©2004 Fairchild Semiconductor Corporation RFP15N05L, Rev. C
RFP15N05L
15A, 50V, 0.140 Ohm, Logic Level N-
Channel Power MOSFETs
These are N-Channel enhancement mo de sil icon gate
power fiel d effect transistors desig ned fo r applicat ions such
as switching regulators , s witching converters, motor driver s,
relay dri ver s and drivers for high power bipolar s w itchi ng
transistors requiring high speed and low gate drive power.
These types can be ope rated dir ectly from i ntegrated
circuits.
Formerly deve lopmental ty pe TA05 22.
Features
15A, 50V
•r
DS(ON) = 0.140
Design Optimized for 5V Gate D rives
Can be Driv en from QMOS, NMOS , TTL Ci rcuits
Compatible with Autom oti ve Driv e Requirements
SOA is Po wer Dissipation Limited
Nanose cond Switching Speeds
Linear Transfer Characteristics
High Input Impedance
Majority Carrier Device
Related Literature
- TB334 “Guidelin es fo r Sol deri ng Surface Mount
Components to PC Boards”
Symbol
Packaging
JEDEC T O-220AB
Ordering Information
PART NUMBER PACKAGE BRAND
RFP15N05L TO-220AB RFP15N05L
NOTE: When ordering, us e the entire part number.
D
G
S
SOURCE
DRAIN
GATE
DRAIN
(TAB)
Data S heet Janu ary 2004
©2004 Fairchild Semiconductor Corporation RFP15N05L, Rev. C
Absolute Maximum Ratings TC = 25oC, U nless Otherw ise Spe c ifi ed
Parameter Ratings Units
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS 50 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR 50 V
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM 15
40 A
A
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS ±10 V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Above TC = 25oC, Derate Linearly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
0.48 W
W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, TSTG -5 5 to 15 0 oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg 300
260
oC
oC
CAUT ION: Str esses ab ove those l is ted in “ Ab solute Max imum R atings” m ay ca use permanen t dam age t o the device. This i s a st ress onl y rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25oC to 125oC.
Electrical Speci fications TC = 25oC, U nless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Dr ain to Source Breakdown Voltage BVDSS ID = 250µA, VGS = 0V 50 - - V
Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 250µA (Figure 7) 1 - 2 V
Z ero Gat e V ol tag e D rain C urr e nt IDSS VDS = 48V, VDS = 50V - - 1 µA
VDS = 48V, VDS = 50V TC = 125oC--50µA
Ga te t o Sour c e Le ak ag e C urr e nt I GSS VGS = ±10 V, VDS = 0V - - 100 nA
Drain to Source On Resistance (Note 2) rDS(ON) ID = 15A, VGS = 5V (Figures 5, 6) - - 0.140
Input Capacitance CISS VDS = 25V, VGS = 0V, f = 1MHz
(Fi gu r e 8) --900pF
Output Capacitance COSS --450pF
Re ve r s e-Tran s fer C ap ac itance CRSS --200pF
Turn-O n Delay Time td(ON) VDD = 30V, ID = 7.5A, RG = 6.25
(Figure s 10, 11) -1640ns
Rise Time tr- 250 325 ns
Turn-O ff Delay Time td(OFF) - 200 325 ns
Fa ll Time tfVGS = 5V - 225 325 ns
Thermal Resistance Junction to Case RθJC --2.083
oC/W
Source to Drain Diode Specific ations
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drai n Diode Voltage (N ote 2) VSD ISD = 7.5A - - 1.4 V
Diode Reverse Recovery Time trr ISD = 4A, dISD/dt = 100A/µs-225-ns
NOTE:
2. Pulsed: pulse duration = 300µs maximu m, duty cycle = 2%.
3. Repititive rating: pulse width limited by maximum junction temperature.
RFP15N05L
©2004 Fairchild Semiconductor Corporation RFP15N05L, Rev. C
Typical Performance Curves Unless Otherwise Specified
FIGURE 1. NORMALIZED P O WER DISSIPATION vs CASE
TEMPERATURE FIGURE 2. FORWARD BIAS SAFE OPERAT ING AREA
FIGURE 3. S ATURATION CHARACTERISTICS FIGURE 4. TRANSFER CHARA CTERISTICS
FIGURE 5. DRAIN T O SOURCE ON RESISTANCE vs DRAIN
CURRENT FIGURE 6. NORMALIZED DRAIN T O SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
0 50 100 150
0
TC, CASE TEMPERATURE (oC)
POWER DISSIPATION MULTIPLIER
0.2
0.4
0.6
0.8
1.0
1.2
1 10 100 1000
VDS, DRAIN SOURCE VOLTAG E (V)
100
10
1
0
ID, DRAIN CURRENT (A)
OPERATION IN
THIS AREA IS
LIMITED BY rDS(ON)
ID MAX CONTINUOUS
RFP15N06LRFP15N05L
DC OPERATION
CURVES MUST BE
DERATED LINEARLY
WITH INCREASE IN
TEMPERATURE
TC = 25oC
VGS = 10V
012345
VDS, DRAIN TO SOURCE VOLTAGE (V)
40
30
20
10
0
IDS, DRAIN TO SOURCE CURRENT (A)
PULSE DURATION = 80µs
DUTY CYCLE 0.5% MAX
TC = 25oCVGS = 7.5V
VGS = 3.5V
VGS = 3V
VGS = 5V
VGS = 4.5V
VGS = 4V
VGS = 2V
VGS = 2.5V
012345
VGS, GATE TO SOURCE VOLTAGE (V)
16
14
12
10
8
6
4
2
0
IDS, DRAIN TO SOURCE CURRENT
-40oC
125oC
25oC
VDS = 10V
PULSE DURATION = 80µs
DUTY CYCLE 0.5% MAX
125oC-40oC
0 2 4 6 8 10 12 14 16
ID, DRAIN TO SOURCE CURRENT (A)
0
rDS(ON), DRAIN TO SOURCE
ON RESISTANCE ()
VGS = 5V
PULSE DURATION = 80µs
DUTY CYCLE 0.5% MAX
0.3
0.2
0.1
TC = 125oC
25oC
-40oC
VGS = 10V, ID = 15A
2.0
1.5
1
0.5
0
-50 0 50 100 150 200
TJ, JUNCTION TEMPERATURE (oC)
NORMALIZED DRAIN TO SOURCE
ON RESISTANCE
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
RFP15N05L
©2004 Fairchild Semiconductor Corporation RFP15N05L, Rev. C
FIGURE 7. NORMALIZED GATE THRESHOLD V OLTAGE vs
JUNCTION TEMPERATURE FIGURE 8. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
NOTE: Refer to Fairchil d Applicati on Notes AN7 254 and AN7260.
FIGURE 9. NORMALIZED SWITCHING WAVEFORMS FOR CONSTANT GATE CURRENT
Test Circuits and Waveforms
FIGURE 10. SWITCHING TIME TEST CIRCUIT FIGURE 11. RESISTIVE SWITCHING WAVEFORMS
Typical Performance Curves Unless Otherwise Specified (Continued)
VGS = VDS
ID = 250µA
1.4
1.2
1
0.8
0.6
-50 0 50 100 150 200
TJ, JUNCTION TEMPERATURE (oC)
NORMALIZED GATE THRESHOLD
VOLTAGE
1600
1400
1200
1000
800
600
400
200
001020304050
VDS, DRAIN TO SOURCE VOLTAGE (V)
C, CAPACITANCE (pF)
CRSS
COSS
CISS
VGS = 0V, f = 1MHz
CISS = CGS + CGD
CRSS = CGD
COSS CDS + CGD
60
45
30
15
0
10
8
6
4
2
0
GATE SOURCE
VOLTAGE
RL = 4
IG(REF) = 0.5mA
VGS = 5V
DRAIN SOURCE VOLTAGE
DRAIN TO SOURCE VOLTAGE (V)
GATE TO SOURCE VOLTAG E (V)
IG (REF)
IG (ACT)
20 IG (REF)
IG (ACT)
80
t, TIME (µs)
BVDSS
VDD = BVDSS VDD = BVDSS
0.75BVDSS
0.50BVDSS
0.25BVDSS
VGS
RL
RG
DUT
+
-VDD
tON
td(ON)
tr
90%
10%
VDS 90%
10%
tf
td(OFF)
tOFF
90%
50%50%
10% PULSE WIDTH
VGS
0
0
RFP15N05L
©2004 Fairchild Semiconductor Corporation RFP15N05L, Rev. C
FIGURE 12. GATE CHARGE TEST CIRCUIT FIGURE 13. GATE CHARGE WAVEFORMS
Test Circuits and Waveforms (Continued)
RL
VGS +
-
VDS
VDD
DUT
IG(REF)
VDD
Qg(TH)
VGS = 1V
Qg(5)
VGS = 5V
Qg(TOT)
VGS = 10V
VDS
VGS
IG(REF)
0
0
RFP15N05L
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS P ATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
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The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT ST A TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
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