5
4
3
R
1
R
2
R
L
V
OUT
INA137
1µF
V
IN
+V
O
–In
+In
–V
O
+18V
7
2
3
6
1
5
1µF
–18V
4
DRV134
1µF
+18V
68
1
7
2
1µF
–18V
NOTE: Cable loads, where indicated, are Belden 9452 cable.
5
4
3
Test Point
or
DRV134, DRV135
10 SBOS094A
www.ti.com
SIGNAL BALANCE RATIO
Signal balance ratio (SBR) measures the symmetry of the
output signals under loaded conditions. To measure SBR an
input signal is applied and the outputs are summed as shown
in Figure 5. VOUT should be zero since each output ideally
is exactly equal and opposite. However, an error signal
results from any imbalance in the outputs. This error is
quantified by SBR. The impedances of the DRV134’s out
put stages are closely matched by laser trimming to mini-
mize SBR errors. In an application, SBR also depends on the
balance of the load network.
SINGLE-ENDED OPERATION
The DRV134 can be operated in single-ended mode without
degrading output drive capability. Single-ended operation
requires that the unused side of the output pair be grounded
(both the VO and Sense pins) to a low impedance return path.
Gain remains +6dB. Grounding the negative outputs as
shown in Figure 6 results in a noninverted output signal
(G = +2) while grounding the positive outputs gives an
inverted output signal (G = –2).
FIGURE 6. Typical Single-Ended Application.
FIGURE 5. Signal Balance Ratio Test Circuit.
600Ω
VOUT = 2VIN
VIN
V+
V–
DRV134 8
1
7
2
G = +6dB
4
5
6
3
For best rejection of line noise and hum differential mode
operation is recommended. However, single-ended perfor-
mance is adequate for many applications. In general single-
ended performance is comparable to differential mode (see
THD+N typical performance curves), but the common-
mode and noise rejection inherent in balanced-pair systems
is lost.
CABLE
The DRV134 is capable of driving large signals into 600Ω
loads over long cables. Low impedance shielded audio
cables such as the standard Belden 8451 or 9452 (or similar)
are recommended, especially in applications where long
cable lengths are required.
THERMAL PERFORMANCE
The DRV134 and DRV135 have robust output drive capa-
bility and excellent performance over temperature. In most
applications there is no significant difference between the
DIP, SOL-16, and SO-8 packages. However, for applica-
tions with extreme temperature and load conditions, the
SOL-16 (DRV134UA) or DIP (DRV134PA) packages are
recommended. Under these conditions, such as loads greater
than 600Ω or very long cables, performance may be de-
graded in the SO-8 (DRV135UA) package.
LAYOUT CONSIDERATIONS
A driver/receiver balanced-pair (such as the DRV134 and
INA137) rejects the voltage differences between the grounds
at each end of the cable, which can be caused by ground
currents, supply variations, etc. In addition to proper bypass-
ing, the suggestions below should be followed to achieve
optimal OCMR and noise rejection.
• The DRV134 input should be driven by a low impedance
source such as an op amp or buffer.
• As is the case for any single-ended system, the source’s
common should be connected as close as possible to the
DRV134’s ground. Any ground offset errors in the source
will degrade system performance.
• Symmetry on the outputs should be maintained.
• Shielded twisted-pair cable is recommended for all appli-
cations. Physical balance in signal wiring should be main-
tained. Capacitive differences due to varying wire lengths
may result in unequal noise pickup between the pair and
degrade OCMR. Follow industry practices for proper sys-
tem grounding of the cables.
VOUT
VIN
( )
600Ω
300Ω(1)
300Ω(1)
VOUT
SBR = –20 Log at f = 1kHz
VIN = 10Vp-p +VO
–VO
DRV134
1µF
+18V
68
1
7
2
1µF
–18V
Gnd 5
4
3
NOTE: (1) Matched to 0.1%.
PACKAGE OPTION ADDENDUM
www.ti.com 21-Aug-2010
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
DRV134PA ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type Request Free Samples
DRV134PAG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type Contact TI Distributor
or Sales Office
DRV134UA ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) Call TI Level-3-260C-168 HR Contact TI Distributor
or Sales Office
DRV134UA/1K ACTIVE SOIC DW 16 1000 Green (RoHS
& no Sb/Br) Call TI Level-3-260C-168 HR Purchase Samples
DRV134UA/1KE4 ACTIVE SOIC DW 16 1000 Green (RoHS
& no Sb/Br) Call TI Level-3-260C-168 HR Purchase Samples
DRV134UAE4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) Call TI Level-3-260C-168 HR Contact TI Distributor
or Sales Office
DRV135UA ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Request Free Samples
DRV135UA/2K5 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Purchase Samples
DRV135UA/2K5E4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Purchase Samples
DRV135UAG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-3-260C-168 HR Contact TI Distributor
or Sales Office
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
PACKAGE OPTION ADDENDUM
www.ti.com 21-Aug-2010
Addendum-Page 2
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DRV134UA/1K SOIC DW 16 1000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
DRV135UA/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DRV134UA/1K SOIC DW 16 1000 367.0 367.0 38.0
DRV135UA/2K5 SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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