Product Folder Order Now Technical Documents Tools & Software Support & Community Reference Design WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 WL18xxMOD WiLinkTM 8 Single-Band Combo Module - Wi-Fi(R), Bluetooth(R), and Bluetooth(R) Low Energy (LE) 1 Device Overview 1.1 Features 1 * General - Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives, and Power Management - Quick Hardware Design With TI Module Collateral and Reference Designs - Operating Temperature: -20C to +70C - Small Form Factor: 13.3 x 13.4 x 2 mm - 100-Pin MOC Package - FCC, IC, ETSI/CE, and TELEC Certified With PCB, Dipole, Chip, and PIFA Antennas * Wi-Fi(R) - WLAN Baseband Processor and RF Transceiver Support of IEEE Std 802.11b, 802.11g, and 802.11n - 20- and 40-MHz SISO and 20-MHz 2 x 2 MIMO at 2.4 GHz for High Throughput: 80 Mbps (TCP), 100 Mbps (UDP) - 2.4-GHz MRC Support for Extended Range - Fully Calibrated: Production Calibration Not Required - 4-Bit SDIO Host Interface Support - Wi-Fi Direct Concurrent Operation (Multichannel, Multirole) 1.2 * * * * * Bluetooth(R) and Bluetooth low energy (WL183xMOD Only) - Bluetooth 4.2 Secure Connection Compliant and CSA2 Support (Declaration ID: D032799) - Host Controller Interface (HCI) Transport for Bluetooth Over UART - Dedicated Audio Processor Support of SBC Encoding + A2DP - Dual-Mode Bluetooth and Bluetooth Low Energy - TI's Bluetooth- and Bluetooth Low EnergyCertified Stack * Key Benefits - Reduces Design Overhead - Differentiated Use Cases by Configuring WiLinkTM 8 Simultaneously in Two Roles (STA and AP) to Connect Directly With Other Wi-Fi Devices on Different RF Channel (Wi-Fi Networks) - Best-in-Class Wi-Fi With High-Performance Audio and Video Streaming Reference Applications With Up to 1.4x the Range Versus One Antenna - Different Provisioning Methods for In-Home Devices Connectivity to Wi-Fi in One Step - Lowest Wi-Fi Power Consumption in Connected Idle (< 800 A) - Configurable Wake on WLAN Filters to Only Wake Up the System - Wi-Fi-Bluetooth Single Antenna Coexistence Applications Internet of Things (IoT) Multimedia Home Electronics Home Appliances and White Goods * * * * Industrial and Home Automation Smart Gateway and Metering Video Conferencing Video Camera and Security 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 1.3 www.ti.com Description The certified WiLinkTM 8 module from TI offers high throughput and extended range along with Wi-Fi(R) and Bluetooth(R) coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux(R)and AndroidTM. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties. Device Information (1) PART NUMBER PACKAGE BODY SIZE WL1801MOD QFM (100) 13.3 mm x 13.4 mm x 2 mm WL1805MOD QFM (100) 13.3 mm x 13.4 mm x 2 mm WL1831MOD QFM (100) 13.3 mm x 13.4 mm x 2 mm WL1835MOD QFM (100) 13.3 mm x 13.4 mm x 2 mm (1) For more information, see Section 9. _ 1.4 Functional Block Diagram Figure 1-1 shows a functional block diagram of the WL1835MOD variant. RF_ANT2 ZigBee COEX Interface BG1 BT_UART F WRF2 MAC/PHY WLAN_SDIO BT_EN BG2 RF_ANT1 2.4-GHz SPDT WRF1 WLAN_EN F BT MAC/PHY 32.768 kHz 26M XTAL BTRF VIO VBAT PM Copyright (c) 2017, Texas Instruments Incorporated NOTE: Dashed lines indicate optional configurations and are not applied by default. Figure 1-1. WL1835MOD Functional Block Diagram 2 Device Overview Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com SWRS152M - JULY 2013 - REVISED OCTOBER 2017 Table of Contents 1 Device Overview ......................................... 1 5.16 Characteristics....................................... 16 Bluetooth low energy Performance: Modulation Characteristics....................................... 16 Description ............................................ 2 5.17 Bluetooth BR and EDR Dynamic Currents.......... 16 Functional Block Diagram ............................ 2 5.18 Bluetooth low energy Currents ...................... 17 Revision History ......................................... 3 Device Comparison ..................................... 4 5.19 Timing and Switching Characteristics ............... 17 1.1 Features .............................................. 1 1.2 Applications ........................................... 1 1.3 1.4 2 3 6.1 WLAN Features ..................................... 26 Terminal Configuration and Functions .............. 5 6.2 Bluetooth Features .................................. 26 Pin Attributes ......................................... 6 6.3 Bluetooth low energy Features 9 6.4 Device Certification .................................. 27 Absolute Maximum Ratings .......................... 9 6.5 Module Markings .................................... 29 ESD Ratings .......................................... 9 6.6 Test Grades ......................................... 29 Recommended Operating Conditions ................ 9 6.7 End Product Labeling ............................... 30 External Digital Slow Clock Requirements .......... 10 Thermal Resistance Characteristics for MOC 100Pin Package ......................................... 10 WLAN Performance: 2.4-GHz Receiver Characteristics....................................... 11 6.8 Manual Information to the End User ................ 30 4.1 5 Detailed Description ................................... 25 Related Products ..................................... 4 3.1 4 6 Specifications 5.1 5.2 5.3 5.4 5.5 5.6 ............................................ 5.7 WLAN Performance: 2.4-GHz Transmitter Power .. 12 5.8 5.9 WLAN Performance: Currents ...................... 13 Bluetooth Performance: BR, EDR Receiver Characteristics--In-Band Signals ................... 13 5.10 5.11 5.12 5.13 5.14 5.15 ........... Bluetooth Performance: Transmitter, EDR .......... Bluetooth Performance: Modulation, BR ............ Bluetooth Performance: Modulation, EDR .......... Bluetooth Performance: Transmitter, BR 15 15 Bluetooth low energy Performance: Receiver Characteristics - In-Band Signals................... 15 Bluetooth low energy Performance: Transmitter 27 7 Applications, Implementation, and Layout........ 31 8 Device and Documentation Support ............... 38 7.1 14 14 ..................... 9 Application Information .............................. 31 8.1 Device Support ...................................... 38 8.2 Related Links ........................................ 41 8.3 Community Resources .............................. 41 8.4 Trademarks.......................................... 41 8.5 Electrostatic Discharge Caution ..................... 41 8.6 Glossary ............................................. 41 Mechanical, Packaging, and Orderable Information .............................................. 42 ...................... 9.1 TI Module Mechanical Outline 9.2 Tape and Reel Information .......................... 43 9.3 Packaging Information .............................. 42 45 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from November 18, 2016 to October 31, 2017 * * * * * * * * * * * * * * * Page Changed Features section .......................................................................................................... 1 Changed Bluetooth 4.1 to Bluetooth 4.2 .......................................................................................... 1 Added Bluetooth 4.2 secure connection compliance in Features .............................................................. 1 Changed package information in Device Information table ..................................................................... 2 Changed name for pin 18 from 2G4_ANT2_W in Pin Attributes ............................................................... 7 Changed name for pin 18 from 2G4_ANT1_WB in Pin Attributes ............................................................. 7 Changed note in Absolute Maximum Ratings..................................................................................... 9 Bluetooth LE sensitivity typical value from -93.2 in LE Receiver Characteristics - In-Band Signals .................... 15 added (Typ) to Specification column in WLAN Performance Parameters ................................................... 25 calibration performance from 5 seconds to 5 minutes WLAN Performance Parameters .................................. 25 Added Device Certification and Qualification section........................................................................... 27 Changed Module Markings section ............................................................................................... 29 Added End Product Labeling section ............................................................................................. 30 Added Device Nomenclature image ............................................................................................. 40 Changed package type in Package Option Addendum ........................................................................ 46 Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Revision History 3 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com 3 Device Comparison The TI WiLink 8 module offers four footprint-compatible 2.4-GHz variants providing stand-alone Wi-Fi and Bluetooth combo connectivity. Table 3-1 compares the features of the module variants. Table 3-1. TI WiLinkTM 8 Module Variants DEVICE FEATURE WL1835MOD WL1831MOD WL1805MOD WL1801MOD WLAN 2.4-GHZ SISO (1) (1) WLAN 2.4-GHZ MIMO WLAN 2.4-GHZ MRC (1) BLUETOOTH (1) 3.1 SISO: single input, single output; MIMO: multiple input, multiple output; MRC: maximum ratio combining, supported at 802.11 g/n. Related Products For information about other devices in this family of products or related products, see the following links. Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low-power RF solutions suitable for a broad range of application. The offerings range from fully customized solutions to turnkey offerings with precertified hardware and software (protocol). Sub-1 GHz Long-range, low power wireless connectivity solutions are offered in a wide range of Sub-1 GHz ISM bands. Reference Designs for WL18xx The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor, and connectivity. Created by TI experts to help you jump-start your system design, all TI Designs include schematic or block diagrams, BOMs and design files to speed your time to market. Search and download designs at ti.com/tidesigns. 4 Device Comparison Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com SWRS152M - JULY 2013 - REVISED OCTOBER 2017 4 Terminal Configuration and Functions PIN 48 - GND PIN 47 - VBAT_IN PIN 45 - GND PIN 46 - VBAT_IN PIN 44 - GND PIN 42 - WL_UART_DBG PIN 43 - BT_UART_DBG PIN 40 - WLAN_EN PIN 41 - BT_EN PIN 38 - VIO PIN 39 - GND PIN 37 - GND PIN 36 - EXT_32K PIN 34 - GND PIN 35 - GND PIN 33 - GND Figure 4-1 shows the pin assignments for the 100-pin MOC package. PIN 49 - GND PIN 32 - RF_ANT1 PIN 50 - BT_HCI_RTS PIN 31 - GND GND GND GND GND GND PIN 51 - BT_HCI_CTS GND PIN 30 - GND PIN 52 - BT_HCI_TX PIN 29 - GND GND GND GND GND GND GND GND GND PIN 53 - BT_HCI_RX PIN 54 - GND PIN 28 - GND PIN 27 - GPIO1 GND PIN 26 - GPIO2 GND GND GND PIN 55 - GND PIN 56 - BT_AUD_IN PIN 25 - GPIO4 PIN 57 - BT_AUD_OUT PIN 24 - GND PIN 23 - GND PIN 58 - BT_AUD_FSYNC GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND PIN 59 - GND PIN 22 - RESERVED2 PIN 60 - BT_AUD_CLK PIN 21 - RESERVED1 PIN 61 - GND PIN 62 - RESERVED3 PIN 20 - GND PIN 19 - GND PIN 63 - GND PIN 64 - GND PIN 18 - RF_ANT2 PIN 17 - GND PIN 1 - GND PIN 2 - GPIO11 PIN 3 - GPIO9 PIN 5 - GPIO12 PIN 4 - GPIO10 PIN 6 - WL_SDIO_CMD PIN 7 - GND PIN 8 - WL_SDIO_CLK PIN 9 - GND PIN 10 - WL_SDIO_D0 PIN 11 - WL_SDIO_D1 PIN 13 - WL_SDIO_D3 PIN 12 - WL_SDIO_D2 PIN 14 - WLAN_IRQ PIN 16 - GND PIN 15 - GND Pin 2 Indicator Figure 4-1. 100-Pin MOC Package (Bottom View) Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Copyright (c) 2013-2017, Texas Instruments Incorporated 5 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 4.1 www.ti.com Pin Attributes Table 4-1 describes the module pins. Table 4-1. Pin Attributes PIN NAME PIN NO. TYPE/ SHUTDOWN DIR STATE CONNECTIVITY (2) AFTER POWER UP (1) VOLTAGE LEVEL 1801 1805 1831 1835 Hi-Z 1.8 V v v v v WLAN SDIO clock. Must be driven by the host. - v v v v Input sleep clock: 32.768 kHz DESCRIPTION (3) Clocks and Reset Signals WL_SDIO_CLK 8 I Hi-Z EXT_32K 36 ANA WLAN_EN 40 I PD PD 1.8 V v v v v Mode setting: high = enable BT_EN 41 I PD PD 1.8 V x x v v Mode setting: high = enable PD PD 1.8 V v v v v Connect to 1.8-V external VIO Power-Management Signals VIO_IN 38 POW VBAT_IN 46 POW VBAT v v v v Power supply input, 2.9 to 4.8 V VBAT_IN 47 POW VBAT v v v v Power supply input, 2.9 to 4.8 V GPIO11 2 I/O PD PD 1.8 V v v v v Reserved for future use. NC if not used. GPIO9 3 I/O PD PD 1.8 V v v v v Reserved for future use. NC if not used. GPIO10 4 I/O PU PU 1.8 V v v v v Reserved for future use. NC if not used. GPIO12 5 I/O PU PU 1.8 V v v v v Reserved for future use. NC if not used. RESERVED1 21 I PD PD 1.8 V x x x x Reserved for future use. NC if not used. RESERVED2 22 I PD PD 1.8 V x x x x Reserved for future use. NC if not used. GPIO4 25 I/O PD PD 1.8 V v v v v Reserved for future use. NC if not used. RESERVED3 62 O PD PD 1.8 V x x x x Reserved for future use. NC if not used. TI Reserved WLAN Functional Block: Int Signals WL_SDIO_CMD_1V8 6 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO command WL_SDIO_D0_1V8 10 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 0 WL_SDIO_D1_1V8 11 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 1 WL_SDIO_D2_1V8 12 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 2 (1) (2) (3) 6 PU = pullup; PD = pulldown v = connect; x = no connect Host must provide PU using a 10-K resistor for all non-CLK SDIO signals. Terminal Configuration and Functions Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com SWRS152M - JULY 2013 - REVISED OCTOBER 2017 Table 4-1. Pin Attributes (continued) PIN NAME WL_SDIO_D3_1V8 PIN NO. 13 TYPE/ SHUTDOWN DIR STATE I/O Hi-Z WL_IRQ_1V8 14 O PD RF_ANT2 18 ANA GPIO2 26 I/O PD GPIO1 27 I/O PD RF_ANT1 32 ANA WL_UART_DBG 42 O AFTER POWER UP (1) PU VOLTAGE LEVEL 1.8 V CONNECTIVITY (2) 1801 v 1805 v 1831 v 1835 DESCRIPTION (3) v WLAN SDIO data bit 3. Changes state to PU at WL_EN or BT_EN assertion for card detects. Later disabled by software during initialization. 1.8 V v v v v WLAN SDIO out-ofband interrupt line. Set to rising edge (active high) by default. (To extract the debug option WL_RS232_TX/RX interface out, pull up the IRQ line at power up before applying enable.) - x v x v 2.4-GHz ANT2 TX, RX; 2.4-GHz secondary antenna MRC/MIMO only. PD 1.8 V v v v v WL_RS232_RX (when WLAN_IRQ = 1 at power up) PD 1.8 V v v v v WL_RS232_TX (when WLAN_IRQ = 1 at power up) - v v v v 2.4-GHz WLAN main antenna SISO, Bluetooth 0 PU PU 1.8 V v v v v Option: WLAN logger Bluetooth Functional Block: Int Signals BT_UART_DBG 43 O PU PU 1.8 V x x v v Option: Bluetooth logger BT_HCI_RTS_1V8 50 O PU PU 1.8 V x x v v UART RTS to host. NC if not used. BT_HCI_CTS_1V8 51 I PU PU 1.8 V x x v v UART CTS from host. NC if not used. BT_HCI_TX_1V8 52 O PU PU 1.8 V x x v v UART TX to host. NC if not used. BT_HCI_RX_1V8 53 I PU PU 1.8 V x x v v UART RX from host. NC if not used. BT_AUD_IN 56 I PD PD 1.8 V x x v v Bluetooth PCM/I2S bus. Data in. NC if not used. BT_AUD_OUT 57 O PD PD 1.8 V x x v v Bluetooth PCM/I2S bus. Data out. NC if not used. BT_AUD_FSYNC 58 I/O PD PD 1.8 V x x v v Bluetooth PCM/I2S bus. Frame sync. NC if not used. BT_AUD_CLK 60 I/O PD PD 1.8 V x x v v Bluetooth PCM/I2S bus. NC if not used. Terminal Configuration and Functions Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Copyright (c) 2013-2017, Texas Instruments Incorporated 7 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com Table 4-1. Pin Attributes (continued) PIN NAME PIN NO. TYPE/ SHUTDOWN DIR STATE AFTER POWER UP (1) CONNECTIVITY (2) VOLTAGE LEVEL 1801 1805 1831 1835 DESCRIPTION (3) Ground Pins GND 1 GND - v v v v GND 7 GND - v v v v GND 9 GND - v v v v GND 15 GND - v v v v GND 16 GND - v v v v GND 17 GND - v v v v GND 19 GND - v v v v GND 20 GND - v v v v GND 23 GND - v v v v GND 24 GND - v v v v GND 28 GND - v v v v GND 29 GND - v v v v GND 30 GND - v v v v GND 31 GND - v v v v GND 33 GND - v v v v GND 34 GND - v v v v GND 35 GND - v v v v GND 37 GND - v v v v GND 39 GND - v v v v GND 44 GND - v v v v GND 45 GND - v v v v GND 48 GND - v v v v GND 49 GND - v v v v GND 54 GND - v v v v GND 55 GND - v v v v GND 59 GND - v v v v GND 61 GND - v v v v GND 63 GND - v v v v GND 64 GND - v v v v GND G1 - G36 GND - v v v v 8 Terminal Configuration and Functions Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com SWRS152M - JULY 2013 - REVISED OCTOBER 2017 5 Specifications All specifications are measured at the module pins using the TI WL1835MODCOM8 evaluation board. All measurements are performed with VBAT = 3.7 V, VIO = 1.8 V, 25C for typical values with matched RF antennas, unless otherwise indicated. NOTE For level-shifting I/Os with the TI WL18x5MOD, see the Level Shifting WL18xx I/Os Application Report. Absolute Maximum Ratings (1) 5.1 over operating free-air temperature range (unless otherwise noted) MIN MAX VBAT 4.8 UNIT (2) V VIO -0.5 2.1 V Input voltage to analog pins -0.5 2.1 V Input voltage limits (CLK_IN) -0.5 VDD_IO V Input voltage to all other pins -0.5 (VDD_IO + 0.5 V) V Operating ambient temperature -20 70 (3) C Storage temperature, Tstg -40 85 C (1) (2) (3) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 4.8 V cumulative to 2.33 years, including charging dips and peaks In the WL18xx system, a control mechanism exists to ensure Tj < 125C. When Tj approaches this threshold, the control mechanism manages the transmitter patterns. 5.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) 1000 Charged device model (CDM), per JEDEC specification JESD22-C101 (2) 250 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 5.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) VBAT (1) DC supply range for all modes MIN TYP MAX UNIT 2.9 3.7 4.8 V 1.62 1.8 1.95 V 0.65 x VDD_IO VDD_IO V 0 0.35 x VDD_IO V 1.365 VDD_IO V 0 0.4 V V VIO 1.8-V I/O ring power supply voltage VIH I/O high-level input voltage VIL I/O low-level input voltage VIH_EN Enable inputs high-level input voltage VIL_EN Enable inputs low-level input voltage VOH High-level output voltage @ 4 mA VDD_IO -0.45 VDD_IO VOL Low-level output voltage @ 4 mA 0 0.45 V Tr,Tf Input transitions time Tr,Tf from 10% to 90% (digital I/O) (2) 1 10 ns Tr Output rise time from 10% to 90% (digital pins) (2) CL < 25 pF 5.3 ns Tf Output fall time from 10% to 90% (digital pins) (2) CL < 25 pF 4.9 ns (1) (2) 4.8 V is applicable only for 2.33 years (30% of the time). Otherwise, maximum VBAT must not exceed 4.3 V. Applies to all digital lines except PCM and slow clock lines Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Specifications 9 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com Recommended Operating Conditions (continued) over operating free-air temperature range (unless otherwise noted) MIN Ambient operating temperature Maximum power dissipation 5.4 TYP MAX -20 UNIT 70 C WLAN operation 2.8 W Bluetooth operation 0.2 External Digital Slow Clock Requirements The supported digital slow clock is 32.768 kHz digital (square wave). All core functions share a single input. CONDITION MIN Input slow clock frequency Input slow clock accuracy (Initial + temp + aging) Tr, Tf Input transition time (10% to 90%) 15% Square wave, DCcoupled Input voltage limits Input impedance MAX UNIT 250 ppm 200 ns 32768 WLAN, Bluetooth Frequency input duty cycle VIH, VIL TYP 50% Hz 85% 0.65 x VDD_IO VDD_IO 0 0.35 x VDD_IO 1 M Input capacitance 5.5 5 (C/W) (2) JA Junction to free air JB Junction to board JC (2) (3) (4) 10 pF Thermal Resistance Characteristics for MOC 100-Pin Package THERMAL METRICS (1) (1) Vpeak Junction to case (3) 16.6 6.06 (4) 5.13 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application Report. These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: * JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) * JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages * JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages * JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements Power dissipation of 2 W and an ambient temperature of 70C is assumed. According to the JEDEC EIA/JESD 51 document Modeled using the JEDEC 2s2p thermal test board with 36 thermal vias Specifications Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com 5.6 SWRS152M - JULY 2013 - REVISED OCTOBER 2017 WLAN Performance: 2.4-GHz Receiver Characteristics over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin. PARAMETER CONDITION MIN TYP MAX UNIT 2484 MHz RF_ANT1 pin 2.4-GHz SISO Operation frequency range 2412 Sensitivity: 20-MHz bandwidth. At < 10% PER limit 1 Mbps DSSS -96.3 2 Mbps DSSS -93.2 5.5 Mbps CCK -90.6 11 Mbps CCK -87.9 6 Mbps OFDM -92.0 9 Mbps OFDM -90.4 12 Mbps OFDM -89.5 18 Mbps OFDM -87.2 24 Mbps OFDM -84.1 36 Mbps OFDM -80.7 48 Mbps OFDM -76.5 54 Mbps OFDM -74.9 MCS0 MM 4K -90.4 MCS1 MM 4K -87.6 MCS2 MM 4K -85.9 MCS3 MM 4K -82.8 MCS4 MM 4K -79.4 MCS5 MM 4K -75.2 MCS6 MM 4K -73.5 MCS7 MM 4K -72.4 MCS0 MM 4K 40 MHz -86.7 MCS7 MM 4K 40 MHz -67.0 MCS0 MM 4K MRC -92.7 MCS7 MM 4K MRC -75.2 MCS13 MM 4K -73.7 MCS14 MM 4K -72.3 MCS15 MM 4K Maximum input level Adjacent channel rejection: Sensitivity level +3 dB for OFDM; Sensitivity level +6 dB for 11b dBm -71.0 OFDM -20.0 -10.0 CCK -10.0 -6.0 -1.0 DSSS -4.0 2 Mbps DSSS 42.0 11 Mbps CCK 38.0 54 Mbps OFDM 2.0 Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD dBm dB Specifications 11 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 5.7 www.ti.com WLAN Performance: 2.4-GHz Transmitter Power over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin. PARAMETER CONDITION (1) MIN TYP MAX UNIT RF_ANT1 Pin 2.4-GHz SISO Output Power: Maximum RMS output power measured at 1 dB from IEEE spectral mask or EVM (2) 1 Mbps DSSS 17.3 2 Mbps DSSS 17.3 5.5 Mbps CCK 17.3 11 Mbps CCK 17.3 6 Mbps OFDM 17.1 9 Mbps OFDM 17.1 12 Mbps OFDM 17.1 18 Mbps OFDM 17.1 24 Mbps OFDM 16.2 36 Mbps OFDM 15.3 48 Mbps OFDM 14.6 54 Mbps OFDM 13.8 MCS0 MM 16.1 MCS1 MM 16.1 MCS2 MM 16.1 MCS3 MM 16.1 MCS4 MM 15.3 MCS5 MM 14.6 MCS6 MM 13.8 MCS7 MM (3) 12.6 MCS0 MM 40 MHz 14.8 MCS7 MM 40 MHz dBm 11.3 RF_ANT1 + RF_ANT2 MCS12 (WL18x5) 18.5 MCS13 (WL18x5) 17.4 MCS14 (WL18x5) 14.5 MCS15 (WL18x5) 13.4 dBm RF_ANT1 + RF_ANT2 Operation frequency range Return loss Reference input impedance (1) (2) (3) 12 2412 2484 MHz -10.0 dB 50.0 Maximum transmitter power (TP) degradation of up to 30% is expected, starting from 80C ambient temperature on MIMO operation Regulatory constraints limit TI module output power to the following: * Channel 14 is used only in Japan; to keep the channel spectral shaping requirement, the power is limited: 14.5 dBm. * Channels 1, 11 @ OFDM legacy and HT 20-MHz rates: 12 dBm * Channels 1, 11 @ HT 40-MHz rates: 10 dBm * Channel 7 @ HT 40-MHz lower rates: 10 dBm * Channel 5 @ HT 40-MHz upper rates: 10 dBm * All 11B rates are limited to 16 dBm to comply with the ETSI PSD 10 dBm/MHz limit. * All OFDM rates are limited to 16.5 dBm to comply with the ETSI EIRP 20 dBm limit. * For clarification regarding power limitation, see the WL18xx .INI File Application Report. To ensure compliance with the EVM conditions specified in the PHY chapter of IEEE Std 802.11TM - 2012: * MCS7 20 MHz channel 12 output power is 2 dB lower than the typical value. * MCS7 20 MHz channel 8 output power is 1 dB lower than the typical value. Specifications Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com 5.8 SWRS152M - JULY 2013 - REVISED OCTOBER 2017 WLAN Performance: Currents over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the module pin. PARAMETER SPECIFICATION TYP (AVG) -25C Low-power mode (LPM) 2.4-GHz RX SISO20 single chain 49 Receiver Transmitter 5.9 2.4 GHz RX search SISO20 54 2.4-GHz RX search MIMO20 74 2.4-GHz RX search SISO40 59 2.4-GHz RX 20 M SISO 11 CCK 56 2.4-GHz RX 20 M SISO 6 OFDM 61 2.4-GHz RX 20 M SISO MCS7 65 2.4-GHz RX 20 M MRC 1 DSSS 74 2.4-GHz RX 20 M MRC 6 OFDM 81 2.4-GHz RX 20 M MRC 54 OFDM 85 2.4-GHz RX 40-MHz MCS7 77 2.4-GHz TX 20 M SISO 6 OFDM 15.4 dBm 285 2.4-GHz TX 20 M SISO 11 CCK 15.4 dBm 273 2.4-GHz TX 20 M SISO 54 OFDM 12.7 dBm 247 2.4-GHz TX 20 M SISO MCS7 11.2 dBm 238 2.4-GHz TX 20 M MIMO MCS15 11.2 dBm 420 2.4-GHz TX 40 M SISO MCS7 8.2 dBm 243 UNIT mA mA Bluetooth Performance: BR, EDR Receiver Characteristics--In-Band Signals (1) over operating free-air temperature range (unless otherwise noted) PARAMETER CONDITION Bluetooth BR, EDR operation frequency range MIN Bluetooth BR, EDR channel spacing Bluetooth BR, EDR input impedance Bluetooth BR, EDR sensitivity (2) Dirty TX on Bluetooth EDR BER floor at sensitivity + 10 dB Dirty TX off (for 1,600,000 bits) -91.7 EDR3, BER = 0.01% -84.7 EDR3 1e-6 -15.0 EDR3, BER = 0.1% -15.0 Bluetooth BR intermodulation Level of interferers for n = 3, 4, and 5 MHz 50 -92.2 1e-6 UNIT 2480 MHz EDR2, BER = 0.01% EDR2 MAX 1 BR, BER = 0.1% Bluetooth BR, EDR maximum BR, BER = 0.1% usable input power EDR2, BER = 0.1% (1) (2) TYP 2402 dBm -5.0 -36.0 dBm -30.0 dBm All RF and performance numbers are aligned to the module pin. Sensitivity degradation up to -3 dB may occur due to fast clock harmonics with dirty TX on. Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Specifications 13 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com Bluetooth Performance: BR, EDR Receiver Characteristics--In-Band Signals(1) (continued) over operating free-air temperature range (unless otherwise noted) PARAMETER CONDITION MIN TYP MAX BR, co-channel EDR, co-channel EDR2 12 EDR3 20 BR, adjacent 1 MHz Bluetooth BR, EDR C/I performance Numbers show wanted signal-to-interfering-signal ratio. Smaller numbers indicate better C/I performances (Image frequency = -1 MHz) UNIT 10 -3.0 EDR, adjacent 1 MHz, (image) EDR2 -3.0 EDR3 2.0 BR, adjacent +2 MHz -33.0 EDR, adjacent +2 MHz EDR2 -33.0 EDR3 -28.0 BR, adjacent -2 MHz dB -20.0 EDR, adjacent -2 MHz EDR2 -20.0 EDR3 -13.0 BR, adjacent 3 MHz -42.0 EDR, adjacent 3 MHz EDR2 -42.0 EDR3 -36.0 Bluetooth BR, EDR RF return loss -10.0 dB 5.10 Bluetooth Performance: Transmitter, BR (1) over operating free-air temperature range (unless otherwise noted) PARAMETER MIN 11.7 VBAT < 3 V (3) 7.2 VBAT 3 V BR RF output power (2) TYP (3) BR gain control range MAX dBm 30.0 BR power control step UNIT dB 5.0 dB BR adjacent channel power |M-N| = 2 -43.0 dBm BR adjacent channel power |M-N| > 2 -48.0 dBm (1) (2) (3) All RF and performance numbers are aligned to the module pin. Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command. VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%. 5.11 Bluetooth Performance: Transmitter, EDR (1) over operating free-air temperature range (unless otherwise noted) PARAMETER EDR output power (2) MIN TYP VBAT 3 V (3) 7.2 VBAT < 3 V (3) 5.2 MAX UNIT dBm EDR gain control range 30 dB EDR power control step 5 dB EDR adjacent channel power |M-N| = 1 -36 dBc EDR adjacent channel power |M-N| = 2 -30 dBm EDR adjacent channel power |M-N| > 2 -42 dBm (1) (2) (3) 14 All RF and performance numbers are aligned to the module pin. Values reflect default maximum power. Maximum power can be changed using a VS command. VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%. Specifications Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com SWRS152M - JULY 2013 - REVISED OCTOBER 2017 5.12 Bluetooth Performance: Modulation, BR (1) over operating free-air temperature range (unless otherwise noted) CONDITION (2) CHARACTERISTICS MIN BR -20-dB bandwidth BR modulation characteristics BR carrier frequency drift MAX UNIT 925 995 kHz f1avg Mod data = 4 1s, 4 0s: 111100001111... 145 160 170 kHz f2max limit for at least 99.9% of all f2max Mod data = 1010101... 120 130 f2avg, f1avg 85% 88% One-slot packet -25 25 kHz Three- and five-slot packet -35 35 kHz 15 kHz/50 s 75 kHz BR drift rate lfk+5 - fkl , k = 0 .... max BR initial carrier frequency tolerance (3) f0-fTX (1) (2) (3) TYP 75 kHz All RF and performance numbers are aligned to the module pin. Performance values reflect maximum power. Numbers include XTAL frequency drift over temperature and aging. 5.13 Bluetooth Performance: Modulation, EDR (1) over operating free-air temperature range (unless otherwise noted) PARAMETER (2) CONDITION EDR carrier frequency stability TYP -5 EDR initial carrier frequency tolerance (3) 75 EDR RMS DEVM UNIT 5 kHz 75 kHz 4% 15% EDR3 4% 10% 30% EDR3 EDR peak DEVM MAX EDR2 EDR2 EDR 99% DEVM (1) (2) (3) MIN 20% EDR2 9% 25% EDR3 9% 18% All RF and performance numbers are aligned to the module pin. Performance values reflect maximum power. Numbers include XTAL frequency drift over temperature and aging. 5.14 Bluetooth low energy Performance: Receiver Characteristics - In-Band Signals (1) over operating free-air temperature range (unless otherwise noted) CONDITION (2) PARAMETER Bluetooth low energy operation frequency range MIN TYP 2402 MAX UNIT 2480 MHz Bluetooth low energy channel spacing 2 MHz Bluetooth low energy input impedance 50 Bluetooth low energy sensitivity Dirty TX on (3) -92.2 Bluetooth low energy maximum usable input power Bluetooth low energy intermodulation characteristics (1) (2) (3) -5 Level of interferers. For n = 3, 4, 5 -36 dBm dBm -30 dBm All RF and performance numbers are aligned to the module pin. BER of 0.1% corresponds to PER of 30.8% for a minimum of 1500 transmitted packets, according to the Bluetooth low energy test specification. Sensitivity degradation of up to -3 dB can occur due to fast clock harmonics. Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Specifications 15 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com Bluetooth low energy Performance: Receiver Characteristics - In-Band Signals(1) (continued) over operating free-air temperature range (unless otherwise noted) CONDITION (2) PARAMETER MIN TYP low energy, co-channel Bluetooth low energy C/I performance. Note: Numbers show wanted signal-tointerfering-signal ratio. Smaller numbers indicate better C/I performance. Image = -1 MHz MAX UNIT 12 low energy, adjacent 1 MHz 0 low energy, adjacent +2 MHz -38 low energy, adjacent -2 MHz -15 low energy, adjacent |3|MHz -40 dB 5.15 Bluetooth low energy Performance: Transmitter Characteristics (1) over operating free-air temperature range (unless otherwise noted) PARAMETER MIN Bluetooth low energy RF output power (2) TYP VBAT 3 V (3) 7.0 VBAT < 3 V (3) 7.0 MAX UNIT dBm Bluetooth low energy adjacent channel power |M-N| = 2 -51.0 dBm Bluetooth low energy adjacent channel power |M-N| > 2 -54.0 dBm (1) (2) (3) All RF and performance numbers are aligned to the module pin. Bluetooth low energy power is restricted to comply with the ETSI 10-dBm EIRP limit requirement. VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%. 5.16 Bluetooth low energy Performance: Modulation Characteristics (1) over operating free-air temperature range (unless otherwise noted) CONDITION (2) CHARACTERISTICS f1avg Bluetooth low energy modulation characteristics f2max limit for at least 99.9% of all f2max TYP MAX 240 250 260 UNIT kHz Mod data = 1010101... f2avg, f1avg Bluetooth low energy carrier frequency drift lf0 - fnl , n = 2,3 .... K Bluetooth low energy drift rate lf1 - f0l and lfn - fn-5l , n = 6,7.... K Bluetooth low energy initial carrier frequency tolerance (3) fn - fTX (1) (2) (3) MIN Mod data = four 1s and four 0s: 111100001111... 195 215 85% 90% -25 75 25 kHz 15 kHz/50 s 75 kHz All RF and performance numbers are aligned to the module pin. Performance values reflect maximum power. Numbers include XTAL frequency drift over temperature and aging. 5.17 Bluetooth BR and EDR Dynamic Currents Current is measured at output power as follows: BR at 11.7 dBm; EDR at 7.2 dBm. USE CASE (1) (2) TYP UNIT BR voice HV3 + sniff 11.6 mA EDR voice 2-EV3 no retransmission + sniff 5.9 mA Sniff 1 attempt 1.28 s 178.0 A EDR A2DP EDR2 (master). SBC high quality - 345 kbps 10.4 mA EDR A2DP EDR2 (master). MP3 high quality - 192 kbps 7.5 mA Full throughput ACL RX: RX-2DH5 (3) (4) 18.0 mA Full throughput BR ACL TX: TX-DH5 (4) 50.0 mA (1) (2) (3) (4) 16 The role of Bluetooth in all scenarios except A2DP is slave. CL1P5 PA is connected to VBAT, 3.7 V. ACL RX has the same current in all modulations. Full throughput assumes data transfer in one direction. Specifications Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com SWRS152M - JULY 2013 - REVISED OCTOBER 2017 Bluetooth BR and EDR Dynamic Currents (continued) Current is measured at output power as follows: BR at 11.7 dBm; EDR at 7.2 dBm. USE CASE (1) (2) TYP UNIT 33.0 mA Page scan or inquiry scan (scan interval is 1.28 s or 11.25 ms, respectively) 253.0 A Page scan and inquiry scan (scan interval is 1.28 s and 2.56 s, respectively) 332.0 A TYP UNIT Full throughput EDR ACL TX: TX-2DH5 (4) 5.18 Bluetooth low energy Currents All current measured at output power of 7.0 dBm USE CASE (1) Advertising, not connectable (2) 131 A Advertising, discoverable (2) 143 A Scanning (3) 266 A Connected, master role, 1.28-s connect interval (4) 124 A 132 A Connected, slave role, 1.28-s connect interval (1) (2) (3) (4) (4) CL1p% PA is connected to VBAT, 3.7 V. Advertising in all three channels, 1.28-s advertising interval, 15 bytes advertise data Listening to a single frequency per window, 1.28-s scan interval, 11.25-ms scan window Zero slave connection latency, empty TX and RX LL packets 5.19 Timing and Switching Characteristics 5.19.1 Power Management 5.19.1.1 Block Diagram - Internal DC-DCs The device incorporates three internal DC-DCs (switched-mode power supplies) to provide efficient internal supplies, derived from VBAT. WL18xx Top Level VIO_IN VIO VBAT VBAT VBAT_IN_MAIN_DC2DC VBAT VBAT_IN_PA_DC2DC MAIN_DC2DC_OUT LDO_IN_DIG SW FB Main DC2DC PA DC2DC VDD_DIG PA_DC2DC_OUT FB FB_IN_PA_DC2DC 2.2 - 2.7 V 1.8 V DIG_DC2DC_OUT SW SW FB Digital DC2DC 1V Figure 5-1. Internal DC-DCs 5.19.2 Power-Up and Shut-Down States The correct power-up and shut-down sequences must be followed to avoid damage to the device. While VBAT or VIO or both are deasserted, no signals should be driven to the device. The only exception is the slow clock that is a fail-safe I/O. While VBAT, VIO, and slow clock are fed to the device, but WL_EN is deasserted (low), the device is in SHUTDOWN state. In SHUTDOWN state all functional blocks, internal DC-DCs, clocks, and LDOs are disabled. Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Specifications 17 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com To perform the correct power-up sequence, assert (high) WL_EN. The internal DC-DCs, LDOs, and clock start to ramp and stabilize. Stable slow clock, VIO, and VBAT are prerequisites to the assertion of one of the enable signals. To perform the correct shut-down sequence, deassert (low) WL_EN while all the supplies to the device (VBAT, VIO, and slow clock) are still stable and available. The supplies to the chip (VBAT and VIO) can be deasserted only after both enable signals are deasserted (low). Figure 5-2 shows the general power scheme for the module, including the power-down sequence. VBAT 1 VIO 5 5 EXT_32K >10 s 2 >10 s 4 3 WLEN > 60 s NOTE: NOTE: NOTE: NOTE: NOTE: NOTE: NOTE: NOTE: 1. Either VBAT or VIO can come up first. 2. VBAT and VIO supplies and slow clock (SCLK), must be stable prior to EN being asserted and at all times when the EN is active. 3. At least 60 s is required between two successive device enables. The device is assumed to be in shutdown state during that period, meaning all enables to the device are LOW for that minimum duration. 4. EN must be deasserted at least 10 s before VBAT or VIO supply can be lowered (order of supply turn off after EN shutdown is immaterial). 5. EXT_32K - Fail safe I/O Figure 5-2. Power-Up System 5.19.3 Chip Top-level Power-Up Sequence Figure 5-3 shows the top-level power-up sequence for the chip. VBAT / VIO input EXT_32K input WL_EN input 4.5 ms delay Main 1V8 DC2DC DIG DC2DC SRAM LDO Top RESETZ TCXO_CLK_REQ output Internal power stable = 5 ms Figure 5-3. Chip Top-Level Power-Up Sequence 18 Specifications Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com SWRS152M - JULY 2013 - REVISED OCTOBER 2017 5.19.4 WLAN Power-Up Sequence Figure 5-4 shows the WLAN power-up sequence. VBAT / VIO input SLOWCLK input WL_EN input TCXO_CLK_REQ output TXCO_LDO output TCXO input SDIO_CLK input Indicates completion of firmware download and internal initialization NLCP: trigger at rising edge WLAN_IRQ output NLCP Wake-up time Indicates completion of firmware download and internal initialization WLAN_IRQ output MCP Wake-up time MCP: trigger at low level Host configures device to reverse WLAN_IRQ polarity Figure 5-4. WLAN Power-Up Sequence 5.19.5 Bluetooth-Bluetooth low energy Power-Up Sequence Figure 5-5 shows the Bluetooth-Bluetooth low energy power-up sequence. Completion of Bluetooth firmware initialztion. Initialization time Figure 5-5. Bluetooth-Bluetooth low energy Power-Up Sequence Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Specifications 19 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com 5.19.6 WLAN SDIO Transport Layer The SDIO is the host interface for WLAN. The interface between the host and the WL18xx module uses an SDIO interface and supports a maximum clock rate of 50 MHz. The device SDIO also supports the following features of the SDIO V3 specification: * 4-bit data bus * Synchronous and asynchronous in-band interrupt * Default and high-speed (HS, 50 MHz) timing * Sleep and wake commands 5.19.6.1 SDIO Timing Specifications Figure 5-6 and Figure 5-7 show the SDIO switching characteristics over recommended operating conditions and with the default rate for input and output. tWH tWL VDD VIH VIH VIH Clock Input VIL VSS VIL tTHL tTLH tISU VDD tIH VIH Data Input Not Valid VIH Valid VIL Not Valid VIL VSS Figure 5-6. SDIO Default Input Timing tTHL VDD tWH tWL VIH VIH VIH Clock Input VIL VIL VSS tTLH tODLY(max) tODLY(min) VDD VOH VOH Data Output Valid Not Valid VOL Not Valid VOL VSS Figure 5-7. SDIO Default Output Timing Table 5-1 lists the SDIO default timing characteristics. Table 5-1. SDIO Default Timing Characteristics (1) fclock Clock frequency, CLK (2) (2) MIN MAX UNIT 0.0 26.0 MHz 40.0% 60.0% DC Low, high duty cycle tTLH Rise time, CLK (2) 10.0 ns tTHL Fall time, CLK (2) 10.0 ns (2) tISU Setup time, input valid before CLK tIH Hold time, input valid after CLK (2) 2.0 tODLY Delay time, CLK to output valid (2) 7.0 Cl Capacitive load on outputs (2) (1) (2) 20 3.0 ns ns 10.0 ns 15.0 pF To change the data out clock edge from the falling edge (default) to the rising edge, set the configuration bit. Parameter values reflect maximum clock frequency. Specifications Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com SWRS152M - JULY 2013 - REVISED OCTOBER 2017 5.19.6.2 SDIO Switching Characteristics - High Rate Figure 5-8 and Figure 5-9 show the parameters for maximum clock frequency. tWH tWL VDD VIH VIH Clock Input VIL VSS VIL tTHL tTLH tISU VDD VIH Data Input VIH 50% VDD Not Valid tIH VIH Valid VIL Not Valid VIL VSS Figure 5-8. SDIO HS Input Timing tWL tTHL VDD tWH VIH Clock Input VIH VIH 50% VDD 50% VDD VIL VIL VSS tTLH tODLY(max) VDD tOH(min) VOH Data Output VOH Valid Not Valid VOL Not Valid VOL VSS Figure 5-9. SDIO HS Output Timing Table 5-2 lists the SDIO high-rate timing characteristics. Table 5-2. SDIO HS Timing Characteristics MIN MAX UNIT 0.0 52.0 MHz 40.0% 60.0% fclock Clock frequency, CLK DC Low, high duty cycle tTLH Rise time, CLK tTHL Fall time, CLK tISU Setup time, input valid before CLK 3.0 ns tIH Hold time, input valid after CLK 2.0 ns tODLY Delay time, CLK to output valid 7.0 Cl Capacitive load on outputs Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD 3.0 ns 3.0 ns 10.0 ns 10.0 pF Specifications 21 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com 5.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN) The device includes a UART module dedicated to the Bluetooth shared-transport, host controller interface (HCI) transport layer. The HCI transports commands, events, and ACL between the Bluetooth device and its host using HCI data packets ack as a shared transport for all functional blocks except WLAN. Table 5-3 lists the transport mechanism for WLAN and bluetooth audio. _ Table 5-3. Transport Mechanism WLAN SHARED HCI FOR ALL FUNCTIONAL BLOCKS EXCEPT WLAN BLUETOOTH VOICE-AUDIO WLAN HS SDIO Over UART Bluetooth PCM The HCI UART supports most baud rates (including all PC rates) for all fast-clock frequencies up to a maximum of 4 Mbps. After power up, the baud rate is set for 115.2 Kbps, regardless of the fast-clock frequency. The baud rate can then be changed using a VS command. The device responds with a Command Complete Event (still at 115.2 Kbps), after which the baud rate change occurs. HCI hardware includes the following features: * Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions * Receiver-transmitter underflow detection * CTS, RTS hardware flow control * 4 wire (H4) Table 5-4 lists the UART default settings. Table 5-4. UART Default Setting PARAMETER Bit rate Data length Stop-bit Parity VALUE 115.2 Kbps 8 bits 1 None 5.19.7.1 UART 4-Wire Interface - H4 The interface includes four signals: * TXD * RXD * CTS * RTS Flow control between the host and the device is byte-wise by hardware. When the UART RX buffer of the device passes the flow-control threshold, the buffer sets the UART_RTS signal high to stop transmission from the host. When the UART_CTS signal is set high, the device stops transmitting on the interface. If HCI_CTS is set high in the middle of transmitting a byte, the device finishes transmitting the byte and stops the transmission. 22 Specifications Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com SWRS152M - JULY 2013 - REVISED OCTOBER 2017 Figure 5-10 shows the UART timing. _ _ Figure 5-10. UART Timing Diagram Table 5-5 lists the UART timing characteristics. Table 5-5. UART Timing Characteristics PARAMETER CONDITION MIN Baud rate MAX UNIT 37.5 4364 Kbps 1.5% Baud rate accuracy per byte Receive-transmit -2.5% Baud rate accuracy per bit Receive-transmit -12.5% t3 CTS low to TX_DATA on 0.0 t4 CTS high to TX_DATA off t6 CTS high pulse width 1.0 t1 RTS low to RX_DATA on 0.0 t2 RTS high to RX_DATA off TYP 12.5% 2.0 s Hardware flow control 1.0 Interrupt set to 1/4 FIFO Byte Bit 2.0 s 16.0 Bytes Figure 5-11 shows the UART data frame. tb TX STR STR-Start-bit; D0 D1 D2 D0..Dn - Data bits (LSB first); Dn PAR STP PAR - Parity bit (if used); STP - Stop-bit Figure 5-11. UART Data Frame Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Specifications 23 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com 5.19.8 Bluetooth Codec-PCM (Audio) Timing Specifications Figure 5-12 shows the Bluetooth codec-PCM (audio) timing diagram. tW tCLK tis tW tih top Figure 5-12. Bluetooth Codec-PCM (Audio) Master Timing Diagram Table 5-6 lists the Bluetooth codec-PCM master timing characteristics. Table 5-6. Bluetooth Codec-PCM Master Timing Characteristics PARAMETER MIN MAX 162.76 (6.144 MHz) 15625 (64 kHz) Tclk Cycle time Tw High or low pulse width tis AUD_IN setup time tih AUD_IN hold time 0 top AUD_OUT propagation time 0 15 top FSYNC_OUT propagation time 0 15 Cl Capacitive loading on outputs UNIT ns 35% of Tclk min 10.6 40 pF Table 5-7 lists the Bluetooth codec-PCM slave timing characteristics. Table 5-7. Bluetooth Codec-PCM Slave Timing Characteristics PARAMETER MIN Tclk Cycle time Tw High or low pulse width tis AUD_IN setup time 5 tih AUD_IN hold time 0 tis AUD_FSYNC setup time 5 tih AUD_FSYNC hold time 0 top AUD_OUT propagation time 0 Cl Capacitive loading on outputs 24 Specifications MAX 81.38 (12.288 MHz) UNIT ns 35% of Tclk min 19 40 pF Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com SWRS152M - JULY 2013 - REVISED OCTOBER 2017 6 Detailed Description The WiLink 8 module is a self-contained connectivity solution based on WiLink 8 connectivity. As the eighth-generation connectivity combo chip from TI, the WiLink 8 module is based on proven technology. Figure 6-1 shows a high-level view of the WL1835MOD variant. VBAT 32 kHz XTAL Antenna 1 Wi-Fi and Bluetooth VIO WPA Supplicant and Wi-Fi Driver Bluetooth Stack and Profiles 32 kHz Antenna 2 Wi-Fi (Optional) WL1835MOD Enable Wi-Fi SDIO UART Driver SDIO Driver Bluetooth UART Figure 6-1. WL1835MOD High-Level System Diagram Table 6-1, Table 6-2, and Table 6-3 list performance parameters along with shutdown and sleep currents. Table 6-1. WLAN Performance Parameters WLAN (1) CONDITIONS SPECIFICATION (TYP) UNIT Maximum TX power 1-Mbps DSSS 17.3 dBm Minimum sensitivity 1-Mbps DSSS -96.3 dBm Sleep current Leakage, firmware retained 160 A Connected IDLE No traffic IDLE connect 750 A RX search Search (SISO20) 54 mA RX current (SISO20) MCS7, 2.4 GHz 65 mA TX current (SISO20) MCS7, 2.4 GHz, +11.2 dBm 238 mA 850 mA Maximum peak current consumption during calibration (2) (1) (2) System design power scheme must comply with both peak and average TX bursts. Peak current VBAT can hit 850 mA during device calibration. * At wakeup, the WiLink 8 module performs the entire calibration sequence at the center of the 2.4-GHz band. * Once a link is established, calibration is performed periodically (every 5 minutes) on the specific channel tuned. * The maximum VBAT value is based on peak calibration consumption with a 30% margin. Table 6-2. Bluetooth Performance Parameters SPECIFICATION (TYP) UNIT Maximum TX power BLUETOOTH GFSK CONDITIONS 11.7 dBm Minimum sensitivity GFSK -92.2 dBm Sniff 1 attempt, 1.28 s (+4 dBm) 178 A Page or inquiry 1.28-s interrupt, 11.25-ms scan window (+4 dBm) 253 A A2DP MP3 high quality 192 kbps (+4 dBm) 7.5 mA Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Detailed Description 25 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com Table 6-3. Shutdown and Sleep Currents PARAMETER Shutdown mode All functions shut down WLAN sleep mode Bluetooth sleep mode 6.1 POWER SUPPLY CURRENT TYP VBAT 10 VIO 2 VBAT 160 VIO 60 VBAT 110 VIO 60 UNIT A A A WLAN Features The device supports the following WLAN features: * Integrated 2.4-GHz power amplifiers (PAs) for a complete WLAN solution * Baseband processor: IEEE Std 802.11b/g and IEEE Std 802.11n data rates with 20- or 40-MHz SISO and 20-MHz MIMO * Fully calibrated system (production calibration not required) * Medium access controller (MAC) - Embedded ARM(R) central processing unit (CPU) - Hardware-based encryption-decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys - Requirements for Wi-Fi-protected access (WPA and WPA2.0) and IEEE Std 802.11i (includes hardware-accelerated Advanced Encryption Standard [AES]) * New advanced coexistence scheme with Bluetooth and Bluetooth low energy wireless technology * 2.4-GHz radio - Internal LNA and PA - IEEE Std 802.11b, 802.11g, and 802.11n * 4-bit SDIO host interface, including high speed (HS) and V3 modes 6.2 Bluetooth Features The device supports the following Bluetooth features: * Bluetooth 4.2 secure connection as well as CSA2 * Concurrent operation and built-in coexisting and prioritization handling of Bluetooth and Bluetooth low energy wireless technology, audio processing, and WLAN * Dedicated audio processor supporting on-chip SBC encoding + A2DP - Assisted A2DP (A3DP): SBC encoding implemented internally - Assisted WB-speech (AWBS): modified SBC codec implemented internally 26 Detailed Description Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com 6.3 SWRS152M - JULY 2013 - REVISED OCTOBER 2017 Bluetooth low energy Features The device supports the following Bluetooth low energy features: * Bluetooth 4.2 low energy dual-mode standard * All roles and role combinations, mandatory as well as optional * Up to 10 low energy connections * Independent low energy buffering allowing many multiple connections with no affect on BR-EDR performance 6.4 Device Certification The WL18MODGB modules from TI (test grades 01, 05, 31, and 35) are certified for FCC, IC, ETSI/CE, and Japan MIC. Moreover, the module is also Wi-Fi certified and has the ability to request a certificate transfer for Wi-Fi alliance members. TI customers that build products based on the WL18MODGI device from TI can save on testing costs and time per product family. Table 6-4 shows the certification list for the WL18MODGI module. Table 6-4. Device Certification Regulatory Body Specification ID (If Applicable) FCC (USA) Part 15C + MPE FCC RF exposure Z64-WL18SBMOD ISED (Canada) RSS-102 (MPE) and RSS-247 (Wi-Fi, Bluetooth) 451I-WL18SBMOD EN300328 v2.1.1 (2.4-GHz Wi-Fi, Bluetooth) -- EN301893 v2.1.1 (5-GHz Wi-Fi) -- EN62311:2008 (MPE) -- EN301489-1 v2.1.1 (general EMC) -- EN301489-17 v3.1.1 (EMC) -- ETSI/CE (Europe) EN60950-- 1:2006/A11:2009/A1:2010/A12:2011/A2:2013 MIC (Japan) 6.4.1 Article 49-20 of ORRE 201-135370 FCC Certification and Statement The WL18MODGB modules from TI are certified for the FCC as a single-modular transmitter. The modules are FCC-certified radio modules that carries a modular grant. Users are cautioned that changes or modifications not expressively approved by the party responsible for compliance could void the authority of the user to operate the equipment. This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: * This device may not cause harmful interference. * This device must accept any interference received, including interference that may cause undesired operation of the device. CAUTION FCC RF Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specific operating instructions for satisfying RF exposure limits. This transmitter must not be colocated or operating with any other antenna or transmitter. Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Detailed Description 27 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 6.4.2 www.ti.com Innovation, Science, and Economic Development Canada (ISED) The WL18MODGB modules from TI are certified for IC as a single-modular transmitter. The WL18MODGB modules from TI meet IC modular approval and labeling requirements. The IC follows the same testing and rules as the FCC regarding certified modules in authorized equipment. This device complies with Industry Canada licence-exempt RSS standards. Operation is subject to the following two conditions: * This device may not cause interference. * This device must accept any interference, including interference that may cause undesired operation of the device. Le present appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisee aux deux conditions suivantes: * L'appareil ne doit pas produire de brouillage. * L'utilisateur de l'appareil doit accepter tout brouillage radioelectrique subi, meme si le brouillage est susceptible d'en compromettre le fonctionnement. CAUTION IC RF Radiation Exposure Statement: To comply with IC RF exposure requirements, this device and its antenna must not be colocated or operating in conjunction with any other antenna or transmitter. Pour se conformer aux exigences de conformite RF canadienne l'exposition, cet appareil et son antenne ne doivent pas etre co-localises ou fonctionnant en conjonction avec une autre antenne or transmitter. 6.4.3 ETSI/CE The WL18MODGB modules conform to the EU Radio Equipment Directive. For further detains, see the full text of the EU Declaration of Conformity for the WL18MODGBWL18MODGB (test grade 01), WL18MODGB (test grade 05), WL18MODGB (test grade 31), and WL18MODGI (test grade 35) devices. 6.4.4 MIC Certification The WL18MODGB modules from TI are MIC certified against article 49-20 and the relevant articles of the Ordinance Regulating Radio Equipment. Operation is subject to the following condition: * The host system does not contain a wireless wide area network (WWAN) device. 28 Detailed Description Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com 6.5 SWRS152M - JULY 2013 - REVISED OCTOBER 2017 Module Markings Figure 6-2 shows the markings for the TI WiLink 8 module. Model: WL18 MODGB Test Grade:&& FCC ID: Z64-WL18SBMOD IC: 451I-WL18SBMOD R 201-135370 LTC: XXXXXXX Figure 6-2. WiLink 8 Module Markings Table 6-5 describes the WiLink 8 module markings. Table 6-5. Description of WiLinkTM 8 Module Markings MARKING DESCRIPTION WL18 MODGB && Model Test grade (for more information, see Section 6.6) Z64-WL18SBMOD FCC ID: single modular FCC grant ID 451I-WL18SBMOD IC: single modular IC grant ID LTC (lot trace code): XXXXXXX 201-135370 LTC: Reserved for TI Use R: single modular TELEC grant ID TELEC compliance mark CE 6.6 CE compliance mark Test Grades To minimize delivery time, TI may ship the device ordered or an equivalent device currently available that contains at least the functions of the part ordered. From all aspects, this device will behave exactly the same as the part ordered. For example, if a customer orders device WL1801MOD, the part shipped can be marked with a test grade of 35, 05 (see Table 6-6). Table 6-6. Test Grade Markings MARK 1 WLAN BLUETOOTH 0& Tested - 3& Tested Tested MARK 2 WLAN 2.4 GHz MIMO 2.4 GHz &1 Tested - &5 Tested Tested Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Detailed Description 29 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 6.7 www.ti.com End Product Labeling These modules are designed to comply with the FCC single modular FCC grant, Z64- WL18SBMOD. The host system using this module must display a visible label indicating the following text: Contains FCC ID: Z64-WL18SBMOD These modules are designed to comply with the IC single modular FCC grant, IC: 451I-WL18SBMOD. The host system using this module must display a visible label indicating the following text: Contains IC: 451I-WL18SBMOD This module is designed to comply with the JP statement, 201-135370. The host system using this module must display a visible label indicating the following text: Contains transmitter module with certificate number: 201-135370 6.8 Manual Information to the End User The OEM integrator must be aware of not providing information to the end user regarding how to install or remove this RF module in the user's manual of the end product which integrates this module. The end user's manual must include all required regulatory information and warnings as shown in this manual. 30 Detailed Description Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com SWRS152M - JULY 2013 - REVISED OCTOBER 2017 7 Applications, Implementation, and Layout NOTE Information in the following Applications section is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 7.1 7.1.1 Application Information Typical Application - WL1835MODGB Reference Design Figure 7-1 shows the TI WL1835MODGB reference design. Applications, Implementation, and Layout Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Copyright (c) 2013-2017, Texas Instruments Incorporated 31 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com BT_EN WLAN/BT Enable Control. Connect to Host GPIO. WLAN_EN For Debug only VIO_IN OSC1 1V8 / 32.768kHz OSC-3.2X2.5 SLOW_CLK C1 1uF 0402 OUT GND EN VCC VIO_IN 1 4 C4 0.1uF 0402 RESERVED3 GND A L1 1.1nH 0402 2 1 3 27 WL_RS232_TX_1V8 TP3 26 WL_RS232_RX_1V8 TP4 25 J5 U.FL-R-SMT(10) U.FL For Debug only TP5 5G C9 2.2pF 0402 29 28 2.4G B2 C7 NU_10pF 0402 30 B1 FEED 31 C10 NU_0.3pF 0402 The value of antenna matching components is for WL1835MODCOM8B For Debug only 24 23 22 TP6 21 TP7 ANT2- WL_2.4_IO1 20 C6 10pF 0402 19 C14 4pF 0402 18 ANT2 ANT016008LCD2442MA1 ANT-N3-1.6X0.8MM-B A 17 C8 NU_10pF 0402 G1 G2 G3 G4 G5 G6 G7 G8 G9 G10 G11 G12 G13 G14 G15 G16 G17 G18 L2 1.5nH 0402 2 1 3 J6 U.FL-R-SMT(10) U.FL C11 1.2pF 0402 FEED 2.4G 5G C12 NU 0402 The value of antenna matching components is for WL1835MODCOM8B For Debug only 16 15 14 13 12 GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND WLAN_IRQ GND WL_SDIO_D3 RF_ANT2 GND WL_SDIO_D2 GND 32 ANT1 ANT016008LCD2442MA1 ANT-N3-1.6X0.8MM-A C13 8pF 0402 C5 10pF 0402 B2 34 33 GND GND 36 35 GND EXT_32K 38 39 40 37 GND VIO GND BT_EN_SOC WLAN_EN_SOC 43 41 42 WL_UART_DBG 44 GND BT_UART_DBG 46 45 GND 47 GND 1 G19 G20 G21 G22 G23 G24 G25 G26 G27 G28 G29 G30 G31 G32 G33 G34 G35 G36 GND WL_SDIO_D1 64 RESERVED1 11 63 GND RESERVED2 WL_SDIO_D0 62 GND BT_AUD_CLK GND TP8 GPIO_4 GND WL_SDIO_CLK Connect to Host BT PCM Bus. BT_AUD_FSYNC 9 61 BT_AUD_OUT 10 60 GPIO_2 U1 WL1835MODGB E-13.4X13.3-N100_0.75-TOP BT_AUD_IN GND 59 BT_AUD_CLK GND 8 58 GPIO_1 7 57 BT_AUD_FSYNC GND GND WL_SDIO_CMD BT_AUD_OUT BT_HCI_RX GPIO12 56 GND 6 BT_AUD_IN BT_HCI_TX 5 55 GND GPIO10 54 Connect to Host HCI Interface. BT_HCI_CTS 4 53 GND GPIO9 BT_HCI_RX_1V8 2 ANT1- WL_2.4_IO2/BT RF_ANT1 BT_HCI_RTS 3 52 VBAT 48 GND BT_HCI_TX_1V8 GND GPIO11 51 GND 50 2 49 BT_HCI_RTS_1V8 BT_HCI_CTS_1V8 R6 0R 0402 C3 0.1uF 0402 VBAT C2 10uF 0603 3 B1 TP1 TP2 VBAT_IN VIO_IN For Debug only R20 NU RES1005 TP10TP11TP12TP13 WL_IRQ_1V8 WL_SDIO_D3_1V8 WL_SDIO_D2_1V8 WL_SDIO_D1_1V8 WL_SDIO_D0_1V8 WL_SDIO_CLK_1V8 WL_SDIO_CMD_1V8 Connect to Host SDIO Interface. Figure 7-1. TI Module Reference Schematics 32 Applications, Implementation, and Layout Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com SWRS152M - JULY 2013 - REVISED OCTOBER 2017 Table 7-1 lists the bill materials (BOM). Table 7-1. BOM ITEM DESCRIPTION PART NUMBER PACKAGE REF. QTY 13.4 x 13.3 x 2.0 mm U1 1 TI 7XZ3200005 3.2 x 2.5 x 1.0 mm OSC1 1 TXC Antenna / chip / 2.4 and 5 GHz / peak gain > 5 dBi ANT016008LCD2442MA1 1.6 mm x 0.8 mm ANT1, ANT2 2 TDK 6 Mini RF header receptacle U.FL-R-SMT-1 (10) 3.0 x 2.6 x 1.25 mm J5, J6 2 Hirose 7 Inductor 0402 / 1.1 nH / 0.05 nH SMD LQP15MN1N1W02 0402 L1 1 Murata 8 Inductor 0402 / 1.5 nH / 0.05 nH SMD LQP15MN1N5W02 0402 L2 1 Murata 9 Capacitor 0402 / 1.2 pF / 50 V / C0G / 0.1 pF GJM1555C1H1R2BB01 0402 C11 1 Murata 10 Capacitor 0402 / 2.2 pF / 50 V / C0G / 0.1 pF GJM1555C1H1R2BB01 0402 C9 1 Murata 11 Capacitor 0402 / 4 pF / 50 V / C0G / 0.1 pF GJM1555C1H4R0BB01 0402 C14 1 Murata 12 Capacitor 0402 / 8 pF / 50 V / C0G / 0.1 pF GJM1555C1H8R0BB01 0402 C13 1 Walsin 13 Capacitor 0402 / 10 pF / 50 V / NPO / 5% 0402N100J500LT 0402 C5, C6 2 Walsin 14 Capacitor 0402 / 0.1 F / 10 V / X7R / 10% 0402B104K100CT 0402 C3, C4 1 Walsin 15 Capacitor 0402 / 1 F / 6.3 V / X5R / 10% / HF GRM155R60J105KE19D 0402 C1 1 Murata 16 Capacitor 0603 / 10 F / 6.3 V / X5R / 20% C1608X5R0J106M 0603 C2 1 TDK 1 TI WL1835 Wi-Fi / Bluetooth module WL1835MODGI 2 XOSC 3225 / 32.768 kHz / 1.8 V / 50 ppm 3 7.1.2 MFR Design Recommendations This section describes the layout recommendations for the WL1835 module, RF trace, and antenna. Table 7-2 summarizes the layout recommendations. Table 7-2. Layout Recommendations Summary ITEM DESCRIPTION Thermal 1 The proximity of ground vias must be close to the pad. 2 Signal traces must not be run underneath the module on the layer where the module is mounted. 3 Have a complete ground pour in layer 2 for thermal dissipation. 4 Have a solid ground plane and ground vias under the module for stable system and thermal dissipation. 5 Increase the ground pour in the first layer and have all of the traces from the first layer on the inner layers, if possible. 6 Signal traces can be run on a third layer under the solid ground layer, which is below the module mounting layer. RF Trace and Antenna Routing 7 The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to radiate. 8 The RF trace bends must be gradual with an approximate maximum bend of 45 with trace mitered. RF traces must not have sharp corners. 9 RF traces must have via stitching on the ground plane beside the RF trace on both sides. 10 RF traces must have constant impedance (microstrip transmission line). 11 For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer must be solid. 12 There must be no traces or ground under the antenna section. 13 RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The proximity of the antenna to the enclosure and the enclosure material must also be considered. Applications, Implementation, and Layout Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Copyright (c) 2013-2017, Texas Instruments Incorporated 33 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com Table 7-2. Layout Recommendations Summary (continued) ITEM DESCRIPTION Supply and Interface 14 The power trace for VBAT must be at least 40-mil wide. 15 The 1.8-V trace must be at least 18-mil wide. 16 Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance. 17 If possible, shield VBAT traces with ground above, below, and beside the traces. 18 SDIO signals traces (CLK, CMD, D0, D1, D2, and D3) must be routed in parallel to each other and as short as possible (less than 12 cm). In addition, every trace length must be the same as the others. There should be enough space between traces - greater than 1.5 times the trace width or ground - to ensure signal quality, especially for the SDIO_CLK trace. Remember to keep these traces away from the other digital or analog signal traces. TI recommends adding ground shielding around these buses. 19 SDIO and digital clock signals are a source of noise. Keep the traces of these signals as short as possible. If possible, maintain a clearance around them. 7.1.3 RF Trace and Antenna Layout Recommendations Figure 7-2 shows the location of the antenna on the WL1835MODCOM8B board as well as the RF trace routing from the WL1835 module (TI reference design). The Pulse multilayer antennas are mounted on the board with a specific layout and matching circuit for the radiation test conducted in FCC, CE, and IC certifications. NOTE For reuse of the regulatory certification, a trace of 1-dB attenuation is required on the final application board. Antennas are orthogonal to each other. Antennas distance is Higher than half wavelength. 76.00mm No sharp corners. Constant 50 OHM control impedance RF Trace. Antenna placement on the edge of the board. Figure 7-2. Location of Antenna and RF Trace Routing on the WL1835MODCOM8B Board Follow these RF trace routing recommendations: * RF traces must have 50- impedance. * RF traces must not have sharp corners. * RF traces must have via stitching on the ground plane beside the RF trace on both sides. * RF traces must be as short as possible. The antenna, RF traces, and module must be on the edge of the PCB product in consideration of the product enclosure material and proximity. 34 Applications, Implementation, and Layout Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com 7.1.4 SWRS152M - JULY 2013 - REVISED OCTOBER 2017 Module Layout Recommendations Figure 7-3 shows layer 1 and layer 2 of the TI module layout. Layer 1 Layer 2 (Solid GND) Figure 7-3. TI Module Layout Follow these module layout recommendations: * Ensure a solid ground plane and ground vias under the module for stable system and thermal dissipation. * Do not run signal traces underneath the module on a layer where the module is mounted. * Signal traces can be run on a third layer under the solid ground layer and beneath the module mounting. * Run the host interfaces with ground on the adjacent layer to improve the return path. * TI recommends routing the signals as short as possible to the host. 7.1.5 Thermal Board Recommendations The TI module uses vias for layers 1 through 6 with full copper filling, providing heat flow all the way to the module ground pads. TI recommends using one big ground pad under the module with vias all the way to connect the pad to all ground layers (see Figure 7-4). Applications, Implementation, and Layout Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Copyright (c) 2013-2017, Texas Instruments Incorporated 35 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com Module COM8 Board Figure 7-4. Block of Ground Pads on Bottom Side of Package Figure 7-5 shows via array patterns, which are applied wherever possible to connect all of the layers to the TI module central or main ground pads. Figure 7-5. Via Array Patterns 36 Applications, Implementation, and Layout Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com 7.1.6 SWRS152M - JULY 2013 - REVISED OCTOBER 2017 Baking and SMT Recommendations 7.1.6.1 Baking Recommendations Follow these baking guidelines for the WiLink 8 module: * Follow MSL level 3 to perform the baking process. * After the bag is open, devices subjected to reflow solder or other high temperature processes must be mounted within 168 hours of factory conditions (< 30C/60% RH) or stored at <10% RH. * If the Humidity Indicator Card reads >10%, devices require baking before they are mounted. * If baking is required, bake devices for 8 hours at 125C. 7.1.6.2 SMT Recommendations Figure 7-6 shows the recommended reflow profile for the WiLink 8 module. Temp (degC) D3 D2 T3 D1 T1 Meating T2 Soldering Preheat Cooling Time (SeC) Figure 7-6. Reflow Profile for the WiLink 8 Module Table 7-3 lists the temperature values for the profile shown in Figure 7-6. Table 7-3. Temperature Values for Reflow Profile ITEM TEMPERATURE (C) TIME (s) Preheat D1 to approximately D2: 140 to 200 T1: 80 to approximately 120 Soldering D2: 220 T2: 60 10 Peak temperature D3: 250 maximum T3: 10 NOTE TI does not recommend the use of conformal coating or similar material on the WiLink 8 module. This coating can lead to localized stress on the WCSP solder connections inside the module and impact the device reliability. Care should be taken during module assembly process to the final PCB to avoid the presence of foreign material inside the module. Applications, Implementation, and Layout Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Copyright (c) 2013-2017, Texas Instruments Incorporated 37 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com 8 Device and Documentation Support 8.1 Device Support 8.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 8.1.2 Development Support TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules. 8.1.2.1 Tools and Software For a complete listing of development-support tools, visit the Texas Instruments WL18xx Wiki. For information on pricing and availability, contact the nearest TI field sales office or authorized distributor. Design Kits and Evaluation Modules AM335x EVM (TMDXEVM3358) The AM335x EVM enables developers to immediately evaluate the AM335x processor family (AM3351, AM3352, AM3354, AM3356, and AM3358) and begin building applications, such as portable navigation, portable gaming, and home and building automation. AM437x Evaluation Module (TMDSEVM437X) The AM437x EVM enables developers to immediately evaluate the AM437x processor family (AM4376, AM4377, AM4378, and AM4379 ) and begin building applications, such as portable navigation, patient monitoring, home and building automation, barcode scanners, and portable data terminals. BeagleBone Black Development Board (BEAGLEBK) BeagleBone Black is a low-cost, open source, community-supported development platform for ARM Cortex-A8 processor developers and hobbyists. Boot Linux in under 10 seconds and get started on SitaraTM AM335x ARM CortexA8 processor development in less than 5 minutes using just a single USB cable. WiLink 8 Module 2.4 GHz Wi-Fi + Bluetooth COM8 EVM (WL1835MODCOM8B) The WL1835MODCOM8 Kit for Sitara EVMs easily enables customers to add Wi-Fi and Bluetooth technology (WL183x module only) to embedded applications based on TI's Sitara microprocessors. TI's WiLink 8 Wi-Fi + Bluetooth modules are precertified and offer high throughput and extended range along with Wi-Fi and Bluetooth coexistence (WL183x modules only) in a power-optimized design. Drivers for the Linux and Android high-level operating systems (HLOSs) are available free of charge from TI for the Sitara AM335x microprocessor (Linux and Android version restrictions apply). Note: The WL1835MODCOM8 EVM is one of the two evaluation boards for the TI WiLink 8 combo module family. For designs requiring performance in the 5-GHz band and extended temperature range, see the WL1837MODCOM8I EVM. WL18XXCOM82SDMMC Adapter Board The WiLink SDIO board is an SDMMC adapter board and an easy-to-use connector between the WiLink COM8 EVM (WL1837MODCOM8i and WL1835MODCOM8B) and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO and provides a UART connection for Bluetooth technology over an FPC connector or wire cables. In addition, the adapter is a standalone evaluation platform using TI wireless PC debug tools for any WiLink module or chip solution with a PCB 100-pin edge connector. This board is designed for use with various platforms such as the TI Sitara AM335 and AM437. TI Designs and Reference Designs The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded processor, and connectivity. Created by TI experts to help you jumpstart your system design, all TI Designs include schematics or block diagrams, BOMs, and design files to speed your time to market. 38 Device and Documentation Support Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com SWRS152M - JULY 2013 - REVISED OCTOBER 2017 TI WiLink 8 Wi-Fi/Bluetooth/Bluetooth Smart Audio Multi-Room Cape Reference Design (TIDCWL1837MOD-AUDIO-MULTIROOM-CAPE) The TI WiLink 8 WL1837MOD audio cape is wireless a multi-room audio reference design used with BeagleBone Black featuring the TI Sitara (AM335x). The WLAN capability of the WiLink 8 device to capture and register precise arrival time of the connected AP beacon is used to achieve ultra-precise synchronization between multiple connected audio devices. The WiLink 8 module (WL1837MOD) offers integrated Wi-Fi/Bluetooth/Bluetooth Smart solution featuring 2.4-GHz MIMO and antenna diversity on the 5-GHz band. The WiLink 8 module offers a best-in-class audio solution featuring multi-room, Airplay(R) receiver, full audio stack streaming, support for online music services, and much more. This TI Design enables customers to design their own audio boards with Wi-Fi/Bluetooth/Bluetooth Smart connectivity from our WiLink 8 module (WL1837MOD) and evaluate audio multi-room software. 2.4-GHz Wi-Fi + Bluetooth Certified Antenna Design on WiLink 1835 Module (TIDCWL1835MODCOM8B) The WiLink 1835 Module Antenna Design is a reference design that combines the functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing the module in the way the module is certified. Customers can thus evaluate the performance of the module through embedded applications, such as home automation and the Internet of Things that make use of both Wi-Fi and Bluetooth/Bluetooth low energy functionalities found on the WiLink 1835 module. This antenna design is the same layout used during module certification, allowing customers to avoid repeated certification when creating their specific applications. Smart Home and Energy Gateway Reference Design (TIEP-SMART-ENERGY-GATEWAY) The Smart Home and Energy Gateway Reference Design provides example implementation for measurement, management and communication of energy systems for smart homes and buildings. This example design is a bridge between different communication interfaces, such as Wi-Fi, Ethernet, ZigBee or Bluetooth, that are commonly found in residential and commercial buildings. Because objects in homes and buildings are becoming more and more connected and no single RF standard dominates the market, the gateway design must be flexible to accommodate different RF standards. This example gateway addresses the problem by supporting existing legacy RF standards (Wi-Fi, Bluetooth) and newer RF standards ( ZigBee(R) and BLE). Streaming Audio Reference Design (TIDEP0009) The TIDEP0009 Streaming Audio Reference Design minimizes design time for customers by offering small form factor hardware and major software components, including streaming protocols and Internet radio services. With this reference design, TI offers a quick and easy transition path to the AM335x and WiLink 8 platform solution. This proven combination solution provides key advantages in this market category that helps bring your products to the next level. Software WiLink 8 Wi-Fi Driver for Linux OS (WILINK8-WIFI-NLCP) The NLCP package contains the install package, pre-compiled object and source of the TI Linux Open-Source Wi-Fi image to easily upgrade the default LINUX EZSDK release with the TI WiLink family NLCP Wi-Fi driver. The software is built with Linaro GCC 4.7 and can be added to Linux Software Development Kits (SDKs) that use similar toolchain on other platforms. Android Development Kit for Sitara Microprocessors (ANDROIDSDK-SITARA) Although originally designed for mobile handsets, the Android Operating System offers designers of embedded applications the ability to easily add a high-level OS to their product. Developed in association with Google, Android delivers a complete operating system that is ready for integration and production today. Linux EZ Software Development Kit (EZSDK) for Sitara Processors (LINUXEZSDK-SITARA) Linux SDKs provide Sitara developers with an easy setup and quick out-of-box experience that is specific to and highlights the features of TI's ARM processors. Launching demos, benchmarks, and applications is a snap with the included graphical user interface. The Sitara Linux SDK also allows developers to quickly start development of their own applications and easily add them to the application launcher, which can be customized by the developer. TI Dual-Mode Bluetooth Stack (TIBLUETOOTHSTACK-SDK) TI's dual-mode Bluetooth stack enables Bluetooth + Bluetooth low energy and is comprised of single-mode and dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free, provides simple command line sample applications to speed development and has MFI capability on request. Device and Documentation Support Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Copyright (c) 2013-2017, Texas Instruments Incorporated 39 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com Bluetooth Service Pack for WL18xx (WL18XX-BT-SP) The Bluetooth Service Pack is composed of the following four files: BTS file (TIInit_11.8.32.bts), ILI file (TIInit_11.8.32.ili), XML (TIInit_11.8.32.xml), Release Notes Document, and License Agreement Note. TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone with WL18xx and CC256x (TI-BT-STACK-LINUX-ADDON) The Bluetooth Linux Add-On package contains the install package, pre-compiled object, and source of the TI Bluetooth Stack and Platform Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x EVM, or BeagleBone. The software is built with Linaro GCC 4.7 and can be added to Linux SDKs that use a similar toolchain on other platforms. The Bluetooth stack is fully qualified (QDID 69886 and QDID 69887), provides simple command line sample applications to speed development, and has MFI capability on request. WiLink Wireless Tools for WL18XX Modules (WILINK-BT_WIFI-WIRELESS_TOOLS) The WiLink Wireless Tools package includes the following applications: WLAN Real-Time Tuning Tool (RTTT), Bluetooth Logger, WLAN gLogger, Link Quality Monitor (LQM), HCITester Tool (BTSout, BTSTransform, and ScriptPad). The applications provide all of the capabilities required to debug and monitor WiLink WLAN/Bluetooth/Bluetooth low energy firmware with a host, perform RF validation tests, run pretest for regulatory certification testing, and debug hardware and software platform integration issues. Development Tools WiLink 8 Proprietary Wi-Fi Driver - QNX, WinCE, Nucleus RTOS Baseline (WILINK8-WIFI-WAPIMCP8, WILINK8-WIFI-MCP8, WILINK8-WIFI-SIGMA-MCP8) The MCP package contains the install package, precompiled object, and source of the proprietary Wi-Fi driver - QNX, Nucleus, WinCE as well as ThreadX, FreeRTOS, C, MQX ,RTX and uITRON RTOS baseline image to easily integrate the TI WiLink Wi-Fi drivers. The integration is supported through third party vendors. The WAPI package provides the WPA Supplicant patch to support WAPI security protocol. The Sigma package provides the required APIs for WL8 code to support automated Sigma certification testing. 8.1.3 Device Support Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. These prefixes represent evolutionary stages of product development from engineering prototypes through fully qualified production devices. X WL18XY MOD XX MOC X Packaging R = Large Reel T = Small Reel Prefix X= Preproduction No Prefix = Production Device Package Designator MOC = LGA Package WL18XY Family X = 0/3 0 = WLAN only 3 = Bluetooth, WLAN Model GB = 2.4 GHz Wi-Fi GI = 5 GHz Wi-Fi Y = 1/5/7 1 = 2.4 GHz SISO 5 = 2.4 GHz MIMO 7 = 2.4 GHz MIMO + 5 GHz Module MOD = module Figure 8-1. Device Nomenclature X null 40 Experimental, preproduction, sample or prototype device. Device may not meet all product qualification conditions and may not fully comply with TI specifications. Experimental/Prototype devices are shipped against the following disclaimer: "This product is still in development and is intended for internal evaluation purposes." Notwithstanding any provision to the contrary, TI makes no warranty expressed, implied, or statutory, including any implied warranty of merchantability of fitness for a specific purpose, of this device. Device is qualified and released to production. TI's standard warranty applies to production devices. Device and Documentation Support Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com 8.2 SWRS152M - JULY 2013 - REVISED OCTOBER 2017 Related Links Table 8-1 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 8-1. Related Links 8.3 PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY WL1801MOD Click here Click here Click here Click here Click here WL1805MOD Click here Click here Click here Click here Click here WL1831MOD Click here Click here Click here Click here Click here WL1835MOD Click here Click here Click here Click here Click here Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. TI Embedded Processors Wiki Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices. 8.4 Trademarks WiLink, Sitara, E2E are trademarks of Texas Instruments. ARM is a registered trademark of ARM Physical IP, Inc. Airplay is a registered trademark of Apple Inc. Bluetooth is a registered trademark of Bluetooth SIG. Android is a trademark of Google, Inc. IEEE Std 802.11 is a trademark of IEEE. Linux is a registered trademark of Linus Torvalds. Wi-Fi is a registered trademark of Wi-Fi Alliance. ZigBee is a registered trademark of ZigBee Alliance. All other trademarks are the property of their respective owners. 8.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 8.6 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. Device and Documentation Support Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Copyright (c) 2013-2017, Texas Instruments Incorporated 41 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com 9 Mechanical, Packaging, and Orderable Information 9.1 TI Module Mechanical Outline Figure 9-1 shows the mechanical outline for the device. W e4 T e5 W e2 d2 e3 d1 e1 L L e6 Pin 2 Indicator a3 c2 c3 b1 b2 4 3 2 a1 a2 b3 1 c1 Bottom View Top View Side View Figure 9-1. TI Module Mechanical Outline Table 9-1 lists the dimensions for the mechanical outline of the device. NOTE The TI module weighs 0.684 g typical. Table 9-1. Dimensions for TI Module Mechanical Outline 42 MARKING MIN (mm) NOM (mm) MAX (mm) MARKING MIN (mm) NOM (mm) MAX (mm) L (body size) 13.20 13.30 13.40 c2 0.65 0.75 0.85 W (body size) 13.30 13.40 13.50 c3 1.15 1.25 1.35 T (thickness) 1.80 1.90 2.00 d1 0.90 1.00 1.10 a1 0.30 0.40 0.50 d2 0.90 1.00 1.10 a2 0.60 0.70 0.80 e1 1.30 1.40 1.50 a3 0.65 0.75 0.85 e2 1.30 1.40 1.50 b1 0.20 0.30 0.40 e3 1.15 1.25 1.35 b2 0.65 0.75 0.85 e4 1.20 1.30 1.40 b3 1.20 1.30 1.40 e5 1.00 1.10 1.20 c1 0.20 0.30 0.40 e6 1.00 1.10 1.20 Mechanical, Packaging, and Orderable Information Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com 9.2 SWRS152M - JULY 2013 - REVISED OCTOBER 2017 Tape and Reel Information Emboss taping specification for MOC 100 pin. Tape and Reel Specification P2 Po E 9.2.1 F Do W Pin 1 T P C0.5 Ko 5.00 Ao = Bo Figure 9-2. Tape Specification Table 9-2. Dimensions for Tape Specification ITEM W E F P Po P2 Do T Ao Bo Ko DIMENSION (mm) 24.00 (0.30) 1.75 (0.10) 11.50 (0.10) 20.00 (0.10) 4.00 (0.10) 2.00 (0.10) 2.00 (0.10) 0.35 (0.05) 13.80 (0.10) 13.80 (0.10) 2.50 (0.10) 330.002.0 2.200.7 100.001.5 W1 W2 Figure 9-3. Reel Specification Table 9-3. Dimensions for Reel Specification ITEM W1 W2 DIMENSION (mm) 24.4 (+1.5, -0.5) 30.4 (maximum) Mechanical, Packaging, and Orderable Information Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Copyright (c) 2013-2017, Texas Instruments Incorporated 43 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 9.2.2 www.ti.com Packing Specification 9.2.2.1 Reel Box The reel is packed in a moisture barrier bag fastened by heat-sealing. Each moisture-barrier bag is packed into a reel box, as shown in Figure 9-4. 856 45 370 572 360 Figure 9-4. Reel Box The reel box is made of corrugated fiberboard. 9.2.2.2 Shipping Box Figure 9-5 shows a typical shipping box. If the shipping box has excess space, filler (such as cushion) is added. NOTE 362 616 The size of the shipping box may vary depending on the number of reel boxes packed. 354 250 1,243 Figure 9-5. Shipping Box The shipping box is made of corrugated fiberboard. 44 Mechanical, Packaging, and Orderable Information Copyright (c) 2013-2017, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD www.ti.com 9.3 SWRS152M - JULY 2013 - REVISED OCTOBER 2017 Packaging Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Mechanical, Packaging, and Orderable Information Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Copyright (c) 2013-2017, Texas Instruments Incorporated 45 WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD SWRS152M - JULY 2013 - REVISED OCTOBER 2017 www.ti.com PACKAGE OPTION ADDENDUM Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball Finish MSL Peak Temp (C) (3) Op Temp (C) WL1801MODGBMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 -20 to 70 WL1801MODGBMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 -20 to 70 WL1805MODGBMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 -20 to 70 WL1805MODGBMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 -20 to 70 WL1831MODGBMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 -20 to 70 WL1831MODGBMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 -20 to 70 WL1835MODGBMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 -20 to 70 WL1835MODGBMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 -20 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS Compliance: This product has an RoHS exemption for one or more subcomponent(s). The product is otherwise considered Pb-Free (RoHS compatible) as defined above. (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. space Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 46 Mechanical, Packaging, and Orderable Information Submit Documentation Feedback Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD Copyright (c) 2013-2017, Texas Instruments Incorporated PACKAGE OUTLINE QFM - 2.0 mm max height MOC0100A QUAD FLAT MODULE 13.4 13.2 B A 1 PIN 1 INDEX AREA 13.5 13.3 C 2 MAX 0.08 C 2X 11.95 2X 9.8 7.7 TYP 17 56X 0.7 33 G36 G6 7.7 TYP (1.4) TYP SYMM 2X 9.8 G3 60X 0.8 0.7 2X 12.05 60X 0.45 0.35 G1 G7 G19 G31 0.1 0.05 1 PIN 2 ID 64 4X 0.8 0.7 C A B C 49 SYMM 36X (1.4) TYP 1.05 0.95 4221006/B 10/2016 NOTES: 1. 2. 3. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. This drawing is subject to change without notice. The package thermal pads must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT QFM - 2.0 mm max height MOC0100A QUAD FLAT MODULE 2X (11.95) 64 1 49 G1 G7 G19 G13 G25 G31 2X (12.05) SYMM 56X (0.7) (1.05) TYP (1.4) TYP 60X (0.75) 60X (0.4) G6 G12 G18 G24 G30 (1.05) TYP G36 (1.4) TYP 33 17 4X (0.75) 36X (1) SYMM LAND PATTERN EXAMPLE SCALE: 8X 0.05 MIN ALL AROUND SOLDER MASK DETAILS SOLDER MASK OPENING SOLDER MASK DEFINED (R0.05) TYP METAL UNDER SOLDER MASK 4221006/B 10/2016 NOTES: (continued) 4. 5. 6. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . Solder mask tolerances between and around signal pads can vary based on board fabrication site. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, it is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN QFM - 2.0 mm max height MOC0100A QUAD FLAT MODULE 2X (11.95) 64 1 49 G1 G7 G19 G13 G25 G31 60X (0.4) 60X (0.75) 2X (12.05) SYMM 56X (0.7) (1.05) TYP (1.4) TYP SEE DETAIL B G6 G12 G18 (1.05) TYP G24 G30 G36 (1.4) TYP 33 17 SYMM SEE DETAIL A SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL PADS 1, 17, 33, 49, G1-G36 90% PRINTED COVERAGE BY AREA SCALE: 8X SOLDER PASTE METAL UNDER SOLDER MASK METAL UNDER SOLDER MASK 4X (0.713) DETAIL A SCALE 20X SOLDER PASTE SOLDER MASK EDGE SOLDER MASK EDGE 36X (0.95) DETAIL B SCALE 20X 4221006/B 10/2016 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. 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