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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152M –JULY 2013–REVISED OCTOBER 2017

WL18xxMOD WiLink™ 8 Single-Band Combo Module –

Wi-Fi

,Bluetooth

, and Bluetooth

Low Energy (LE)

1 Device Overview

1.1 Features

• General

– Integrates RF, Power Amplifiers (PAs), Clock,

RF Switches, Filters, Passives, and Power

Management

– Quick Hardware Design With TI Module

Collateral and Reference Designs

– Operating Temperature: –20°C to +70°C

– Small Form Factor: 13.3 × 13.4 × 2 mm

– 100-Pin MOC Package

– FCC, IC, ETSI/CE, and TELEC Certified With

PCB, Dipole, Chip, and PIFA Antennas

• Wi-Fi®

– WLAN Baseband Processor and RF Transceiver

Support of IEEE Std 802.11b, 802.11g, and

802.11n

– 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO

at 2.4 GHz for High Throughput: 80 Mbps

(TCP), 100 Mbps (UDP)

– 2.4-GHz MRC Support for Extended Range

– Fully Calibrated: Production Calibration Not

Required

– 4-Bit SDIO Host Interface Support

– Wi-Fi Direct Concurrent Operation

(Multichannel, Multirole)

• Bluetooth®and Bluetooth low energy

(WL183xMOD Only)

– Bluetooth 4.2 Secure Connection Compliant and

CSA2 Support (Declaration ID: D032799)

– Host Controller Interface (HCI) Transport for

Bluetooth Over UART

– Dedicated Audio Processor Support of SBC

Encoding + A2DP

– Dual-Mode Bluetooth and Bluetooth Low Energy

– TI's Bluetooth- and Bluetooth Low Energy-

Certified Stack

• Key Benefits

– Reduces Design Overhead

– Differentiated Use Cases by Configuring

WiLink™ 8 Simultaneously in Two Roles (STA

and AP) to Connect Directly With Other Wi-Fi

Devices on Different RF Channel (Wi-Fi

Networks)

– Best-in-Class Wi-Fi With High-Performance

Audio and Video Streaming Reference

Applications With Up to 1.4× the Range Versus

One Antenna

– Different Provisioning Methods for In-Home

Devices Connectivity to Wi-Fi in One Step

– Lowest Wi-Fi Power Consumption in Connected

Idle (< 800 µA)

– Configurable Wake on WLAN Filters to Only

Wake Up the System

– Wi-Fi-Bluetooth Single Antenna Coexistence

1.2 Applications

• Internet of Things (IoT)

• Multimedia

• Home Electronics

• Home Appliances and White Goods

• Industrial and Home Automation

• Smart Gateway and Metering

• Video Conferencing

• Video Camera and Security

VIO

ZigBee

COEX

MAC/PHY

32.768 kHz

WLAN_SDIO

BT_UART

WRF1

BTRF

BG2

BG1

MAC/PHY

BT_EN

WLAN_EN

VBAT

RF_ANT1

RF_ANT2

26M XTAL

2.4-GHz

SPDT

WRF2

Interface

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

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(1) For more information, see Section 9.

1.3 Description

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi®and

Bluetooth®coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a

2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and

client. TI offers drivers for high-level operating systems such as Linux®and Android™. Additional drivers,

such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported

through third parties.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE

WL1801MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm

WL1805MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm

WL1831MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm

WL1835MOD QFM (100) 13.3 mm × 13.4 mm × 2 mm

1.4 Functional Block Diagram

Figure 1-1 shows a functional block diagram of the WL1835MOD variant.

NOTE: Dashed lines indicate optional configurations and are not applied by default.

Figure 1-1. WL1835MOD Functional Block Diagram

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

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Table of Contents

1 Device Overview ......................................... 1

1.1 Features .............................................. 1

1.2 Applications........................................... 1

1.3 Description............................................ 2

1.4 Functional Block Diagram ............................ 2

2 Revision History ......................................... 3

3 Device Comparison ..................................... 4

3.1 Related Products ..................................... 4

4 Terminal Configuration and Functions.............. 5

4.1 Pin Attributes ......................................... 6

5 Specifications ............................................ 9

5.1 Absolute Maximum Ratings .......................... 9

5.2 ESD Ratings.......................................... 9

5.3 Recommended Operating Conditions................ 9

5.4 External Digital Slow Clock Requirements.......... 10

5.5 Thermal Resistance Characteristics for MOC 100-

Pin Package......................................... 10

5.6 WLAN Performance: 2.4-GHz Receiver

Characteristics....................................... 11

5.7 WLAN Performance: 2.4-GHz Transmitter Power .. 12

5.8 WLAN Performance: Currents ...................... 13

5.9 Bluetooth Performance: BR, EDR Receiver

Characteristics—In-Band Signals................... 13

5.10 Bluetooth Performance: Transmitter, BR ........... 14

5.11 Bluetooth Performance: Transmitter, EDR.......... 14

5.12 Bluetooth Performance: Modulation, BR............ 15

5.13 Bluetooth Performance: Modulation, EDR.......... 15

5.14 Bluetooth low energy Performance: Receiver

Characteristics – In-Band Signals................... 15

5.15 Bluetooth low energy Performance: Transmitter

Characteristics....................................... 16

5.16 Bluetooth low energy Performance: Modulation

Characteristics....................................... 16

5.17 Bluetooth BR and EDR Dynamic Currents.......... 16

5.18 Bluetooth low energy Currents...................... 17

5.19 Timing and Switching Characteristics............... 17

6 Detailed Description ................................... 25

6.1 WLAN Features ..................................... 26

6.2 Bluetooth Features.................................. 26

6.3 Bluetooth low energy Features ..................... 27

6.4 Device Certification.................................. 27

6.5 Module Markings.................................... 29

6.6 Test Grades......................................... 29

6.7 End Product Labeling ............................... 30

6.8 Manual Information to the End User ................ 30

7 Applications, Implementation, and Layout........ 31

7.1 Application Information.............................. 31

8 Device and Documentation Support ............... 38

8.1 Device Support...................................... 38

8.2 Related Links........................................ 41

8.3 Community Resources.............................. 41

8.4 Trademarks.......................................... 41

8.5 Electrostatic Discharge Caution..................... 41

8.6 Glossary............................................. 41

9 Mechanical, Packaging, and Orderable

Information .............................................. 42

9.1 TI Module Mechanical Outline ...................... 42

9.2 Tape and Reel Information.......................... 43

9.3 Packaging Information .............................. 45

2 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from November 18, 2016 to October 31, 2017 Page

• Changed Features section .......................................................................................................... 1

• Changed Bluetooth 4.1 to Bluetooth 4.2 .......................................................................................... 1

• Added Bluetooth 4.2 secure connection compliance in Features .............................................................. 1

• Changed package information in Device Information table ..................................................................... 2

• Changed name for pin 18 from 2G4_ANT2_W in Pin Attributes ............................................................... 7

• Changed name for pin 18 from 2G4_ANT1_WB in Pin Attributes ............................................................. 7

• Changed note in Absolute Maximum Ratings..................................................................................... 9

• Bluetooth LE sensitivity typical value from –93.2 in LE Receiver Characteristics – In-Band Signals.................... 15

• added (Typ) to Specification column in WLAN Performance Parameters................................................... 25

• calibration performance from 5 seconds to 5 minutes WLAN Performance Parameters.................................. 25

• Added Device Certification and Qualification section........................................................................... 27

• Changed Module Markings section ............................................................................................... 29

• Added End Product Labeling section............................................................................................. 30

• Added Device Nomenclature image ............................................................................................. 40

• Changed package type in Package Option Addendum ........................................................................ 46

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

SWRS152M –JULY 2013–REVISED OCTOBER 2017

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(1) SISO: single input, single output; MIMO: multiple input, multiple output; MRC: maximum ratio combining, supported at 802.11 g/n.

3 Device Comparison

The TI WiLink 8 module offers four footprint-compatible 2.4-GHz variants providing stand-alone Wi-Fi and

Bluetooth combo connectivity. Table 3-1 compares the features of the module variants.

Table 3-1. TI WiLink™ 8 Module Variants

FEATURE DEVICE

WL1835MOD WL1831MOD WL1805MOD WL1801MOD

WLAN 2.4-GHZ SISO(1) √ √ √ √

WLAN 2.4-GHZ MIMO(1) √ √

WLAN 2.4-GHZ MRC(1) √ √

BLUETOOTH √ √

3.1 Related Products

For information about other devices in this family of products or related products, see the following links.

Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low-power RF

solutions suitable for a broad range of application. The offerings range from fully customized

solutions to turnkey offerings with precertified hardware and software (protocol).

Sub-1 GHz Long-range, low power wireless connectivity solutions are offered in a wide range of Sub-1

GHz ISM bands.

Reference Designs for WL18xx The TI Designs Reference Design Library is a robust reference design

library spanning analog, embedded processor, and connectivity. Created by TI experts to

help you jump-start your system design, all TI Designs include schematic or block diagrams,

BOMs and design files to speed your time to market. Search and download designs at

ti.com/tidesigns.

PIN 19 - GND

PIN 17 - GND

PIN 20 - GND

PIN 23 - GND

PIN 24 - GND

PIN 28 - GND

PIN 29 - GND

PIN 30 - GND

PIN 31 - GND

PIN 18 - RF_ANT2

PIN 21 - RESERVED1

PIN 22 - RESERVED2

PIN 25 - GPIO4

PIN 26 - GPIO2

PIN 27 - GPIO1

PIN 32 - RF_ANT1

PIN 1 - GND

PIN 4 - GPIO10

PIN 5 - GPIO12

PIN 2 - GPIO11

PIN 3 - GPIO9

PIN 6 - WL_SDIO_CMD

PIN 8 - WL_SDIO_CLK

PIN 7 - GND

PIN 9 - GND

PIN 10 - WL_SDIO_D0

PIN 11 - WL_SDIO_D1

PIN 12 - WL_SDIO_D2

PIN 13 - WL_SDIO_D3

PIN 14 - WLAN_IRQ

PIN 15 - GND

PIN 16 - GND

PIN 33 - GND

PIN 40 - WLAN_EN

PIN 38 - VIO

PIN 39 - GND

PIN 37 - GND

PIN 41 - BT_EN

PIN 43 - BT_UART_DBG

PIN 46 - VBAT_IN

PIN 36 - EXT_32K

PIN 34 - GND

PIN 35 - GND

PIN 42 - WL_UART_DBG

PIN 44 - GND

PIN 45 - GND

PIN 47 - VBAT_IN

PIN 48 - GND

PIN 49 - GND

PIN 50 - BT_HCI_RTS

PIN 51 - BT_HCI_CTS

PIN 52 - BT_HCI_TX

PIN 53 - BT_HCI_RX

PIN 54 - GND

PIN 55 - GND

PIN 56 - BT_AUD_IN

PIN 57 - BT_AUD_OUT

PIN 58 - BT_AUD_FSYNC

PIN 60 - BT_AUD_CLK

PIN 59 - GND

PIN 61 - GND

PIN 63 - GND

PIN 62 - RESERVED3

PIN 64 - GND

GND GND

GND

GND GND GND

GND GND

GND

GND GND GND

GND GND

GND

GND GND GND

GND GND

GND

GND GND

GND

Pin 2 Indicator

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

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4 Terminal Configuration and Functions

Figure 4-1 shows the pin assignments for the 100-pin MOC package.

Figure 4-1. 100-Pin MOC Package (Bottom View)

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

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(1) PU = pullup; PD = pulldown

(2) v = connect; x = no connect

(3) Host must provide PU using a 10-K resistor for all non-CLK SDIO signals.

4.1 Pin Attributes

Table 4-1 describes the module pins.

Table 4-1. Pin Attributes

PIN NAME PIN

NO. TYPE/

DIR SHUTDOWN

STATE

AFTER

POWER

UP(1) VOLTAGE

LEVEL

CONNECTIVITY(2)

DESCRIPTION(3)

1801 1805 1831 1835

Clocks and Reset Signals

WL_SDIO_CLK 8 I Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO clock.

Must be driven by the

host.

EXT_32K 36 ANA – v v v v Input sleep clock:

32.768 kHz

WLAN_EN 40 I PD PD 1.8 V v v v v Mode setting: high =

enable

BT_EN 41 I PD PD 1.8 V x x v v Mode setting: high =

enable

Power-Management Signals

VIO_IN 38 POW PD PD 1.8 V v v v v Connect to 1.8-V

external VIO

VBAT_IN 46 POW VBAT v v v v Power supply input,

2.9 to 4.8 V

VBAT_IN 47 POW VBAT v v v v Power supply input,

2.9 to 4.8 V

TI Reserved

GPIO11 2 I/O PD PD 1.8 V v v v v Reserved for future

use. NC if not used.

GPIO9 3 I/O PD PD 1.8 V v v v v Reserved for future

use. NC if not used.

GPIO10 4 I/O PU PU 1.8 V v v v v Reserved for future

use. NC if not used.

GPIO12 5 I/O PU PU 1.8 V v v v v Reserved for future

use. NC if not used.

RESERVED1 21 I PD PD 1.8 V x x x x Reserved for future

use. NC if not used.

RESERVED2 22 I PD PD 1.8 V x x x x Reserved for future

use. NC if not used.

GPIO4 25 I/O PD PD 1.8 V v v v v Reserved for future

use. NC if not used.

RESERVED3 62 O PD PD 1.8 V x x x x Reserved for future

use. NC if not used.

WLAN Functional Block: Int Signals

WL_SDIO_CMD_1V8 6 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO

command

WL_SDIO_D0_1V8 10 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit

WL_SDIO_D1_1V8 11 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit

WL_SDIO_D2_1V8 12 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

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Table 4-1. Pin Attributes (continued)

PIN NAME PIN

NO. TYPE/

DIR SHUTDOWN

STATE

AFTER

POWER

UP(1) VOLTAGE

LEVEL

CONNECTIVITY(2)

DESCRIPTION(3)

1801 1805 1831 1835

WL_SDIO_D3_1V8 13 I/O Hi-Z PU 1.8 V v v v v

WLAN SDIO data bit

3. Changes state to

PU at WL_EN or

BT_EN assertion for

card detects. Later

disabled by software

during initialization.

WL_IRQ_1V8 14 O PD 0 1.8 V v v v v

WLAN SDIO out-of-

band interrupt line.

Set to rising edge

(active high) by

default. (To extract

the debug option

WL_RS232_TX/RX

interface out, pull up

the IRQ line at power

up before applying

enable.)

RF_ANT2 18 ANA – x v x v 2.4-GHz ANT2 TX,

RX; 2.4-GHz

secondary antenna

MRC/MIMO only.

GPIO2 26 I/O PD PD 1.8 V v v v v WL_RS232_RX

(when WLAN_IRQ =

1 at power up)

GPIO1 27 I/O PD PD 1.8 V v v v v WL_RS232_TX

(when WLAN_IRQ =

1 at power up)

RF_ANT1 32 ANA – v v v v 2.4-GHz WLAN main

antenna SISO,

Bluetooth

WL_UART_DBG 42 O PU PU 1.8 V v v v v Option: WLAN logger

Bluetooth Functional Block: Int Signals

BT_UART_DBG 43 O PU PU 1.8 V x x v v Option: Bluetooth

logger

BT_HCI_RTS_1V8 50 O PU PU 1.8 V x x v v UART RTS to host.

NC if not used.

BT_HCI_CTS_1V8 51 I PU PU 1.8 V x x v v UART CTS from host.

NC if not used.

BT_HCI_TX_1V8 52 O PU PU 1.8 V x x v v UART TX to host. NC

if not used.

BT_HCI_RX_1V8 53 I PU PU 1.8 V x x v v UART RX from host.

NC if not used.

BT_AUD_IN 56 I PD PD 1.8 V x x v v Bluetooth PCM/I2S

bus. Data in. NC if not

used.

BT_AUD_OUT 57 O PD PD 1.8 V x x v v Bluetooth PCM/I2S

bus. Data out. NC if

not used.

BT_AUD_FSYNC 58 I/O PD PD 1.8 V x x v v Bluetooth PCM/I2S

bus. Frame sync. NC

if not used.

BT_AUD_CLK 60 I/O PD PD 1.8 V x x v v Bluetooth PCM/I2S

bus. NC if not used.

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

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Table 4-1. Pin Attributes (continued)

PIN NAME PIN

NO. TYPE/

DIR SHUTDOWN

STATE

AFTER

POWER

UP(1) VOLTAGE

LEVEL

CONNECTIVITY(2)

DESCRIPTION(3)

1801 1805 1831 1835

Ground Pins

GND 1 GND – v v v v

GND 7 GND – v v v v

GND 9 GND – v v v v

GND 15 GND – v v v v

GND 16 GND – v v v v

GND 17 GND – v v v v

GND 19 GND – v v v v

GND 20 GND – v v v v

GND 23 GND – v v v v

GND 24 GND – v v v v

GND 28 GND – v v v v

GND 29 GND – v v v v

GND 30 GND – v v v v

GND 31 GND – v v v v

GND 33 GND – v v v v

GND 34 GND – v v v v

GND 35 GND – v v v v

GND 37 GND – v v v v

GND 39 GND – v v v v

GND 44 GND – v v v v

GND 45 GND – v v v v

GND 48 GND – v v v v

GND 49 GND – v v v v

GND 54 GND – v v v v

GND 55 GND – v v v v

GND 59 GND – v v v v

GND 61 GND – v v v v

GND 63 GND – v v v v

GND 64 GND – v v v v

GND G1 –

G36 GND – v v v v

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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Operating Conditions is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) 4.8 V cumulative to 2.33 years, including charging dips and peaks

(3) In the WL18xx system, a control mechanism exists to ensure Tj< 125°C. When Tjapproaches this threshold, the control mechanism

manages the transmitter patterns.

5 Specifications

All specifications are measured at the module pins using the TI WL1835MODCOM8 evaluation board. All

measurements are performed with VBAT = 3.7 V, VIO = 1.8 V, 25°C for typical values with matched RF

antennas, unless otherwise indicated.

NOTE

For level-shifting I/Os with the TI WL18x5MOD, see the Level Shifting WL18xx I/Os

Application Report.

5.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT

VBAT 4.8(2) V

VIO –0.5 2.1 V

Input voltage to analog pins –0.5 2.1 V

Input voltage limits (CLK_IN) –0.5 VDD_IO V

Input voltage to all other pins –0.5 (VDD_IO + 0.5 V) V

Operating ambient temperature –20 70(3) °C

Storage temperature, Tstg –40 85 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

5.2 ESD Ratings

VALUE UNIT

V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V

Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±250

(1) 4.8 V is applicable only for 2.33 years (30% of the time). Otherwise, maximum VBAT must not exceed 4.3 V.

(2) Applies to all digital lines except PCM and slow clock lines

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT

VBAT(1) DC supply range for all modes 2.9 3.7 4.8 V

VIO 1.8-V I/O ring power supply voltage 1.62 1.8 1.95 V

VIH I/O high-level input voltage 0.65 × VDD_IO VDD_IO V

VIL I/O low-level input voltage 0 0.35 × VDD_IO V

VIH_EN Enable inputs high-level input voltage 1.365 VDD_IO V

VIL_EN Enable inputs low-level input voltage 0 0.4 V

VOH High-level output voltage @ 4 mA VDD_IO –0.45 VDD_IO V

VOL Low-level output voltage @ 4 mA 0 0.45 V

Tr,TfInput transitions time Tr,Tffrom 10% to

90% (digital I/O)(2) 1 10 ns

TrOutput rise time from 10% to 90%

(digital pins)(2) CL< 25 pF 5.3 ns

TfOutput fall time from 10% to 90%

(digital pins)(2) CL< 25 pF 4.9 ns

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Recommended Operating Conditions (continued)

over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT

Ambient operating temperature –20 70 ºC

Maximum power

dissipation WLAN operation 2.8 W

Bluetooth operation 0.2

5.4 External Digital Slow Clock Requirements

The supported digital slow clock is 32.768 kHz digital (square wave). All core functions share a single input.

CONDITION MIN TYP MAX UNIT

Input slow clock frequency 32768 Hz

Input slow clock accuracy (Initial + temp +

aging) WLAN,

Bluetooth ±250 ppm

Tr, TfInput transition time (10% to 90%) 200 ns

Frequency input duty cycle 15% 50% 85%

VIH, VIL Input voltage limits Square

wave, DC-

coupled

0.65 x VDD_IO VDD_IO Vpeak

0 0.35 x VDD_IO

Input impedance 1 MΩ

Input capacitance 5 pF

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application

Report.

(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)

• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.

(3) According to the JEDEC EIA/JESD 51 document

(4) Modeled using the JEDEC 2s2p thermal test board with 36 thermal vias

5.5 Thermal Resistance Characteristics for MOC 100-Pin Package

THERMAL METRICS(1) (°C/W)(2)

θJA Junction to free air(3) 16.6

θJB Junction to board 6.06

θJC Junction to case(4) 5.13

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5.6 WLAN Performance: 2.4-GHz Receiver Characteristics

over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the

module pin. PARAMETER CONDITION MIN TYP MAX UNIT

RF_ANT1 pin 2.4-GHz SISO

Operation frequency range 2412 2484 MHz

Sensitivity: 20-MHz bandwidth. At < 10% PER limit

1 Mbps DSSS –96.3

dBm

2 Mbps DSSS –93.2

5.5 Mbps CCK –90.6

11 Mbps CCK –87.9

6 Mbps OFDM –92.0

9 Mbps OFDM –90.4

12 Mbps OFDM –89.5

18 Mbps OFDM –87.2

24 Mbps OFDM –84.1

36 Mbps OFDM –80.7

48 Mbps OFDM –76.5

54 Mbps OFDM –74.9

MCS0 MM 4K –90.4

MCS1 MM 4K –87.6

MCS2 MM 4K –85.9

MCS3 MM 4K –82.8

MCS4 MM 4K –79.4

MCS5 MM 4K –75.2

MCS6 MM 4K –73.5

MCS7 MM 4K –72.4

MCS0 MM 4K 40 MHz –86.7

MCS7 MM 4K 40 MHz –67.0

MCS0 MM 4K MRC –92.7

MCS7 MM 4K MRC –75.2

MCS13 MM 4K –73.7

MCS14 MM 4K –72.3

MCS15 MM 4K –71.0

Maximum input level OFDM –20.0 –10.0 dBmCCK –10.0 –6.0

DSSS –4.0 –1.0

Adjacent channel rejection: Sensitivity level +3 dB for

OFDM; Sensitivity level +6 dB for 11b

2 Mbps DSSS 42.0 dB11 Mbps CCK 38.0

54 Mbps OFDM 2.0

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(1) Maximum transmitter power (TP) degradation of up to 30% is expected, starting from 80°C ambient temperature on MIMO operation

(2) Regulatory constraints limit TI module output power to the following:

• Channel 14 is used only in Japan; to keep the channel spectral shaping requirement, the power is limited: 14.5 dBm.

• Channels 1, 11 @ OFDM legacy and HT 20-MHz rates: 12 dBm

• Channels 1, 11 @ HT 40-MHz rates: 10 dBm

• Channel 7 @ HT 40-MHz lower rates: 10 dBm

• Channel 5 @ HT 40-MHz upper rates: 10 dBm

• All 11B rates are limited to 16 dBm to comply with the ETSI PSD 10 dBm/MHz limit.

• All OFDM rates are limited to 16.5 dBm to comply with the ETSI EIRP 20 dBm limit.

• For clarification regarding power limitation, see the WL18xx .INI File Application Report.

(3) To ensure compliance with the EVM conditions specified in the PHY chapter of IEEE Std 802.11™ – 2012:

• MCS7 20 MHz channel 12 output power is 2 dB lower than the typical value.

• MCS7 20 MHz channel 8 output power is 1 dB lower than the typical value.

5.7 WLAN Performance: 2.4-GHz Transmitter Power

over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the

module pin. PARAMETER CONDITION(1) MIN TYP MAX UNIT

RF_ANT1 Pin 2.4-GHz SISO

Output Power: Maximum RMS output power measured

at 1 dB from IEEE spectral mask or EVM(2)

1 Mbps DSSS 17.3

dBm

2 Mbps DSSS 17.3

5.5 Mbps CCK 17.3

11 Mbps CCK 17.3

6 Mbps OFDM 17.1

9 Mbps OFDM 17.1

12 Mbps OFDM 17.1

18 Mbps OFDM 17.1

24 Mbps OFDM 16.2

36 Mbps OFDM 15.3

48 Mbps OFDM 14.6

54 Mbps OFDM 13.8

MCS0 MM 16.1

MCS1 MM 16.1

MCS2 MM 16.1

MCS3 MM 16.1

MCS4 MM 15.3

MCS5 MM 14.6

MCS6 MM 13.8

MCS7 MM(3) 12.6

MCS0 MM 40 MHz 14.8

MCS7 MM 40 MHz 11.3

RF_ANT1 + RF_ANT2

MCS12 (WL18x5) 18.5

dBm

MCS13 (WL18x5) 17.4

MCS14 (WL18x5) 14.5

MCS15 (WL18x5) 13.4

RF_ANT1 + RF_ANT2

Operation frequency range 2412 2484 MHz

Return loss –10.0 dB

Reference input impedance 50.0 Ω

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5.8 WLAN Performance: Currents

over operating free-air temperature range (unless otherwise noted). All RF and performance numbers are aligned to the

module pin.

PARAMETER SPECIFICATION TYP (AVG) –25°C UNIT

Receiver

Low-power mode (LPM) 2.4-GHz RX SISO20 single chain 49

2.4 GHz RX search SISO20 54

2.4-GHz RX search MIMO20 74

2.4-GHz RX search SISO40 59

2.4-GHz RX 20 M SISO 11 CCK 56

2.4-GHz RX 20 M SISO 6 OFDM 61

2.4-GHz RX 20 M SISO MCS7 65

2.4-GHz RX 20 M MRC 1 DSSS 74

2.4-GHz RX 20 M MRC 6 OFDM 81

2.4-GHz RX 20 M MRC 54 OFDM 85

2.4-GHz RX 40-MHz MCS7 77

Transmitter

2.4-GHz TX 20 M SISO 6 OFDM 15.4 dBm 285

2.4-GHz TX 20 M SISO 11 CCK 15.4 dBm 273

2.4-GHz TX 20 M SISO 54 OFDM 12.7 dBm 247

2.4-GHz TX 20 M SISO MCS7 11.2 dBm 238

2.4-GHz TX 20 M MIMO MCS15 11.2 dBm 420

2.4-GHz TX 40 M SISO MCS7 8.2 dBm 243

(1) All RF and performance numbers are aligned to the module pin.

(2) Sensitivity degradation up to –3 dB may occur due to fast clock harmonics with dirty TX on.

5.9 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals(1)

over operating free-air temperature range (unless otherwise noted)

PARAMETER CONDITION MIN TYP MAX UNIT

Bluetooth BR, EDR operation

frequency range 2402 2480 MHz

Bluetooth BR, EDR channel

spacing 1 MHz

Bluetooth BR, EDR input

impedance 50 Ω

Bluetooth BR, EDR

sensitivity(2)

Dirty TX on

BR, BER = 0.1% –92.2 dBmEDR2, BER = 0.01% –91.7

EDR3, BER = 0.01% –84.7

Bluetooth EDR BER floor at

sensitivity + 10 dB

Dirty TX off (for 1,600,000

bits)

EDR2 1e-6

EDR3 1e-6

Bluetooth BR, EDR maximum

usable input power BR, BER = 0.1% –5.0 dBmEDR2, BER = 0.1% –15.0

EDR3, BER = 0.1% –15.0

Bluetooth BR intermodulation Level of interferers for n = 3, 4, and 5 –36.0 –30.0 dBm

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Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals(1) (continued)

over operating free-air temperature range (unless otherwise noted)

PARAMETER CONDITION MIN TYP MAX UNIT

Bluetooth BR, EDR C/I

performance

Numbers show wanted

signal-to-interfering-signal

ratio. Smaller numbers

indicate better C/I

performances (Image

frequency = –1 MHz)

BR, co-channel 10

EDR, co-channel EDR2 12

EDR3 20

BR, adjacent ±1 MHz –3.0

EDR, adjacent ±1 MHz,

(image) EDR2 –3.0

EDR3 2.0

BR, adjacent +2 MHz –33.0

EDR, adjacent +2 MHz EDR2 –33.0

EDR3 –28.0

BR, adjacent –2 MHz –20.0

EDR, adjacent –2 MHz EDR2 –20.0

EDR3 –13.0

BR, adjacent ≥Ι±3ΙMHz –42.0

EDR, adjacent ≥Ι±3ΙMHz EDR2 –42.0

EDR3 –36.0

Bluetooth BR, EDR RF return

loss –10.0 dB

(1) All RF and performance numbers are aligned to the module pin.

(2) Values reflect maximum power. Reduced power is available using a vendor-specific (VS) command.

(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.

5.10 Bluetooth Performance: Transmitter, BR(1)

over operating free-air temperature range (unless otherwise noted)

PARAMETER MIN TYP MAX UNIT

BR RF output power(2) VBAT ≥3 V(3) 11.7 dBm

VBAT < 3 V(3) 7.2

BR gain control range 30.0 dB

BR power control step 5.0 dB

BR adjacent channel power |M-N| = 2 –43.0 dBm

BR adjacent channel power |M-N| > 2 –48.0 dBm

(1) All RF and performance numbers are aligned to the module pin.

(2) Values reflect default maximum power. Maximum power can be changed using a VS command.

(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.

5.11 Bluetooth Performance: Transmitter, EDR(1)

over operating free-air temperature range (unless otherwise noted)

PARAMETER MIN TYP MAX UNIT

EDR output power(2) VBAT ≥3 V(3) 7.2 dBm

VBAT < 3 V(3) 5.2

EDR gain control range 30 dB

EDR power control step 5 dB

EDR adjacent channel power |M-N| = 1 –36 dBc

EDR adjacent channel power |M-N| = 2 –30 dBm

EDR adjacent channel power |M-N| > 2 –42 dBm

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(1) All RF and performance numbers are aligned to the module pin.

(2) Performance values reflect maximum power.

(3) Numbers include XTAL frequency drift over temperature and aging.

5.12 Bluetooth Performance: Modulation, BR(1)

over operating free-air temperature range (unless otherwise noted)

CHARACTERISTICS CONDITION(2) MIN TYP MAX UNIT

BR –20-dB bandwidth 925 995 kHz

BR modulation characteristics

∆f1avg Mod data = 4 1s, 4

0s:

111100001111...

145 160 170 kHz

∆f2max ≥limit for

at least 99.9% of

all Δf2max

Mod data =

1010101... 120 130 kHz

∆f2avg, ∆f1avg 85% 88%

BR carrier frequency drift One-slot packet –25 25 kHz

Three- and five-slot

packet –35 35 kHz

BR drift rate lfk+5 – fkl , k =

0 …. max 15 kHz/50 µs

BR initial carrier frequency tolerance(3) f0–fTX ±75 ±75 kHz

(1) All RF and performance numbers are aligned to the module pin.

(2) Performance values reflect maximum power.

(3) Numbers include XTAL frequency drift over temperature and aging.

5.13 Bluetooth Performance: Modulation, EDR(1)

over operating free-air temperature range (unless otherwise noted)

PARAMETER(2) CONDITION MIN TYP MAX UNIT

EDR carrier frequency stability –5 5 kHz

EDR initial carrier frequency tolerance(3) ±75 ±75 kHz

EDR RMS DEVM EDR2 4% 15%

EDR3 4% 10%

EDR 99% DEVM EDR2 30%

EDR3 20%

EDR peak DEVM EDR2 9% 25%

EDR3 9% 18%

(1) All RF and performance numbers are aligned to the module pin.

(2) BER of 0.1% corresponds to PER of 30.8% for a minimum of 1500 transmitted packets, according to the Bluetooth low energy test

specification.

(3) Sensitivity degradation of up to –3 dB can occur due to fast clock harmonics.

5.14 Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals(1)

over operating free-air temperature range (unless otherwise noted)

PARAMETER CONDITION(2) MIN TYP MAX UNIT

Bluetooth low energy operation frequency

range 2402 2480 MHz

Bluetooth low energy channel spacing 2 MHz

Bluetooth low energy input impedance 50 Ω

Bluetooth low energy sensitivity(3)

Dirty TX on –92.2 dBm

Bluetooth low energy maximum usable input

power –5 dBm

Bluetooth low energy intermodulation

characteristics Level of interferers.

For n = 3, 4, 5 –36 –30 dBm

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Bluetooth low energy Performance: Receiver Characteristics – In-Band Signals(1) (continued)

over operating free-air temperature range (unless otherwise noted)

PARAMETER CONDITION(2) MIN TYP MAX UNIT

Bluetooth low energy C/I performance.

Note: Numbers show wanted signal-to-

interfering-signal ratio. Smaller numbers

indicate better C/I performance.

Image = –1 MHz

low energy, co-channel 12

low energy, adjacent ±1 MHz 0

low energy, adjacent +2 MHz –38

low energy, adjacent –2 MHz –15

low energy, adjacent ≥

|±3|MHz –40

(1) All RF and performance numbers are aligned to the module pin.

(2) Bluetooth low energy power is restricted to comply with the ETSI 10-dBm EIRP limit requirement.

(3) VBAT is measured with an on-chip ADC that has an accuracy error of up to 5%.

5.15 Bluetooth low energy Performance: Transmitter Characteristics(1)

over operating free-air temperature range (unless otherwise noted)

PARAMETER MIN TYP MAX UNIT

Bluetooth low energy RF output power(2) VBAT ≥3 V(3) 7.0 dBm

VBAT < 3 V(3) 7.0

Bluetooth low energy adjacent channel power |M-N| = 2 –51.0 dBm

Bluetooth low energy adjacent channel power |M-N| > 2 –54.0 dBm

(1) All RF and performance numbers are aligned to the module pin.

(2) Performance values reflect maximum power.

(3) Numbers include XTAL frequency drift over temperature and aging.

5.16 Bluetooth low energy Performance: Modulation Characteristics(1)

over operating free-air temperature range (unless otherwise noted)

CHARACTERISTICS CONDITION(2) MIN TYP MAX UNIT

Bluetooth low energy

modulation characteristics

∆f1avg Mod data = four 1s

and four 0s:

111100001111... 240 250 260

kHz

∆f2max ≥limit for at

least 99.9% of all

Δf2max

Mod data = 1010101... 195 215

∆f2avg, ∆f1avg 85% 90%

Bluetooth low energy carrier

frequency drift lf0 – fnl , n = 2,3 …. K –25 25 kHz

Bluetooth low energy drift rate lf1 – f0l and lfn – fn-5l , n = 6,7…. K 15 kHz/50 µs

Bluetooth low energy initial

carrier frequency tolerance(3) fn – fTX ±75 ±75 kHz

(1) The role of Bluetooth in all scenarios except A2DP is slave.

(2) CL1P5 PA is connected to VBAT, 3.7 V.

(3) ACL RX has the same current in all modulations.

(4) Full throughput assumes data transfer in one direction.

5.17 Bluetooth BR and EDR Dynamic Currents

Current is measured at output power as follows: BR at 11.7 dBm; EDR at 7.2 dBm.

USE CASE(1) (2) TYP UNIT

BR voice HV3 + sniff 11.6 mA

EDR voice 2-EV3 no retransmission + sniff 5.9 mA

Sniff 1 attempt 1.28 s 178.0 µA

EDR A2DP EDR2 (master). SBC high quality – 345 kbps 10.4 mA

EDR A2DP EDR2 (master). MP3 high quality – 192 kbps 7.5 mA

Full throughput ACL RX: RX-2DH5(3)(4) 18.0 mA

Full throughput BR ACL TX: TX-DH5(4) 50.0 mA

WL18xx Top Level

Main DC2DC

VBAT

VIO

DC2DC FB

Digital DC2DC

1.8 V 2.2 – 2.7 V

VBAT

VIO_IN

VBAT_IN_MAIN_DC2DC

VBAT_IN_PA_DC2DC

VBAT

MAIN_DC2DC_OUT

DIG_DC2DC_OUT

VDD_DIG

LDO_IN_DIG

PA_DC2DC_OUT

FB_IN_PA_DC2DC

1 V

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Bluetooth BR and EDR Dynamic Currents (continued)

Current is measured at output power as follows: BR at 11.7 dBm; EDR at 7.2 dBm.

USE CASE(1) (2) TYP UNIT

Full throughput EDR ACL TX: TX-2DH5(4) 33.0 mA

Page scan or inquiry scan (scan interval is 1.28 s or 11.25 ms, respectively) 253.0 µA

Page scan and inquiry scan (scan interval is 1.28 s and 2.56 s, respectively) 332.0 µA

(1) CL1p% PA is connected to VBAT, 3.7 V.

(2) Advertising in all three channels, 1.28-s advertising interval, 15 bytes advertise data

(3) Listening to a single frequency per window, 1.28-s scan interval, 11.25-ms scan window

(4) Zero slave connection latency, empty TX and RX LL packets

5.18 Bluetooth low energy Currents

All current measured at output power of 7.0 dBm

USE CASE(1) TYP UNIT

Advertising, not connectable(2) 131 µA

Advertising, discoverable(2) 143 µA

Scanning(3) 266 µA

Connected, master role, 1.28-s connect interval(4) 124 µA

Connected, slave role, 1.28-s connect interval (4) 132 µA

5.19 Timing and Switching Characteristics

5.19.1 Power Management

5.19.1.1 Block Diagram – Internal DC-DCs

The device incorporates three internal DC-DCs (switched-mode power supplies) to provide efficient

internal supplies, derived from VBAT.

Figure 5-1. Internal DC-DCs

5.19.2 Power-Up and Shut-Down States

The correct power-up and shut-down sequences must be followed to avoid damage to the device.

While VBAT or VIO or both are deasserted, no signals should be driven to the device. The only exception is

the slow clock that is a fail-safe I/O.

While VBAT, VIO, and slow clock are fed to the device, but WL_EN is deasserted (low), the device is in

SHUTDOWN state. In SHUTDOWN state all functional blocks, internal DC-DCs, clocks, and LDOs are

disabled.

VBAT / VIO

input

EXT_32K

input

WL_EN

input

Main 1V8 DC2DC

TCXO_CLK_REQ

output

DIG DC2DC

SRAM LDO

Internal power stable = 5 ms

Top RESETZ

4.5 ms delay

>10 µs

>10 µs 4

5 5

>60 µs

VBAT

VIO

EXT_32K

WLEN

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To perform the correct power-up sequence, assert (high) WL_EN. The internal DC-DCs, LDOs, and clock

start to ramp and stabilize. Stable slow clock, VIO, and VBAT are prerequisites to the assertion of one of the

enable signals.

To perform the correct shut-down sequence, deassert (low) WL_EN while all the supplies to the device

(VBAT, VIO, and slow clock) are still stable and available. The supplies to the chip (VBAT and VIO) can be

deasserted only after both enable signals are deasserted (low).

Figure 5-2 shows the general power scheme for the module, including the power-down sequence.

NOTE: 1. Either VBAT or VIO can come up first.

NOTE: 2. VBAT and VIO supplies and slow clock (SCLK), must be stable prior to EN being asserted and at all times

NOTE: when the EN is active.

NOTE: 3. At least 60 µs is required between two successive device enables. The device is assumed to be in

NOTE: shutdown state during that period, meaning all enables to the device are LOW for that minimum duration.

NOTE: 4. EN must be deasserted at least 10 µs before VBAT or VIO supply can be lowered (order of supply turn off

NOTE: after EN shutdown is immaterial).

NOTE: 5. EXT_32K - Fail safe I/O

Figure 5-2. Power-Up System

5.19.3 Chip Top-level Power-Up Sequence

Figure 5-3 shows the top-level power-up sequence for the chip.

Figure 5-3. Chip Top-Level Power-Up Sequence

Completion of Bluetooth firmware initialztion.

Initialization time

Indicates completion of firmware download

and internal initialization

Wake-up time

SLOWCLK

input

WL_EN

input

SDIO_CLK

input

WLAN_IRQ

output

TCXO

input

TCXO_CLK_REQ

output

TXCO_LDO

output

VBAT / VIO

input

NLCP

WLAN_IRQ

output

MCP

Host configures device to

reverse WLAN_IRQ polarity

Wake-up time

Indicates completion of firmware download

and internal initialization

NLCP: trigger at rising edge

MCP: trigger at low level

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5.19.4 WLAN Power-Up Sequence

Figure 5-4 shows the WLAN power-up sequence.

Figure 5-4. WLAN Power-Up Sequence

5.19.5 Bluetooth-Bluetooth low energy Power-Up Sequence

Figure 5-5 shows the Bluetooth-Bluetooth low energy power-up sequence.

Figure 5-5. Bluetooth-Bluetooth low energy Power-Up Sequence

tTHL

tTLH

VIH

VIL VIL

VIH VIH

VOH

Valid

VOL

VDD

VSS

NotValidNotValid

ClockInput

DataOutput

tWL

VOH

VOL

tWH

tODLY(max) tODLY(min)

tTHL tTLH

VIH

VIL VIL

VIH VIH

tIH

tISU

VIH VIH

Valid

VIL VIL

VDD

VSS

NotValid

ClockInput

DataInput

tWL tWH

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(1) To change the data out clock edge from the falling edge (default) to the rising edge, set the configuration bit.

(2) Parameter values reflect maximum clock frequency.

5.19.6 WLAN SDIO Transport Layer

The SDIO is the host interface for WLAN. The interface between the host and the WL18xx module uses

an SDIO interface and supports a maximum clock rate of 50 MHz.

The device SDIO also supports the following features of the SDIO V3 specification:

• 4-bit data bus

• Synchronous and asynchronous in-band interrupt

• Default and high-speed (HS, 50 MHz) timing

• Sleep and wake commands

5.19.6.1 SDIO Timing Specifications

Figure 5-6 and Figure 5-7 show the SDIO switching characteristics over recommended operating

conditions and with the default rate for input and output.

Figure 5-6. SDIO Default Input Timing

Figure 5-7. SDIO Default Output Timing

Table 5-1 lists the SDIO default timing characteristics.

Table 5-1. SDIO Default Timing Characteristics(1)

MIN MAX UNIT

fclock Clock frequency, CLK(2) 0.0 26.0 MHz

DC Low, high duty cycle(2) 40.0% 60.0%

tTLH Rise time, CLK(2) 10.0 ns

tTHL Fall time, CLK(2) 10.0 ns

tISU Setup time, input valid before CLK ↑(2) 3.0 ns

tIH Hold time, input valid after CLK ↑(2) 2.0 ns

tODLY Delay time, CLK ↓to output valid(2) 7.0 10.0 ns

ClCapacitive load on outputs(2) 15.0 pF

tTHL

tTLH

VIH

VIL

VIH VIH

VOH

Valid

VOL

VDD

VSS

NotValidNotValid

ClockInput

DataOutput

tWL

VOH

VOL

tWH

tODLY(max) tOH(min)

VIL

50%VDD

tTHL tTLH

VIH

VIL VIL

VIH VIH

Valid

VIL VIL

VDD

VSS

NotValid

ClockInput

DataInput

tWL tWH

tISU tIH

50%VDD

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5.19.6.2 SDIO Switching Characteristics – High Rate

Figure 5-8 and Figure 5-9 show the parameters for maximum clock frequency.

Figure 5-8. SDIO HS Input Timing

Figure 5-9. SDIO HS Output Timing

Table 5-2 lists the SDIO high-rate timing characteristics.

Table 5-2. SDIO HS Timing Characteristics

MIN MAX UNIT

fclock Clock frequency, CLK 0.0 52.0 MHz

DC Low, high duty cycle 40.0% 60.0%

tTLH Rise time, CLK 3.0 ns

tTHL Fall time, CLK 3.0 ns

tISU Setup time, input valid before CLK ↑3.0 ns

tIH Hold time, input valid after CLK ↑2.0 ns

tODLY Delay time, CLK ↑to output valid 7.0 10.0 ns

ClCapacitive load on outputs 10.0 pF

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5.19.7 HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)

The device includes a UART module dedicated to the Bluetooth shared-transport, host controller interface

(HCI) transport layer. The HCI transports commands, events, and ACL between the Bluetooth device and

its host using HCI data packets ack as a shared transport for all functional blocks except WLAN. Table 5-3

lists the transport mechanism for WLAN and bluetooth audio.

Table 5-3. Transport Mechanism

WLAN SHARED HCI FOR ALL FUNCTIONAL BLOCKS EXCEPT WLAN BLUETOOTH VOICE-AUDIO

WLAN HS SDIO Over UART Bluetooth PCM

The HCI UART supports most baud rates (including all PC rates) for all fast-clock frequencies up to a

maximum of 4 Mbps. After power up, the baud rate is set for 115.2 Kbps, regardless of the fast-clock

frequency. The baud rate can then be changed using a VS command. The device responds with a

Command Complete Event (still at 115.2 Kbps), after which the baud rate change occurs.

HCI hardware includes the following features:

• Receiver detection of break, idle, framing, FIFO overflow, and parity error conditions

• Receiver-transmitter underflow detection

• CTS, RTS hardware flow control

• 4 wire (H4)

Table 5-4 lists the UART default settings.

Table 5-4. UART Default Setting

PARAMETER VALUE

Bit rate 115.2 Kbps

Data length 8 bits

Stop-bit 1

Parity None

5.19.7.1 UART 4-Wire Interface – H4

The interface includes four signals:

• TXD

• RXD

• CTS

• RTS

Flow control between the host and the device is byte-wise by hardware.

When the UART RX buffer of the device passes the flow-control threshold, the buffer sets the UART_RTS

signal high to stop transmission from the host. When the UART_CTS signal is set high, the device stops

transmitting on the interface. If HCI_CTS is set high in the middle of transmitting a byte, the device

finishes transmitting the byte and stops the transmission.

STR-Start-bit; D0..Dn - Data bits (LSB first); PAR - Parity bit (if used); STP - Stop-bit

TX STR D0 D1 D2 Dn PAR STP

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Figure 5-10 shows the UART timing.

Figure 5-10. UART Timing Diagram

Table 5-5 lists the UART timing characteristics.

Table 5-5. UART Timing Characteristics

PARAMETER CONDITION MIN TYP MAX UNIT

Baud rate 37.5 4364 Kbps

Baud rate accuracy per byte Receive-transmit –2.5% 1.5%

Baud rate accuracy per bit Receive-transmit –12.5% 12.5%

t3 CTS low to TX_DATA on 0.0 2.0 µs

t4 CTS high to TX_DATA off Hardware flow control 1.0 Byte

t6 CTS high pulse width 1.0 Bit

t1 RTS low to RX_DATA on 0.0 2.0 µs

t2 RTS high to RX_DATA off Interrupt set to 1/4 FIFO 16.0 Bytes

Figure 5-11 shows the UART data frame.

Figure 5-11. UART Data Frame

tWtW

tCLK

tis tih

top

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5.19.8 Bluetooth Codec-PCM (Audio) Timing Specifications

Figure 5-12 shows the Bluetooth codec-PCM (audio) timing diagram.

Figure 5-12. Bluetooth Codec-PCM (Audio) Master Timing Diagram

Table 5-6 lists the Bluetooth codec-PCM master timing characteristics.

Table 5-6. Bluetooth Codec-PCM Master Timing Characteristics

PARAMETER MIN MAX UNIT

Tclk Cycle time 162.76 (6.144 MHz) 15625 (64 kHz) ns

TwHigh or low pulse width 35% of Tclk min

tis AUD_IN setup time 10.6

tih AUD_IN hold time 0

top AUD_OUT propagation time 0 15

top FSYNC_OUT propagation time 0 15

ClCapacitive loading on outputs 40 pF

Table 5-7 lists the Bluetooth codec-PCM slave timing characteristics.

Table 5-7. Bluetooth Codec-PCM Slave Timing Characteristics

PARAMETER MIN MAX UNIT

Tclk Cycle time 81.38 (12.288 MHz) ns

TwHigh or low pulse width 35% of Tclk min

tis AUD_IN setup time 5

tih AUD_IN hold time 0

tis AUD_FSYNC setup time 5

tih AUD_FSYNC hold time 0

top AUD_OUT propagation time 0 19

ClCapacitive loading on outputs 40 pF

WPA Supplicant

and Wi-Fi Driver

UART Driver

Bluetooth

Stack and Profiles

SDIO Driver

32 kHz

XTAL

VBAT

VIO

32 kHz

Enable

Wi-Fi

SDIO

Bluetooth

UART

Antenna 1

Wi-Fi and Bluetooth

Antenna 2

Wi-Fi

(Optional)

WL1835MOD

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(1) System design power scheme must comply with both peak and average TX bursts.

(2) Peak current VBAT can hit 850 mA during device calibration.

• At wakeup, the WiLink 8 module performs the entire calibration sequence at the center of the 2.4-GHz band.

• Once a link is established, calibration is performed periodically (every 5 minutes) on the specific channel tuned.

• The maximum VBAT value is based on peak calibration consumption with a 30% margin.

6 Detailed Description

The WiLink 8 module is a self-contained connectivity solution based on WiLink 8 connectivity. As the

eighth-generation connectivity combo chip from TI, the WiLink 8 module is based on proven technology.

Figure 6-1 shows a high-level view of the WL1835MOD variant.

Figure 6-1. WL1835MOD High-Level System Diagram

Table 6-1,Table 6-2, and Table 6-3 list performance parameters along with shutdown and sleep currents.

Table 6-1. WLAN Performance Parameters

WLAN(1) CONDITIONS SPECIFICATION (TYP) UNIT

Maximum TX power 1-Mbps DSSS 17.3 dBm

Minimum sensitivity 1-Mbps DSSS –96.3 dBm

Sleep current Leakage, firmware retained 160 µA

Connected IDLE No traffic IDLE connect 750 µA

RX search Search (SISO20) 54 mA

RX current (SISO20) MCS7, 2.4 GHz 65 mA

TX current (SISO20) MCS7, 2.4 GHz, +11.2 dBm 238 mA

Maximum peak current consumption during

calibration(2) 850 mA

Table 6-2. Bluetooth Performance Parameters

BLUETOOTH CONDITIONS SPECIFICATION (TYP) UNIT

Maximum TX power GFSK 11.7 dBm

Minimum sensitivity GFSK –92.2 dBm

Sniff 1 attempt, 1.28 s (+4 dBm) 178 µA

Page or inquiry 1.28-s interrupt, 11.25-ms scan window

(+4 dBm) 253 µA

A2DP MP3 high quality 192 kbps (+4 dBm) 7.5 mA

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Table 6-3. Shutdown and Sleep Currents

PARAMETER POWER SUPPLY CURRENT TYP UNIT

Shutdown mode

All functions shut down VBAT 10 µA

VIO 2

WLAN sleep mode VBAT 160 µA

VIO 60

Bluetooth sleep mode VBAT 110 µA

VIO 60

6.1 WLAN Features

The device supports the following WLAN features:

• Integrated 2.4-GHz power amplifiers (PAs) for a complete WLAN solution

• Baseband processor: IEEE Std 802.11b/g and IEEE Std 802.11n data rates with 20- or

40-MHz SISO and 20-MHz MIMO

• Fully calibrated system (production calibration not required)

• Medium access controller (MAC)

– Embedded ARM®central processing unit (CPU)

– Hardware-based encryption-decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys

– Requirements for Wi-Fi-protected access (WPA and WPA2.0) and IEEE Std 802.11i (includes

hardware-accelerated Advanced Encryption Standard [AES])

• New advanced coexistence scheme with Bluetooth and Bluetooth low energy wireless technology

• 2.4-GHz radio

– Internal LNA and PA

– IEEE Std 802.11b, 802.11g, and 802.11n

• 4-bit SDIO host interface, including high speed (HS) and V3 modes

6.2 Bluetooth Features

The device supports the following Bluetooth features:

• Bluetooth 4.2 secure connection as well as CSA2

• Concurrent operation and built-in coexisting and prioritization handling of Bluetooth and Bluetooth low

energy wireless technology, audio processing, and WLAN

• Dedicated audio processor supporting on-chip SBC encoding + A2DP

– Assisted A2DP (A3DP): SBC encoding implemented internally

– Assisted WB-speech (AWBS): modified SBC codec implemented internally

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6.3 Bluetooth low energy Features

The device supports the following Bluetooth low energy features:

• Bluetooth 4.2 low energy dual-mode standard

• All roles and role combinations, mandatory as well as optional

• Up to 10 low energy connections

• Independent low energy buffering allowing many multiple connections with no affect on BR-EDR

performance

6.4 Device Certification

The WL18MODGB modules from TI (test grades 01, 05, 31, and 35) are certified for FCC, IC, ETSI/CE,

and Japan MIC. Moreover, the module is also Wi-Fi certified and has the ability to request a certificate

transfer for Wi-Fi alliance members. TI customers that build products based on the WL18MODGI device

from TI can save on testing costs and time per product family. Table 6-4 shows the certification list for the

WL18MODGI module.

Table 6-4. Device Certification

Regulatory Body Specification ID (If Applicable)

FCC (USA) Part 15C + MPE FCC RF exposure Z64-WL18SBMOD

ISED (Canada) RSS-102 (MPE) and RSS-247 (Wi-Fi,

Bluetooth) 451I-WL18SBMOD

ETSI/CE (Europe)

EN300328 v2.1.1 (2.4-GHz Wi-Fi, Bluetooth) —

EN301893 v2.1.1 (5-GHz Wi-Fi) —

EN62311:2008 (MPE) —

EN301489-1 v2.1.1 (general EMC) —

EN301489-17 v3.1.1 (EMC) —

EN60950-

1:2006/A11:2009/A1:2010/A12:2011/A2:2013 —

MIC (Japan) Article 49-20 of ORRE 201-135370

6.4.1 FCC Certification and Statement

The WL18MODGB modules from TI are certified for the FCC as a single-modular transmitter. The

modules are FCC-certified radio modules that carries a modular grant. Users are cautioned that changes

or modifications not expressively approved by the party responsible for compliance could void the

authority of the user to operate the equipment.

This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions:

• This device may not cause harmful interference.

• This device must accept any interference received, including interference that may cause undesired

operation of the device.

CAUTION

FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an

uncontrolled environment. End users must follow the specific operating

instructions for satisfying RF exposure limits. This transmitter must not be

colocated or operating with any other antenna or transmitter.

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6.4.2 Innovation, Science, and Economic Development Canada (ISED)

The WL18MODGB modules from TI are certified for IC as a single-modular transmitter. The WL18MODGB

modules from TI meet IC modular approval and labeling requirements. The IC follows the same testing

and rules as the FCC regarding certified modules in authorized equipment. This device complies with

Industry Canada licence-exempt RSS standards.

Operation is subject to the following two conditions:

• This device may not cause interference.

• This device must accept any interference, including interference that may cause undesired operation of

the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de

licence.

L'exploitation est autorisée aux deux conditions suivantes:

• L'appareil ne doit pas produire de brouillage.

• L'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est

susceptible d'en compromettre le fonctionnement.

CAUTION

IC RF Radiation Exposure Statement:

To comply with IC RF exposure requirements, this device and its antenna must

not be colocated or operating in conjunction with any other antenna or

transmitter.

Pour se conformer aux exigences de conformité RF canadienne l'exposition,

cet appareil et son antenne ne doivent pas étre co-localisés ou fonctionnant en

conjonction avec une autre antenne or transmitter.

6.4.3 ETSI/CE

The WL18MODGB modules conform to the EU Radio Equipment Directive. For further detains, see the full

text of the EU Declaration of Conformity for the WL18MODGBWL18MODGB (test grade 01),

WL18MODGB (test grade 05),WL18MODGB (test grade 31), and WL18MODGI (test grade 35) devices.

6.4.4 MIC Certification

The WL18MODGB modules from TI are MIC certified against article 49-20 and the relevant articles of the

Ordinance Regulating Radio Equipment. Operation is subject to the following condition:

• The host system does not contain a wireless wide area network (WWAN) device.

Model: WL18 MODGB

Test Grade:&&

FCC ID: Z64-WL18SBMOD

IC: 451I-WL18SBMOD

LTC: XXXXXXX

R 201-135370

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6.5 Module Markings

Figure 6-2 shows the markings for the TI WiLink 8 module.

Figure 6-2. WiLink 8 Module Markings

Table 6-5 describes the WiLink 8 module markings.

Table 6-5. Description of WiLink™ 8 Module Markings

MARKING DESCRIPTION

WL18 MODGB Model

&& Test grade (for more information, see Section 6.6)

Z64-WL18SBMOD FCC ID: single modular FCC grant ID

451I-WL18SBMOD IC: single modular IC grant ID

LTC (lot trace code): XXXXXXX LTC: Reserved for TI Use

201-135370 R: single modular TELEC grant ID

TELEC compliance mark

CE CE compliance mark

6.6 Test Grades

To minimize delivery time, TI may ship the device ordered or an equivalent device currently available that

contains at least the functions of the part ordered. From all aspects, this device will behave exactly the

same as the part ordered. For example, if a customer orders device WL1801MOD, the part shipped can

be marked with a test grade of 35, 05 (see Table 6-6).

Table 6-6. Test Grade Markings

MARK 1 WLAN BLUETOOTH

0& Tested –

3& Tested Tested

MARK 2 WLAN 2.4 GHz MIMO 2.4 GHz

&1 Tested –

&5 Tested Tested

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6.7 End Product Labeling

These modules are designed to comply with the FCC single modular FCC grant, Z64- WL18SBMOD. The

host system using this module must display a visible label indicating the following text:

Contains FCC ID: Z64-WL18SBMOD

These modules are designed to comply with the IC single modular FCC grant, IC: 451I-WL18SBMOD.

The host system using this module must display a visible label indicating the following text:

Contains IC: 451I-WL18SBMOD

This module is designed to comply with the JP statement, 201-135370. The host system using this module

must display a visible label indicating the following text:

Contains transmitter module with certificate number: 201-135370

6.8 Manual Information to the End User

The OEM integrator must be aware of not providing information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module. The end

user's manual must include all required regulatory information and warnings as shown in this manual.

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7 Applications, Implementation, and Layout

NOTE

Information in the following Applications section is not part of the TI component specification,

and TI does not warrant its accuracy or completeness. TI’s customers are responsible for

determining suitability of components for their purposes. Customers should validate and test

their design implementation to confirm system functionality.

7.1 Application Information

7.1.1 Typical Application – WL1835MODGB Reference Design

Figure 7-1 shows the TI WL1835MODGB reference design.

The value of antenna matching components

is for WL1835MODCOM8B

The value of antenna matching components

is for WL1835MODCOM8B

WLAN/BT Enable Control.

Connect to Host GPIO.

For Debug only

Connect to Host HCI Interface.

Connect to Host BT PCM Bus.

Connect to Host SDIO Interface.

For Debug only

ANT1- WL_2.4_IO2/BT

ANT2- WL_2.4_IO1

WL_IRQ_1V8

WL_SDIO_D3_1V8

WL_SDIO_CLK_1V8

WL_SDIO_D2_1V8

WL_SDIO_D1_1V8

WL_SDIO_D0_1V8

WL_SDIO_CMD_1V8

BT_HCI_RTS_1V8

BT_HCI_CTS_1V8

BT_AUD_CLK

BT_AUD_IN

BT_AUD_OUT

BT_AUD_FSYNC

WL_RS232_TX_1V8

WL_RS232_RX_1V8

BT_HCI_TX_1V8

BT_HCI_RX_1V8

BT_EN

WLAN_EN

SLOW_CLK

VBAT_IN

VIO_IN

0.1uF

0402

TP6

U.FL-R-SMT(10)

U.FL

WL1835MODGB

E-13.4X13.3-N100_0.75-TOP

GPIO9

GPIO12

GPIO11

GPIO10

GND 17

VIO 38

VBAT 47

EXT_32K 36

BT_AUD_FSYNC

BT_AUD_IN

BT_AUD_OUT

BT_AUD_CLK

WL_SDIO_D2

WL_SDIO_CLK

WL_SDIO_D3

WL_SDIO_D0

WL_SDIO_D1

WL_SDIO_CMD

BT_HCI_RTS

BT_HCI_RX

BT_HCI_TX

BT_HCI_CTS

GND

GPIO_4 25

GPIO_2 26

GPIO_1 27

BT_EN_SOC 41

WLAN_IRQ

WLAN_EN_SOC 40

BT_UART_DBG 43

WL_UART_DBG 42

GND G13

GND G14

GND G15

GND G16

GND G9

GND G10

GND 48

GND G11

GND G12

VBAT 46

GND 28

GND G1

GND G2

GND G3

GND G4

GND G5

GND G6

GND G7

GND G8

RF_ANT1 32

GND

GND 20

RESERVED1 21

RESERVED2 22

GND 37

GND 19

RESERVED3

GND G17

GND G18

GND

G19

GND

G20

GND

G21

GND

G22

GND

G23

GND

G24

GND

G25

GND

G26

GND

G27

GND

G28

GND

G29

GND

G30

GND

G31

GND

G32

GND

G33

GND

G34

GND

G35

GND 23

GND

GND 34

GND 29

GND

RF_ANT2 18

GND

GND 31

GND 35

GND

GND 45

GND 44

GND 30

GND 24

GND

GND 39

GND 33

GND

G36

OSC1

1V8 / 32.768kHz

OSC-3.2X2.5

EN 1

VCC 4

OUT

GND

R20

RES1005

TP10

TP7

TP2

TP13

TP5

TP8

C12

0402

10pF

0402

ANT2

ANT016008LCD2442MA1

ANT-N3-1.6X0.8MM-B

FEED

2.4G

C11

1.2pF

0402

NU_10pF

0402

TP4

1uF

0402

1.1nH

0402

0.1uF

0402

TP3

10pF

0402

TP11

U.FL-R-SMT(10)

U.FL

2.2pF

0402

C10

NU_0.3pF

0402

ANT1

ANT016008LCD2442MA1

ANT-N3-1.6X0.8MM-A

FEED

2.4G

C13

8pF

0402

NU_10pF

0402

1.5nH

0402

TP12

10uF

0603

TP1

C14

4pF

0402

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Figure 7-1. TI Module Reference Schematics

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Table 7-1 lists the bill materials (BOM).

Table 7-1. BOM

ITEM DESCRIPTION PART NUMBER PACKAGE REF. QTY MFR

1 TI WL1835 Wi-Fi / Bluetooth module WL1835MODGI 13.4 x 13.3 x 2.0 mm U1 1 TI

2 XOSC 3225 / 32.768 kHz / 1.8 V /

±50 ppm 7XZ3200005 3.2 x 2.5 x 1.0 mm OSC1 1 TXC

3 Antenna / chip / 2.4 and 5 GHz / peak

gain > 5 dBi ANT016008LCD2442MA1 1.6 mm x 0.8 mm ANT1, ANT2 2 TDK

6 Mini RF header receptacle U.FL-R-SMT-1 (10) 3.0 x 2.6 x 1.25 mm J5, J6 2 Hirose

7 Inductor 0402 / 1.1 nH / ±0.05 nH SMD LQP15MN1N1W02 0402 L1 1 Murata

8 Inductor 0402 / 1.5 nH / ±0.05 nH SMD LQP15MN1N5W02 0402 L2 1 Murata

9 Capacitor 0402 / 1.2 pF / 50 V / C0G /

±0.1 pF GJM1555C1H1R2BB01 0402 C11 1 Murata

10 Capacitor 0402 / 2.2 pF / 50 V / C0G /

±0.1 pF GJM1555C1H1R2BB01 0402 C9 1 Murata

11 Capacitor 0402 / 4 pF / 50 V / C0G /

±0.1 pF GJM1555C1H4R0BB01 0402 C14 1 Murata

12 Capacitor 0402 / 8 pF / 50 V / C0G /

±0.1 pF GJM1555C1H8R0BB01 0402 C13 1 Walsin

13 Capacitor 0402 / 10 pF / 50 V / NPO /

±5% 0402N100J500LT 0402 C5, C6 2 Walsin

14 Capacitor 0402 / 0.1 µF / 10 V / X7R /

±10% 0402B104K100CT 0402 C3, C4 1 Walsin

15 Capacitor 0402 / 1 µF / 6.3 V / X5R /

±10% / HF GRM155R60J105KE19D 0402 C1 1 Murata

16 Capacitor 0603 / 10 µF / 6.3 V / X5R /

±20% C1608X5R0J106M 0603 C2 1 TDK

7.1.2 Design Recommendations

This section describes the layout recommendations for the WL1835 module, RF trace, and antenna.

Table 7-2 summarizes the layout recommendations.

Table 7-2. Layout Recommendations Summary

ITEM DESCRIPTION

Thermal

1 The proximity of ground vias must be close to the pad.

2 Signal traces must not be run underneath the module on the layer where the module is mounted.

3 Have a complete ground pour in layer 2 for thermal dissipation.

4 Have a solid ground plane and ground vias under the module for stable system and thermal dissipation.

5 Increase the ground pour in the first layer and have all of the traces from the first layer on the inner layers, if possible.

6 Signal traces can be run on a third layer under the solid ground layer, which is below the module mounting layer.

RF Trace and Antenna Routing

7 The RF trace antenna feed must be as short as possible beyond the ground reference. At this point, the trace starts to radiate.

8 The RF trace bends must be gradual with an approximate maximum bend of 45° with trace mitered. RF traces must not have sharp

corners.

9 RF traces must have via stitching on the ground plane beside the RF trace on both sides.

10 RF traces must have constant impedance (microstrip transmission line).

11 For best results, the RF trace ground layer must be the ground layer immediately below the RF trace. The ground layer must be

solid.

12 There must be no traces or ground under the antenna section.

13 RF traces must be as short as possible. The antenna, RF traces, and modules must be on the edge of the PCB product. The

proximity of the antenna to the enclosure and the enclosure material must also be considered.

AntennasdistanceisHigherthan

halfwavelength.

Antennaplacementon

theedgeoftheboard.

Nosharpcorners. Constant50OHMcontrol

impedanceRF Trace.

Antennasareorthogonal

toeachother.

76.00mm

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Table 7-2. Layout Recommendations Summary (continued)

ITEM DESCRIPTION

Supply and Interface

14 The power trace for VBAT must be at least 40-mil wide.

15 The 1.8-V trace must be at least 18-mil wide.

16 Make VBAT traces as wide as possible to ensure reduced inductance and trace resistance.

17 If possible, shield VBAT traces with ground above, below, and beside the traces.

18 SDIO signals traces (CLK, CMD, D0, D1, D2, and D3) must be routed in parallel to each other and as short as possible (less than

12 cm). In addition, every trace length must be the same as the others. There should be enough space between traces – greater

than 1.5 times the trace width or ground – to ensure signal quality, especially for the SDIO_CLK trace. Remember to keep these

traces away from the other digital or analog signal traces. TI recommends adding ground shielding around these buses.

19 SDIO and digital clock signals are a source of noise. Keep the traces of these signals as short as possible. If possible, maintain a

clearance around them.

7.1.3 RF Trace and Antenna Layout Recommendations

Figure 7-2 shows the location of the antenna on the WL1835MODCOM8B board as well as the RF trace

routing from the WL1835 module (TI reference design). The Pulse multilayer antennas are mounted on

the board with a specific layout and matching circuit for the radiation test conducted in FCC, CE, and IC

certifications.

NOTE

For reuse of the regulatory certification, a trace of 1-dB attenuation is required on the final

application board.

Figure 7-2. Location of Antenna and RF Trace Routing on the WL1835MODCOM8B Board

Follow these RF trace routing recommendations:

• RF traces must have 50-Ωimpedance.

• RF traces must not have sharp corners.

• RF traces must have via stitching on the ground plane beside the RF trace on both sides.

• RF traces must be as short as possible. The antenna, RF traces, and module must be on the edge of

the PCB product in consideration of the product enclosure material and proximity.

Layer1

Layer2(SolidGND)

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7.1.4 Module Layout Recommendations

Figure 7-3 shows layer 1 and layer 2 of the TI module layout.

Figure 7-3. TI Module Layout

Follow these module layout recommendations:

• Ensure a solid ground plane and ground vias under the module for stable system and thermal

dissipation.

• Do not run signal traces underneath the module on a layer where the module is mounted.

• Signal traces can be run on a third layer under the solid ground layer and beneath the module

mounting.

• Run the host interfaces with ground on the adjacent layer to improve the return path.

• TI recommends routing the signals as short as possible to the host.

7.1.5 Thermal Board Recommendations

The TI module uses µvias for layers 1 through 6 with full copper filling, providing heat flow all the way

to the module ground pads.

TI recommends using one big ground pad under the module with vias all the way to connect the pad to

all ground layers (see Figure 7-4).

Module

COM8Board

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Figure 7-4. Block of Ground Pads on Bottom Side of Package

Figure 7-5 shows via array patterns, which are applied wherever possible to connect all of the layers to

the TI module central or main ground pads.

Figure 7-5. Via Array Patterns

Temp

(degC)

Time

(SeC)

Meating Preheat Soldering Cooling

T1 T2

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7.1.6 Baking and SMT Recommendations

7.1.6.1 Baking Recommendations

Follow these baking guidelines for the WiLink 8 module:

• Follow MSL level 3 to perform the baking process.

• After the bag is open, devices subjected to reflow solder or other high temperature processes must be

mounted within 168 hours of factory conditions (< 30°C/60% RH) or stored at <10% RH.

• If the Humidity Indicator Card reads >10%, devices require baking before they are mounted.

• If baking is required, bake devices for 8 hours at 125°C.

7.1.6.2 SMT Recommendations

Figure 7-6 shows the recommended reflow profile for the WiLink 8 module.

Figure 7-6. Reflow Profile for the WiLink 8 Module

Table 7-3 lists the temperature values for the profile shown in Figure 7-6.

Table 7-3. Temperature Values for Reflow Profile

ITEM TEMPERATURE (°C) TIME (s)

Preheat D1 to approximately D2: 140 to 200 T1: 80 to approximately 120

Soldering D2: 220 T2: 60 ±10

Peak temperature D3: 250 maximum T3: 10

NOTE

TI does not recommend the use of conformal coating or similar material on the WiLink 8

module. This coating can lead to localized stress on the WCSP solder connections inside the

module and impact the device reliability. Care should be taken during module assembly

process to the final PCB to avoid the presence of foreign material inside the module.

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8 Device and Documentation Support

8.1 Device Support

8.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES

NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR

SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR

SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

8.1.2 Development Support

TI offers an extensive line of development tools, including tools to evaluate the performance of the

processors, generate code, develop algorithm implementations, and fully integrate and debug software

and hardware modules.

8.1.2.1 Tools and Software

For a complete listing of development-support tools, visit the Texas Instruments WL18xx Wiki. For

information on pricing and availability, contact the nearest TI field sales office or authorized distributor.

Design Kits and Evaluation Modules

AM335x EVM (TMDXEVM3358) The AM335x EVM enables developers to immediately evaluate the

AM335x processor family (AM3351, AM3352, AM3354, AM3356, and AM3358) and begin

building applications, such as portable navigation, portable gaming, and home and building

automation.

AM437x Evaluation Module (TMDSEVM437X) The AM437x EVM enables developers to immediately

evaluate the AM437x processor family (AM4376, AM4377, AM4378, and AM4379 ) and

begin building applications, such as portable navigation, patient monitoring, home and

building automation, barcode scanners, and portable data terminals.

BeagleBone Black Development Board (BEAGLEBK) BeagleBone Black is a low-cost, open source,

community-supported development platform for ARM Cortex-A8 processor developers and

hobbyists. Boot Linux in under 10 seconds and get started on Sitara™ AM335x ARM Cortex-

A8 processor development in less than 5 minutes using just a single USB cable.

WiLink 8 Module 2.4 GHz Wi-Fi + Bluetooth COM8 EVM (WL1835MODCOM8B) The

WL1835MODCOM8 Kit for Sitara EVMs easily enables customers to add Wi-Fi and

Bluetooth technology (WL183x module only) to embedded applications based on TI's Sitara

microprocessors. TI’s WiLink 8 Wi-Fi + Bluetooth modules are precertified and offer high

throughput and extended range along with Wi-Fi and Bluetooth coexistence (WL183x

modules only) in a power-optimized design. Drivers for the Linux and Android high-level

operating systems (HLOSs) are available free of charge from TI for the Sitara AM335x

microprocessor (Linux and Android version restrictions apply).

Note: The WL1835MODCOM8 EVM is one of the two evaluation boards for the TI WiLink 8

combo module family. For designs requiring performance in the 5-GHz band and extended

temperature range, see the WL1837MODCOM8I EVM.

WL18XXCOM82SDMMC Adapter Board The WiLink SDIO board is an SDMMC adapter board and an

easy-to-use connector between the WiLink COM8 EVM (WL1837MODCOM8i and

WL1835MODCOM8B) and a generic SD/MMC card slot on a host processor EVM. The

adapter card enables the WiLink Wi-Fi module to operate over SDIO and provides a UART

connection for Bluetooth technology over an FPC connector or wire cables. In addition, the

adapter is a standalone evaluation platform using TI wireless PC debug tools for any WiLink

module or chip solution with a PCB 100-pin edge connector. This board is designed for use

with various platforms such as the TI Sitara AM335 and AM437.

TI Designs and Reference Designs

The TI Designs Reference Design Library is a robust reference design library spanning analog, embedded

processor, and connectivity. Created by TI experts to help you jumpstart your system design, all TI

Designs include schematics or block diagrams, BOMs, and design files to speed your time to market.

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TI WiLink 8 Wi-Fi/Bluetooth/Bluetooth Smart Audio Multi-Room Cape Reference Design (TIDC-

WL1837MOD-AUDIO-MULTIROOM-CAPE) The TI WiLink 8 WL1837MOD audio cape is

wireless a multi-room audio reference design used with BeagleBone Black featuring the TI

Sitara (AM335x). The WLAN capability of the WiLink 8 device to capture and register precise

arrival time of the connected AP beacon is used to achieve ultra-precise synchronization

between multiple connected audio devices. The WiLink 8 module (WL1837MOD) offers

integrated Wi-Fi/Bluetooth/Bluetooth Smart solution featuring 2.4-GHz MIMO and antenna

diversity on the 5-GHz band. The WiLink 8 module offers a best-in-class audio solution

featuring multi-room, Airplay®receiver, full audio stack streaming, support for online music

services, and much more. This TI Design enables customers to design their own audio

boards with Wi-Fi/Bluetooth/Bluetooth Smart connectivity from our WiLink 8 module

(WL1837MOD) and evaluate audio multi-room software.

2.4-GHz Wi-Fi + Bluetooth Certified Antenna Design on WiLink 1835 Module (TIDC-

WL1835MODCOM8B)

The WiLink 1835 Module Antenna Design is a reference design that combines the

functionalities of the WiLink 8 module with a built-in antenna on a single board, implementing

the module in the way the module is certified. Customers can thus evaluate the performance

of the module through embedded applications, such as home automation and the Internet of

Things that make use of both Wi-Fi and Bluetooth/Bluetooth low energy functionalities found

on the WiLink 1835 module. This antenna design is the same layout used during module

certification, allowing customers to avoid repeated certification when creating their specific

applications.

Smart Home and Energy Gateway Reference Design (TIEP-SMART-ENERGY-GATEWAY) The Smart

Home and Energy Gateway Reference Design provides example implementation for

measurement, management and communication of energy systems for smart homes and

buildings. This example design is a bridge between different communication interfaces, such

as Wi-Fi, Ethernet, ZigBee or Bluetooth, that are commonly found in residential and

commercial buildings. Because objects in homes and buildings are becoming more and more

connected and no single RF standard dominates the market, the gateway design must be

flexible to accommodate different RF standards. This example gateway addresses the

problem by supporting existing legacy RF standards (Wi-Fi, Bluetooth) and newer RF

standards ( ZigBee®and BLE).

Streaming Audio Reference Design (TIDEP0009) The TIDEP0009 Streaming Audio Reference Design

minimizes design time for customers by offering small form factor hardware and major

software components, including streaming protocols and Internet radio services. With this

reference design, TI offers a quick and easy transition path to the AM335x and WiLink 8

platform solution. This proven combination solution provides key advantages in this market

category that helps bring your products to the next level.

Software

WiLink 8 Wi-Fi Driver for Linux OS (WILINK8-WIFI-NLCP) The NLCP package contains the install

package, pre-compiled object and source of the TI Linux Open-Source Wi-Fi image to easily

upgrade the default LINUX EZSDK release with the TI WiLink family NLCP Wi-Fi driver. The

software is built with Linaro GCC 4.7 and can be added to Linux Software Development Kits

(SDKs) that use similar toolchain on other platforms.

Android Development Kit for Sitara Microprocessors (ANDROIDSDK-SITARA) Although originally

designed for mobile handsets, the Android Operating System offers designers of embedded

applications the ability to easily add a high-level OS to their product. Developed in

association with Google, Android delivers a complete operating system that is ready for

integration and production today.

Linux EZ Software Development Kit (EZSDK) for Sitara Processors (LINUXEZSDK-SITARA) Linux

SDKs provide Sitara developers with an easy setup and quick out-of-box experience that is

specific to and highlights the features of TI's ARM processors. Launching demos,

benchmarks, and applications is a snap with the included graphical user interface. The Sitara

Linux SDK also allows developers to quickly start development of their own applications and

easily add them to the application launcher, which can be customized by the developer.

TI Dual-Mode Bluetooth Stack (TIBLUETOOTHSTACK-SDK) TI’s dual-mode Bluetooth stack enables

Bluetooth + Bluetooth low energy and is comprised of single-mode and dual-mode offerings

implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully Bluetooth Special

Interest Group (SIG) qualified, certified and royalty-free, provides simple command line

sample applications to speed development and has MFI capability on request.

X WL18XY XX MOC

Prefix

X= Preproduction

No Prefix = Production Device

WL18XY Family

X = 0/3

Packaging

Package Designator

Model

R = Large Reel

T = Small Reel

MOC = LGA Package

GB = 2.4 GHz Wi-Fi

GI = 5 GHz Wi-Fi

Y = 1/5/7

MOD

Module

MOD = module

0 = WLAN only

3 = Bluetooth, WLAN

1 = 2.4 GHz SISO

5 = 2.4 GHz MIMO

7 = 2.4 GHz MIMO + 5 GHz

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Bluetooth Service Pack for WL18xx (WL18XX-BT-SP) The Bluetooth Service Pack is composed of the

following four files: BTS file (TIInit_11.8.32.bts), ILI file (TIInit_11.8.32.ili), XML

(TIInit_11.8.32.xml), Release Notes Document, and License Agreement Note.

TI Bluetooth Linux Add-On for AM335x EVM, AM437x EVM and BeagleBone with WL18xx and

CC256x (TI-BT-STACK-LINUX-ADDON) The Bluetooth Linux Add-On package contains

the install package, pre-compiled object, and source of the TI Bluetooth Stack and Platform

Manager to easily upgrade the default LINUX EZSDK Binary on a AM437x EVM, AM335x

EVM, or BeagleBone. The software is built with Linaro GCC 4.7 and can be added to Linux

SDKs that use a similar toolchain on other platforms. The Bluetooth stack is fully qualified

(QDID 69886 and QDID 69887), provides simple command line sample applications to

speed development, and has MFI capability on request.

WiLink Wireless Tools for WL18XX Modules (WILINK-BT_WIFI-WIRELESS_TOOLS) The WiLink

Wireless Tools package includes the following applications: WLAN Real-Time Tuning Tool

(RTTT), Bluetooth Logger, WLAN gLogger, Link Quality Monitor (LQM), HCITester Tool

(BTSout, BTSTransform, and ScriptPad). The applications provide all of the capabilities

required to debug and monitor WiLink WLAN/Bluetooth/Bluetooth low energy firmware with a

host, perform RF validation tests, run pretest for regulatory certification testing, and debug

hardware and software platform integration issues.

Development Tools

WiLink 8 Proprietary Wi-Fi Driver – QNX, WinCE, Nucleus RTOS Baseline (WILINK8-WIFI-WAPI-

MCP8, WILINK8-WIFI-MCP8, WILINK8-WIFI-SIGMA-MCP8) The MCP package contains

the install package, precompiled object, and source of the proprietary Wi-Fi driver - QNX,

Nucleus, WinCE as well as ThreadX, FreeRTOS, µC, MQX ,RTX and uITRON RTOS

baseline image to easily integrate the TI WiLink Wi-Fi drivers. The integration is supported

through third party vendors. The WAPI package provides the WPA Supplicant patch to

support WAPI security protocol. The Sigma package provides the required APIs for WL8

code to support automated Sigma certification testing.

8.1.3 Device Support Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. These

prefixes represent evolutionary stages of product development from engineering prototypes through fully

qualified production devices.

Figure 8-1. Device Nomenclature

X Experimental, preproduction, sample or prototype device. Device may not meet all product qualification conditions and

may not fully comply with TI specifications. Experimental/Prototype devices are shipped against the following disclaimer:

“This product is still in development and is intended for internal evaluation purposes.” Notwithstanding any provision to the

contrary, TI makes no warranty expressed, implied, or statutory, including any implied warranty of merchantability of

fitness for a specific purpose, of this device.

null Device is qualified and released to production. TI’s standard warranty applies to production devices.

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8.2 Related Links

Table 8-1 lists quick access links. Categories include technical documents, support and community

resources, tools and software, and quick access to sample or buy.

Table 8-1. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

WL1801MOD Click here Click here Click here Click here Click here

WL1805MOD Click here Click here Click here Click here Click here

WL1831MOD Click here Click here Click here Click here Click here

WL1835MOD Click here Click here Click here Click here Click here

8.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the

respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;

see TI's Terms of Use.

TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster

collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge,

explore ideas and help solve problems with fellow engineers.

TI Embedded Processors Wiki Established to help developers get started with Embedded Processors

from Texas Instruments and to foster innovation and growth of general knowledge about the

hardware and software surrounding these devices.

8.4 Trademarks

WiLink, Sitara, E2E are trademarks of Texas Instruments.

ARM is a registered trademark of ARM Physical IP, Inc.

Airplay is a registered trademark of Apple Inc.

Bluetooth is a registered trademark of Bluetooth SIG.

Android is a trademark of Google, Inc.

IEEE Std 802.11 is a trademark of IEEE.

Linux is a registered trademark of Linus Torvalds.

Wi-Fi is a registered trademark of Wi-Fi Alliance.

ZigBee is a registered trademark of ZigBee Alliance.

All other trademarks are the property of their respective owners.

8.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

8.6 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

e4 e5

d1 e1

432 1

Pin 2 Indicator

Bottom View

Side View Top View

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9 Mechanical, Packaging, and Orderable Information

9.1 TI Module Mechanical Outline

Figure 9-1 shows the mechanical outline for the device.

Figure 9-1. TI Module Mechanical Outline

Table 9-1 lists the dimensions for the mechanical outline of the device.

NOTE

The TI module weighs 0.684 g typical.

Table 9-1. Dimensions for TI Module Mechanical Outline

MARKING MIN (mm) NOM (mm) MAX (mm) MARKING MIN (mm) NOM (mm) MAX (mm)

L (body size) 13.20 13.30 13.40 c2 0.65 0.75 0.85

W (body size) 13.30 13.40 13.50 c3 1.15 1.25 1.35

T (thickness) 1.80 1.90 2.00 d1 0.90 1.00 1.10

a1 0.30 0.40 0.50 d2 0.90 1.00 1.10

a2 0.60 0.70 0.80 e1 1.30 1.40 1.50

a3 0.65 0.75 0.85 e2 1.30 1.40 1.50

b1 0.20 0.30 0.40 e3 1.15 1.25 1.35

b2 0.65 0.75 0.85 e4 1.20 1.30 1.40

b3 1.20 1.30 1.40 e5 1.00 1.10 1.20

c1 0.20 0.30 0.40 e6 1.00 1.10 1.20

2.20±0.7

100.00±1.5

330.00±2.0

5.00°

C0.5

Ao = Bo

Pin 1

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9.2 Tape and Reel Information

Emboss taping specification for MOC 100 pin.

9.2.1 Tape and Reel Specification

Figure 9-2. Tape Specification

Table 9-2. Dimensions for Tape Specification

ITEM W E F P Po P2 Do T Ao Bo Ko

DIMENSION

(mm) 24.00

(±0.30) 1.75

(±0.10) 11.50

(±0.10) 20.00

(±0.10) 4.00

(±0.10) 2.00

(±0.10) 0.35

(±0.05) 13.80

(±0.10) 13.80

(±0.10) 2.50

(±0.10)

Figure 9-3. Reel Specification

Table 9-3. Dimensions for Reel Specification

ITEM W1 W2

DIMENSION (mm) 24.4 (+1.5, –0.5) 30.4 (maximum)

616

1,243

250354

362

572

360

370

856

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9.2.2 Packing Specification

9.2.2.1 Reel Box

The reel is packed in a moisture barrier bag fastened by heat-sealing. Each moisture-barrier bag is

packed into a reel box, as shown in Figure 9-4.

Figure 9-4. Reel Box

The reel box is made of corrugated fiberboard.

9.2.2.2 Shipping Box

Figure 9-5 shows a typical shipping box. If the shipping box has excess space, filler (such as cushion) is

added.

NOTE

The size of the shipping box may vary depending on the number of reel boxes packed.

Figure 9-5. Shipping Box

The shipping box is made of corrugated fiberboard.

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9.3 Packaging Information

The following pages include mechanical, packaging, and orderable information. This information is the

most current data available for the designated devices. This data is subject to change without notice and

revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Product Folder Links: WL1801MOD WL1805MOD WL1831MOD WL1835MOD

WL1801MOD, WL1805MOD, WL1831MOD, WL1835MOD

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PACKAGE OPTION ADDENDUM

Orderable Device Status(1) Package Type Package

Drawing Pins Package Qty Eco Plan(2) Lead/Ball Finish MSL Peak Temp (°C) (3) Op Temp (°C)

WL1801MODGBMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 –20 to 70

WL1801MODGBMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 –20 to 70

WL1805MODGBMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 –20 to 70

WL1805MODGBMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 –20 to 70

WL1831MODGBMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 –20 to 70

WL1831MODGBMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 –20 to 70

WL1835MODGBMOCR ACTIVE QFM MOC 100 1200 Green NiPdAu 250 –20 to 70

WL1835MODGBMOCT ACTIVE QFM MOC 100 250 Green NiPdAu 250 –20 to 70

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS Compliance: This product has an RoHS exemption for one or more subcomponent(s). The product is otherwise considered Pb-Free (RoHS compatible) as defined above.

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

space

Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on

information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.

TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming

materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pads must be soldered to the printed circuit board for thermal and mechanical performance.

PACKAGE OUTLINE

4221006/B 10/2016

www.ti.com

QFM - 2.0 mm max height

QUAD FLAT MODULE

MOC0100A

0.08 C

0.1 C A B

0.05 C

SYMM

13.5

13.3

13.4

13.2

PIN 1

INDEX AREA

2 MAX

60X 0.8

0.7

60X 0.45

0.35

4X 0.8

0.7 36X 1.05

0.95

56X

0.7

7.7

TYP

2X 9.8

2X 12.05

(1.4) TYP

7.7

TYP

2X 9.8

2X 11.95

(1.4) TYP

PIN 2

17 33

G7 G31

G36

G19

NOTES: (continued)

4. This package is designed to be soldered to thermal pads on the board. For more information, see Texas Instruments

literature number SLUA271 (www.ti.com/lit/slua271).

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, it is recommended

that vias under paste be filled, plugged or tented.

EXAMPLE BOARD LAYOUT

4221006/B 10/2016

www.ti.com

QFM - 2.0 mm max height

MOC0100A QUAD FLAT MODULE

SYMM

LAND PATTERN EXAMPLE

SCALE: 8X

2X (11.95)

(12.05)

(1.05) TYP

(1.4) TYP

60X (0.75)

60X (0.4)

56X (0.7)

(1.05) TYP (1.4) TYP

36X (1)

4X (0.75)

17 33

G1 G7 G13 G19 G25 G31

G6 G12 G18 G24 G30 G36

SOLDER MASK

DEFINED

SOLDER MASK DETAILS

0.05 MIN

ALL AROUND

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

(R0.05) TYP

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations..

EXAMPLE STENCIL DESIGN

4221006/B 10/2016

www.ti.com

QFM - 2.0 mm max height

MOC0100A QUAD FLAT MODULE

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

PADS 1, 17, 33, 49, G1-G36

90% PRINTED COVERAGE BY AREA

SCALE: 8X

4X (0.713) 36X (0.95)

SEE DETAIL A

DETAIL A

SCALE 20X DETAIL B

SCALE 20X

SEE DETAIL B

SOLDER

PASTE

SOLDER

MASK

EDGE

METAL UNDER

SOLDER MASK

SOLDER

PASTE

2X (11.95)

G1 G7 G13 G19 G25 G31

(12.05)

(1.05) TYP

(1.4) TYP

60X (0.75)

60X (0.4)

56X (0.7)

(1.05) TYP (1.4) TYP

G6 G12 G18 G24 G30 G36

METAL UNDER

SOLDER MASK

SOLDER

MASK

EDGE

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ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF

MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL

PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM,

INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF

PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL,

DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN

CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN

ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949

and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.

Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such

products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards

and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must

ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in

life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.

Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life

support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all

medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.

TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).

Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications

and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory

requirements in connection with such selection.

Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-

compliance with the terms and provisions of this Notice.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

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