Sample & Buy Product Folder Support & Community Tools & Software Technical Documents Reference Design OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 OPAx316 10-MHz, Low-Power, Low-Noise, RRIO, 1.8-V CMOS Operational Amplifier 1 Features 3 Description * * * * * * * * * * The OPAx316 family of single, dual, and quad operational amplifiers represents a new generation of general-purpose, low-power operational amplifiers. Featuring rail-to-rail input and output swings, low quiescent current (400 A/ch typical) combined with a wide bandwidth of 10 MHz and very-low noise (11 nV/Hz at 1 kHz) makes this family attractive for a variety of applications that require a good balance between cost and performance. The low input bias current supports those operational amplifiers to be used in applications with M source impedances. 1 Unity-Gain Bandwidth: 10 MHz Low IQ: 400 A/ch Wide Supply Range: 1.8 V to 5.5 V Low Noise: 11 nV/Hz at 1 kHz Low Input Bias Current: 5 pA Offset Voltage: 0.5 mV Unity-Gain Stable Internal RFI-EMI Filter Shutdown Version: OPA2316S Extended Temperature Range: -40C to +125C 2 Applications * * * * * * Battery-Powered Instruments: - Consumer, Industrial, Medical - Notebooks, Portable Media Players Sensor Signal Conditioning Automotive Applications Barcode Scanners Active Filters Audio The robust design of the OPAx316 provide ease-ofuse to the circuit designer--a unity-gain stable, integrated RFI-EMI rejection filter, no phase reversal in overdrive condition, and high electrostatic discharge (ESD) protection (4-kV HBM). These devices are optimized for low-voltage operation as low as 1.8 V (0.9 V) and up to 5.5 V (2.75 V). This latest addition of low-voltage CMOS operational amplifiers, in conjunction with the OPAx313 and OPAx314 provide a family of bandwidth, noise, and power options to meet the needs of a wide variety of applications. Device Information(1) PART NUMBER OPA316 OPA2316 PACKAGE BODY SIZE (NOM) SC-70 (5) 1.25 mm x 2.00 mm SOT-23 (5) 1.60 mm x 2.90 mm DFN (8) 3.00 mm x 3.00 mm MSOP, VSSOP (8) 3.00 mm x 3.00 mm SOIC (8) 3.91 mm x 4.90 mm MSOP, VSSOP (10) 3.00 mm x 3.00 mm OPA2316S OPA4316 X2QFN (10) 1.50 mm x 2.00 mm TSSOP (14) 4.40 mm x 5.00 mm SOIC (14) 8.65 mm x 3.91 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. SPACE Single-Pole, Low-Pass Filter Low-Supply Current (400 A/ch) for 10-MHz Bandwidth RF VOUT VIN C1 f-3 dB = 1 2pR1C1 120 270 100 225 80 180 60 135 Phase 40 90 20 45 VS = "2.75 V V S = "2.75 V 0 ( RF VOUT = 1+ RG VIN (( 1 1 + sR1C1 ( Phase () R1 Gain (dB) RG 0 Gain VS = "0.9 "0.9 VV V S = 20 1 10 100 1k 10k 100k Frequency (Hz) 1M 10M -45 100M C006 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 7 1 1 1 2 4 6 Absolute Maximum Ratings ...................................... 6 ESD Ratings.............................................................. 6 Recommended Operating Conditions....................... 6 Thermal Information: OPA316 .................................. 6 Thermal Information: OPA2316 ................................ 7 Thermal Information: OPA2316S.............................. 7 Thermal Information: OPA4316 ................................ 8 Electrical Characteristics........................................... 9 Typical Characteristics ............................................ 11 Detailed Description ............................................ 17 7.1 Overview ................................................................. 17 7.2 Functional Block Diagram ....................................... 17 7.3 Feature Description................................................. 17 7.4 Device Functional Modes........................................ 20 8 Application and Implementation ........................ 21 8.1 Application Information............................................ 21 8.2 Typical Application .................................................. 22 9 Power Supply Recommendations...................... 25 10 Layout................................................................... 26 10.1 Layout Guidelines ................................................. 26 10.2 Layout Example .................................................... 26 11 Device and Documentation Support ................. 27 11.1 11.2 11.3 11.4 11.5 11.6 11.7 Documentation Support ........................................ Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 27 27 27 27 27 27 27 12 Mechanical, Packaging, and Orderable Information ........................................................... 28 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (May 2016) to Revision F Page * Added SOIC (14) / OPA4316 body size information to Device Information table ................................................................. 1 * Added D package to PW package pinout drawing ................................................................................................................ 4 * Added D (SOIC) thermal information to Thermal Information: OPA4316 table .................................................................... 8 Changes from Revision D (December 2014) to Revision E * Page Added new "RUG" package ................................................................................................................................................... 1 Changes from Revision C (October 2014) to Revision D Page * Added Shutdown section to Electrical Characteristics table ............................................................................................... 10 * Added Related Documentation section ............................................................................................................................... 27 Changes from Revision B (August 2014) to Revision C Page * Updated devices and packages in Device Information table ................................................................................................ 1 * Added thermal information for OPA2316S and OPA4316 ..................................................................................................... 7 Changes from Revision A (April 2014) to Revision B Page * Added OPA2316 to the Device Information table................................................................................................................... 1 * Added thermal information for OPA2316 .............................................................................................................................. 7 * Added channel separation to Electrical Characteristics ........................................................................................................ 9 * Added GBP instead of UGB in the Electrical Characteristics ................................................................................................ 9 * Added Channel Separation vs Frequency plot..................................................................................................................... 16 2 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 Changes from Original (April 2014) to Revision A * Page Changed status from preview to production .......................................................................................................................... 1 Copyright (c) 2014-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 3 OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com 5 Pin Configuration and Functions DCK Package 5-Pin SC70 Top View +IN 1 V- 2 -IN 3 DGS Package 10-Pin MSOP Top View V+ 5 OUT A 1 -IN A 2 10 V+ 9 OUT B 8 -IN B A OUT 4 +IN A 3 B DBV Package 5-Pin SOT-23 Top View OUT 1 V- 2 +IN 3 5 V+ 4 -IN V- 4 7 +IN B SHDN A 5 6 SHDN B RUG Package 10-Pin QFN Top View +IN A 10 DRG Package 8-Pin DFN Top View OUT A 1 -IN A 2 +IN A 3 V- 4 Exposed Thermal Die Pad on Underside(2) 8 V+ 7 OUT B 6 -IN B 5 +IN B V 1 9 IN A SHDN A 2 8 OUT A SHDN B 3 7 V+ +IN B 4 6 OUT B 5 Pitch: 0.5 mm. IN B Connect thermal pad to V-. Pad size: 2.00 mm x 1.20 mm. D, PW Packages 14-Pin SOIC, TSSOP Top View D, DGK Packages 8-Pin MSOP, SO Top View OUT A 4 1 8 V+ OUT A 1 A D 14 OUT D 13 -IN D -IN A 2 7 OUT B -IN A 2 +IN A 3 6 -IN B +IN A 3 12 +IN D V- 4 5 +IN B V+ 4 11 V- +IN B 5 10 +IN C -IN B 6 9 -IN C OUT B 7 8 OUT C Submit Documentation Feedback B C Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 Pin Functions PIN OPA316 NAME OPA2316 OPA2316S OPA4316 DESCRIPTION DBV DCK D, DGK, DRG +IN 3 1 -- -- -- -- -- Noninverting input +IN A -- -- 3 3 10 3 3 Noninverting input +IN B -- -- 5 7 4 5 5 Noninverting input +IN C -- -- -- -- -- 10 10 Noninverting input +IN D -- -- -- -- -- 12 12 Noninverting input -IN 4 3 -- -- -- -- -- Inverting input -IN A -- -- 2 2 9 2 2 Inverting input -IN B -- -- 6 8 5 6 6 Inverting input -IN C -- -- -- -- -- 9 9 Inverting input -IN D -- -- -- -- -- 13 13 Inverting input OUT 1 4 -- -- -- -- -- Output OUT A -- -- 1 1 8 1 1 Output OUT B -- -- 7 9 6 7 7 Output OUT C -- -- -- -- -- 8 8 Output OUT D -- -- -- -- -- 14 14 Output SHDN A -- -- -- 5 2 -- -- Shutdown (logic low), enable (logic high) SHDN B -- -- -- 6 3 -- -- Shutdown (logic low), enable (logic high) V+ 5 5 8 10 7 4 4 Positive supply V- 2 2 4 4 1 11 11 Negative supply or ground (for single-supply operation) DGS RUG PW D Copyright (c) 2014-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 5 OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature (unless otherwise noted) (1) MIN MAX UNIT 7 V (V+) + 0.5 V Supply voltage Signal input pins Common-mode Voltage (2) (V-) - 0.5 Differential Current (2) Operating temperature TJ Junction temperature Tstg Storage temperature (3) mA Continuous TA (2) V 10 -10 Output short-circuit (3) (1) (V+) - (V-) + 0.2 -55 -65 150 C 150 C 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Input pins are diode-clamped to the power-supply rails. Current limit input signals that can swing more than 0.5 V beyond the supply rails to 10 mA or less. Short-circuit to ground, one amplifier per package. 6.2 ESD Ratings over operating free-air temperature range (unless otherwise noted). VALUE V(ESD) (1) (2) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) 4000 Charged device model (CDM), per JEDEC specification JESD22-C101 (2) 1500 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted). MIN VS MAX UNIT Supply voltage 1.8 5.5 V Specified temperature -40 125 C 6.4 Thermal Information: OPA316 OPA316 THERMAL METRIC (1) DBV (SOT23) DCK (SC70) 5 PINS 5 PINS UNIT RJA Junction-to-ambient thermal resistance (2) 221.7 263.3 C/W RJC(top) Junction-to-case(top) thermal resistance (3) 144.7 75.5 C/W RJB Junction-to-board thermal resistance (4) 49.7 51 C/W JT Junction-to-top characterization parameter (5) 26.1 1 C/W JB Junction-to-board characterization parameter (6) 49 50.3 C/W (1) (2) (3) (4) (5) (6) 6 For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953). The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, JT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, JB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RJA, using a procedure described in JESD51-2a (sections 6 and 7). Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 Thermal Information: OPA316 (continued) OPA316 THERMAL METRIC (1) RJC(bot) (7) DBV (SOT23) DCK (SC70) 5 PINS 5 PINS N/A N/A Junction-to-case(bottom) thermal resistance (7) UNIT C/W The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. 6.5 Thermal Information: OPA2316 OPA2316 THERMAL METRIC (1) D (SO) DGK (MSOP) DRG (DFN) 8 PINS 8 PINS 8 PINS UNIT RJA Junction-to-ambient thermal resistance (2) 127.2 186.6 56.3 C/W RJC(top) Junction-to-case(top) thermal resistance (3) 71.6 78.8 72.2 C/W RJB Junction-to-board thermal resistance (4) 68.2 107.9 31 C/W JT Junction-to-top characterization parameter (5) 22 15.5 2.3 C/W JB Junction-to-board characterization parameter (6) 67.6 106.3 21.2 C/W RJC(bot) Junction-to-case(bottom) thermal resistance (7) N/A N/A 10.9 C/W (1) (2) (3) (4) (5) (6) (7) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953). The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, JT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, JB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. 6.6 Thermal Information: OPA2316S OPA2316S THERMAL METRIC (1) DGS (MSOP) QFN (RUG) 10 PINS 10 PINS UNIT RJA Junction-to-ambient thermal resistance (2) 189.6 158 C/W RJC(top) Junction-to-case(top) thermal resistance (3) 73.9 52 C/W RJB Junction-to-board thermal resistance (4) 110.7 88 C/W JT Junction-to-top characterization parameter (5) 13.4 1 C/W JB Junction-to-board characterization parameter (6) 109.1 87 C/W RJC(bot) Junction-to-case(bottom) thermal resistance (7) N/A N/A C/W (1) (2) (3) (4) (5) (6) (7) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953). The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, JT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, JB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Copyright (c) 2014-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 7 OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com 6.7 Thermal Information: OPA4316 OPA4316 THERMAL METRIC (1) Junction-to-ambient thermal resistance (2) RJA (3) PW (TSSOP) D (SOIC) 14 PINS 14 PINS UNIT 117.2 87.0 C/W RJC(top) Junction-to-case(top) thermal resistance 46.2 44.4 C/W RJB Junction-to-board thermal resistance (4) 58.9 41.7 C/W JT Junction-to-top characterization parameter (5) 4.9 11.6 C/W JB Junction-to-board characterization parameter (6) 58.3 41.4 C/W RJC(bot) Junction-to-case(bottom) thermal resistance (7) N/A N/A C/W (1) (2) (3) (4) (5) (6) (7) 8 For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953). The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, JT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, JB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining RJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 6.8 Electrical Characteristics VS (total supply voltage) = (V+) - (V-) = 1.8 V to 5.5 V. at TA = 25C, RL = 10 k connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 0.5 2.5 mV OFFSET VOLTAGE VOS Input offset voltage dVOS/dT Drift PSRR vs power supply VS = 5 V VS = 5 V, TA = -40C to 125C mV VS = 5 V, TA = -40C to 125C 2 10 V/C VS = 1.8 V - 5.5 V, VCM = (V-) 30 150 V/V 250 V/V VS = 1.8 V - 5.5 V, VCM = (V-), TA = -40C to 125C Channel separation, dc 3.5 At dc 10 V/V INPUT VOLTAGE RANGE VCM Common-mode voltage CMRR Common-mode rejection ratio VS = 1.8 V to 2.5 V (V-) - 0.2 (V+) V VS = 2.5 V to 5.5 V (V-) - 0.2 (V+) + 0.2 V VS = 1.8 V, (V-) - 0.2 V < VCM < (V+) - 1.4 V, TA= -40C to 125C 70 86 dB VS = 5.5 V, (V-) - 0.2 V < VCM < (V+) - 1.4 V, TA= -40C to 125C 76 90 dB VS = 1.8 V, VCM = -0.2 V to 1.8 V, TA= -40C to 125C 57 72 dB VS = 5.5 V, VCM = -0.2 V to 5.7 V, TA= -40C to 125C 65 80 dB INPUT BIAS CURRENT IB 5 Input bias current IOS TA= -40C to 125C 2 Input offset current TA= -40C to 125C 15 pA 15 nA 15 pA 8 nA NOISE En Input voltage noise (peak-to-peak) VS = 5 V, f = 0.1 Hz to 10 Hz 3 VPP en Input voltage noise density VS = 5 V, f = 1 kHz 11 nV/Hz in Input current noise density f = 1 kHz 1.3 fA/Hz INPUT IMPEDANCE ZID Differential 2 || 2 1016 || pF ZIC Common-mode 2 || 4 1011 || pF OPEN-LOOP GAIN AOL Open-loop voltage gain VS = 1.8 V, (V-) + 0.04 V < VO < (V+) - 0.04 V, RL = 10 k 94 100 dB VS = 5.5 V, (V-) + 0.05 V < VO < (V+) - 0.05 V, RL = 10 k 104 110 dB 90 96 dB VS = 5.5 V, (V-) + 0.15 V < VO < (V+) - 0.15 V, RL = 2 k 100 106 dB VS = 5.5 V, (V-) + 0.05 V < VO < (V+) - 0.05 V, RL = 10 k, TA= -40C to 125C 86 dB VS = 5.5 V, (V-) + 0.15 V < VO < (V+) - 0.15 V, RL = 2 k, TA= -40C to 125C 84 dB VS = 1.8 V, (V-) + 0.1 V < VO < (V+) - 0.1 V, RL = 2 k FREQUENCY RESPONSE GBP Gain bandwidth product VS = 5 V, G = +1 10 MHz m Phase margin VS = 5 V, G = +1 60 Degrees SR Slew rate VS = 5 V, G = +1 6 V/s To 0.1%, VS = 5 V, 2-V step , G = +1, CL = 100 pF 1 s 1.66 s 0.3 s tS Settling time tOR Overload recovery time THD + N Total harmonic distortion + noise (1) VS = 5 V, VO = 0.5 VRMS, G = +1, f = 1 kHz (1) To 0.01%, VS = 5 V, 2-V step , G = +1, CL = 100 pF VS = 5 V, VIN x gain = VS 0.0008% Third-order filter; bandwidth = 80 kHz at -3 dB. Copyright (c) 2014-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 9 OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com Electrical Characteristics (continued) VS (total supply voltage) = (V+) - (V-) = 1.8 V to 5.5 V. at TA = 25C, RL = 10 k connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT OUTPUT VO Voltage output swing from supply rails VS = 1.8 V, RL = 10 k, TA= -40C to 125C 15 mV VS = 5.5 V, RL = 10 k, TA= -40C to 125C 30 mV VS = 1.8 V, RL = 2 k, TA= -40C to 125C 60 mV VS = 5.5 V, RL = 2 k, TA= -40C to 125C 120 mV ISC Short-circuit current VS = 5 V 50 mA ZO Open-loop output impedance VS = 5 V, f = 10 MHz 250 POWER SUPPLY VS Specified voltage IQ Quiescent current per amplifier VS = 5 V, IO = 0 mA, TA= -40C to 125C 1.8 400 Power-on time VS = 0 V to 5.5 V 200 All amplifiers disabled, SHDN = VS- 0.01 5.5 V 500 A s SHUTDOWN (VS = 1.8 V to 5.5 V) (2) IQSD Quiescent current, per device VIH High voltage (enabled) Amplifier enabled VIL Low voltage (disabled) Amplifier disabled tON tOFF Amplifier enable time One amplifier disabled (OPA2316S) (3) Amplifier disable time (3) 345 A A (V+) - 0.5 V (V-) + 0.2 V Full shutdown, G = 1, VOUT = 0.9 x VS / 2 (4) 13 s Partial shutdown, G = 1, VOUT = 0.9 x VS / 2 (4) 10 s G = 1, VOUT = 0.1 x VS / 2 SHDN pin input bias current (per pin) 1 5 s VIH = 5 V 3.5 pA VIL = 0 V 2.5 pA TEMPERATURE Specified temperature -40 125 C TA Operating temperature -55 150 C Tstg Storage temperature -65 150 C (2) (3) (4) 10 Ensured by design and characterization; not production tested. Enable time (tON) and disable time (tOFF) are defined as the time interval between the 50% point of the signal applied to the SHDN pin and the point at which the output voltage reaches the 10% (disable) or 90% (enable) level. Full shutdown refers to the dual OPA2316S having both channels A and B disabled (SHDN_A = SHDN_B = VS-). For partial shutdown, only one SHDN pin is exercised; in partial mode, the internal biasing and oscillator remain operational and the enable time is shorter. Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 6.9 Typical Characteristics at TA = 25C, VS = 5.5 V, RL = 10 k connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2, unless otherwise noted. 40 Percentage of Amplifiers (%) Percentage of Amplifiers (%) 25 20 15 10 5 35 30 25 20 15 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0 0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.5 0 -2.0 5 Offset Voltage (mV) Offset Voltage Drift (V/C) C013 C013 Distribution taken from 12551 amplifiers TA = -40C to +125C, Distribution taken from 70 amplifiers Figure 2. Offset Voltage Drift Distribution 2500 2000 2000 1500 1500 1000 1000 500 500 VOS ( V) VOS ( V) Figure 1. Offset Voltage Production Distribution 2500 0 500 0 500 1000 1000 1500 1500 2000 2000 2500 2500 75 50 0 25 25 50 75 100 125 150 Temperature (C) 2 0 1 1 2 3 VCM (V) C001 V+ = 2.75 V, V- = -2.75 V, 9 typical units shown Figure 3. Offset Voltage vs Temperature Figure 4. Offset Voltage vs Common-Mode Voltage 2000 VS = 2.75 V VS = 0.9 V Gain (dB) 500 0 500 1000 120 270 100 225 80 180 60 135 Phase 40 90 20 1500 45 VS = "2.75 V V S = "2.75 V 0 2000 Phase () VOS ( V) Transition 3 2500 1000 NChannel PChannel C001 9 typical units shown 1500 VCM = 2.95 V VCM = -2.95 V 0 Gain VS = "0.9 "0.9 VV V S = 2500 20 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 VSUPPLY (V) V+ = 0.9 V to 2.75 V, V- = -0.9 V to -2.75 V, 9 typical units shown Figure 5. Offset Voltage vs Power Supply Copyright (c) 2014-2016, Texas Instruments Incorporated 2.8 C001 1 10 100 1k 10k 100k 1M 10M -45 100M Frequency (Hz) C006 VCM < (V+) - 1.4 V Figure 6. Open-Loop Gain and Phase vs Frequency Submit Documentation Feedback Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 11 OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com Typical Characteristics (continued) at TA = 25C, VS = 5.5 V, RL = 10 k connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2, unless otherwise noted. 100 100 75 75 AOL (V/V) 50 50 AOL (V/V) VS = 1.8 V 25 VS = 1.8 V 25 0 0 VS = 5.5 V VS = 5.5 V -25 -25 -50 -50 75 50 25 0 25 50 75 100 125 150 Temperature (C) 75 50 25 50 75 100 125 150 C001 RL = 2 k Figure 7. Open-Loop Gain vs Temperature Figure 8. Open-Loop Gain vs Temperature 100000 25 20 IB+ IB Ios 10000 Input Bias Current and Input Offset Current (pA) 15 1000 10 Gain (dB) 25 Temperature (C) RL = 10 k 5 0 -5 G = +1 -10 100 10 1 G = +10 -15 G = -1 0 -20 10k 100k 1M Frequency (Hz) 10M 75 100M 50 25 Figure 9. Closed-Loop Gain vs Frequency 0 25 50 75 100 125 Temperature (C) C007 150 C001 Figure 10. Input Bias and Offset Current vs Temperature 3 25C Common-Mode Rejection Ratio (dB), Power-Supply Rejection Ratio (dB) 120 -40C 2 1 Vout (V) 0 C001 85C 125C 0 125C -1 85C -2 25C -40C 100 80 60 40 PSRR 20 CMRR 0 -3 0 10 20 30 40 Iout (mA) 50 60 C001 1 10 100 1k 10k 100k Frequency (Hz) 1M C011 V+ = 2.75 V, V- = -2.75 V Figure 11. Output Voltage Swing vs Output Current 12 Submit Documentation Feedback Figure 12. CMRR and PSRR vs Frequency (Referred to Input) Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 Typical Characteristics (continued) 200 Common-Mode Rejection Ratio (V/V) Common-Mode Rejection Ratio (V/V) at TA = 25C, VS = 5.5 V, RL = 10 k connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2, unless otherwise noted. 150 9 " 9CM " 9 VS = 1.8 V, (V-) - 100 - 1.4 V 50 0 9 " 9CM " 9 VS = 5.5 V, (V-) - 50 - 1.4 V 100 150 200 1000 750 500 9 " 9CM " 9 VS = 1.8 V, (V-) - 250 0 VS = 5.5 V, (V-) - 250 9 " 9CM " 9 9 500 750 1000 75 50 25 0 25 50 75 100 125 Temperature (C) 150 75 50 0 25 25 50 75 100 125 150 Temperature (C) C001 Figure 13. CMRR vs Temperature (Narrow Range) C001 Figure 14. CMRR vs Temperature (Wide Range) 80 60 1 V/div Power-Supply Rejection Ratio (V/V) 100 40 20 0 Peak-to-Peak Noise = VRMS x 6.6 = 3 Vpp -20 75 50 25 0 25 50 75 100 125 Temperature (C) Time (1 s/div) 150 C014 C001 Figure 16. 0.1-Hz to 10-Hz Input Voltage Noise Figure 15. PSRR vs Temperature 16 15 Voltage Noise (nV/rtHz) 9ROWDJH 1RLVH 'HQVLW\ Q9 +] 1000 100 10 14 13 12 11 10 9 1 8 0.1 1 10 100 1k Frequency (Hz) 10k 100k C015 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 Common-Mode Voltage (V) 5.5 C039 = 1 kHz Figure 17. Input Voltage Noise Spectral Density vs Frequency Copyright (c) 2014-2016, Texas Instruments Incorporated Figure 18. Input Voltage Noise vs Common-Mode Voltage Submit Documentation Feedback Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 13 OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com Typical Characteristics (continued) Total Harmonic Distortion + Noise (%) G = +1 G +1 V/V, V/V,RL RL = 2 kN G V/V,RL RL = 10 kN G = -1 V/V, 0.01 -80 G V/V,RL RL = 2 kN G = -1 V/V, -100 0.001 -120 100k 0.0001 10 100 1k 10k Frequency (Hz) 1. -40 0.1 -60 0.01 -80 0.001 -100 G = +1 V/V, RL N G = +1 +1 V/V, V/V,RL RL = 2 kN 0.0001 -120 G = -1 G -1 V/V, V/V,RL RL = 10 kN G = -1 -1 V/V, V/V,RL RL = 2 kN 0.00001 0.001 0.01 -140 0.1 1 10 Output Amplitude (VRMS) C017 BW = 80 kHz, VOUT = 0.5 VRMS Total Harmonic Distortion + Noise (dB) G = +1 G +1 V/V, V/V,RL RL = 10 kN Total Harmonic Distortion + Noise (dB) -60 0.1 Total Harmonic Distortion + Noise (%) at TA = 25C, VS = 5.5 V, RL = 10 k connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2, unless otherwise noted. C018 = 1 kHz, BW = 80 kHz Figure 19. THD + N vs Frequency Figure 20. THD + N vs Amplitude 450 450 425 425 400 IQ (A) IQ (A) 375 350 VS = 5.5 V 400 VS = 1.8 V 325 375 300 275 250 350 1.5 2 2.5 3 3.5 4 4.5 5 5.5 Supply Voltage (V) 6 75 50 25 0 25 50 75 100 125 150 Temperature (C) C001 Figure 21. Quiescent Current vs Supply Voltage C001 Figure 22. Quiescent Current vs Temperature 10k 50 40 ZO ( ) Overshoot (%) 1k 100 30 RI = 1 kohm RF = 1 kohm 20 + 2.75 V + 10 Device VIN = 100 mVpp + 10 CL 2.75 V 0 1 10 100 1k 10k 100k Frequency (Hz) 1M 10M 100M 1000M C024 0p 100p 200p Capacitive Load (F) 300p C025 V+ = 2.75 V, V- = -2.75 V, G = -1 V/V Figure 23. Open-Loop Output Impedance vs Frequency 14 Submit Documentation Feedback Figure 24. Small-Signal Overshoot vs Load Capacitance Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 Typical Characteristics (continued) at TA = 25C, VS = 5.5 V, RL = 10 k connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2, unless otherwise noted. 80 VIN 70 VOUT 50 1 V/div Overshoot (%) 60 40 + 2.75 V 30 + 2.75 V Device Device 20 + VIN = 100 mVpp + 2.75 V RL CL 10 0 0p 100p 200p Time (100 s/div) 300p Capacitive Load (F) C027 C026 V+ = 2.75 V, V- = -2.75 V V+ = 2.75 V, V- = -2.75 V , G = +1 V/V, RL = 1 k Figure 26. No Phase Reversal Figure 25. Small-Signal Overshoot vs Load Capacitance 1V VOUT 5.5 V RI = 1 kohm RF = 10 kohm 0V + 2.75 V VIN = 1 Vpp Device VIN VOUT + 500 mV/div 500 mV/div + 2.75 V 6.1 VPP Sine Wave VOUT + + 2.75 V Saturated Slewing Recovering Saturated RI = 1 kohm Slewing + 2.75 V + VIN Recovering RF = 10 kohm VIN = 1 Vpp Device VOUT + 0V 2.75 V -5.5 V VOUT -1 V Time (100 ns/div) Time (100 ns/div) C028 C029 V+ = 2.75 V, V- = -2.75 V , G = -10 V/V V+ = 2.75 V, V- = -2.75 V, G = -10 V/V Figure 27. Positive Overload Recovery Figure 28. Negative Overload Recovery + 2.75 V Device CL = 100 100 pF pF C L = + VIN = 1 Vpp + 2.75 V RL CL 200 mV/div Output Voltage (20 mV/div) CL = 10 pF C L = 10 pF + 2.75 V VOUT Device + VIN = 100 mVpp + 2.75 V RL CL VIN Time (200 ns/div) Time (100 ns/div) C030 V+ = 2.75 V, V- = -2.75 V, G = +1 V/V Figure 29. Small-Signal Step Response Copyright (c) 2014-2016, Texas Instruments Incorporated C031 V+ = 2.75 V, V- = -2.75 V, CL = 100 pF, G = +1 V/V Figure 30. Large-Signal Step Response Submit Documentation Feedback Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 15 OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com Typical Characteristics (continued) at TA = 25C, VS = 5.5 V, RL = 10 k connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2, unless otherwise noted. 40 Output Delta from Final Value (mV) Output Delta from Final Value (mV) 100 80 60 40 20 0.1% Settling = 2 mV 0 -20 20 0 0.1% Settling = 2 mV -20 -40 -60 -80 -40 0 0.5 1 1.5 0 2 Time ( s) 0.5 CL = 100 pF, G = +1 V/V 1.5 2 C033 CL = 100 pF, G = +1 V/V Figure 31. Positive Large-Signal Settling Time Figure 32. Negative Large-Signal Settling Time 70 7 6 Output Voltage (VPP) 60 ISC, Source ISC (mA) 1 Time ( s) C032 50 ISC, Sink 40 VS = 5.5 V 5 VS = 5 V Maximum output voltage without slew-rate induced distortion. 4 3 VS = 1.8 V 2 1 30 75 50 25 0 25 50 75 100 125 0 100k 150 Temperature (C) C001 10M C035 Figure 34. Maximum Output Voltage vs Frequency and Supply Voltage 100 0 80 20 Crosstalk (dB) EMIRR IN+ (dB) Figure 33. Short-Circuit Current vs Temperature 60 40 20 40 60 80 100 0 120 10M 100M 1G Frequency (Hz) 10G Figure 35. Electromagnetic Interference Rejection Ratio Referred to Noninverting Input (EMIRR IN+) vs Frequency Submit Documentation Feedback 10 100 1k 10k 100k 1M Frequency (Hz) C036 PRF = -10 dBm 16 1M Frequency (Hz) 10M C001 V+ = 2.75 V, V- = -2.75 V Figure 36. Channel Separation vs Frequency Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 7 Detailed Description 7.1 Overview The OPA316 is a family of low-power, rail-to-rail input and output operational amplifiers. These devices operate from 1.8 V to 5.5 V, are unity-gain stable, and are suitable for a wide range of general-purpose applications. The class AB output stage is capable of driving less than or equal to 10-k loads connected to any point between V+ and ground. The input common-mode voltage range includes both rails and allows the OPA316 series to be used in virtually any single-supply application. Rail-to-rail input and output swing significantly increases dynamic range, especially in low-supply applications, and makes them ideal for driving sampling analog-to-digital converters (ADCs). The OPA316 family features 10-MHz bandwidth and 6-V/s slew rate with only 400-A supply current per channel, providing good ac performance at very-low power consumption. DC applications are well served with a very-low input noise voltage of 11 nV/Hz at 1 kHz, low input bias current (5 pA), and an input offset voltage of 0.5 mV (typical). 7.2 Functional Block Diagram V+ Reference Current VIN+ VINVBIAS1 Class AB Control Circuitry VO VBIAS2 V(Ground) 7.3 Feature Description 7.3.1 Operating Voltage The OPAx316 operational amplifiers are fully specified and ensured for operation from 1.8 V to 5.5 V. In addition, many specifications apply from -40C to +125C. Parameters that vary significantly with operating voltages or temperature are illustrated in the Typical Characteristics graphs. 7.3.2 Rail-to-Rail Input The input common-mode voltage range of the OPAx316 series extends 200 mV beyond the supply rails for supply voltages greater than 2.5 V. This performance is achieved with a complementary input stage: an Nchannel input differential pair in parallel with a P-channel differential pair, as shown in the Functional Block Diagram. The N-channel pair is active for input voltages close to the positive rail, typically (V+) - 1.4 V to 200 mV above the positive supply, whereas the P-channel pair is active for inputs from 200 mV below the negative Copyright (c) 2014-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 17 OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com Feature Description (continued) supply to approximately (V+) - 1.4 V. There is a small transition region, typically (V+) - 1.2 V to (V+) - 1 V, in which both pairs are on. This 200-mV transition region can vary up to 200 mV with process variation. Thus, the transition region (both stages on) can range from (V+) - 1.4 V to (V+) - 1.2 V on the low end, up to (V+) - 1 V to (V+) - 0.8 V on the high end. Within this transition region, PSRR, CMRR, offset voltage, offset drift, and THD can be degraded compared to device operation outside this region. 7.3.3 Input and ESD Protection The OPAx316 incorporates internal ESD protection circuits on all pins. In the case of input and output pins, this protection primarily consists of current-steering diodes connected between the input and power-supply pins. These ESD protection diodes provide in-circuit, input overdrive protection, as long as the current is limited to 10 mA as stated in Absolute Maximum Ratings. Figure 37 shows how a series input resistor can be added to the driven input to limit the input current. The added resistor contributes thermal noise at the amplifier input and the value must be kept to a minimum in noise-sensitive applications. V+ IOVERLOAD 10-mA max Device VOUT VIN 5 kW Figure 37. Input Current Protection 7.3.4 Common-Mode Rejection Ratio (CMRR) CMRR for the OPAx316 is specified in several ways so the user can select the best match for a given application, as shown in Electrical Characteristics. First, the data sheet gives the CMRR of the device in the common-mode range below the transition region [VCM < (V+) - 1.4 V]. This specification is the best indicator of device capability when the application requires use of one of the differential input pairs. Second, the CMRR over the entire common-mode range is specified at VCM = -0.2 V to 5.7 V for VS = 5.5 V. This last value includes the variations shown in Figure 4 through the transition region. 7.3.5 EMI Susceptibility and Input Filtering Operational amplifiers vary with regard to the susceptibility of the device to electromagnetic interference (EMI). If conducted EMI enters the operational amplifier, the dc offset observed at the amplifier output can shift from its nominal value when EMI is present. This shift is a result of signal rectification associated with the internal semiconductor junctions. Although all operational amplifier pin functions can be affected by EMI, the signal input pins are likely to be the most susceptible. The OPA316 operational amplifier family incorporates an internal input low-pass filter that reduces the amplifier response to EMI. This filter provides both common-mode and differential-mode filtering. The filter is designed for a cutoff frequency of approximately 80 MHz (-3 dB), with a roll-off of 20 dB per decade. TI developed the ability to accurately measure and quantify the immunity of an operational amplifier over a broad frequency spectrum extending from 10 MHz to 6 GHz. The EMI rejection ratio (EMIRR) metric allows operational amplifiers to be directly compared by the EMI immunity. Figure 35 illustrates the results of this testing on the OPA316 series. For more information, see EMI Rejection Ratio of Operational Amplifiers (SBOA128). 7.3.6 Rail-to-Rail Output Designed as a low-power, low-noise operational amplifier, the OPAx316 delivers a robust output drive capability. A class AB output stage with common-source transistors is used to achieve full rail-to-rail output swing capability. For resistive loads of 10-k, the output swings typically to within 30 mV of either supply rail regardless of the power-supply voltage applied. Different load conditions change the ability of the amplifier to swing close to the rails; see the typical characteristic graph Output Voltage Swing vs Output Current (Figure 11). 18 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 Feature Description (continued) 7.3.7 Capacitive Load and Stability The OPAx316 is designed to be used in applications where driving a capacitive load is required. As with all operational amplifiers, there may be specific instances where the OPAx316 can become unstable. The particular operational amplifier circuit configuration, layout, gain, and output loading are some of the factors to consider when establishing whether or not an amplifier is stable in operation. An operational amplifier in the unity-gain (+1 V/V) buffer configuration that drives a capacitive load exhibits a greater tendency to be unstable than an amplifier operated at a higher noise gain. The capacitive load, in conjunction with the operational amplifier output resistance, creates a pole within the feedback loop that degrades the phase margin. The degradation of the phase margin increases as the capacitive loading increases. As a conservative best practice, designing for 25% overshoot (40 phase margin) provides improved stability over process variations. The equivalent series resistance (ESR) of some very-large capacitors (CL greater than 1 F) is sufficient to alter the phase characteristics in the feedback loop such that the amplifier remains stable. Increasing the amplifier closed-loop gain allows the amplifier to drive increasingly larger capacitance. This increased capability is evident when observing the overshoot response of the amplifier at higher voltage gains. See the typical characteristic graphs, Small-Signal Overshoot vs Capacitive Load (Figure 24, G = -1 V/V) and Small-Signal Overshoot vs Capacitive Load (Figure 25, G = +1 V/V). One technique for increasing the capacitive load drive capability of the amplifier operating in a unity-gain configuration is to insert a small resistor (typically 10 to 20 ) in series with the output, as shown in Figure 38. This resistor significantly reduces the overshoot and ringing associated with large capacitive loads. One possible problem with this technique, however, is that a voltage divider is created with the added series resistor and any resistor connected in parallel with the capacitive load. The voltage divider introduces a gain error at the output that reduces the output swing. V+ RS VOUT Device VIN 10 W to 20 W RL CL Figure 38. Improving Capacitive Load Drive 7.3.8 Overload Recovery Overload recovery is defined as the time required for the operational amplifier output to recover from a saturated state to a linear state. The output devices of the operational amplifier enter a saturation region when the output voltage exceeds the rated operating voltage, either because of the high input voltage or the high gain. After the device enters the saturation region, the charge carriers in the output devices require time to return back to the linear state. After the charge carriers return back to the linear state, the device begins to slew at the specified slew rate. Thus, the propagation delay in case of an overload condition is the sum of the overload recovery time and the slew time. The overload recovery time for the OPAx316 is approximately 300 ns. 7.3.9 DFN Package The OPA2316 (dual version) device uses the DFN style package (also known as SON); this package is a QFN with contacts on only two sides of the package bottom. This leadless package maximizes printed circuit board (PCB) space and offers enhanced thermal and electrical characteristics through an exposed pad. One of the primary advantages of the DFN package is the low, 0.9-mm height. DFN packages are physically small, have a smaller routing area, improved thermal performance, reduced electrical parasitics, and use a pinout scheme that is consistent with other commonly-used packages, such as SOIC and MSOP). Additionally, the absence of external leads eliminates bent-lead issues. The DFN package can be simply mounted using standard PCB assembly techniques. See QFN/SON PCB Attachment (SLUA271) , and Quad Flatpack No-Lead Logic Packages (SCBA017). Copyright (c) 2014-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 19 OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com Feature Description (continued) NOTE Connect the exposed lead frame die pad on the bottom of the DFN package to the most negative potential (V-). 7.4 Device Functional Modes The OPA316, OPA2316, and OPA4316 devices are powered on when the supply is connected. The devices can be operated as a single-supply operational amplifier or a dual-supply amplifier, depending on the application. The OPA2316S device has a SHDN (enable) pin function referenced to the negative supply voltage of the operational amplifier. A logic level high enables the operational amplifier. A valid logic high is defined as voltage [(V+) - 0.1 V], up to (V+), applied to the SHDN pin. A valid logic low is defined as [(V-) + 0.1 V], down to (V-), applied to the enable pin. The maximum allowed voltage applied to SHDN is 5.5 V with respect to the negative supply, independent of the positive supply voltage. Connect this pin to a valid high or a low voltage or driven, but not left as an open circuit. The logic input is a high-impedance CMOS input. Both inputs are independently controlled. For battery-operated applications, this feature can be used to greatly reduce the average current and extend battery life. 20 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information 8.1.1 General Configurations When receiving low-level signals, the device often requires limiting the bandwidth of the incoming signals into the system. The simplest way to establish this limited bandwidth is to place an RC filter at the noninverting pin of the amplifier, as Figure 39 shows. RG RF R1 VOUT VIN C1 f-3 dB = ( RF VOUT = 1+ RG VIN (( 1 1 + sR1C1 1 2pR1C1 ( Figure 39. Single-Pole Low-Pass Filter If even more attenuation is needed, the device requires a multiple-pole filter. The Sallen-Key filter can be used for this task, as Figure 40 shows. For best results, the amplifier must have a bandwidth that is 8 to 10 times the filter frequency bandwidth. Failure to follow this guideline can result in phase shift of the amplifier. C1 R1 R1 = R2 = R C1 = C2 = C Q = Peaking factor (Butterworth Q = 0.707) R2 VIN VOUT C2 1 2pRC f-3 dB = RF RF RG = RG ( 2- 1 Q ( Figure 40. Two-Pole, Low-Pass, Sallen-Key Filter Copyright (c) 2014-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 21 OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com 8.2 Typical Application Some applications require differential signals. Figure 41 shows a simple circuit to convert a single-ended input of 0.1 V to 2.4 V into a differential output of 2.3 V on a single 2.7-V supply. The output range is intentionally limited to maximize linearity. The circuit is composed of two amplifiers. One amplifier functions as a buffer and creates a voltage, VOUT+. The second amplifier inverts the input and adds a reference voltage to generate VOUT-. VOUT+ and VOUT- range from 0.1 V to 2.4 V. The difference, VDIFF, is the difference between VOUT+ and VOUT- which makes the differential output voltage range 2.3 V. R2 2.7V R1 - Vout- + R3 + Vref 2.5V R4 V + 2.7V - Vdiff Vout+ + + + Vin Figure 41. Schematic for a Single-Ended Input to Differential Output Conversion 8.2.1 Design Requirements Table 1 lists the design requirements: Table 1. Design Parameters DESIGN PARAMETER VALUE Supply voltage 2.7 V Reference voltage 2.5 V Input voltage 0.1 V to 2.4 V Output differential voltage 2.3 V Output common-mode voltage 1.25 V Small-signal bandwidth 5 MHz 8.2.2 Detailed Design Procedure The circuit in Figure 41 takes a single-ended input signal, VIN, and generates two output signals, VOUT+ and VOUT- using two amplifiers and a reference voltage, VREF. VOUT+ is the output of the first amplifier and is a buffered version of the input signal, VIN (as shown in Equation 1). VOUT- is the output of the second amplifier which uses VREF to add an offset voltage to VIN and feedback to add inverting gain. The transfer function for VOUT- is given in Equation 2. Vout Vin (1) 22 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com Vout SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 R 4 * R2 * R2 Vref u Vin u u 1 R1 R1 (c) R3 R 4 (c) (2) The differential output signal, VDIFF, is the difference between the two single-ended output signals, VOUT+ and VOUT-. Equation 3 shows the transfer function for VDIFF. Using conditions in Equation 4 and Equation 5 and applying the conditions that R1 = R2 and R3 = R4, the transfer function is simplified into Equation 6. Using this configuration, the maximum input signal is equal to the reference voltage, and the maximum output of each amplifier is equal to VREF. The differential output range is 2 x VREF. Furthermore, the common-mode voltage is one half of VREF, as shown in Equation 7. Vout Vout Vout Vdiff Vin Vref Vin 2 u Vin Vref Vout * Vout 2 (c) Vcm Vout Vin u 1 (c) Vdiff R2 * R1 R4 * Vref u u 1 (c) R3 R4 (c) R2 * R1 (3) (4) (5) (6) 1 Vref 2 (7) 8.2.2.1 Amplifier Selection Linearity over the input range is key for good dc accuracy. The common-mode input range and output swing limitations determine the linearity. In general, an amplifier with rail-to-rail input and output swing is required. Bandwidth is a key concern for this design, so the OPAx316 is selected because the bandwidth is greater than the target of 5 MHz. The bandwidth and power ratio makes this device power efficient and the low offset and drift ensure good accuracy for moderate precision applications. 8.2.2.2 Passive Component Selection Because the transfer function of VOUT- is heavily reliant on resistors (R1, R2, R3, and R4), use resistors with low tolerances to maximize performance and minimize error. This design uses resistors with resistance values of 49.9 k and tolerances of 0.1%. However, if the noise of the system is a key parameter, smaller resistance values (6 k or lower) can be selected to keep the overall system noise low. This ensures that the noise from the resistors is lower than the amplifier noise. Copyright (c) 2014-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 23 OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com 8.2.3 Application Curves 2.50 2.50 2.00 2.00 1.50 1.50 Vout- (V) Vout+ (V) The measured transfer functions in Figure 42, Figure 43, and Figure 44 are generated by sweeping the input voltage from 0.1 V to 2.4 V. The full input range is actually 0 V to 2.5 V, but is restricted by 0.1 V to maintain optimal linearity. For more details on this design and other alternative devices that can be used in place of the OPAx316, see (Single-Ended Input to Differential Output Conversion Circuit Reference Design (TIPD131). 1.00 0.50 0.00 0.00 1.00 0.50 0.50 1.00 1.50 2.00 0.00 0.00 2.50 Input voltage (V) 0.50 1.00 1.50 2.00 Input voltage (V) C027 Figure 42. VOUT+ vs Input Voltage 2.50 C027 Figure 43. VOUT- vs Input Voltage 2.50 2.00 1.50 Vdiff (V) 1.00 0.50 0.00 -0.50 -1.00 -1.50 -2.00 -2.50 0.00 0.50 1.00 1.50 2.00 Input voltage (V) 2.50 C027 Figure 44. VDIFF vs Input Voltage 24 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 9 Power Supply Recommendations The OPAx316 is specified for operation from 1.8 V to 5.5 V (0.9 V to 2.75 V); many specifications apply from -40C to +125C. Typical Characteristics presents parameters that can exhibit significant variance with regard to operating voltage or temperature. CAUTION Supply voltages larger than 7 V can permanently damage the device (see the Absolute Maximum Ratings) table. Place 0.1-F bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or highimpedance power supplies. For more information on bypass capacitor placement, see Layout Guidelines. Copyright (c) 2014-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 25 OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com 10 Layout 10.1 Layout Guidelines For best operational performance of the device, use good PCB layout practices, including: * Noise can propagate into analog circuitry through the power pins of the circuit as a whole and the operational amplifier. Bypass capacitors reduce the coupled noise by providing low-impedance power sources local to the analog circuitry. - Connect low-ESR, 0.1-F ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for singlesupply applications. * Separate grounding for analog and digital portions of the circuitry is one of the simplest and most effective methods of noise suppression. One or more layers on multilayer PCBs are typically devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Take care to physically separate digital and analog grounds, paying attention to the flow of the ground current. For more detailed information, see Circuit Board Layout Techniques (SLOA089). * To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicularly is much better than crossing in parallel with the noisy trace. * Place the external components as close to the device as possible. Keeping RF and RG close to the inverting input minimizes parasitic capacitance, as shown in Layout Example . * Keep the length of input traces as short as possible. Remember that the input traces are the most sensitive part of the circuit. * Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials. 10.2 Layout Example Run the input traces as far away from the supply lines as possible Place components close to device and to each other to reduce parasitic errors VS+ RF N/C N/C GND IN V+ VIN +IN OUTPUT V N/C RG Use low-ESR, ceramic bypass capacitor GND VS GND Use low-ESR, ceramic bypass capacitor VOUT Ground (GND) plane on another layer Figure 45. Operational Amplifier Board Layout for Noninverting Configuration 26 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 OPA316, OPA2316, OPA2316S, OPA4316 www.ti.com SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation see the following: * EMI Rejection Ratio of Operational Amplifiers (SBOA128). * QFN/SON PCB Attachment (SLUA271). * Quad Flatpack No-Lead Logic Packages (SCBA017). * Single-Ended Input to Differential Output Conversion Circuit Reference Design (TIPD131). * Circuit Board Layout Techniques (SLOA089). 11.2 Related Links The following table lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 2. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY OPA316 Click here Click here Click here Click here Click here OPA2316 Click here Click here Click here Click here Click here OPA2316S Click here Click here Click here Click here Click here OPA4316 Click here Click here Click here Click here Click here 11.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.7 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. Copyright (c) 2014-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 27 OPA316, OPA2316, OPA2316S, OPA4316 SBOS703F - APRIL 2014 - REVISED OCTOBER 2016 www.ti.com 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 28 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: OPA316 OPA2316 OPA2316S OPA4316 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) OPA2316ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 O2316 OPA2316IDGK ACTIVE VSSOP DGK 8 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 OVMQ OPA2316IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 OVMQ OPA2316IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 O2316 OPA2316IDRGR ACTIVE SON DRG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 SMD OPA2316IDRGT ACTIVE SON DRG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 SMD OPA2316SIDGS ACTIVE VSSOP DGS 10 80 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 SMG OPA2316SIDGSR ACTIVE VSSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAUAG Level-2-260C-1 YEAR -40 to 125 SMG OPA2316SIRUGR ACTIVE X2QFN RUG 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 1QU OPA2316SIRUGT ACTIVE X2QFN RUG 10 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 1QU OPA316IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 SLE OPA316IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 SLE OPA316IDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 SLD OPA316IDCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 SLD OPA4316ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 O4316D OPA4316IDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 O4316D OPA4316IPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 OPA4316 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 9-Oct-2016 Status (1) OPA4316IPWR ACTIVE Package Type Package Pins Package Drawing Qty TSSOP PW 14 2000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Op Temp (C) Device Marking (4/5) -40 to 125 OPA4316 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 Samples PACKAGE MATERIALS INFORMATION www.ti.com 28-Jul-2018 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing OPA2316IDGKR VSSOP SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA2316IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA2316IDRGR SON DRG 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 OPA2316IDRGT SON DRG 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 OPA2316SIDGSR VSSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA316IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3 OPA316IDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 OPA316IDCKR SC70 DCK 5 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 OPA316IDCKT SC70 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 OPA4316IDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 OPA4316IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 28-Jul-2018 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA2316IDGKR VSSOP DGK 8 2500 366.0 364.0 50.0 OPA2316IDR SOIC D 8 2500 367.0 367.0 35.0 OPA2316IDRGR SON DRG 8 3000 367.0 367.0 35.0 OPA2316IDRGT SON DRG 8 250 210.0 185.0 35.0 OPA2316SIDGSR VSSOP DGS 10 2500 366.0 364.0 50.0 OPA316IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 OPA316IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 OPA316IDCKR SC70 DCK 5 3000 180.0 180.0 18.0 OPA316IDCKT SC70 DCK 5 250 180.0 180.0 18.0 OPA4316IDR SOIC D 14 2500 333.2 345.9 28.6 OPA4316IPWR TSSOP PW 14 2000 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 MAX 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE DBV0005A SOT-23 - 1.45 mm max height SCALE 4.000 SMALL OUTLINE TRANSISTOR C 3.0 2.6 1.75 1.45 PIN 1 INDEX AREA 1 0.1 C B A 5 2X 0.95 1.9 1.45 MAX 3.05 2.75 1.9 2 4 0.5 5X 0.3 0.2 3 (1.1) C A B 0.15 TYP 0.00 0.25 GAGE PLANE 8 TYP 0 0.22 TYP 0.08 0.6 TYP 0.3 SEATING PLANE 4214839/C 04/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Refernce JEDEC MO-178. www.ti.com EXAMPLE BOARD LAYOUT DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X (0.95) 3 4 (R0.05) TYP (2.6) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL 0.07 MIN ARROUND 0.07 MAX ARROUND NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS 4214839/C 04/2017 NOTES: (continued) 4. Publication IPC-7351 may have alternate designs. 5. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DBV0005A SOT-23 - 1.45 mm max height SMALL OUTLINE TRANSISTOR PKG 5X (1.1) 1 5 5X (0.6) SYMM (1.9) 2 2X(0.95) 4 3 (R0.05) TYP (2.6) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4214839/C 04/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2018, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: OPA316IDCKT OPA316IDBVT OPA316IDBVR OPA316IDCKR