SM72238
www.ti.com
SNVS694C –JANUARY 2011–REVISED APRIL 2013
Micropower Voltage Regulator
Check for Samples: SM72238
1FEATURES DESCRIPTION
The SM72238 is a micropower voltage regulator with
2• Renewable Energy Grade very low quiescent current (75µA typ.) and very low
• High-Accuracy Output Voltage dropout voltage (typ. 40mV at light loads and 380mV
• Ensured 100mA Output Current at 100mA). It is ideally suited for use in battery-
powered systems. Furthermore, the quiescent current
• Extremely Low Quiescent Current of the SM72238 increases only slightly in dropout,
• Low Dropout Voltage prolonging battery life.
• Extremely Tight Load and Line Regulation The SM72238 is available in the surface-mount D-
• Very Low Temperature Coefficient Pak package.
• Use as Regulator or Reference Careful design of the SM72238 has minimized all
• Needs Minimum Capacitance for Stability contributions to the error budget. This includes a tight
• Current and Thermal Limiting initial tolerance (.5% typ.), extremely good load and
line regulation (.05% typ.) and a very low output
• Stable With Low-ESR Output Capacitors voltage temperature coefficient, making the part
(10mΩto 6Ω)useful as a low-power voltage reference.
Block Diagram and Typical Applications
Figure 1. SM72238
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2011–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SM72238
SNVS694C –JANUARY 2011–REVISED APRIL 2013
www.ti.com
Connection Diagrams
Front View
Figure 2. PFM Package
See Package Number NDP0003B
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Input Supply Voltage −0.3 to +30V
Power Dissipation Internally Limited
Junction Temperature (TJ) +150°C
Ambient Storage Temperature −65° to +150°C
Soldering Dwell Time, Temperature Wave 4 seconds, 260°C
Infrared 10 seconds, 240°C
Vapor Phase 75 seconds, 219°C
ESD Rating Human Body Model(3) 2500V
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human Body Model 1.5kΩin series with 100pF.
Operating Ratings(1)
Maximum Input Supply Voltage 30V
Junction Temperature Range, (TJ)(2) −40° to +125°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) Junction-to-case thermal resistance for the PFM package is 5.4°C/W.
2Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: SM72238
SM72238
www.ti.com
SNVS694C –JANUARY 2011–REVISED APRIL 2013
Electrical Characteristics(1)
Parameter Conditions(1) Typ Tested Limit(2) Design Limit(3) Units
3V Versions
Output Voltage TJ= 25°C 3.0 3.030 V max
2.970 V min
−25°C ≤TJ≤85°C 3.0 3.045 V max
2.955 V min
Full Operating Temperature Range 3.0 3.060 V max
2.940 V min
Output Voltage 100µA ≤IL≤100mA, 3.0 3.072 V max
TJ≤TJMAX 2.928 V min
3.3V Versions
Output Voltage TJ= 25°C 3.3 3.333 V max
3.267 V min
−25°C ≤TJ≤85°C 3.3 3.350 V max
3.251 V min
Full Operating Temperature Range 3.3 3.366 V max
3.234 V min
Output Voltage 100µA ≤IL≤100mA 3.3 3.379 V max
TJ≤TJMAX 3.221 V min
5.0V Versions
Output Voltage TJ= 25°C 5.0 5.05 V max
4.95 V min
−25°C ≤TJ≤85°C 5.0 5.075 V max
4.925 V min
Full Operating Temperature Range 5.0 5.1 V max
4.9 V min
Output Voltage 100µA ≤IL≤100mA 5.0 5.12 V max
TJ≤TJMAX 4.88 V min
All Voltage Options
Output Voltage See(4) 50 150 ppm/°C
Temperature Coefficient
Line Regulation(5) (VONOM + 1)V ≤Vin ≤30V(6) 0.04 0.2 % max
0.4 % max
Load Regulation(5) 100µA ≤IL≤100mA 0.1 0.2 % max
0.3 % max
Dropout Voltage(7) IL= 100µA 80 mV max
50 150 mV max
IL= 100mA 450 mV max
380 600 mV max
(1) Unless otherwise specified all limits ensured for VIN = (VONOM + 1)V, IL= 100µA and CL= 1µF. Limits appearing in boldface type apply
over the entire junction temperature range for operation. Limits appearing in normal type apply for TA= TJ= 25°C.
(2) Ensured and 100% production tested.
(3) Ensured but not 100% production tested. These limits are not used to calculate outgoing AQL levels.
(4) Output or reference voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range.
(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specification for thermal regulation.
(6) For IL= 100µA and TJ= 125°C, line regulation is ensured by design to 0.2%. See Typical Performance Characteristics for line regulation
versus temperature and load current.
(7) Dropout Voltage is defined as the input to output differential at which the output voltage drops 100 mV below its nominal value
measured at 1V differential. At very low values of programmed output voltage, the minimum input supply voltage of 2V (2.3V over
temperature) must be taken into account.
Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: SM72238
SM72238
SNVS694C –JANUARY 2011–REVISED APRIL 2013
www.ti.com
Electrical Characteristics(1) (continued)
Parameter Conditions(1) Typ Tested Limit(2) Design Limit(3) Units
Ground Current IL= 100µA 75 120 µA max
140 µA max
IL= 100mA 8 12 mA max
14 mA max
Dropout Ground Current Vin = (VONOM −0.5)V, 110 170 µA max
IL= 100µA 200 µA max
Current Limit Vout = 0 160 200 mA max
220 mA max
Thermal Regulation See(8) 0.05 0.2 %/W
max
Output Noise, CL= 1µF (5V Only) 430 µV rms
10 Hz to 100 kHz CL= 200µF 160 µV rms
CL= 3.3µF 100 µV rms
(Bypass = 0.01µF)
(8) Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a 50mA load pulse at VIN = 30V (1.25W pulse) for T = 10ms.
4Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: SM72238
SM72238
www.ti.com
SNVS694C –JANUARY 2011–REVISED APRIL 2013
Typical Performance Characteristics
Quiescent Current Dropout Characteristics
Figure 3. Figure 4.
Input Current Input Current
Figure 5. Figure 6.
Output Voltage
vs.
Temperature of 3
Representative Units Quiescent Current
Figure 7. Figure 8.
Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: SM72238
SM72238
SNVS694C –JANUARY 2011–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
Quiescent Current Quiescent Current
Figure 9. Figure 10.
Quiescent Current Short Circuit Current
Figure 11. Figure 12.
Dropout Voltage Line Transient Response
Figure 13. Figure 14.
6Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: SM72238
SM72238
www.ti.com
SNVS694C –JANUARY 2011–REVISED APRIL 2013
Typical Performance Characteristics (continued)
Load Transient Response Load Transient Response
Figure 15. Figure 16.
Output Impedance Ripple Rejection
Figure 17. Figure 18.
Ripple Rejection Ripple Rejection
Figure 19. Figure 20.
Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: SM72238
SM72238
SNVS694C –JANUARY 2011–REVISED APRIL 2013
www.ti.com
Typical Performance Characteristics (continued)
Shutdown Threshold Voltage Line Regulation
Figure 21. Figure 22.
Maximum Rated Output Current Thermal Response
Figure 23. Figure 24.
Output Capacitor ESR Range
Figure 25.
8Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: SM72238
SM72238
SM72238
www.ti.com
SNVS694C –JANUARY 2011–REVISED APRIL 2013
APPLICATION HINTS
EXTERNAL CAPACITORS
A 1.0µF (or greater) capacitor is required between the output and ground for stability. Without this capacitor the
part will oscillate. Most types of tantalum or aluminum electrolytics work fine here; even film types work but are
not recommended for reasons of cost. Many aluminum electrolytics have electrolytes that freeze at about −30°C,
so solid tantalums are recommended for operation below −25°C. The important parameters of the capacitor are
an ESR of about 5Ωor less and a resonant frequency above 500kHz. The value of this capacitor may be
increased without limit.
Ceramic capacitors whose value is greater than 1000pF should not be connected directly from the SM72238
output to ground. Ceramic capacitors typically have ESR values in the range of 5 to 10mΩ, a value below the
lower limit for stable operation (see Figure 25).
The reason for the lower ESR limit is that the loop compensation of the part relies on the ESR of the output
capacitor to provide the zero that gives added phase lead. The ESR of ceramic capacitors is so low that this
phase lead does not occur, significantly reducing phase margin. A ceramic output capacitor can be used if a
series resistance is added (recommended value of resistance about 0.1Ωto 2Ω).
At lower values of output current, less output capacitance is required for stability. The capacitor can be reduced
to 0.33µF for currents below 10mA or 0.1µF for currents below 1mA.
Unlike many other regulators, the SM72238 will remain stable and in regulation with no load in addition to the
internal voltage divider. This is especially important in CMOS RAM keep-alive applications.
A 1µF tantalum, ceramic or aluminum electrolytic capacitor should be placed from the SM72238 input to ground
if there is more than 10 inches of wire between the input and the AC filter capacitor or if a battery is used as the
input.
REDUCING OUTPUT NOISE
In reference applications it may be advantageous to reduce the AC noise present at the output. One method is to
reduce the regulator bandwidth by increasing the size of the output capacitor. This is the only way noise can be
reduced but is relatively inefficient, as increasing the capacitor from 1µF to 220µF only decreases the noise from
430µV to 160µV rms for a 100kHz bandwidth at 5V output.
Typical Applications
*Minimum input-output voltage ranges from 40mV to 400mV, depending on load current. Current limit is typically
160mA.
Figure 26. 5 Volt Current Limiter
Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: SM72238
SM72238
www.ti.com
SNVS694C –JANUARY 2011–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 10
Copyright © 2011–2013, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: SM72238
PACKAGE OPTION ADDENDUM
www.ti.com 21-May-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SM72238TD-3.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238
-3.0
SM72238TD-3.3/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238
-3.3
SM72238TD-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238
SM72238TDE-3.0/NOPB ACTIVE TO-252 NDP 3 250 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238
-3.0
SM72238TDE-3.3/NOPB ACTIVE TO-252 NDP 3 250 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238
-3.3
SM72238TDE-5.0/NOPB ACTIVE TO-252 NDP 3 250 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238
SM72238TDX-3.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238
-3.0
SM72238TDX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238
-3.3
SM72238TDX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 21-May-2013
Addendum-Page 2
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SM72238TDE-3.0/NOPB TO-252 NDP 3 250 178.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
SM72238TDE-3.3/NOPB TO-252 NDP 3 250 178.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
SM72238TDE-5.0/NOPB TO-252 NDP 3 250 178.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
SM72238TDX-3.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
SM72238TDX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
SM72238TDX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 29-May-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SM72238TDE-3.0/NOPB TO-252 NDP 3 250 213.0 191.0 55.0
SM72238TDE-3.3/NOPB TO-252 NDP 3 250 213.0 191.0 55.0
SM72238TDE-5.0/NOPB TO-252 NDP 3 250 213.0 191.0 55.0
SM72238TDX-3.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
SM72238TDX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
SM72238TDX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-May-2013
Pack Materials-Page 2
MECHANICAL DATA
NDP0003B
www.ti.com
TD03B (Rev F)
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
