HSDL-3020-021 - Agilent / Hewlett-Packard

Agilent HSDL-3020

IrDA® Data Compliant Low Power

4.0 Mbit/s with Remote Control

Infrared Transceiver

Data Sheet

Features

General Features

• Enhanced optical 3 lens design for

optimized IrDA and RC

performance

• Operating temperature from

-25°C ~ 85°C

– Critical parameters are

guaranteed over temperature and

supply voltage

•V

CC supply 2.4 to 3.6 volts

• Miniature package

– Height: 2.5 mm

– Width: 10.4 mm

– Depth: 2.95 mm

• Integrated remote control LED

driver

• Input/output interface voltage

of 1.5 V

• Integrated EMI shield

• LED stuck-high protection

• Designed to accommodate light

loss with cosmetic windows

• IEC 825-Class 1 eye safe

• LED stuck high protection

• Interface to various super I/O and

controller devices

• Lead free package

IrDA‚ Features

• Fully compliant to IrDA 1.4

Physical Layer Low Power

Specifications from 9.6 kbit/s to

4.0 Mb/s

– Link distance up to 50 cm

typically

• Complete shutdown for TxD_IrDA,

RxD_IrDA and PIN diode

Description

The HSDL-3020 is a new

generation low profile high speed

enhanced infrared (IR)

transceiver module that provides

the capability of (1) interface

between logic and IR signals for

through-air, serial, half-duplex IR

data link, and (2) IR remote

control transmission operating at

the optimum 940 nm wavelength

for universal remote control

applications. The HSDL-3020

features an enhanced 3 lens

optical package for optimized

IrDA and RC performance.

The module is fully compliant to

IrDA® Physical Layer specifi-

cation version 1.4 low power from

9.6 kbit/s to 4.0 Mbit/s (FIR) and

IEC825 Class 1 eye safety

standards.

The HSDL-3020 can be shutdown

completely to achieve very low

power consumption. In the

shutdown mode, the PIN diode

will be inactive and thus

producing very little photocurrent

even under very bright ambient

• Low power consumption

– Low shutdown current

Remote Control Features

• Wide angle and high radiant

intensity

• Spectrally suited to remote control

transmission function at 940 nm

typically

• Typical link distance up to 14

meters (on-axis)

Applications

• Mobile data communication and

universal remote control

– Mobile phones

– PDAs

– Webpads

light. It is also designed to

interface to input/output logic

circuits as low as 1.5 V. These

features are ideal for battery

operated mobile devices such as

PDAs and mobile phones that

require low power consumption.

Figure 1. Functional block diagram of HSDL-3020.

Figure 2. Rear view diagram with pinout.

Order Information

Part Number Packaging Type Package Quantity

HSDL-3020-021 Tape and Reel Front Option 2500

Marking Information

The unit is marked with “7YWLL” on the shield

Y = Year

W = Work week

LL = Lot information

Application Support Information

The Application Engineering

Group is available to assist you

with the application design

associated with HSDL-3020

infrared transceiver module.

You can contact them through

your local sales representatives

for additional details.

CX6 CX7 RC_LEDC 1

RC VLED

SHIELD

RC LED

DRIVER

IOVCC

TxD_IR 5

RC_LEDA 2

CX3 CX4

CX5

IR VLED

CX1 CX2

VCC

IR LED

DRIVER

Rx PULSE

SHAPER

IR_LEDA 3

RxD 6

SD 7

VCC 8

TxD_RC 9

GND 10

10 897654321

I/O Pins Configuration Table

Pin Symbol Description I/O Type Notes

1 RC_LEDC RC LED Cathode Note 1

2 RC_LEDA RC LED Anode Note 2

3 IR_LEDA IR LED Anode Note 3

4 IOVCC Input/Output ASIC Voltage Note 4

5 TxD_IR IrDA Transmitter Data Input Input. Active High Note 5

6 RxD IrDA Receive Data Output. Active Low Note 6

7 SD Shutdown Input. Active High Note 7

CC Supply Voltage Note 8

9 TxD_RC RC Transmitter Data Input Input. Active High Note 9

10 GND Ground Note 10

– Shield EMI Shield Note 11

Notes:

1. Internally connected to RC LED driver. Leave this pin unconnected.

2. Tied through external resistor, R3, to RC Vled. Refer to the table below for recommended series resistor value.

3. Tied through external resistor, R2, to IR Vled. Refer to the table below for recommended series resistor value.

4. Connect to ASIC logic controller supply voltage or VCC. The voltage at this pin should be equal to or less than VCC.

5. This pin is used to transmit serial data when SD pin is low. If held high for longer than 50 µs, the LED is turned off. Do NOT float this pin.

6. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull-down resistor is required. The pin is in tri-state when the

transceiver is in shutdown mode.

7. Complete shutdown of IC and PIN diode. The pin is used for setting receiver bandwidth and RC drive programming mode. Refer to section on

“Bandwidth Selection Timing” and “Remote Control Drive Modes” for more information. Do NOT float this pin.

8. Regulated, 2.4 V to 3.6 V.

9. Logic high turns on the RC LED. If held high longer than 50 µs, the RC LED is turned off. Do NOT float this pin.

10. Connect to system ground.

11, Connect to system ground via a low inductance trace. For best performance, do not connect directly to the transceiver GND pin.

CAUTIONS: The BiCMOS inherent to the design of this component increases the component’s

susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static

precautions be taken in handling and assembly of this component to prevent damage and/or

degradation which may be induced by ESD.

Recommended Application Circuit Components

Component Recommended Value Note

R1 4.7 Ω, ±5%, 0.25 watt for VCC ≥3.6 V

R2 4.7 Ω for 2.4 V ≤ VLED < 2.7 V

6.8 Ω for 2.7 V ≤ VLED < 3 V

10 Ω for 3 V ≤ VLED < 3.3 V

13 Ω for 3.3 V ≤ VLED < 3.6 V

15 Ω for 3.6 V ≤ VLED < 4.2 V

20 Ω for 4.2 V ≤ VLED < 5 V

R3 1.8 Ω for 2.2 V ≤ VLED < 2.7 V

2.7 Ω for 2.7 V ≤ VLED < 3 V

3 Ω for

CX1, CX3, CX5, CX6 100 nF, ± 20%, X7R Ceramic 1

CX2, CX4, CX7 4.7 µF, ± 20%, Tantalum 1

Note:

1. CX1, CX2, CX3, CX4, CX5, CX6 & CX7 must be placed within 0.7 cm of HSDL-3020 to obtain

optimum noise immunity.

Absolute Maximum Ratings

For implementations where case to ambient thermal resistance is ≤50°C/W.

Parameter Symbol Min. Max. Units Conditions

Storage Temperature TS-40 +100 °C

Operating Temperature TA-25 +85 °C

LED Anode Voltage VLEDA 06.5V

Supply Voltage VCC 06 V

Input Voltage: TxD, SD/Mode VI05.5V

Input/Output Supply Voltage IOVCC 06 V

RC LED Current RC ILED 500 mA

IR LED Current IR ILED 190 mA

Recommended Operating Conditions

Parameter Symbol Min. Typ. Max. Units Conditions

Operating Temperature TA-25 +85 °C

Supply Voltage VCC 2.4 3.6 V

Input/Output Voltage IOVCC 1.5 3.6 V

Logic Input Voltage Logic High VIH IOVCC - 0.5 IOVCC V

for TXD, SD/Mode

Logic Low VIL 00.5V

0.0090 500 For in-band signals

≤ 115.2 kbit/s[3]

Receiver Input Logic High EIHmW/cm2

Irradiance 0.0225 500 0.576 Mbit/s ≤ in-band

signals ≤ 4.0 Mbit/s[3]

Logic Low EIL0.3 µW/cm2For in-band signals[3]

LED (Logic High) Current Pulse IR_ILEDA 70 mA IR VLED = 3.6, R = 15 Ω,

Amplitude – SIR Mode ≤ 20% duty cycle,

≤ 90 µs pulse width

LED (Logic High) Current Pulse IR_ILEDA 120 mA IR VLED = 3.6, R = 15 Ω,

Amplitude – MIR/FIR Mode ≤ 25% duty cycle,

≤ 90 µs pulse width

LED (Logic High) Current Pulse RC_ILEDA 420 mA RC VLED = 3.6, R = 3.9 Ω,

Amplitude – RC Mode ≤ 25% duty cycle,

≤ 90 µs pulse width

Receiver Data Rate 0.0096 4.0 Mbit/s

Ambient Light See IrDA Serial Infrared

Physical Layer Link

Specification, Appendix A

for ambient levels

Note:

3. An in-band optical signal is a pulse/sequence where the peak wavelength, lp, is defined as 850 ≤ lp ≤ 900 nm, and the pulse characteristics are

compliant with the IrDA Serial Infrared Physical Layer Link Specification v1.4.

Electrical and Optical Specifications

Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted.

Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C with VCC set to

3.0 V and IOVCC set to 1.8 V unless otherwise noted.

Parameter Symbol Min. Typ. Max. Units Conditions

Receiver

Viewing Angle 2q1/2 30 °

Peak Sensitivity Wavelength lP875 nm

RxD_IrDA Output Logic High VOH IOVCC – 0.5 IOVCC VI

OH = -200 µA, EI ≤ 0.3

Voltage µW/cm2

Logic Low VOL 00.4V

RxD_IrDA Pulse Width (SIR)[4] tRPW(SIR) 1 4 µsq1/2 ≤ 15°, CL = 9 pF

RxD_IrDA Pulse Width (MIR)[4] tRPW(MIR) 100 500 ns q1/2 ≤ 15°, CL = 9 pF

RxD_IrDA Pulse Width (Single) (FIR)[4] tRPW(FIR) 80 175 ns q1/2 ≤ 15°, CL = 9 pF

RxD_IrDA Pulse Width (Double) (FIR)[4] tRPW(FIR) 200 290 ns q1/2 ≤ 15°, CL = 9 pF

RxD_IrDA Rise & Fall Times tr, tf 40 ns CL = 9 pF

Receiver Latency Time[5] tL100 µs EI = 9.0 µW/cm2

Receiver Wake Up Time[6] tRW 200 µs EI = 10 µW/cm2

Infrared (IR) Transmitter

IR Radiant Intensity (SIR Mode) IEH 4 mW/sr IR_ILEDA = 70 mA,

q1/2 ≤ 15°, TxD_IR ≥ VIH,

TA = 25°C

IR Radiant Intensity (MIR/FIR Mode) IEH 10 mW/sr IR_ILEDA = 120 mA,

q1/2 ≤ 15°, TxD_IR ≥ VIH,

TA = 25°C

IR Viewing Angle 2q1/2 30 60 °

IR Peak Wavelength lP875 nm

TxD_IrDA Logic Levels High VIH IOVCC - 0.5 IOVCC V

Low VIL 00.5V

TxD_IrDA Input Current High IH0.02 µAV

I ≥ VIH

Low IL-0.02 µA0 ≤ VI ≤ VIL

Wake Up Time[7] tTW 180 ns

Maximum Optical Pulse Width[8] tPW(Max)2550µs

TxD Pulse Width (SIR) tPW(SIR) 1.6 µst

PW (TxD_IR) = 1.6 µs at

115.2 kbit/s

TxD Pulse Width (MIR) tPW(MIR) 217 ns tPW (TxD_IR) = 217 ns at

1.152 Mbit/s

TxD Pulse Width (FIR) tPW(FIR) 125 ns tPW (TxD_IR) = 125 ns at

4.0 Mbit/s

TxD Rise & Fall Times (Optical) tr, tf 600 ns tPW (TxD_IR) = 1.6 µs at

115.2 kbit/s

40 ns tPW (TxD_IR) = 125 ns at

4.0 Mbit/s

Electrical and Optical Specifications (Cont’d.)

Parameter Symbol Min. Typ. Max. Units Conditions

IR LED Anode On-State Voltage VON 2.5 V IR_ILEDA = 70 mA,

(SIR Mode) (IR_LEDA) IR VLED = 3.6 V, R = 15 Ω,

VI (TxD) ≥ VIH

IR LED Anode On-State Voltage VON 1.9 V IR_ILEDA = 120 mA,

(MIR/FIR Mode) (IR_LEDA) IR VLED = 3.6 V, R = 15 Ω,

VI(TxD_IR) ≥ VIH

Remote Control (RC) Transmitter

RC Radiant Intensity IEH 110 mW/sr RC_ILEDA = 420 mA,

q1/2 ≤ 15°, TxD_RC ≥ VIH,

TA = 25°C

RC Viewing Angle 2q1/2 30 60 °

RC Peak Wavelength lP940 nm

TxD_RC Logic Levels High VIH IOVCC - 0.5 IOVCC V

Low VIL 00.5V

TxD_RC Input Current High IH0.02 1 µAV

I ≥ VIH

Low IL-0.02 1 µA0 ≤ VI ≤ VIL

RC LED Anode On-State Voltage VON 2.0 V RC_ILEDA = 420 mA,

(RC_LEDA) RC VLED = 3.6 V, R = 3.9 Ω,

VI(TxD_RC) ≥ VIH

Transceiver

Input Current High IH0.01 1 µAV

I ≥ VIH

Low IL-1 -0.02 1 µA0 ≤ VI ≤ VIL

Supply Current Shutdown ICC1 1µAV

SD ≥ VCC - 0.5, TA = 25°C

Idle ICC2 2.0 2.9 mA VI(TxD) ≤ VIL, EI = 0

(Standby)

Active ICC3 3.5 mA VI(TxD) ≥ VIL, EI = 10 mW/cm2

Notes:

4. An in-band optical signal is a pulse/sequence where the peak wavelength, lP, is defined as 850 nm ≤ lP ≤ 900 nm, and the pulse characteristics are

compliant with the IrDA Serial Infrared Physical Layer Link Specification version 1.4.

5. For in-band signals 9.6 kbit/s to 115.2 kbit/s where 9 µW/cm2 ≤ EI ≤ 500 mW/cm2.

6. Latency is defined as the time from the last TxD_IrDA light output pulse until the receiver has recovered full sensitivity.

7. Receiver Wake Up Time is measured from VCC power ON to valid RxD_IrDA output.

8. Transmitter Wake Up Time is measured from VCC power ON to valid light output in response to a TxD_IrDA pulse.

9. The Optical PW is defined as the maximum time in which the IR LED will turn on. This is to prevent the long Turn On time for the IR LED.

IR SIR Mode - VLED_A vs ILED

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.3

0 0.02 0.04 0.08 0.10 0.12

ILED (A)

VLED_A (V)

0.06

IR MIR/FIR Mode - VLED_A vs ILED

1.50

1.55

1.60

1.65

1.70

1.75

1.80

0.05 0.075 0.10 0.125 0.15 0.175

ILED (A)

VLED_A (V)

IR SIR Mode - Radiant Intensity vs ILED

0 0.02 0.04 0.06 0.08 0.10 0.12

ILED (A)

RADIANT INTENSITY (mW/sr)

IR MIR/FIR Mode - Radiant Intensity vs ILED

0.05 0.075 0.10 0.125 0.15 0.175

ILED (A)

RADIANT INTENSITY (mW/sr)

HSDL-3020 Package Dimensions

5.20

MOUNTING

CENTER

1.025

10.40

2.50

1.15

R2.10

5.10

1.20

3.60

EMITTER DA

EMITTER RECEIVER

R1.10 R1.10 R1.10

2.95

12345678910

1.50

0.70

1.80

COPLANARITY

0.00 TO 0.20 mm

0.95

0.50

0.60PITCH 0.95

0.68

10.

RC CATHODE

RC VLED

IR VLED

IOVCC

TxD IR

RxD

VDD

TxD RC

GND

HSDL-3020 Tape and Reel Dimensions

D0P0

2 ± 0.1

5°(MAX.)

SECTION A-A

5°(MAX.)

SECTION B-B

10P0

A0P2

FEWD1

P1T

10.65 ± 0.10

SYMBOL

SPEC.

SYMBOL

2.95 ± 0.10 2.77 ± 0.10 4.0 ± 0.10 8.0 ± 0.10 2.4 ± 0.10 0.35 ± 0.10

1.75 ± 0.10 11.5 ± 0.10 1.55 ± 0.05 1.50 ± 0.10 24.0 ± 0.30 40.0 ± 0.20

NOTES:

1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE IS ± 0.2 mm.

2. CARRIER CHAMBER SHALL BE NOT MORE THAN 1 mm PER 100 mm THROUGH A LENGTH OF 250 mm.

3. A0 AND B0 MEASURED ON A PLACE 0.3 mm ABOVE THE BOTTOM OF THE POCKET.

4. K0 MEASURED FROM A PLACE ON THE BOTTOM OF THE POCKET IN TOP SURFACE OF CARRIER.

5. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED AS TRUE POSITION OF POCKET, NOT POCKET HOLE.

HSDL-3020 Moisture Proof Packaging

All HSDL-3020 options are

shipped in moisture proof

package. Once opened, moisture

absorption begins.

This part is compliant to JEDEC

Level 4.

Figure 3. Baking conditions chart.

Baking Conditions

If the parts are not stored in dry

conditions, they must be baked

before reflow to prevent damage

to the parts.

Package Temp. Time

In reels 60°C≥ 48 hours

In bulk 100°C ≥ 4 hours

125°C ≥ 2 hours

150°C ≥ 1 hour

Baking should only be done once.

Recommended Storage Conditions

Storage Temperature 10°C to 30°C

Relative Humidity Below 60% RH

Time from Unsealing to Soldering

After removal from the bag, the

parts should be soldered within

three days if stored at the

recommended storage

conditions. If times longer than

three days are needed, the parts

must be stored in a dry box.

UNITS IN A SEALED

MOISTURE-PROOF

PACKAGE

PACKAGE IS

OPENED (UNSEALED)

ENVIRONMENT

LESS THAN 30°C,

AND LESS THAN

60% RH

PACKAGE IS

OPENED MORE

THAN 72 HOURS

PERFORM RECOMMENDED

BAKING CONDITIONS

NO BAKING

IS NECESSARY

YES

Recommended Reflow Profile

t-TIME (SECONDS)

T – TEMPERATURE – (°C)

230

200

160

120

50 150100 200 250 300

180

220

255

HEAT

SOLDER PASTE DRY P3

SOLDER

REFLOW

COOL

DOWN

R3 R4

60 sec.

MAX.

ABOVE

220°C

MAX. 260°C

Process Zone Symbol DT Maximum DT/Dtime

Heat Up P1, R1 25°C to 160°C4°C/s

Solder Paste Dry P2, R2 160°C to 200°C 0.5°C/s

Solder Reflow P3, R3 200°C to 255°C (260°C at 10 seconds max) 4°C/s

P3, R4 255°C to 200°C-6°C/s

Cool Down P4, R5 200°C to 25°C-6°C/s

The reflow profile is a straight-

line representation of a nominal

temperature profile for a

convective reflow solder

process. The temperature profile

is divided into four process

zones, each with different

DT/Dtime temperature change

rates. The DT/Dtime rates are

detailed in the above table. The

temperatures are measured at

the component to printed circuit

board connections.

In process zone P1, the PC

board and HSDL-3020

castellation pins are heated to a

temperature of 160°C to activate

the flux in the solder paste. The

temperature ramp up rate, R1, is

limited to 4°C per second to

allow for even heating of both

the PC board and HSDL-3020

castellations.

Process zone P2 should be of

sufficient time duration (60 to

120 seconds) to dry the solder

paste. The temperature is raised

to a level just below the liquidus

point of the solder, usually

200°C (392°F).

Process zone P3 is the solder

reflow zone. In zone P3, the

temperature is quickly raised

above the liquidus point of

solder to 255°C (491°F) for

optimum results. The dwell time

above the liquidus point of

solder should be between 20 and

60 seconds. It usually takes

about 20 seconds to assure

proper coalescing of the solder

balls into liquid solder and the

formation of good solder

connections. Beyond a dwell

time of 60 seconds, the

intermetallic growth within the

solder connections becomes

excessive, resulting in the

formation of weak and

unreliable connections. The

temperature is then rapidly

reduced to a point below the

solidus temperature of the

solder, usually 200°C (392°F), to

allow the solder within the

connections to freeze solid.

Process zone P4 is the cool

down after solder freeze. The

cool down rate, R5, from the

liquidus point of the solder to

25°C (77°F) should not exceed

6°C per second maximum. This

limitation is necessary to allow

the PC board and HSDL-3020

castellations to change

dimensions evenly, putting

minimal stresses on the HSDL-

3020 transceiver.

Appendix A: HSDL3020 SMT Assembly Application Note

Solder Pad, Mask and Metal Stencil

Figure 1. Stencil and PCBA.

Recommended Land Pattern

Figuure 2.

METAL STENCIL

FOR SOLDER PASTE

PRINTING

LAND

PATTERN

PCBA

STENCIL

APERTURE

SOLDER

MASK

MOUNTING CENTER

SYMETRICAL CENTER

1.25

2.7

1.75

0.475

1.425

0.35

0.10

0.775

FIDUCIAL

2.05

Recommended Metal solder Stencil

Aperture

It is recommended that only a

0.152 mm (0.006 inch) or a

0.127 mm (0.005 inch) thick

stencil be used for solder paste

printing. This is to ensure

adequate printed solder paste

volume and no shorting. See Table

1, below the drawing, for combin-

ations of metal stencil aperture

and metal stencil thickness that

should be used. Aperture opening

for shield pad is 3.05 mm x 1.1

mm as per land pattern.

Figure 3. Solder stencil aperture.

Table 1.

Aperture Size (mm)

Stencil Thickness, t (mm) Length, l Width, w

0.127 mm 1.75 ± 0.05 0.55 ± 0.05

0.11 mm 2.4 ± 0.05 0.55 ± 0.05

APERTURES AS PER

LAND DIMENSIONS

Adjacent Land Keepout and Solder

Mask Areas

Adjacent land keepout is the

maximum space occupied by the

unit relative to the land pattern.

There should be no other SMD

components within this area.

The minimum solder resist strip

width required to avoid solder

bridging adjacent pads is

0.2 mm. It is recommended that

two fiducial crosses be placed at

mid length of the pads for unit

alignment.

Note: Wet/Liquid Photo-imageable

solder resist/mask is recommended.

SOLDER MASK

DIMENSION

0.2

3.0

3.85

11.9

Appendix B: PCB Layout Suggestion

The effects of EMI and power

supply noise can potentially

reduce the sensitivity of the

receiver, resulting in reduced link

distance. The PCB layout played

an important role to obtain a good

PSRR and EM immunity resulting

in good electrical performance.

Things to note:

1. The ground plane should be

continuous under the part, but

should not extend under the

shield trace.

2. The shield trace is a wide, low

inductance trace back to the

system ground. CX1, CX2,

CX3, CX4, CX5, CX6 and CX7

are optional supply filter

capacitors; they may be left

out if a clean power supply is

used.

3. IR and RC VLED can be

connected to either unfiltered

or unregulated power supply.

The bypass capacitors should

be connection before the

current limiting resistor R3

and R4 respectively. In a noisy

environment, including

capacitor CX2 and CX7 can

enhance supply rejection. CX6

and CX3 that are generally a

ceramic capacitor of low

inductance providing a wide

frequency response while CX2

and CX4 are tantalum

capacitor of big volume and

fast frequency response. The

use of a tantalum capacitor is

more critical on the VLED line,

which carries a high current.

4. VCC pin can be connected to

either unfiltered or

unregulated power supply.

The Resistor, R1 together with

the capacitors, CX1 and CX2

acts as the low pass filter.

5. IOVCC is connected to the

ASIC voltage supply or the VCC

supply. The capacitor, CX5

acts as the bypass capacitor.

6. Preferably a multi-layered

board should be used to

provide sufficient ground

plane. Use the layer

underneath and near the

•Top Layer: Connect the

metal shield and module

ground pin to bottom

ground layer;

Place the bypass capacitors

within 0.5cm from the VCC

and ground pin of the

module.

•Layer 2: Critical ground

plane zone. 3 cm in all

direction around the

module. Connect to a

clean, noiseless ground

node (eg bottom layer).

•Layer 3: Keep data bus

away from critical ground

plane zone.

•Bottom layer: Ground

layer. Ground noise

<75 mVp-p. Should be

separated from ground

used by noisy sources.

transceiver module as VCC,

and sandwich that layer

between ground connected

board layers. The diagram

below demonstrate an

example of a 4 layer board:

The area underneath the module

at the second layer, and 3 cm in

all directions around the module,

is defined as the critical ground

plane zone. The ground plane

should be maximized in this zone.

Top Layer

Refer to application note AN1114

or the Agilent IrDA Data Link

Design Guide for details. The

layout below is based on a

2-layer PCB.

Bottom Layer

LAYER 3

TOP LAYER

CX6 CX4

CX3 CX5

CX1

CX2

CX7

BOTTOM LAYER (GND)

LEGEND: GROUND VIA

NOISE SOURCES TO BE PLACED AS FAR AWAY

FROM THE TRANSCEIVER AS POSSIBLE

Interface to the Recommended

I/O Chip

The HSDL-3020’s TxD data input

is buffered to allow for CMOS

drive levels. No peaking circuit or

capacitor is required. Data rate

from 9.6 kb/s to 4 Mb/s is

available at RxD pin. The TxD_RC,

pin 2, together with RC_LEDA,

pin 9, is used to select the remote

control transmit mode.

Alternatively, the TxD_IR, pin 6,

together with IR_LEDA, pin 8, is

used for infrared transmit

selection.

Following shows the hardware

reference design with HSDL-3020.

*Detailed configuration of HSDL-

3020 with the controller chip is

shown in Figure 3.

The use of the infrared tech–

niques for data communication

has increased rapidly lately and

almost all mobile application

processors have built in the IR

port. This does away with the

external Endec and simplifies the

interfacing to a direct connection

between the processor and the

transceiver. The next section

discusses interfacing

configuration with a general

processor.

Figure 2: Mobile application platform.

Appendix C: General Application

Guide for the HSDL-3020 Infrared

IrDA Compliant 4 Mb/s Transceiver

Description

The HSDL-3020, a wide-voltage

operating range infrared

transceiver is a low-cost and small

form factor device that is

designed to address the mobile

computing market such as PDAs,

as well as small embedded mobile

products such as digital cameras

and cellular phones. It is

spectrally suited to universal

remote control transmission

function at 940 nm typically. It is

fully compliant to IrDA 1.4 low

power specification up 4 Mb/s

and supports most remote control

codes. The design of HSDL-3020

also includes the following unique

features:

• Spectrally suited to universal

remote control transmission

function at 940 nm typically

• Low passive component count

• Shutdown mode for low power

consumption requirement

• Direct interface with I/O logic

circuit

Selection of Resistor R2 and R3

Resistor R2 and R3 should be

selected to provide the

appropriate peak pulse IR and RC

LED current respectively at

different ranges of VCC as shown

on page 4 under “Recommended

Application Circuit Components.”

LOGIC BUS

DRIVER

MEMORY

EXPANSION

ROM

FLASH

SDRAM

MOBILE

APPLICATION

CHIPSET

IrDA

INTERFACE

AC97

SOUND

BASEBAND

CONTROLLER

I2S

TOUCH PANEL

AUDIO INPUT

POWER

MANAGEMENT

PCM SOUND

LCD BACKLIGHT

CONTRAST

ANTENNA

STN/TFT

LCD PANEL KEY PAD

LCD CONTROL PERIPHERIAL INTERFACE

PWM

A/D

MEMORY I/F

*HSDL-3020

General Mobile Application Processor The transceiver is directly

interfaced with the

microprocessor provided its

support infrared communication

commonly known as Infrared

Communications Port (ICP). The

ICP supports both SIR data rates,

with up to 115.2 kps, and

sometimes FIR data, with data

rates up to 4 Mbps. The remote

control commands can be sent to

one of the available General

Purpose IO pins or the UART

block with IrDA functionality. It

should be observed that although

both IrDA data transmission and

Remote control transmission is

possible simultaneously by the

hardware, the software is

required to resolve this issue to

prevent the mixing and

corruption of data while being

transmitted over the free air. The

above Figure 3 illustrates a

reference interfacing to

implement both IR and RC

functionality with HSDL-3020.

Figure 3: HSDL-3020 configuration with general mobile architecture processor.

GND

RC LED CATHODE

HSDL-3020

IOV

TxD_RC

RC_VLEDA

CX6 CX7 CX5

GND

CX3 CX4

CX1

CX2

IR_VLED

GND

RXD

TxD_IR

IOV

RC_VLED

GPIO

100 kW

GND

100 kW

IR_RxD

GPIO

IR_TxD

IR_VLEDA

Remote Control Operation

The HSDL-3020 is spectrally

suited to universal remote

control transmission function at

940 nm typically. Remote control

applications are not governed by

any standards, owing to which

there are numerous remote

codes in market. Each of those

standards results in receiver

modules with different

sensitivities, depending on the

carrier frequencies and

responsively to the incident light

wavelength. Remote control

carrier frequencies are in the

range of 30 KHz to 60 KHz (for

details of some the frequently

Table 3.

Remote Control Carrier SA-1110 UART

Frequency (kHz) Frequency (kHz) Baud Rate Divisor

30 28.8 8

32, 33 32.9 7

36, 36.7, 38, 39.2, 40 38.4 6

56 57.6 4

used carrier frequencies, please

refer to AN1314). Some common

carrier frequencies and the

corresponding SA-1110 UART

frequency and baud rate divisor

are shown in Table 3.

Appendix D: Window Design for

HSDL-3020

To ensure IrDA compliance, some

constraints on the height and

width of the window exist. The

minimum dimensions ensure that

the IrDA cones angles are met

without vignetting. The maximum

dimensions minimize the effects

of stray light. The minimum size

corresponds to a cone angle of

30° and the maximum size

corresponds to a cone angle

of 60°.

In the figure above, X is the width

of the window, Y is the height of

window, Z is the distance from

the HSDL-3020 to the back of the

window, and T is the thickness of

the IR transparent window.

Module Depth, Min. Aperture Min. Aperture Max. IR Window

Z (mm) Width, X (mm) Height, Y (mm) (mm)

0.5 11.00 3.00 1.0

1.0 11.50 3.25 1.0

2.0 12.25 3.75 1.0

3.0 12.80 4.50 1.0

4.0 13.25 5.20 1.0

5.0 14.00 6.00 1.0

IR TRANSPARENT WINDOW

OPAQUE WINDOW

OPAQUE MATERIAL IR TRANSPARENT WINDOW

Window Material

Almost any plastic material will

work as a window material.

Polycarbonate is recommended.

The surface finish of the plastic

should be smooth, without any

texture. An IR filter dye may be

used in the window to make it

look black to the eye, but the

Recommended Plastic Materials:

Material # Light Transmission Haze Refractive Index

Lexan 141 88% 1% 1.586

Lexan 920A 85% 1% 1.586

Lexan 940A 85% 1% 1.586

Note: 920A and 940A are more flame retardant than 141.

Recommended Dye: Violet #21051 (IR transmissant above 625 mm)

For the modules depth values

that are not shown on the tables

above, the minimum X and Y

values can be interpolated.

APERTURE WIDTH (X) – mm

APERTURE DEPTH (Z) – mm

APERTURE WIDTH (X) vs. MODULE DEPTH

002 6

135

APERTURE HEIGHT (Y) – mm

APERTURE DEPTH (Z) – mm

APERTURE WIDTH (X) vs. MODULE DEPTH

002 6

135

total optical loss of the window

should be 10% or less for best

optical performance. Light loss

should be measured at 875 nm.

The recommended plastic

materials for use as a cosmetic

window are available from

General Electric Plastics.

Shape of the Window

From an optics standpoint, the

window should be flat. This

ensures that the window will not

alter either the radiation pattern

of the LED, or the receive pattern

of the photodiode. If the window

must be curved for mechanical or

industrial design reasons, place

the same curve on the backside of

the window that has an identical

radius as the front side. While this

will not completely eliminate the

lens effect of the front curved

surface, it will significantly reduce

the effects. The amount of change

in the radiation pattern is

dependent upon the material

chosen for the window, the radius

of the front and back curves, and

the distance from the back surface

to the transceiver. Once these

items are known, a lens design

can be made which will eliminate

the effect of the front surface

curve. The following drawings

show the effects of a curved

window on the radiation pattern.

In all cases, the center thickness

of the window is 1.5 mm, the

window is made of polycarbonate

plastic, and the distance from the

transceiver to the back surface of

the window is 3 mm.

Flat Window

(First Choice)

Curved Front, Flat Back

(Do not use)

Curved Front and Back

(Second Choice)

Appendix E: General Application

Guide for the HSDL-3020

Remote Control Drive Modes

The HSDL-3020 can operate in

the single-TxD programmable

mode or the two-TxD direct

transmission mode.

Single-TxD Programmable Mode

In the single-TxD programmable

mode, only one input pin (TxD_IR

input pin) is used to turn on the

remote control (940 nm) LED

while the TxD_RC input pin is

grounded.

The transceiver is in default mode

(IrDA-SIR) when powered up. The

user needs to apply the following

programming sequence to both

the TxD_IR and SD inputs to

enable the transceiver to operate

in either the IrDA or remote

control mode.

Mode Programming Timing Table

Parameter Symbol Min Typ Max Unit Notes

The following timings describe input constraints required using the active serial interface for mode programming with pins

SD, TxIR, and TxRC:

Shutdown input pulse width, tSDPW 30 - ∞µs Will activate complete shutdown

at pin SD

SD mode setup time tA200 - - ns Setup for mode programming

TxIR pulse width for RC mode tB200 - - ns RC drive enabled with pin TxIR

SD programming pulse width tC--5.0µs Pulse width mode programming

Note: ( tA + tB ) < tC < tSDPW

TxIR setup time for tS50 - - ns Setup time for IrDA bandwidth selection

SIR or MIR/FIR mode

TxIR or SD hold time to latch tH50 - - ns Hold time for IrDA or RC modes

SIR, MIR/FIR or RC mode

DRIVE

IrDA LED

DRIVE

RC LED

DRIVE

IrDA LED

SHUTDOWN

(ACTIVE HIGH)

TxIR

(ACTIVE HIGH)

TxRC

(GND)

RESET

tTL

MODE

• • • • • •• • •

Two-TxD Direct Transmission Mode

In the two-TxD direct

transmission mode, the IrDA

(875 nm) LED and the remote

control (940 nm) LED are turned

on separately by two different

input pins. The TxIR input pin is

Transceiver Control I/O Truth Table for Two-TxD Direct Transmission Mode

SD TxIR TxRC IrDA LED RC LED Remarks

0 0 0 OFF OFF IR Rx enabled. Idle mode

0 0 1 OFF ON Remote control operation

0 1 0 ON OFF IrDA Tx operation

0 1 1 – – Not recommended

(Both Transmitters off)

1 0 0 OFF OFF Shutdown mode*

*The shutdown condition will set the transceiver to the default mode (IrDA-SIR)

Bandwidth Selection Timing

The power on state should be the

IrDA SIR mode. The data transfer

rate must be set by a program-

ming sequence using the TxD_IR

and SD inputs as described below.

Note: SD should not exceed the

maximum, tC ≤ 5 µs, to prevent shutdown.

Setting to the High Bandwidth

MIR/FIR Mode (0.576 Mbits/s to

4 Mbits/s)

1. Set SD input to logic “HIGH.”

Wait tA ≥ 200 ns.

2. Set TxD_IR input to logic

“HIGH.” Wait tS ≥ 50 ns.

3. Set SD to logic “LOW” (this

negative edge latches state of

TxD_IR, which determines

speed setting).

4. After waiting tH ≥ 50 ns

TxD_IR can be set to logic

“LOW.” TxD_IR is now re-

enabled as normal IrDA

transmit input for the High

Bandwidth MIR/FIR mode.

Setting to the Low Bandwidth SIR

Mode (2.4 kbits/s to 115.2 kbits/s)

1. Set SD input to logic “HIGH.”

2. Set TxIR input to logic

“LOW.” Wait tS ≥ 50 ns.

3. Set SD to logic “LOW” (this

negative edge latches state of

TxIR, which determines

speed setting).

4. TxIR must be held for tS ≥

50 ns. TxIR is now re-enabled

as normal IrDA transmit

input for the Low Bandwidth

SIR mode.

used to turn on the IrDA

(875 nm) LED while the TxRC

input pin is used to turn on the

remote control (940 nm) LED.

Please refer to the Transceiver

I/O truth table for more detail.

50% 50%

TxIR

50% 50%

HIGH: MIR/FIR

LOW: SIR

www.agilent.com/semiconductors

For product information and a complete list of

distributors, please go to our web site.

For technical assistance call:

Americas/Canada: +1 (800) 235-0312 or

(916) 788-6763

Europe: +49 (0) 6441 92460

China: 10800 650 0017

Hong Kong: (+65) 6756 2394

India, Australia, New Zealand: (+65) 6755 1939

Japan: (+81 3) 3335-8152 (Domestic/Interna-

tional), or 0120-61-1280 (Domestic Only)

Korea: (+65) 6755 1989

Singapore, Malaysia, Vietnam, Thailand,

Philippines, Indonesia: (+65) 6755 2044

Taiwan: (+65) 6755 1843

Data subject to change.

March 9, 2005

5989-2359EN