SN54BCT25244, SN74BCT25244
25-Ω OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS064A – JUNE 1990 – REVISED NOVEMBER 1993
Copyright 1993, Texas Instruments Incorporated
2–1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
•State-of-the-Art BiCMOS Design
Significantly Reduces ICCZ
•ESD Protection Exceeds 2000 V Per
MIL-STD-883C, Method 3015; Exceeds
200 V Using Machine Model (C = 200 pF,
R = 0)
•Designed to Facilitate Incident-Wave
Switching for Line Impedances of 25 Ω
or Greater
•Distributed VCC and GND Pins Minimize
Noise Generated by the Simultaneous
Switching of Outputs
•Package Options Include Plastic
Small-Outline (DW) Packages, Ceramic
Chip Carriers (FK) and Flatpacks (W), and
Standard Plastic and Ceramic 300-mil DIPs
(JT, NT)
description
These 25-Ω octal buffers and line drivers are
designed specifically to improve both the
performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented
receivers and transmitters.
These buffers are capable of sinking 188-mA IOL,
which facilitates switching 25-Ω transmission
lines on the incident wave. The distributed VCC
and GND pins minimize switching noise for more
reliable system operation.
When the output-enable (1OE and 2OE) inputs
are low, the device transmits data from the
A inputs to the Y outputs. When 1OE and 2OE are
high, the outputs are in the high-impedance state.
The SN54BCT25244 is characterized for
operation over the full military temperature range
of –55°C to 125°C. The SN74BCT25244 is
characterized for operation from 0°C to 70°C.
FUNCTION TABLE
(each buffer/driver)
INPUTS OUTPUT
OE AY
L H H
LLL
H X Z
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
1Y1
GND
1Y2
1Y3
GND
1Y4
2Y1
GND
2Y2
2Y3
GND
2Y4
1OE
1A1
1A2
VCC
1A3
1A4
2A1
2A2
VCC
2A3
2A4
2OE
SN54BCT25244 . . . JT OR W PACKAGE
SN74BCT25244 . . . DW OR NT PACKAGE
(TOP VIEW)
3212827
12 13
5
6
7
8
9
10
11
25
24
23
22
21
20
19
2OE
2Y4
GND
NC
2Y3
2Y2
GND
1A3
VCC
1A2
NC
1A1
1OE
1Y1
426
14 15 16 17 18
GND
1Y2
1Y3
NC
GND
1Y4
2Y1
1A4
2A1
2A2
NC
V
2A3
2A4
SN54BCT25244 . . . FK PACKAGE
(TOP VIEW)
CC
NC – No internal connection
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN54BCT25244, SN74BCT25244
25-Ω OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS064A – JUNE 1990 – REVISED NOVEMBER 1993
2–2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic symbol†logic diagram (positive logic)
1OE EN
24
23
1A1 22
1A2 20
1A3 19
1A4
1Y1
1
1Y2
3
1Y3
4
1Y4
6
18
2A1 17
2A2 15
2A3 14
2A4
2Y1
7
2Y2
9
2Y3
10
2Y4
12
1
1
†This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
2OE EN
13
1OE
1A1 1Y1
24
23 1
1A2 1Y2
22 3
1A3 1Y3
20 4
1A4 1Y4
19 6
2OE
2A1 2Y1
13
18 7
2A2 2Y2
17 9
2A3 2Y3
15 10
2A4 2Y4
14 12
Pin numbers shown are for the DW, JT, NT, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the disabled or power-off state, VO–0.5 V to 5.5 V. . . . . . . . . . . . . . . .
Voltage range applied to any output in the high state, VO–0.5 V to VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0) –30 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current into any output in the low state, IO: SN54BCT25244 250 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74BCT25244 376 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range: SN54BCT25244 –55°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74BCT25244 0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
‡Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
SN54BCT25244, SN74BCT25244
25-Ω OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS064A – JUNE 1990 – REVISED NOVEMBER 1993
2–3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions (see Note 2)
SN54BCT25244 SN74BCT25244
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
IIK Input clamp current –18 –18 mA
IOH High-level output current –53 –80 mA
IOL Low-level output current 125 188 mA
TAOperating free-air temperature –55 125 0 70 °C
NOTE 2: Unused or floating inputs must be held high or low.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
SN54BCT25244 SN74BCT25244
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYP†MAX MIN TYP†MAX
UNIT
VIK VCC = 4.5 V, II = –18 mA –1.2 –1.2 V
VCC = 4.75 V, IOH = – 3 mA 2.7
VOH
VCC =45V
IOH = –53 mA 2V
V
CC =
4
.
5
V
IOH = –80 mA 2
IOL = 94 mA 0.38 0.55 0.42 0.55
VOL VCC = 4.5 V IOL = 125 mA 0.8 V
IOL = 188 mA 0.7
IIVCC = 5.5 V, VI = 5.5 V 0.1 0.1 mA
IIH VCC = 5.5 V, VI = 2.7 V 20 20 µA
IIL VCC = 5.5 V, VI = 0.5 V –0.6 –0.6 mA
IOZH VCC = 5.5 V, VO = 2.7 V 50 50 µA
IOZL VCC = 5.5 V, VO = 0.5 V –50 –50 µA
ICCL VCC = 5.5 V, Outputs open 90 119 90 119 mA
ICCH VCC = 5.5 V, Outputs open 59 78 59 78 mA
ICCZ VCC = 5.5 V, Outputs open 711 711 mA
CiVCC = 5 V, VI = 2.5 V or 0.5 V 5.5 5.5 pF
CoVCC = 5 V, VO = 2.5 V or 0.5 V 17 17 pF
†All typical values are at VCC = 5 V, TA = 25°C.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Note 3)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
VCC = 5 V,
TA = 25°CSN54BCT25244 SN74BCT25244 UNIT
(INPUT)
(OUTPUT)
MIN TYP MAX MIN MAX MIN MAX
tPLH
A
Y
1 3.2 4.9 1 5.6 1 5.5
ns
tPHL
A
Y
2 4 5.6 2 6.3 2 6
ns
tPZH
OE
Y
3.2 5.6 8.5 3.2 9.7 3.2 9.3
ns
tPZL
OE
Y
3.7 6.3 9.2 3.7 10.4 3.7 10.2
ns
tPHZ
OE
Y
1.6 3.6 5.5 1.6 6.5 1.6 6.3
ns
tPLZ
OE
Y
3.1 5.3 7.8 3.1 9.5 3.1 8.4
ns
NOTE 3: Load circuits and voltage waveforms are shown in Section 1.
SN54BCT25244, SN74BCT25244
25-Ω OCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS064A – JUNE 1990 – REVISED NOVEMBER 1993
2–4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74BCT25244DW ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT25244DWE4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT25244DWG4 ACTIVE SOIC DW 24 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT25244DWR ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT25244DWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT25244DWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74BCT25244NT ACTIVE PDIP NT 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74BCT25244NTE4 ACTIVE PDIP NT 24 15 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Nov-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74BCT25244DWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74BCT25244DWR SOIC DW 24 2000 346.0 346.0 41.0
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2009
Pack Materials-Page 2
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