PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN059V130A24LS
DOCUMENT: SCD27818
REV LETTER: C
REV DATE: JULY 26,2016
PAGE NO.: 1 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
Specification Status: Released
GENERAL DESCRIPTION
Littelfuse PolyZen devices are
polymer-enhanced precision
Zener diode micro-assemblies.
They offer resettable protection
against multi-Watt fault events
and spare the need for large
heavy heat sinks.
A unique feature of the PolyZen
micro-assembly is that the
Zener diode is thermally
coupled to a resistively non-
linear, polymer PTC (Positive Temperature Coefficient) layer.
This PTC layer is fully integrated into the device, and is
electrically in series between VIN and the diode clamped VOUT.
This polymer PTC layer responds to either extended diode
heating or overcurrent events by transitioning from a low to
high resistance state, also known as ”tripping”. A tripped PTC
will limit current and generate voltage drop. It helps to protect
both the Zener diode and the follow-on electronics and
effectively increases the diode’s power handling capability.
The Zener diode used for voltage clamping in a PolyZen
micro-assembly was selected due to its relatively flat voltage
vs current response. This helps improve output voltage
clamping, even when input voltage is high and diode current
is large.
The polymer-enhanced Zener diode helps protect sensitive
portable electronics from damage caused by inductive
voltage spikes, voltage transients, improper power supplies,
and reverse bias conditions. The PolyZen
ZEN059V130A24LS device is particularly useful for USB
2.0/3.0 powered devices; typically, it draws only 500μA of
operating current in USB Suspend Mode.
BENEFITS
Stable Zener diode helps shield
downstream electronics from
overvoltage and reverse bias
PTC trip events help to protect the
Zener diode and extend its power
handling capability
Analog nature of trip events
minimizes upstream inductive spikes
Minimal power dissipation
requirements
Single component placement
FEATURES
Meets USB Suspend Mode current
requirement - 500μA (typ) @ 5.0V
Overvoltage transient suppression
Stable VZ vs fault current
Time delayed, overvoltage and
reverse bias trip
Multi-Watt power handling capability
Integrated device construction
RoHS Compliant and Halogen Free
TARGET APPLICATIONS
USB 2.0/3.0 powered consumer
electronics, external hard disk drives
and solid state devices
DC power port protection in systems
using barrel jacks for power input
DC power port protection in portable
electronics and navigation devices
DC output voltage regulation
USB 3.0 hubs and adapter cards
Laptops and Desktop PCs
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN059V130A24LS
DOCUMENT: SCD27818
REV LETTER: C
REV DATE: JULY 26,2016
PAGE NO.: 2 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
TYPICAL USB 2.0/3.0 APPLICATION BLOCK DIAGRAM
CONFIGURATION INFORMATION
Pin Configuration (Top View)
2
3
VIN
GND
VOUT
1
PIN DESCRIPTION
Pin Number
Pin Name
Pin Function
1
VIN
VIN. Protected input to Zener diode.
2
GND
GND
3
VOUT
VOUT. Zener regulated voltage output
2.21 mm
(0.087”)
0.94 mm
(0.037”)
0.33 mm
(0.013”)
0.56 mm
(0.022”)2.88 mm
(0.1135”)0.56 mm
(0.022”)
0.94 mm
(0.037”)
2.21 mm
(0.087”)
0.94 mm
(0.037”)
0.33 mm
(0.013”)
0.56 mm
(0.022”)2.88 mm
(0.1135”)0.56 mm
(0.022”)
0.94 mm
(0.037”)
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN059V130A24LS
DOCUMENT: SCD27818
REV LETTER: C
REV DATE: JULY 26,2016
PAGE NO.: 3 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
BLOCK DIAGRAM
DEFINITION of TERMS
IPTC
Current flowing through the PTC portion
of the circuit
IFLT
RMS fault current flowing through the
diode
IOUT
Current flowing out the VOUT pin of the
device
Trip Event
A condition where the PTC transitions to
a high resistance state, thereby
significantly limiting IPTC and related
currents, and significantly increasing the
voltage drop between VIN and VOUT.
Trip
Endurance
Time the PTC portion of the device
remains both powered and in a tripped
state.
GENERAL SPECIFICATIONS
Operating Temperature
-40º to +85ºC
Storage Temperature
-40º to +85ºC
ELECTRICAL CHARACTERISTICS1-3, 11 (Typical unless otherwise specified)
VZ4
(V)
Izt4
(A)
IHOLD5
@20ºC
(A)
Operating
Current
R Typ6
(Ohms)
R1Max7
(Ohms)
VInt Max8
(V)
IFLT Max9
Tripped Power
Dissipation10
Max
VINT
Max
(V)
Test
Current
(A)
IFLT
Max
(A)
Test
Voltage
(V)
Value
(W)
Test
Voltage
(V)
Min
Typ
Max
Test
Voltage
Max
Current
GND
VIN
VOUT
Zener
Diode
Polymer PTC
GND
VIN
VOUT
Zener
Diode
Polymer PTC
GND
IFLT
VIN
IOUT
IPTC
VOUT
GND
IFLT
VIN
IOUT
IPTC
VOUT
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN059V130A24LS
DOCUMENT: SCD27818
REV LETTER: C
REV DATE: JULY 26,2016
PAGE NO.: 4 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
(mA)
5.8
5.9
6.0
0.1
1.3
5.0
0.65
0.12
0.15
24
3
+6
-40
+24
-16
1.0
24
Note 1: Electrical characteristics determined at 25ºC unless otherwise specified.
Note 2:This device is intended for limited fault protection. Repeated trip events or extended trip endurance can degrade the
device and may affect performance to specifications. Performance impact will depend on multiple factors including, but
not limited to, voltage, trip current, trip duration, trip cycles, and circuit design. For details or ratings specific to your
application contact Littelfuse Circuit Protection directly.
Note 3:Specifications developed using 1.0 ounce 0.045” wide copper traces on dedicated FR4 test boards. Performance in
your application may vary.
Note 4:Izt is the current at which Vz is measured (VZ = VOUT). Additional VZ values are available on request.
Note 5:IHOLD : Maximum steady state IPTC (current entering or exiting the VIN pin of the device) that will not generate a trip
event at the specified temperature. Specification assumes IFLT (current flowing through the Zener diode) is
sufficiently low so as to prevent the diode from acting as a heat source. Testing is conducted with an “open” Zener.
Note 6:R Typ: Resistance between VIN and VOUT pins during normal operation at room temperature.
Note 7:R1Max: The maximum resistance between VIN and VOUT pins at room temperature, one hour after 1st trip or after reflow
soldering.
Note 8:VINT Max: VINT Max relates to the voltage across the PPTC portion of the PolyZen device (VIN-VOUT). VINT Max is
defined as the voltage (VIN-VOUT) at which typical qualification devices (98% devices, 95% confidence) survived at
least 100 trip cycles and 24hours trip endurance at the specified voltage (VIN-VOUT) and current (IPTC). VINT Max testing
is conducted using a "shorted" load (VOUT = 0V). VINT Max is a survivability rating, not a performance rating.
Note 9:IFLT Max: IFLT Max relates to the stead state current flowing through the diode portion of the PolyZen device in a fault
condition, prior to a trip event. IFLT Max is defined as the current at which typical qualification devices (12 parts per lot
from 3 lots) survived 100 test cycles. RMS fault currents above IFLT Max may permanently damage the diode portion
of the PolyZen device. Testing is conducted with NO load connected to VOUT, such that IOUT = 0. “Test voltage” is
defined as the voltage between VIN to GND and includes the PolyZen Diode drop. Specification is dependent on the
direction of current flow through the diode. IFLT Max is a survivability rating, not a performance rating.
Note 10:The power dissipated by the device when in the “tripped” state, as measured on Littelfuse test boards (see note 3).
Note 11:Specifications based on limited qualification data and subject to change.
MECHANICAL DIMENSIONS
Min
Typical
Max
Length
L
3.85 mm
(0.152”)
4 mm
(0.16”)
4.15 mm
(0.163")
Width
W
3.85 mm
(0.152”)
4 mm
(0.16”)
4.15 mm
(0.163")
Height
H
1.4mm
(0.055”)
1.7 mm
(0.067”)
2.0 mm
(0.081”)
Length
Diode
Ld
-
3.0 mm
(0.118”)
-
Height
Diode
Hd
-
1.0 mm
(0.039”)
-
Offset
O1
-
0.6 mm
(0.024”)
-
Offset
O2
-
0.7 mm
(0.028”)
-
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN059V130A24LS
DOCUMENT: SCD27818
REV LETTER: C
REV DATE: JULY 26,2016
PAGE NO.: 5 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
SOLDER REFLOW RECOMMENDATIONS:
Classification Reflow Profiles
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Tsmax to
Tp)
3° C/second max.
Preheat
• Temperature Min (Tsmin)
150 °C
• Temperature Max (Tsmax)
200 °C
• Time (tsmin to tsmax)
60-180 seconds
Time maintained above:
• Temperature (TL)
217 °C
• Time (tL)
60-150 seconds
Peak/Classification Temperature
(Tp)
260 °C
Time within 5 °C of actual Peak
Temperature (tp)
20-40 seconds
Ramp-Down Rate
6 °C/second max.
Time 25 °C to Peak Temperature
8 minutes max.
Reflow Profile
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN059V130A24LS
DOCUMENT: SCD27818
REV LETTER: C
REV DATE: JULY 26,2016
PAGE NO.: 6 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
PACKAGING
Packaging
Tape & Reel
Standard Box
ZENXXXVXXXAXXLS
3,000
15,000
Reel Dimensions for PolyZen Devices
Amax = 330
Nmin = 102
W1 = 8.4
W2 = 11.1
Taped Component Dimensions for PolyZen Devices
Matte Finish These Area
Amax
Nmin
Matte Finish These Area
Amax
Nmin
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN059V130A24LS
DOCUMENT: SCD27818
REV LETTER: C
REV DATE: JULY 26,2016
PAGE NO.: 7 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
TYPICAL CHARACTERISTICS
Typical Fault Response: ZEN059V130A24LS
24 V/6 A Current Limited Source (IOUT=0)
0
2
4
6
8
10
12
14
16
18
20
22
24
0.00 0.05 0.10 0.15
Time (sec)
V (V) or I (A)
Vin (V)
Vout (V)
I FLT (A)
A = Vin (V)
B = Vout (V)
C = IFLT (A)
A
C
B
A = Vin (V)
B = Vout (V)
C = IFLT (A)
A
C
B
Typical I-V (300 msec pulse)
3.0
4.0
5.0
6.0
7.0
0.00001
0.0001
0.001
0.01
0.1
1
10
Current: IFLT (A)
Voltage: VOUT (V)
ZEN059VxxxAxxLS
Typical I-V (300 msec pulse)
-20
-15
-10
-5
0
5
10
-2 0 2 4 6 8
Voltage: VOUT (V)
Current: IFLT (A)
ZEN059VxxxAxxLS
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN059V130A24LS
DOCUMENT: SCD27818
REV LETTER: C
REV DATE: JULY 26,2016
PAGE NO.: 8 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
Vout peak vs. IFLT RMS (IOUT=0)
5.5
6.0
6.5
7.0
0 1 2 3 4 5 6
IFLT RMS (A)
Vout Peak (V)
ZEN059V130A24LS
Time to Trip vs. IFLT RMS (IOUT=0)
0.01
0.1
1
10
100
0 1 2 3 4 5 6
IFLT RMS (A)
Time to Trip (sec)
ZEN059V130A24LS
Vout Peak vs. IFLT RMS (IOUT=0)
-1.4
-1.2
-1.0
-0.8
-0.6
-40 -30 -20 -10 0
IFLT RMS (A)
Vout Peak (V)
ZEN059V130A24LS
Time To Trip vs. IFLT RMS (IOUT=0)
0.001
0.01
0.1
1
10
100
-40 -30 -20 -10 0
IFLT RMS (A)
Time To Trip (sec)
ZEN059V130A24LS
Temperature Effect on RTYP
0.10
0.12
0.14
0.16
0.18
0.20
20 40 60 80 100
Ambient Temperature (oC)
RTYP (Ohms)
ZENxxxV130A24LS
PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
PRODUCT: ZEN059V130A24LS
DOCUMENT: SCD27818
REV LETTER: C
REV DATE: JULY 26,2016
PAGE NO.: 9 OF 9
© 2016 Littelfuse,Inc. littelfuse.com
Specifications are subject to change without notice.
Revised July 26,2016
Time to Trip vs. IPTC RMS (IFLT=0)
0.001
0.01
0.1
1
10
010 20 30 40
IPTC RMS (A)
Time to Trip (sec)
ZENxxxV130A24LS
Materials Information
ROHS Compliant ELV Compliant Pb-Free Halogen Free*
* Halogen Free refers to: Br≤900ppm, Cl≤900ppm, Br+Cl≤1500ppm.
Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving,
life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired
operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product
documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse
documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in
applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse.
HF