©2004 Fairchild Semiconductor Corporation RFP15N05L, Rev. C
Absolute Maximum Ratings TC = 25oC, U nless Otherw ise Spe c ifi ed
Parameter Ratings Units
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS 50 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR 50 V
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM 15
40 A
A
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS ±10 V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Above TC = 25oC, Derate Linearly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
0.48 W
W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, TSTG -5 5 to 15 0 oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg 300
260
oC
oC
CAUT ION: Str esses ab ove those l is ted in “ Ab solute Max imum R atings” m ay ca use permanen t dam age t o the device. This i s a st ress onl y rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25oC to 125oC.
Electrical Speci fications TC = 25oC, U nless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Dr ain to Source Breakdown Voltage BVDSS ID = 250µA, VGS = 0V 50 - - V
Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 250µA (Figure 7) 1 - 2 V
Z ero Gat e V ol tag e D rain C urr e nt IDSS VDS = 48V, VDS = 50V - - 1 µA
VDS = 48V, VDS = 50V TC = 125oC--50µA
Ga te t o Sour c e Le ak ag e C urr e nt I GSS VGS = ±10 V, VDS = 0V - - 100 nA
Drain to Source On Resistance (Note 2) rDS(ON) ID = 15A, VGS = 5V (Figures 5, 6) - - 0.140 Ω
Input Capacitance CISS VDS = 25V, VGS = 0V, f = 1MHz
(Fi gu r e 8) --900pF
Output Capacitance COSS --450pF
Re ve r s e-Tran s fer C ap ac itance CRSS --200pF
Turn-O n Delay Time td(ON) VDD = 30V, ID = 7.5A, RG = 6.25Ω
(Figure s 10, 11) -1640ns
Rise Time tr- 250 325 ns
Turn-O ff Delay Time td(OFF) - 200 325 ns
Fa ll Time tfVGS = 5V - 225 325 ns
Thermal Resistance Junction to Case RθJC --2.083
oC/W
Source to Drain Diode Specific ations
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drai n Diode Voltage (N ote 2) VSD ISD = 7.5A - - 1.4 V
Diode Reverse Recovery Time trr ISD = 4A, dISD/dt = 100A/µs-225-ns
NOTE:
2. Pulsed: pulse duration = ≤ 300µs maximu m, duty cycle = ≤ 2%.
3. Repititive rating: pulse width limited by maximum junction temperature.
RFP15N05L