VS-VSK.166..PbF, VS-VSK.196..PbF, VS-VSK.236..PbF Series
www.vishay.com Vishay Semiconductors
Revision: 29-Sep-15 2Document Number: 94357
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FORWARD CONDUCTION
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
VSK.166 VSK.196 VSK.236
Maximum average on-state
current at case temperature IF(AV) 180° conduction, half sine wave 165 195 230 A
100 100 100 °C
Maximum RMS on-state current IF(RMS) 260 305 360
A
Maximum peak, one-cycle
on-state, non-repetitive
surge current
IFSM
t = 10 ms No voltage
reapplied
Sine half wave,
initial TJ =
TJ maximum
4000 4750 5500
t = 8.3 ms 4200 4980 5765
t = 10 ms 100 % VRRM
reapplied
3350 4000 4630
t = 8.3 ms 3500 4200 4850
Maximum I2t for fusing I2t
t = 10 ms No voltage
reapplied
80 113 151
kA2s
t = 8.3 ms 73 103 138
t = 10 ms 100 % VRRM
reapplied
56 80 107
t = 8.3 ms 52 73 98
Maximum I2t for fusing I2t t = 0.1 ms to 10 ms, no voltage reapplied 798 1130 1516 kA2s
Low level value of threshold voltage VF(TO)1 (16.7 % x x IF(AV) < I < x IF(AV)), TJ maximum 0.73 0.69 0.7 V
High level value of threshold voltage VF(TO)2 (I > x IF(AV)), TJ maximum 0.88 0.78 0.83
Low level value on-state
slope resistance rt1 (16.7 % x x IF(AV) < I < x IF(AV)), TJ maximum 1.5 1.3 1.2 m
High level value on-statert2 (I > x IF(AV)), TJ maximum 1.26 1.2 1.07
Maximum forward voltage drop VFM
IFM = x IF(AV), TJ = 25 °C, 180° conduction
Average power = VF(TO) x IF(AV) + rf x (IF(RMS))21.43 1.38 1.46 V
BLOCKING
PARAMETER SYMBOL TEST CONDITIONS VSK.166 VSK.196 VSK.236 UNITS
Maximum peak reverse and
off-state leakage current IRRM TJ = 150 °C 20 mA
RMS insulation voltage VINS
50 Hz, circuit to base, all terminals shorted,
t = 1 s 3500 V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
VSK.166 VSK.196 VSK.236
Maximum junction operating and
storage temperature range TJ, TStg -40 to +150 °C
Maximum thermal resistance,
junction to case per junction RthJC DC operation 0.2 0.16 0.14
K/W
Maximum thermal resistance,
case to heatsink per module RthCS Mounting surface smooth, flat and greased 0.05
Mounting
torque ± 10 %
IAP to heatsink A mounting compound is recommended and
the torque should be rechecked after a period
of 3 hours to allow for the spread of
the compound. Lubricated threads.
4 to 6 Nm
busbar to IAP
Approximate weight 200 g
7.1 oz.
Case style INT-A-PAK