VSMY2850RG, VSMY2850G
www.vishay.com Vishay Semiconductors
Rev. 1.2, 04-Aug-11 1Document Number: 83398
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
High Speed Infrared Emitting Diodes, 850 nm,
Surface Emitter Technology
DESCRIPTION
VSMY2850 series are infrared, 850 nm emitting diodes
based on GaAlAs surface emitter chip technology with
extreme high radiant intensities, high optical power and high
speed, molded in clear, untinted plastic packages (with lens)
for surface mounting (SMD).
APPLICATIONS
IrDA compatible data transmission
Miniature light barrier
Photointerrupters
Optical switch
Emitter source for proximity sensors
IR touch panels
IR illumination
FEATURES
Package type: surface mount
Package form: GW, RGW
Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8
Peak wavelength: p = 850 nm
High reliability
High radiant power
Very high radiant intensity
Angle of half intensity: = ± 10°
Suitable for high pulse current operation
Terminal configurations: gullwing or reverse gullwing
Package matches with detector VEMD2500X01 series
Floor life: 4 weeks, MSL 2a, acc. J-STD-020
Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
Halogen-free according to IEC 61249-2-21 definition
Note
** Please see document “Vishay Material Category Policy”:
www.vishay.com/doc?99902
Note
Test conditions see table “Basic Characteristics“
Note
MOQ: minimum order quantity
21725-5
21
7
2
5-5
VSMY2850RGX01 VSMY2850GX01
PRODUCT SUMMARY
COMPONENT Ie (mW/sr) (deg) P (nm) tr (ns)
VSMY2850RG 100 ± 10 850 10
VSMY2850G 100 ± 10 850 10
ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM
VSMY2850RG Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing
VSMY2850G Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing
VSMY2850RG, VSMY2850G
www.vishay.com Vishay Semiconductors
Rev. 1.2, 04-Aug-11 2Document Number: 83398
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage VR5V
Forward current IF100 mA
Peak forward current tp/T = 0.5, tp 100 μs IFM 200 mA
Surge forward current tp = 100 μs IFSM 1A
Power dissipation PV190 mW
Junction temperature Tj100 °C
Operating temperature range Tamb - 40 to + 85 °C
Storage temperature range Tstg - 40 to + 100 °C
Soldering temperature acc. figure 7, J-STD-020 Tsd 260 °C
Thermal resistance junction/ambient J-STD-051, soldered on PCB RthJA 250 K/W
0
20
40
60
80
100
120
140
160
180
200
0 102030405060708090100
21890
T
amb
- Ambient Temperature (°C)
P
V
- Power Dissipation (mW)
RthJA = 250 K/W
0
20
40
60
80
100
120
0 102030405060708090100
21891
R
thJA
= 250 K/W
T
amb
- Ambient Temperature (°C)
I
F
- Forward Current (mA)
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Forward voltage IF = 100 mA, tp = 20 ms VF1.65 1.9 V
IF = 1 A, tp = 100 μs VF2.9 V
Temperature coefficient of VF
IF = 1 mA TKVF - 1.45 mV/K
IF = 10 mA TKVF - 1.3 mV/K
Reverse current IRnot designed for reverse operation μA
Junction capacitance VR = 0 V, f = 1 MHz, E = 0 mW/cm2CJ125 pF
Radiant intensity IF = 100 mA, tp = 20 ms Ie50 100 150 mW/sr
IF = 1 A, tp = 100 μs Ie850 mW/sr
Radiant power IF = 100 mA, tp = 20 ms e55 mW
Temperature coefficient of radiant
power IF = 100 mA TKe- 0.35 %/K
Angle of half intensity ± 10 deg
Peak wavelength IF = 100 mA p840 850 870 nm
Spectral bandwidth IF = 30 mA  30 nm
Temperature coefficient of pIF = 30 mA TKp0.25 nm/K
Rise time IF = 100 mA, 20 % to 80 % tr10 ns
Fall time IF = 100 mA, 20 % to 80 % tf10 ns
Virtual source diameter d 1.5 mm
VSMY2850RG, VSMY2850G
www.vishay.com Vishay Semiconductors
Rev. 1.2, 04-Aug-11 3Document Number: 83398
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 3 - Forward Current vs. Forward Voltage
Fig. 4 - Radiant Intensity vs. Forward Current
Fig. 5 - Relative Radiant Power vs. Wavelength
Fig. 6 - Relative Radiant Intensity vs. Angular Displacement
SOLDER PROFILE
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
V
F
- Forward Voltage (V)
22097
I
F
- Forward Current (A)
0.001
0.01
0.1
1
10
0 0.5 1 1.5 2 2.5 3 3.5
tp = 100 µs
22098 IF - Forward Current (A)
I
e
- Radiant Intensity (mW/sr)
1
10
100
1000
0.001 0.01 0.1 1
t
p
= 100 µs
λ - Wavelength (nm)
21776-1
Φe, rel - Relative Radiant Power
0
0.25
0.5
0.75
1
650 750 850 950
I
F
= 30 mA
21111
0.6 00.20.4
0.9
0.8
30°
10° 20°
40°
50°
60°
70°
80°
0.7
1.0
I
e rel
- Relative Radiant Intensity
ϕ - Angular Displacement
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
240 °C 245 °C
max. 260 °C
max. 120 s max. 100 s
217 °C
max. 30 s
max. ramp up 3 °C/s max. ramp down 6 °C/s
19841
255 °C
VSMY2850RG, VSMY2850G
www.vishay.com Vishay Semiconductors
Rev. 1.2, 04-Aug-11 4Document Number: 83398
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters: VSMY2850RG
2.2
5.8 ± 0.2
2.77 ± 0.2
2.3 ± 0.2
Cathode
0.5 0.05 ± 0.1
0.254
1.1 ± 0.1
Anode
0.4
2.2
0.19
0.3
1.6
0.4
Ø 1.8 ± 0.1
2.3 ± 0.2
specications
according to DIN
technical drawings
Not indicated tolerances ± 0.1
Drawing-No.: 6.544-5391.03-4
Pin ID
Exposed copper
Issue: 1; 18.03.10
22100
0.75
6.7
1.7
Ø 2.3 ± 0.1
Solder pad proposal
acc. IPC 7351
Z
Z 20:1
VSMY2850RG, VSMY2850G
www.vishay.com Vishay Semiconductors
Rev. 1.2, 04-Aug-11 5Document Number: 83398
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters: VSMY2850G
2.2
4.2 ± 0.2
2.77 ± 0.2
2.3 ± 0.2
Cathode
0.5
0.05
0.254
0.6
Anode
0.4
2.2
0.19
0.3
1.6
0.4
Ø 1.8
2.3 ± 0.2
specications
according to DIN
technical drawings
Not indicated tolerances ± 0.1
Drawing-No.: 6.544-5383.03-4
Issue: 1; 18.03.10
22099
Exposed copper
Pin ID
0.75
2.45
5.15
Solder pad proposal
acc. IPC 7351
X
X 20:1
VSMY2850RG, VSMY2850G
www.vishay.com Vishay Semiconductors
Rev. 1.2, 04-Aug-11 6Document Number: 83398
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TAPING AND REEL DIMENSIONS in millimeters: VSMY2850RG
Issue: 2; 18.03.10
Drawing-No.: 9.800-5100.01-4
Leader and trailer tape:
Parts mounted
Empty (400 mm min.)
Empty (160 mm min.)
Direction of pulling out
Unreel direction
Ø 62 ± 0.5
Ø 330 ± 1
Reel
2.5± 0.5
Label posted here
coming out from reel
Tape position
X
Ø13± 0.5
12.4 ± 1.5
X 2:1
I
II
6000 pcs/reel
12 ± 0.3
5.5 ± 0.05 1.75 ± 0.1
2 ± 0.05
4 ± 0.1
4 ± 0.1
Ø 1.55 ± 0.05
3.05 ± 0.1
21572
Technical drawings
according to DIN
specifications
Terminal position in tape
Devicce
VEMD2000
VEMD2500
Cathode Anode
Anode Cathode
VSMB2000
VSMG2000
VSMY2850RG
VEMT2000
VEMT2500 Collector Emitter
Lead I Lead II
VSMY2850RG, VSMY2850G
www.vishay.com Vishay Semiconductors
Rev. 1.2, 04-Aug-11 7Document Number: 83398
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TAPING AND REEL DIMENSIONS in millimeters: VSMY2850G
Drawing-No.: 9.800-5091.01-4
Leader and trailer tape:
Parts mounted
Empty (400 mm min.)
Empty (160 mm min.)
Direction of pulling out
Unreel direction
Ø 62 ± 0.5
Ø 330 ± 1
Reel
2.5± 0.5
Label posted here
coming out from reel
Tape position
X
Ø13 ± 0.5
12.4 ± 1.5
X 2:1
I
II
6000 pcs/reel
12 ± 0.3
5.5 ± 0.05 1.75 ± 0.1
2 ± 0.05
4 ± 0.1
4 ± 0.1
Ø 1.55 ± 0.05
3.05 ± 0.1
21571
technical drawings
according to DIN
specifications
Issue: 3; 18.03.10
Terminal position in tape
Devicce
VSMB2020
VSMG2020
Cathode Anode
Anode Cathode
VEMD2020
VEMD2520
VSMY2850G
VEMT2020
VEMT2520 Collector Emitter
Lead I Lead II
Legal Disclaimer Notice
www.vishay.com Vishay
Revision: 12-Mar-12 1Document Number: 91000
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definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
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