Surface mount capacitors
1.1 - Production process owchart 1.2 - Syfer reliability grades
1.1 to 1.3
Internal inspection
Rumble
Multilayer build
(wet process)
Fire
Ceramic powder
preparation
Electrode ink
material
Termination
Electrical test
Test verification
Packaging
Finished goods store
Plating
(if specified)
QC inspection
Additional Hi Rel
activities
(S02A & S05
100% burn-in, QC insp)
Additional sample
Rel tests
(if specified)
Printing
(if specified)
Standard components
MIL Grade(2)
IECQ-CECC(3)
AEC-Q200(4)
Space
Grade
ESCC 3009(1)
Standard
reliability
High reliability
(space quality)
1.3 - Syfer reliability surface mount product
groups
Standard FlexiCap
TM
capacitors(3)
Open Mode
FlexiCap
TM
capacitors(2)
Tandem
FlexiCap
TM
capacitors(1)
Standard
reliability
High reliability
Standard MLC capacitor(4)
Notes:
(1) “Tandem” construction capacitors, ie internally having the
equivalent of 2 series capacitors. If one of these should fail
short-circuit, there is still capacitance end to end and the chip will
still function as a capacitor, although capacitance maybe affected.
Refer to application note AN0021. Also available qualied to
AEC-Q200.
(2) “Open Mode” capacitors with FlexiCapTM termination also reduce
the possibility of a short circuit by utilising inset electrode margins.
Refer to application note AN0022. Also available qualied to
AEC-Q200.
(3) Multilayer capacitors with Syfer FlexiCapTM termination. By using
FlexiCapTM termination, there is a reduced possibility of the
mechanical cracking occurring.
(4) “Standard” capacitors includes MLCCs with tin nish over nickel,
but no FlexiCapTM.
Notes:
(1) Space grade tested in accordance with ESCC 3009. Refer to Syfer
specication S02A 0100.
(2) MIL Grade. Released in accordance with US standards available on
request.
(3) IECQ-CECC. The International Electrotechnical Commission (IEC)
Quality Assessment System for Electronic Components. This is an
internationally recognised product quality certication which
provides customers with assurance that the product supplied
meets high quality standards.
View Syfer’s IECQ-CECC approvals at http://www.iecq.org or at
www.syfer.com
(4) AEC-Q200. Automotive Electronics Council Stress Test Qualication
For Passive Components. Refer to Syfer application note reference
AN0009.
4
Surface mount capacitors1.4
1.4 - FlexiCap™ termination
MLCCs are widely used in electronic circuit design for a
multitude of applications. Their small package size, technical
performance and suitability for automated assembly makes
them the component of choice for the specier.
However, despite the technical benets, ceramic components
are brittle and need careful handling on the production oor.
In some circumstances they may be prone to mechanical
stress damage if not used in an appropriate manner. Board
exing, depanelisation, mounting through hole components,
poor storage and automatic testing may all result in cracking.
Careful process control is important at all stages of circuit
board assembly and transportation - from component
placement to test and packaging. Any signicant board exing
may result in stress fractures in ceramic devices that may
not always be evident during the board assembly process.
Sometimes it may be the end customer who nds out - when
equipment fails!
Syfer has the solution - FlexiCap™
FlexiCapTM has been developed as a result of listening to
customers’ experiences of stress damage to MLCCs from
many manufacturers, often caused by variations in production
processes.
Our answer is a proprietary exible epoxy polymer termination
material, that is applied to the device under the usual nickel
barrier nish. FlexiCapTM will accommodate a greater degree
of board bending than conventional capacitors.
Syfer FlexiCap™ termination
All ranges are available with FlexiCap™ termination material
offering increased reliability and superior mechanical
performance (board ex and temperature cycling) when
compared with standard termination materials. Refer to Syfer
application note reference AN0001. FlexiCap™ capacitors
enable the board to be bent almost twice as much before
mechanical cracking occurs. Refer to application note AN0002.
FlexiCap™ is also suitable for Space applications having
passed thermal vacuum outgassing tests. Refer to Syfer
application note reference AN0026.
Fired ceramic
dielectric
FlexiCap
TM
termination
base
Intermediate
nickel layer
Tin outer
layer
Metal
electrodes
FlexiCap
TM
MLCC cross section
Application notes
FlexiCapTM may be handled, stored and transported in
the same manner as standard terminated capacitors. The
requirements for mounting and soldering FlexiCapTM are the
same as for standard SMD capacitors.
For customers currently using standard terminated capacitors
there should be no requirement to change the assembly
process when converting to FlexiCapTM.
Based upon board bend tests in accordance with IEC 60384-1
the amount of board bending required to mechanically crack
a FlexiCapTM terminated capacitor is signicantly increased
compared with standard terminated capacitors.
It must be stressed however, that capacitor users must not
assume that the use of FlexiCapTM terminated capacitors will
totally eliminate mechanical cracking. Good process controls
are still required for this objective to be achieved.
● Picture taken at
1,000x magnification
using a SEM
to demonstrate the
fibrous nature of the
FlexiCapTM termination
that absorbs increased
levels of mechanical
stress.
Available on the following ranges:
● All High Reliability ranges
● Standard and High Voltage chips
● Surge Protection and Safety capacitor chips
● 3 terminal EMI chips
● X2Y Integrated Passive Components
● X8R High Temperature capacitors
Summary of PCB bend test results
The bend tests conducted on X7R have proven that
the FlexiCapTM termination withstands a greater level of
mechanical stress before mechanical cracking occurs.
The AEC-Q200 test for X7R requires a bend level of 2mm
minimum and a cap change of less than 10%.
Product
X7R
Typical bend performance under
AEC-Q200 test conditions
Standard termination 2mm to 3mm
FlexiCap™ Typically 8mm to 10mm
FlexiCap™ benets
With traditional termination materials and assembly, the chain
of materials from bare PCB to soldered termination, provides
no exibility. In circumstances where excessive stress is
applied - the weakest link fails. This means the ceramic itself,
which may fail short circuit.
The benet to the user is to facilitate a wider process window
- giving a greater safety margin and substantially reducing the
typical root causes of mechanical stress cracking.
FlexiCapTM may be soldered using your traditional wave
or reow solder techniques and needs no adjustment to
equipment or current processes.
Syfer has delivered millions of FlexiCapTM components and
during that time has collected substantial test and reliability
data, working in partnership with customers world wide, to
eliminate mechanical cracking.
An additional benet of FlexiCap™ is that MLCCs can
withstand temperature cycling -55ºC to 125ºC in excess of
1,000 times without cracking.
5
Surface mount capacitors 1.5 to 1.7
1.7 - RoHS compliance
All Syfer surface mount capacitors (excluding Sn/Pb plated)
are compliant with the EU RoHS directive. Breakdown of
materials content is available on request.
Syfer reliability SM product group
Standard
SM
capacitors
IECQ-CECC AEC-Q200 MIL - PRF
55681(1)
S (space grade) High Rel
S05 S02A (3)
Solderability ●●●●●●
Resistance to soldering heat ●●●●●●
Plating thickness verication (if plated) ●●●●●●
Destructive Physical Analysis (DPA) ●●●●●●
Voltage proof test (DWV / Flash) ●●●●●●
Insulation Resistance ●●●●●●
Capacitance test ●●●●●●
Dissipation Factor test ●●●●●●
100% visual inspection m m ● m ● ●
100% burn-in(2). (2xRV @125ºC for 100 hours) m m m ● - -
100% burn-in(2). (2xRV @125ºC for 168 hours) mmm -● ●
Load sample test @ 125ºC. (Life at elevated
temperature test). mmmmmLAT1 & LAT2
(1000 hours)
Humidity sample test. 85ºC/85%RH mmmmm240 hours
Hot IR sample test m m m ● m m
Axial pull sample test (MIL-STD-123) mmmmmm
Breakdown voltage sample test mmmmmm
Deection (bend) sample test mmmmmm
SAM (Scanning Acoustic Microscopy) mmmmmm
LAT1 (4 x adhesion, 8 x rapid temp change + LAT2 and
LAT3) -----m
LAT2 (20 x 1000 hour life test + LAT3) - - - - - m
LAT3 (6 x TC and 4 x solderability) - - - - - m
● Test conducted as standard.
m Optional test. Please discuss with Syfer Sales.
Notes:
1) In accordance with MIL-PRF-55681 group A. Additional optional tests available.
2) Burn-in also referred to as Voltage conditioning.
3) In accordance with ESCC 3009.
1.5 - Tests conducted during
batch manufacture
1.6 - Precious Metal Electrodes Vs. Base
Metal Electrodes
Multilayer ceramic capacitors typically require sintering temperatures
in excess of 1000ºC, which presents no problems to capacitors that
employ a Precious Metal Electrode (PME) system. However, for Base
Metal Electrode (BME) systems additional processes are required,
including the use of a reducing atmosphere to prevent oxidation of the
electrodes.
Despite the manufacturing problems, BME multilayer ceramic
capacitors have proven to be a good choice for commercial products as
they have reasonable electrical properties and life expectancy and can
be used for some high reliability applications when properly qualied
and screened.
At Syfer Technology we have been developing PME systems for over
thirty years and use them exclusively for all our product lines. It
produces capacitors to the highest reliability that can be used in all
applications including the very demanding space requirements.
A recent Highly Accelerated Life Test (HALT) programme was
undertaken to compare Syfer PME with equivalent BME capacitors.
Capacitors rated at 50 volts were tested at 400 volts and at a
temperature of 180ºC. The programme used three capacitor types
from Syfer and two BME manufacturers.
25
20
15
10
5
0
Median Time to Failure
0603 50V 33nF 0805 50V 100nF 1206 50V 220nF
Syfer PME BME1 BME2
In all cases the Syfer PME parts out-performed the BME capacitors
suggesting that the long term reliability of PME systems is superior to
BME, and PME parts should be regarded as the component of choice
for high reliability applications.
6
Surface mount capacitors1.8 to 1.10
● Release documentation supplied as standard.
m Original documentation.
Syfer reliability SM product group
Standard SM
capacitors IECQ-CECC AEC-Q200
MIL grade
S (space grade) High Rel
S05 S02A
Certicate of conformance ●-●●●
IECQ-CECC Release certicate of conformity -●---
Batch electrical test report mmmIncluded in
data pack
Included in
data pack
S (space grade) data documentation package - - - ● ●
1.8 - Release documentation
Component type: 0805 (C0G/NP0 and X7R).
Testing location: Syfer reliability test department.
Results based on: 14,942,000 component test hours.
From To Operation
FITS MTBF (hours) 109 ÷ FITS
FITS MTBF (years) 109 ÷ (FITS x 8760)
FITS = Failures in 109 hours.
MTBF = Mean time between failures.
Conversion factors:
1.10 - Periodic tests conducted and
reliability data availability
Standard Surface Mount Capacitors
Components are randomly selected on a sample basis and the
following routine tests are conducted:
● Load Test. 1000 hours @125ºC. Applied voltage depends
on components tested.
● Humidity Test. 168 hours @ 85ºC/85%RH.
● Board Deection (bend test).
Test results are available on request.
25ºC 50ºC 75ºC 100ºC 125ºC
10000
0.01
10
0.00001
FIT
10% of RV
50% of RV
25% of RV
RV
Example of FIT (Failure In Time) data available:
1.9 - Technical summary
C0G/NP0 X7R
Dielectric characteristics Ultra stable Stable
IECQ-CECC
EIA
MIL
1B/CG 2C1 2R1 2X1
C0G/NP0 X7R
CG(BP) BZ BX
Rated temperature range -55ºC to +125ºC -55ºC to +125ºC
Maximum capacitance change over
temperature range
No DC voltage applied 0 ± 30 ppm/ºC ± 20% ± 15% ± 15%
Rated DC voltage applied - +20-30% - +15-25%
Syfer dielectric ordering code C R X B
Tangent of loss angle (tan δ) Cr > 50pF ≤ 0.0015
Cr ≤ 50pF = 0.0015 (15 + 0.7)
Cr
The table above highlights the difference in coding for IECQ-CECC, EIA and MIL standards when dening the temperature coefecient and the
voltage coefcient.
7
Surface mount capacitors
1.10 - Periodic tests conducted for IECQ-CECC and AEC-Q200
Test
ref Test Termination
type
D or
ND Additional requirements
Sample
acceptance Reference
P n c
P1
High
temperature
exposure
(storage)
All types D Un-powered. 1000 hours @ T=150ºC.
Measurement at 24 ± 2 hours after test conclusion 12 77 0 MIL-STD-202
Method 108
P2 Temperature
cycling
C0G/NP0: All
types X7R: Y
and H only
D1000 cycles -55ºC to +125ºC
Measurement at 24 ± 2 hours after test conclusion 12 77 0 JESD22
Method JA-104
P3 Moisture
resistance All types D
T = 24 hours/cycle. Note: Steps 7a and 7b not
required. Un-powered.
Measurement at 24 ± 2 hours after test conclusion
12 77 0 MIL-STD-202
Method 106
P4 Biased
humidity All types D
1000 hours 85ºC/85%RH. Rated voltage or 50V
whichever is the least and 1.5V.
Measurement at 24 ± 2 hours after test conclusion
12 77 0 MIL-STD-202
Method 103
P5 Operational
life All types D Condition D steady state TA=125ºC at full rated.
Measurement at 24 ± 2 hours after test conclusion 12 77 0 MIL-STD-202
Method 108
P6 Resistance
to solvents All types D Note: Add aqueous wash chemical.
Do not use banned solvents 12 5 0 MIL-STD-202
Method 215
P7 Mechanical
shock
C0G/NP0: All
types X7R: Y
and H only
D Figure 1 of Method 213. Condition F 12 30 0 MIL-STD-202
Method 213
P8 Vibration
C0G/NP0: All
types X7R: Y
and H only
D
5g for 20 minutes, 12 cycles each of 3 orientations.
Note: Use 8” x 5” PCB 0.031” thick 7 secure points
on one long side and 2 secure points at corners of
opposite sides. Parts mounted within 2” from any
secure point. Test from 10-2000Hz
12 30 0 MIL-STD-202
Method 204
P9 Resistance to
soldering heat All types D Condition B, no pre-heat of samples:
Single wave solder - Procedure 2 3 12 0 MIL-STD-202
Method 210
P10 Thermal shock
C0G/NP0: All
types X7R: Y
and H only
D
-55ºC/+125ºC. Number of cycles 300.
Maximum transfer time - 20 seconds,
Dwell time - 15 minutes. Air-Air
12 30 0 MIL-STD-202
Method 107
P11
Adhesion,
rapid temp
change and
climatic
sequence
X7R: A, F and
J only D5N force applied for 10s, -55ºC/ +125ºC for 5 cycles,
damp heat cycles 12 27 0
BS EN132100
Clause 4.8, 4.12
and 4.13
P12
Board ex
C0G/NP0: All
types X7R: Y
and H only
D3mm deection Class I
2mm deection Class II 12 30 0 AEC-Q200-005
P13 X7R: A, F and
J only D1mm deection. 12 12 0 BS EN132100
Clause 4.9
P14 Terminal
strength All types D Force of 1.8kg for 60 seconds 12 30 0 AEC-Q200-006
P15 Beam load
test All types D - 12 30 0 AEC-Q200-003
P16 Damp heat
steady state All types D 56 days, 40°C/93%RH, 15 x no volts, 15 x 5Vdc,
15 x rated voltage or 50V whichever is the less 12 45 0 BS EN132100
Clause 4.14
1.10
Test results are available on request.
8
Surface mount capacitors
1.11 - Standard product ranges - 10V to 6kV ranges
Capacitance values F.
1.11
Note: * Indicates components that require conformal coating post soldering.
0603 0805 1206 1210 1808 1812 1825 2220 2225 3640 5550 8060
10V
C0G/NP0 0.47p-3.9n 1.0p-15n 1.0p-47n 3.9p-100n 4.7p-100n 10p-220n 10p-470n 10p-470n 10p-560n n/a n/a n/a
X7R 100p-100n 100p-330n 100p-1.0μ 330n-1.5μ 100p-1.5μ 150n-3.3μ 220n-4.7μ 220n-5.6μ 330n-6.8µ n/a n/a n/a
X5R 120n-150n 390n-680n 100p-1.5µ 330p-3.3µ 100p-2.7µ 150p-10µ 220p-15µ 220p-18µ 330p-22µ n/a n/a n/a
16V
C0G/NP0 0.47p-2.7n 1.0p-12n 1.0p-33n 3.9p-68n 4.7p-68n 10p-180n 10p-330n 10p-330n 10p-470n n/a n/a n/a
X7R 100p-100n 100p-330n 100p-1.0μ 330p-1.5μ 100p-1.5μ 150p-3.3μ 220p-4.7μ 220p-5.6μ 330p-6.8µ n/a n/a n/a
X5R 100p-120n 100p-470n 100p-1.2µ 330p-2.7µ 100p-2.2µ 150p-6.8µ 220p-12µ 220p-12µ 330p-15µ n/a n/a n/a
25V
C0G/NP0 0.47p-2.2n 1.0p-10n 1.0p-27n 3.9p-56n 4.7p-47n 10p-150n 10p-220n 10p-220n 10p-330n n/a n/a n/a
X7R 100p-100n 100p-220n 100p-820n 330p-1.2μ 100p-1.2μ 150p-2.2μ 220p-3.9μ 220p-4.7μ 330p-5.6μ n/a n/a n/a
X5R 100p-100n 100p-390n 100p-1.0µ 330p-2.2µ 100p-1.5µ 150p-4.7µ 220p-10µ 220p-10µ 330p-12µ n/a n/a n/a
50/63V
C0G/NP0 0.47p-1.5n 1.0p-5.6n 1.0p-22n 3.9p-33n 4.7p-33n 10p-100n 10p-150n 10p-150n 10p-220n 10p-330n 390p-680n 680p-1.0µ
X7R 100p-47n 100p-220n 100p-470n 330p-1.0μ 100p-680n 150p-2.2μ 220p-1.8μ 220p-3.3μ 330p-3.3μ 470p-10μ 1.0n-15μ 2.2n-22μ
X5R 100p-68n 100p-330n 100p-680n 330p-1.5µ 100p-1.0µ 150p-3.3µ 220p-6.8µ 220p-6.8µ 330p-10µ n/a n/a n/a
100V
C0G/NP0 0.47p-470p 1.0p-2.2n 1.0p-8.2n 3.9p-18n 4.7p-18n 10p-47n 10p-68n 10p-68n 10p-82n 10p-270n 390p-470n 680p-680n
X7R 100p-33n 100p-100n 100p-330n 330p-680n 100p-560n 150p-1.5μ 220p-1.5μ 220p-2.2μ 330p-2.7μ 470p-5.6μ 1n-10μ 2.2n-15μ
200/250V
C0G/NP0 0.47p-150p 1.0p-820p 1.0p-2.7n 3.9p-6.8n 4.7p-6.8n 10p-15n 10p-27n 10p-27n 10p-39n 10p-100n 390p-220n 680p-330n
X7R 100p-10n 100p-56n 100p-150n 330p-330n 100p-270n 150p-680n 220p-1.0μ 220p-1.0μ 330p-1.5μ 470p-3.3μ 1.0n-5.6μ 2.2n-10μ
500V
C0G/NP0 0.47p-68p* 1.0p-390p 1.0p-1.5n 3.9p-4.7n 4.7p-3.9n 10p-10n 10p-18n 10p-15n 10p-22n 10p-68n 390p-150n 680p-220n
X7R 100p-1.5n* 100p-10n 100p-47n 330p-120n 100p-120n 150p-330n 220p-560n 220p-560n 330p-820n 470p-1.0μ 1.0n-1.8μ 2.2n-3.3μ
630V
C0G/NP0 n/a 1.0p-180p 1.0p-1.0n 3.9p-1.8n 4.7p-2.2n 10p-5.6n 10p-10n 10p-10n 10p-15n 10p-39n 390p-68n 680p-150n
X7R n/a 100p-6.8n 100p-33n 330p-47n 100p-68n 150p-180n 220p-180n 220p-330n 330p-390n 470p-680n 1.0n-1.2μ 2.2n-2.2μ
1kV
C0G/NP0 n/a 1.0p-100p 1.0p-470p 3.9p-1.2n 4.7p-1.2n 10p-3.3n 10p-6.8n 10p-8.2n 10p-10n 10p-22n 390p-39n 680p-68n
X7R n/a 100p-4.7n 100p-27n 330p-33n 100p-47n 150p-100n 220p-120n 220p-120n 330p-150n 470p-180n 1.0n-390n 2.2n-1.0μ
1.2kV
C0G/NP0 n/a n/a 1.0p-220p 3.9p-680p 4.7p-1.0n 10p-2.2n 10p-3.9n 10p-4.7n 10p-6.8n 10p-18n 390p-33n 680p-47n
X7R n/a n/a 100p-15n 330p-10n 100p-10n 150p-33n 220p-68n 220p-82n 330p-100n 470p-150n 1.0n-220n 2.2n-470n
1.5kV
C0G/NP0 n/a n/a 1.0p-180p 3.9p-470p 4.7p-680p 10p-1.5n 10p-2.7n 10p-3.3n 10p-4.7n 10p-12n 390p-22n 680p-33n
X7R n/a n/a 100p-10n 330p-6.8n 100p-6.8n 150p-22n 220p-47n 220p-47n 330p-68n 470p-100n 1.0n-150n 2.2n-330n
2kV
C0G/NP0 n/a n/a 1.0p-150p 3.9p-220p 4.7p-270p 10p-820p 10p-1.2n 10p-1.8n 10p-2.2n 10p-5.6n 390p-10n 680p-18n
X7R n/a n/a 100p-2.2n 330p-4.7n 100p-4.7n 150p-10n 220p-10n 220p-27n 330p-33n 470p-47n 1.0n-82n 2.2n-150n
2.5kV
C0G/NP0 n/a n/a n/a n/a 4.7p-220p 10p-680p 10p-1.0n 10p-1.5n 10p-1.8n 10p-4.7n 390p-6.8n 680p-12n
X7R n/a n/a n/a n/a 100p-1.5n 150p-3.3n 220p-6.8n 220p-8.2n 330p-12n 470p-33n 1.0n-68n 2.2n-100n
3kV
C0G/NP0 n/a n/a n/a n/a 4.7p-180p 10p-470p 10p-820p 10p-1.2n 10p-1.5n 10p-3.3n 390p-6.8n 680p-10n
X7R n/a n/a n/a n/a 100p-1.2n 150p-2.7n 220p-3.9n 220p-6.8n 330p-8.2n 470p-22n 1.0n-47n 2.2n-82n
4kV
C0G/NP0 n/a n/a n/a n/a 4.7p-150p* 10p-390p* 10p-680p* 10p-1.0n* 10p-1.2n* 10p-1.5n 390p-4.7n 680p-6.8n
X7R n/a n/a n/a n/a 100p-1.0n* 150p-2.2n* 220p-2.2n* 220p-4.7n* 330p-5.6n* 470p-6.8n 1.0n-15n 2.2n-33n
5kV
C0G/NP0 n/a n/a n/a n/a 4.7p-82p* 10p-270p* 10p-470p* 10p-680p* 10p-820p* 10p-1.0n 390p-2.2n 680p-3.9n
X7R n/a n/a n/a n/a 100p-680p* 150p-1.2n* 220p-1.8n* 220p-3.9n* 330p-4.7n* n/a 1.0n-10n 2.2n-22n
6kV
C0G/NP0 n/a n/a n/a n/a 4.7p-56p* 10p-220p* 10p-330p* 10p-470p* 10p-560p* n/a n/a n/a
X7R n/a n/a n/a n/a 100p-390p* 150p-1.0n* 220p-1.5n* 220p-2.2n* 330p-2.7n* n/a n/a n/a
0603 0805 1206 1210 1808 1812 1825 2220 2225 3640 5550 8060
= X5R Range
9
Surface mount capacitors 1.11
1.11 - IECQ-CECC
Maximum capacitance values.
0603 0805 1206 1210 1808 1812 2220 2225
16V
C0G/NP0
1.5nF 6.8nF 22nF 33nF 33nF 100nF 150nF 220nF
X7R
100nF 330nF 1.0µF 1.5µF 1.5µF 3.3µF 5.6µF 6.8µF
25V
C0G/NP0
1.0nF 4.7nF 15nF 22nF 27nF 68nF 100nF 150nF
X7R
56nF 220nF 820nF 1.2µF 1.2µF 2.2µF 4.7µF 5.6µF
50/63V
C0G/NP0
470pF 2.7nF 10nF 18nF 18nF 33nF 68nF 100nF
X7R
47nF 220nF 470nF 1.0µF 680nF 1.5µF 2.2µF 3.3µF
100V
C0G/NP0
330pF 1.8nF 6.8nF 12nF 12nF 27nF 47nF 68nF
X7R
10nF 47nF 150nF 470nF 330nF 1.0µF 1.5µF 1.5µF
200V
C0G/NP0
100pF 680pF 2.2nF 4.7nF 4.7nF 12nF 22nF 27nF
X7R
5.6nF 27nF 100nF 220nF 180nF 470nF 1.0µF 1.0µF
500V
C0G/NP0
n/a 330pF 1.5nF 3.3nF 3.3nF 10nF 15nF 22nF
X7R
n/a 8.2nF 33nF 100nF 100nF 270nF 560nF 820nF
1kV
C0G/NP0
n/a n/a 470pF 1.0nF 1.2nF 3.3nF 8.2nF 10nF
X7R
n/a n/a 4.7nF 15nF 18nF 56nF 120nF 150nF
1.11 - S05, S02A(1) Space Grade and MIL-PRF-55681(2) ranges
Maximum capacitance values.
0603 0805 1206 1210 1812 2220 2225
16V
C0G/
NP0 390pF - 1.5nF 1pF - 6.8nF 1pF - 22nF 10pF - 33nF 220pF - 100nF 470pF - 150nF 560pF - 220nF
X7R 330pF - 100nF 100pF - 330nF 680pF - 1.0µF 1.0nF - 1.5µF 3.9nF - 3.3µF 10nF - 5.6µF 18nF - 6.8µF
25V
C0G/
NP0 390pF - 1.0nF 1pF - 4.7nF 1pF - 15nF 10pF - 22nF 220pF - 68nF 470pF - 100nF 560pF - 150nF
X7R 330pF - 56nF 100pF - 220nF 680pF - 820nF 1.0nF - 1.2µF 3.9nF - 2.2µF 10nF - 4.7µF 18nF - 5.6µF
50/63V
C0G/
NP0 0.5pF - 470pF 1pF - 2.7nF 1pF - 10nF 10pF - 18nF 220pF - 39nF 470pF - 68nF 560pF - 100nF
X7R 330pF - 47nF 100pF - 220nF 680pF - 470nF 1.0nF - 1.0µF 3.9nF - 2.2µF 10nF - 3.3µF 18nF - 3.3µF
100V
C0G/
NP0 1pF - 330pF 1pF - 1.8nF 1pF - 6.8nF 10pF - 12nF 220pF - 27nF 470pF - 47nF 560pF - 68nF
X7R 100pF - 10nF 100pF - 47nF 100pF - 150nF 1.0nF - 470nF 3.9nF - 1.0µF 10nF - 1.5µF 18nF - 1.5µF
200V
C0G/
NP0 1pF - 100pF 1pF - 680pF 1pF - 2.2nF 10pF - 4.7nF 220pF - 12nF 470pF - 22nF 560pF - 27nF
X7R 100pF - 5.6nF 100pF - 27nF 100pF - 100nF 1.0nF - 220nF 3.9nF - 470nF 10nF - 1.0µF 18nF - 1.0µF
Notes:
1) In accordance with ESCC 3009.
2) In accordance with MIL-PRF-55681 Group A tests.
10
Surface mount capacitors1.11 to 1.13
1.12 - Termination types available
Syfer reliability SM product group
Standard
SM
capacitors
IECQ-CECC AEC-Q200 MIL-PRF
55681(1)
S (space grade) High Rel
S05 S02A
F = Silver Palladium. RoHS compliant. n n -n n n
J = Silver base with nickel barrier (100% matte tin
plating). RoHS compliant. n n
C0G/NP0
dielectric
only
n r r
A = Silver base with nickel barrier (Tin/lead plating with
min. 10% lead). n n -n n n
Y = FlexiCapTM termination base with Ni barrier (100%
matte tin plating). RoHS compliant. n n n n r r
H = FlexiCapTM termination base with Ni barrier (Tin/
lead plating with min. 10% lead). n n -n n n
n Termination available.
r Termination available but generally not requested for space grade components. Please discuss with Syfer Sales.
Notes:
1) In accordance with MIL-PRF-55681 group A. Additional optional tests available.
1.11 - AEC-Q200 Rev C ranges
Maximum capacitance values.
0603 0805 1206 1210 1812
50/63V
C0G/NP0 470pF 2.7nF 10nF 18nF 39nF
X7R 33nF 150nF 330nF 680nF 1.5µF
100V C0G/NP0 330pF 1.8nF 6.8nF 12nF 27nF
X7R 10nF 47nF 150nF 470nF 1µF
200V C0G/NP0 100pF 680pF 2.2nF 4.7nF 12nF
X7R 5.6nF 27nF 100nF 220nF 470nF
500V C0G/NP0 n/a 330pF 1.5nF 3.9nF 10nF
X7R n/a 8.2nF 33nF 100nF 270nF
630V C0G/NP0 n/a n/a 1.0nF 1.8nF 5.6nF
X7R n/a n/a 10nF 27nF 150nF
1kV C0G/NP0 n/a n/a 470pF 1nF 3.3nF
X7R n/a n/a 4.7nF 15nF 56nF
1.13 - Ordering information
Standard product code construction
1210 Y 100 0103 J X T _ _ _
Chip
size Termination Voltage Capacitance in
picofarads (pF)
Capacitance
tolerance
Dielectric
Rel
Release
codes
Packaging Sufx
code
Y = FlexiCapTM
termination base with Ni
barrier (100% matte tin
plating). RoHS compliant.
H = FlexiCapTM
termination base with Ni
barrier (Tin/lead plating
with min. 10% lead).
F = Silver Palladium.
RoHS compliant.
J = Silver base with nickel
barrier (100% matte tin
plating). RoHS compliant.
A = Silver base with
nickel barrier (Tin/lead
plating with min. 10%
lead).
010 = 10V
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
500 = 500V
630 = 630V
1K0 = 1kV
1K2 = 1.2kV
1K5 = 1.5kV
2K0 = 2kV
2K5 = 2.5kV
3K0 = 3kV
4K0 = 4kV
5K0 = 5kV
6K0 = 6kV
First digit is 0.
Second and third digits
are signicant gures of
capacitance code.
The fourth digit is
number of zeros
following
Example:
0103 = 10nF
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
> 10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
C = C0G/NP0
(1B)
X = X7R
(2R1)
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk
pack - tubs
Used for
specic
customer
require-
ments
11
Surface mount capacitors
1.13 - IECQ-CECC product code construction
1210 Y 100 0103 J D T _ _ _
Chip
size Termination Voltage Capacitance in
picofarads (pF)
Capacitance
tolerance
Dielectric
Release codes(1) Packaging Sufx
code
Y = FlexiCapTM
termination base with Ni
barrier (100% matte tin
plating). RoHS compliant.
H = FlexiCapTM
termination base with Ni
barrier (Tin/lead plating
with min. 10% lead).
F = Silver Palladium.
RoHS compliant.
J = Silver base with nickel
barrier (100% matte tin
plating). RoHS compliant.
A = Silver base with
nickel barrier (Tin/lead
plating with min. 10%
lead).
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
500 = 500V
630 = 630V
1K0 = 1kV
First digit is 0.
Second and third
digits are signicant
gures of capacitance
code.
The fourth digit is
number of zeros
following
Example:
0103 = 10nF
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
> 10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
D = X7R
(2R1) with IECQ-
CECC release
F = C0G/NP0
(1B/NP0) with IECQ-
CECC release
B = 2X1/
BX released in
accordance with
IECQ-CECC
R = 2C1/
BZ released in
accordance with
IECQ-CECC
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk
pack - tubs
Used for
specic
customer
require-
ments
1.13
1.13 - Ordering information
AEC-Q200 product code construction
1210 Y 100 0103 J E T _ _ _
Chip
size Termination Voltage Capacitance in
picofarads (pF)
Capacitance
tolerance
Dielectric
Rel
Release codes
Packaging Sufx code
Y = FlexiCapTM
termination base with
Ni barrier (100% matte
tin plating). RoHS
compliant.
J = Silver base with
nickel barrier (100%
matte tin plating).
RoHS compliant. (J
termination not available
with X7R products).
050 = 50V
063 = 63V
100 = 100V
200 = 200V
250 = 250V
500 = 500V
630 = 630V
1K0 = 1kV
First digit is 0.
Second and third
digits are signicant
gures of capacitance
code.
The fourth digit is
number of zeros
following
Example:
0103 = 10nF
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
> 10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
A = C0G/NP0
(1B)
E = X7R
(2R1)
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk pack
- tubs
Used for
specic
customer
requirements
Notes:
1) A & F approved for Space applications. If another termination type is required then contact Syfer Sales.
2) Please include Lot Acceptance Test requirement (LAT1, LAT2 or LAT3) on purchase order against each line item. Tests conducted after 100%
Burn-In (2xRV @125ºC for 168 hours):
LAT1: 4 x adhesion, 8 x rapid temp change + LAT2 and LAT3.
LAT2: 20 x 1000 hour life test + LAT3.
LAT3: 6 x TC and 4 x solderability.
1.13 - S05 and S02A product code construction
1210 A 100 0103 J X T _ _ _
Chip
size Termination Voltage Capacitance in
picofarads (pF)
Capacitance
tolerance
Dielectric
Rel
Release codes
Packaging Sufx code
A = Silver base with
nickel barrier (Tin/
lead plating with min.
10% lead).
F = Silver Palladium.
RoHS compliant.
H = FlexiCapTM
termination base
with Ni barrier (Tin/
lead plating with min.
10% lead).
016 = 16V
025 = 25V
050 = 50V
063 = 63V
100 = 100V
200 = 200V
First digit is 0.
Second and third digits
are signicant gures of
capacitance code.
The fourth digit is
number of zeros
following
Example:
0103 = 10nF
<10pF
B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
> 10pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
C = C0G/NP0
(1B)
X = X7R
(2R1)
T = 178mm
(7”) reel
R = 330mm
(13”) reel
B = Bulk pack
- tubs
Q = Wafe
pack
Used for
specic
customer
requirements
S05 = S
(Space Grade)
High Rel
S02A =
(2)S (Space
Grade) High
Rel
12