1 of 13 082800
FEATURES
32-bit counter
2-wire serial interface
Automatic power-fail detect and switch
circuitry
Power-fail reset output
Low-voltage oscillator operation (1.3V min.)
Trickle charge capability
ORDERING INFORMATION
DS1672X-X
2 2.0V operation
3 3.0V operation
33 3.3V operation
blank 8-pin DIP
S8-pin SOIC
U8-pin µSOP
PIN ASSIGNMENT
PIN DESCRIPTION
VCC, VBACKUP - Power Supply Inputs
GND - Ground
X1, X2 - 32.768 kHz crystal pins
SCL - Serial clock
SDA - Serial data
RST - Reset output
DESCRIPTION
The DS1672 incorporates a 32-bit counter and power monitoring functions. The 32-bit counter is
designed to count seconds and can be used to derive time of da y, week, month, month, and year by using
a software algorithm. A precision temperature-compensated reference and comparator circuit monitors
the status of VCC. When an out-of-tolerance condition occurs, an internal power-fail signal is generated
which forces the r eset to the active stat e. When VCC returns to an in-tolerance condition, the reset signal
is kept in the active state for 250 ms to allow the power supply and processor to stabilize.
OPERATION
The block diagram in Figure 1 shows the main elements of the DS1672. As shown, communications to
and from the DS1672 occur serially over a 2-wire bi-directional bus. The DS1672 operates as a slave
device on the serial bus. Access is obtained b y implementing a START condition and providing a device
identification code followed by a register address. Subsequent registers can be accessed sequentially until
a STOP condition is executed.
DS1672
Low Voltage Serial Timekeeping Chip
PRELIMINARY
1
2
3
4
8
7
6
5
V
CC
RST
SCL
SD
A
X1
X2
VBA
C
K
U
P
GND
DS1672
2 of 13
DS1672 BLOCK DIAGR AM Figure 1
ADDRESS MAP
The counter is accessed by reading or writing the first 4 bytes of the DS1672 (00h - 03h). The control
register and trickle charger are accessed by reading or writing the appropriate register bytes as illustrated
in Figure 2. If the master continues to send or request more data after the address pointer has reached
05h, the address pointer will wrap around to location 00h.
DS1672 REGISTERS Figure 2
AddressB7B6B5B4B3B2B1B0Function
00h Counter
Byte 1
01h Counter
Byte 2
02h Counter
Byte 3
03h Counter
Byte 4
04h EOSC Control
05h TCS TCS TCS TCS DS DS RS RS Trickle
Charger
DATA RETENTION MODE
The device is fully accessible and data can be written and ready only when VCC is greater than VPF.
However, when VCC falls below VPF, (point at which write protection occurs) the internal clock registers
are blocked from any access. If VPF is less than VBACKUP, the device power is switched from VCC to
VBACKUP when VCC drops below VPF. If VPF is greater than VBACKUP, the device power is switched from
VCC to VBACKUP when VCC drops below VBACKUP. The registers are maintained from the VBACKUP source
until VCC is returned to nominal levels.
32-BIT
COUNTER
(4 BYTES)
SERIAL BUS
INTERFACE
OSCILLATOR
AND DIVIDER
POWER
CONTROL
ADDRESS
REGISTER
CONTROL
LOGIC
VCC
VBACKUP
GND
SCL
SDA
CONTROL
TRICKLE CHARGER
X1 X2
RST
DS1672
3 of 13
OSCILLATOR CONTROL
The EOSC bit (bit 7 of the control register) controls the oscillator when in back-up mode. This bit when
set to logic 0 will start the oscillator. When this bit is set to a logic 1, the oscillator is stopped and the
DS1672 is placed into a low-power standby mode with a current drain of less than 200 nanoamps when in
back-up mode. When the DS1672 is powered by VCC, the oscillator is always on regardless of the status
of the EOSC bit; however, the counter is incremented only when EOSC is a logic 0.
CRYSTAL SELECTION
A standard 32.768 kHz quartz crystal should be directly connected to the X1 and X2 oscillator pins. The
crystal selected for use should have a specified load capacitance (CL) of 6 pF. For more information on
crystal selection and crystal layout considerations, please consult Application Note 58, “Crystal
Considerations with Dallas Real Time Clocks.”
MICROPROCESSOR MON ITOR
A temperature-compensated comparator circuit monitors the level of VCC. When VCC falls to the power-
fail trip point, the RST signal (ope n drain) is pulled active. When VCC returns to nominal levels, the RST
signal is kept in the active state for 250 ms (typically) to allow the power supply and microprocessor to
stabilize. Note, however, that if the EOSC bit is set to a logic 1 (to disable the oscillator during write
protection), the reset signal will be kept in an active state for 250 ms plus the start-up time of the
oscillator.
TRICKLE CHARGER
The trickle charger is controlled by the trickle charge register. The simplified schematic of Figure 3
shows the basic components of the trickle charger. The trickl e charge select (TCS) bit (bits 4-7) controls
the selection of the trickle charger. In order to prevent accidental enabling, only a pattern on 1010 will
enable the trickle charger. All other patterns will disable the trickle charger. The DS1672 powers up
with the trickle charger disabled. The diode select (DS) bits (bits 2-3) select whether or not a diode is
connected betwe en VCC and VBACKUP. If DS is 01, no diode is selected or if DS is 10, a diode is sel ected.
The RS bits (bits 0-1) select whet her a r esistor i s connected b et ween VCC and VBACKUP and what the valu e
of the resistor is. The resistor selected by the resistor select (RS) bits and the diode selected by the diode
select (DS) bits are as follows:
TCS TCS TCS TCS DS DS RS RS Function
XXXX 0 0 XXDisabled
XXXX 1 1 XXDisabled
XXXX XX0 0 Disabled
1010 0101No diode, 100 resistor
1010 1001One diode, 100 resistor
1010 0110No diode, 2 k resistor
1010 1010One diode, 2 k resistor
1010 0111No diode, 4 k resistor
1010 1011One diode, 4 k resistor
DS1672
4 of 13
Diode and resistor selection is determined by the user according to the maximum current desired for
battery or super cap charging. The maximum charging current can be calculated as illustrated in the
following example. Assume that a system power supply of 3 volt is applied to VCC and a super cap is
connected to VBACKUP. Also assume that the trickle charger has been enabled with a diode and resistor R2
between VCC and VBACKUP. The maximum current Imax would therefore be calculated as follows:
Imax = (3.0V – diode drop) / R2
~ (3.0V – 0.7V) / 2 k
~ 1.2 mA
Obviously, as the super cap changes, the voltage drop between VCC and VBACKUP will decrease and
therefore the charge current will decrease.
DS1672 PROGRAM MABLE TRICKLE CHARGER Figure 3
1 OF 16 SELECT
NOTE: ONLY 1010 ENABLES 1 OF 2
SELECT 1 OF 3
SELECT
TCS TCS TCS TCS DS DS RS RS
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
100
R1
R2
TRICKLE CHARGE REGISTER
TCS = TRICKLE CHARGER SELECT
DS = DIODE SELECT
RS = RESISTOR SELECT
VCC VBACKUP
2k
R3
4k
DS1672
5 of 13
2-WIRE SERIAL DATA BUS
The DS1672 supports a bi-directional 2-wire bus and data transmission protocol. A device that sends
data onto the bus is defined as a transmitter and a device receiving data as a receiver. The device that
controls the message is called a “mast er." The d evices that are cont rolled b y the master ar e “slaves. ” The
bus must be controlled by a master device which generates the serial clock (SCL), controls the bus access,
and generates the START and STOP conditions. The DS1672 operates as a slave on the 2-wire bus.
Connections to the bus are made via the open-drain I/O lines SDA and SCL.
The following bus protocol has been defined (see Figure 4).
Data transfer may be initiated only when the bus is not busy.
During data transfer, the data line must remain stable whenever the clock line is HIGH. Changes in the
data line while the clock line is high will be interpreted as control signals.
Accordingly, the following bus conditions have been defined:
Bus not busy: Both data and clock lines remain HIGH.
Start data transf er: A change in the state of the data line from high to low, while the clock line is high,
defines a START condition.
Stop data transfer: A change in the state of the data line from low to high, while the clock line is high,
defines a STOP condition.
Data valid: The state of the data line represents valid data when, after a START condition, the data line
is stable for the duration of the high period of the clock signal. The data on the line must be changed
during the low period of the clock signal. There is one clock pulse per bit of data.
Each data transfer is initiated with a START condition and terminated with a STOP condition. The
number of data bytes transferred between the START and the STOP conditions is not limited, and is
determined by the master device. The information is transferred byte-wise and each receiver
acknowledges with a ninth bit.
Acknowledge: Each receiving device, when addressed, is obliged to generate an acknowledge after the
reception of each byte. The master device must generate an extra clock pulse which is associated with
this acknowledge bit.
A device that acknowledges must pull down the SDA line during the acknowl edge clock pulse in such a
way that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into account. A master must signal an end of d ata to the slave
by not generating an acknowledge bit on the last byte that has be en clocked out of the slave. In this case,
the slave must leave the data line HIGH to enable the master to generate the STOP condition.
DS1672
6 of 13
DATA TRANSFER ON 2-WIRE SERIAL BUS Figure 4
MSB slave address R/W
direction
bit
SDA
SCL
START
CONDITION
12 6789 12 89
STOP CONDITION
OR
REPEATED
START CONDITION
3 - 8
acknowledgement
signal from receiver
acknowledgement
signal from receiver
ACK ACK
repeated if more bytes
are transferred
Figures 5 and 6 detail how data transfer is accomplished on the 2-wire bus. Dependin g upon the state of
the R/W bit, two types of data transfer are possible:
1. Data transfer from a master transmitter to a slave receiver. The first byte transmitted by the
master is the slave address. Next follows a number of data bytes. The slave returns an acknowled ge
bit after each received byte.
2. Data transfer from a slave transmitter to a master receiver. The first byte (the slave address) is
transmitted by the master. The slave then returns an acknowledge bit. Nex t follows a number of data
bytes transmitted by the slave to the master. The master returns an acknowle dge bit after all received
bytes other than the last byte. At the end of the last received byte, a ‘not acknowledge’ is returned.
The master device generates all of the serial clock pulses and the START and STOP conditions. A
transfer is ended with a STOP condition or with a repeated START condition. Since a repeated START
condition is also the beginning of the next serial transfer, the bus will not be released.
The DS1672 may operate in the following two modes:
1. Slave receiver mode (DS1672 write mode): Serial data and clock are received through SDA and
SCL. After each byte is received, an acknowledge bit is transmitted. START and STOP conditions
are recognized as the beginning and end of a serial transfer. Address recognition is performed by
hardware after reception of the slave address and direction bit. The address byte is the first byte
received after the START condition is generated by the master. The address byte contains the 7-bit
DS1672 address, which is 1101000, followed by the direction bit (R/W), which for a write is a 0.
After receiving and decoding the address byte the DS1672 outputs an acknowledge on the SDA line.
After the DS1672 acknowledges the slave address + write bit, the master transmits a register address
to the DS1672. This will set the register pointer on the DS1672. The master will then begin
transmitting each byte of data with the DS1672 acknowledging each byte received. The master will
generate a STOP condition to terminate the data write.
2. Slave transmitter mode (DS1672 read mode): The first b yte is received and handled as in the slave
receiver mode. However, in this mode, the direction bit will indicate that the transfer direction is
reversed. Serial data is transmitted on SDA by the DS1672 while the serial clock is input on SCL.
START and STOP conditions are recognized as the beginning and end of a serial transfer. Address
recognition is performed by hardware after reception of the slave address and direction bit. The
address byte is the first byte received after the START condition is generated by the master. The
address byte contains the 7-bit DS1672 address, which is 1101000, followed by the direction bit
DS1672
7 of 13
(R/W), which for a read is a 1. After receiving and decoding the address b yte the DS1672 inputs an
Acknowledge on the SDA line. The DS1672 then begins to transmit data starting with the register
address pointed to b y the register pointer. If the register pointer is not written to before the initiation
of a read mode the first address that is r ead is the last one store d in the register pointer. The DS1672
must receive a not acknowledge to end a read.
DATA WRITE – SLAVE RECEIVER MO DE Figure 5
DATA READ SLAVE TRAN SMIT TER MODE Figure 6
DS1672
8 of 13
ABSOLUTE MAXIMUM RA TINGS*
Voltage on Any Pin Relative to Ground -0.3V to +6.0V
Operating Temperature -40°C to +85°C
Storage Temperat ure -55°C to +125°C
Soldering Temperature See J-STD-020A specification
* This is a stress rating only and functional operation of the d evice at these or an y other conditions above
those indicated in the operation sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods of time may affect reliability.
RECOMMENDED DC OPERATING CONDITI ONS (-40°C to +85 °C)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
VCC 2.97 3.3 3.63 V 1
VCC 2.7 3.0 3.3 V 1
Supply Voltage (DS1672-33)
(DS1672-3)
(DS1672-2) VCC 1.8 2.0 2.2 V 1
Logic 1 VIH 0.7VCC VCC + 0.5 V 1
Logic 0 VIL -0.5 0.3VCC V1
Backup Supply Voltage VBACKUP 1.3 3.6 V 1
DC ELECTRICAL CHARACTERISTICS
DS1672-33 (-40°C to +85°C; VCC = 2.97 to 3.63V)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Active Supply Current ICCA 2mA7
Standby Current ICCS 500 µA8
Power-Fail Voltage VPF 2.80 2.88 2.97 V 1
DC ELECTRICAL CHARACTERISTICS
DS1672-3 (-40°C to +85 °C; VCC = 2.7 to 3.3V)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Active Supply Current ICCA 2mA7
Standby Current ICCS 500 µA9
Power-Fail Voltage VPF 2.5 2.6 2.7 V 1
DC ELECTRICAL CHARACTERISTICS
DS1672-2 (-40°C to +85 °C; VCC = 1.8 to 2.2V)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Active Supply Current ICCA 2mA7
Standby Current ICCS 500 µA10
Power-Fail Voltage VPF 1.6 1.7 1.8 V 1
DC ELECTRICAL CHARACTERISTICS (-40°C to +85 °C; VCC < VPF)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Timekeeping Current IOSC 1µA12
Backup Standby Current
(Oscillator Off) IBACKUP 200 nA 13
DS1672
9 of 13
AC ELECTRICAL CHARACTERIST IC S (-40°C to +85 °C; VCC > VPF)
PARAMETER SYMBOL CONDITION MIN TYP MAX UNITS NOTES
Fast Mode 100 400SCL Clock
Frequency fSCL
Standard Mode 100
kHz
Fast Mode 1.3Bus Free Time
Between a STOP
and START
Condition
tBUF
Standard Mode 4.7 µs
Fast Mode 0.6Hold Time
(Repeated) START
Condition
tHD:STA
Standard Mode 4.0 µs2
Fast Mode 1.3LOW Period of
SCL Clock tLOW Standard Mode 4.7 µs
Fast Mode 0.6HIGH Period of
SCL Clock tHIGH Standard Mode 4.0 µs
Fast Mode 0.6Set-up Time for a
Repeated START
Condition
tSU:STA
Standard Mode 4.7 µs
Fast Mode 0 0.9Data Hold Time tHD:DAT Standard Mode 0 µs3, 4
Fast Mode 100Data Set-up Time tSU:DAT Standard Mode 250 µs11
Fast Mode 20 + 0.1CB300Rise Time of Both
SDA and SCL
Signals
tR
Standard Mode 1000
ns 5
Fast Mode 20 + 0.1CB300Fall Time of Both
SDA and SCL
Signals
tF
Standard Mode 300
ns 5
Fast Mode 0.6Set-up Time for
STOP Condition tSU:STO Standard Mode 4.0 µs
Capacitive Load fo r
each Bus Line CB400 pF 5
I/O Capacitance CI/O 10 pF
DS1672
10 of 13
Timing Diagram Figure 7
SCL
START
SDA
STOP
tBUF
REPEATED
START
tHD:STA
tLOW
tHD:STA
tHD:DAT tSU:DAT
tHIGH tSU:STA
tF
tSU:STO
POWER-UP/DOWN TIMI NG Figure 8
OUTPUTS
VCC
VPF(max)
INPUTS
HIGH-Z
RST
DON'T CARE
VALID
RECOGNIZED RECOGNIZED
VALID
tRPD
VPF(min)
tF
tPD
tR
tRPU
DS1672
11 of 13
POWER-UP DOWN CHARACTERISTICS (-40°C to +85 °C)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
VCC Detect to RST (VCC Falling) tRPD 10 µs
VCC Detect to RST (VCC Rising) tRPU 250 ms 6
VCC Fall Time; VPF(MAX) to VPF(MIN) tF300 µs
VCC Rise Time; VPF(MIN) to VPF(MAX) tR0µs
WARNING:
Under no circumstances are negative undershoots, of any amplitude, allowed when device is in write
protection.
NOTES:
1. All voltages are referenced to ground.
2. After this period, the first clock pulse is generated.
3. A device must internally provide a hold time of at least 300 ns for the SDA signal (referenced to the
VIHMIN of the SCL signal) in order to bridge the undefined region of the falling edge of SCL.
4. The maximum tHD:DAT has onl y to be met if the d evice does not stretch the LOW period (tLOW) o f the
SCL signal.
5. CB - total capacitance of one bus line in pF.
6. If t he EOSC bit in the Control Register is set to logic 1, tRPU is equal to 250 ms plus the start-up time
of the crystal oscillator.
7. ICCA specified with SCL clocking at max frequency (400 kHz).
8. ICCS specified with VCC = 3.3V and SDA, SCL=3.3V.
9. ICCS specified with VCC = 3.0V and SDA, SCL=3.0V.
10. ICCS specified with VCC = 2.0V and SDA, SCL=2.0V.
11. A fast mode device can be used in a standard mode s ystem, but the requirement tSU:DAT >= to 250 ns
must then be met. This will automatically be the case if the device does not stretch the LOW period
of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the
next data bit to the SDA line tR max + tSU:DAT = 1000+250 = 1250 ns before the SCL line is released.
12. IOSC specified with VCC = 0V, VBACKUP =3.6V and oscillator enabled.
13. IBACKUP specified with VCC = 0V, VBACKUP =3.6V and oscillator disabled.
DS1672
12 of 13
8-PIN DIP
PKG 8-PIN
DIM MIN MAX
A IN.
MM 0.360
9.14 0.400
10.16
B IN.
MM 0.240
6.10 0.260
6.60
C IN.
MM 0.120
3.05 0.140
3.56
D IN.
MM 0.300
7.62 0.325
8.26
E IN.
MM 0.015
0.38 0.040
1.02
F IN.
MM 0.120
3.04 0.140
3.56
G IN.
MM 0.090
2.29 0.110
2.79
H IN.
MM 0.320
8.13 0.370
9.40
J IN.
MM 0.008
0.20 0.012
0.30
K IN.
MM 0.015
0.38 0.021
0.53
DS1672
13 of 13
8-PIN SOIC (150-MIL)
PKG 8-PIN
(150-MIL)
DIM MIN MAX
A IN.
MM 0.188
4.78 0.196
4.98
B IN.
MM 0.150
3.81 0.158
4.01
C IN.
MM 0.048
1.22 0.062
1.57
E IN.
MM 0.004
0.10 0.010
0.25
F IN.
MM 0.053
1.35 0.069
1.75
G IN.
MM 0.050 BSC
1.27 BSC
H IN.
MM 0.230
5.84 0.244
6.20
J IN.
MM 0.007
0.18 0.011
0.28
K IN.
MM 0.012
0.30 0.020
0.51
L IN.
MM 0.016
0.41 0.050
1.27
phi