CIC Type (H=2.4mm) 1.0mm Spacing (SMT)
P.C.BoardDimension ApplicableFPCDimension
(t=0.3±0.05)
No.ofPins
A B C D
No.ofPins
A B C D
04 3.0 5.1 9.7 4.5
17 16.0 18.1 22.7 17.5
05 4.0 6.1 10.7 5.5
18 17.0 19.1 23.7 18.5
06 5.0 7.1 11.7 6.5
19 18.0 20.1 24.7 19.5
07 6.0 8.1 12.7 7.5
20 19.0 21.1 25.7 20.5
08 7.0 9.1 13.7 8.5
21 20.0 22.1 26.7 21.5
09 8.0 10.1 14.7 9.5
22 21.0 23.1 27.7 22.5
10 9.0 11.1 15.7 10.5
24 23.0 25.1 29.7 24.5
11 10.0 12.1 16.7 11.5
26 25.0 27.1 31.7 26.5
12 11.0 13.1 17.7 12.5
28 27.0 29.1 33.7 28.5
13 12.0 14.1 18.7 13.5
14 13.0 15.1 19.7 14.5
15 14.0 16.1 20.7 15.5
29 28.0 30.1 34.7 29.5
16 15.0 17.1 21.7 16.5
30 29.0 31.1 35.7 30.5
Upper Contact Type CFP24 -01 F
No.ofPins
×× HoldDown
PackingStyle
01 With
EmbossedTaping
02 Without
EmbossedTaping
11 With PackinBulk
12 Without PackinBulk
Features
1. FPC connector usable with CIC (Carbon in
Circuit) printing.
2. Either upper or lower contact location available.
3. Of the ZIF structure.
4. Supplied in emboss-tape packaging for
automatic mounting.
5. A lead-free product.
Specifications
1. Rating : 0.5A, 100V AC/DC
2. Contact Resistance : 30m, max.
3. Insulation Resistance : 500M, min. at 500V DC
4. Withstanding Voltage : 500V AC for one minute
5. Operating Temperature Range : –25˚C to +70˚C
Material and Plating
Housing : Polyphenylene Sulfide (PPS),
Natural Color, 94V-0
Cover : Polyphenylene Sulfide (PPS),
Natural Color, 94V-0
Contact : Phosphor Bronze, Sn Plating
Frame : Phosphor Bronze, Sn Plating
1.0(Spacing)
5.2
(2.0)
1.7
0.3
2.4 2.4
D
1.0
B
C
A
1.5
3.4
0.5
2.4
3.0
0.25
2.0
2.6
A ± 0.05
1.0 ± 0.05
(D 0.6) +0.1
0
0.5 +0.1
0
4.0min.
Silver ink/carbon paste : 10µm min.
R0.4
(A 2) ± 0.1
A ± 0.05
1.0 ± 0.05 0.7 ± 0.08
1.0 ± 0.15
Lower Contact Type CFP25 -01 F
No.ofPins
1.0(Spacing)
5.2
(2.0)
1.7
0.3
2.4 D
1.0
B
C
A
1.5
3.4
2.4
×× HoldDown
PackingStyle
01 With
EmbossedTaping
02 Without
EmbossedTaping
11 With PackinBulk
12 Without PackinBulk
18
FPCConnector
FPC plating to recommend : Sn plating