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● Features:
1. Emitted Color : Super Red
2. Lens Appearance : Water Clear.
3. Mono-color type.
4. 3.2x1.6x1.4mm(1206) standard package.
5. Suitable for all SMT assembly methods.
6. Compatible with infrared and vapor phase
reflow solder process.
7. Compatible with automatic placement
equipment.
8. This product doesn’t contain restriction
Substance, comply ROHS standard.
● Applications:
1. Automotive : Dashboards, stop lamps,
turn signals.
2. Backlighting : LCDs, Key pads advertising.
3. Status indicators : Comsumer & industrial
electronics.
4. General use.
● Absolute Maximum Ratings(Ta=25℃)
Parameter Symbol Rating Unit
Power Dissipation Pd 120 mW
Forward Current IF 30 mA
Peak Forward Current ＊1 IFP 100 mA
Reverse Volage VR 5 V
Operating Temperature Topr -25℃~80℃ -
Storage Temperature Tstg -30℃~85℃ -
Soldering Temperature Tsol See Page6 -
＊1 Condition for IFP is pulse of 1/10 duty and 0.1msec width.
●Package Dimensions:
NOTES:
1.All dimensions are in millimeters (inches).
2.Tolerance is ±0.10mm (0.004”) unless otherwise specified.
3.Specifications are subject to change without notice.
Ver.1.0 Page 1 of 7
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● Electrical and optical characteristics(Ta=25℃)
Parameter Symbol Condition Min. Typ. Max. Unit
Forward Voltage Vf IF=20mA - 1.8 2.6 V
Luminous Intensity Iv IF=20mA 12.3 25 - mcd
Reverse Current IR VR=5V - - 100 µA
Peak Wave Length λp IF=20mA - 660 - nm
Dominant Wave Length λd IF=20mA 638 - 648 nm
Spectral Line Half-width Δλ IF=20mA - 20 - nm
Veiwing Angle 2θ1/2 I
F=20mA - 60 - deg
● Typical Electro-Optical Characteristics Curves
100604020 80
710660610
Forward current (mA)
30
Relative luminous intensity (@20mA)
0
10 20
1.0
2.0
3.0
Relative radiant intensity
40 50
Fig.5 Relative luminous intensity vs. forward current
Forward voltage(V)
Fig.3 Forward current vs. forward voltage
Wavelength (nm)
3
Forward current (mA)
4.0
10
1
0
2
20
30
40
50
Relative Luminous intensity
(Normalized @20mA)
1.5
Ambient temperature Ta( C)
Fig.6 Radiation diagram
A
45
0
-40
0.5
1.0
400-20 20 60
ambient temperature
2.0
2.5
3.0
Fig.4 Relative luminous intensity vs.
Ambient temperature Ta( C)
Fig.1 Relative intensity vs. wavelength
Relative radiant intensity
0
0.5
1.0
Fig.2 Forward current derating curve
Forward current (mA)
0
1010
20
30
50
40
60
vs. ambient temperature
30
0.6
0.10.5 0.3
0.7
0.40.2
1.0
0.8
0.9
70
90
80
60
50
40
010 20
Ver.1.0 Page 2 of 7
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● Tapping and packaging specifications(Units: mm)
TRAILER
LEADER
FIXING TAPE
179± 1
13.0± 0.5
71.0± 1
0.1
0.1
USER DIRECTION OF FEED
CATHODE
±4.0
±5.3 0.05
ANODE
START
1.98±
3.5
NOTE: 3000 pcs PER REEL
1.5± 0.1
0.1±4.0 2.0± 0.05
±1.75 0.1
0.3
END
±0.05
0.38.0 ±
±
1.46 0.1
3.47 0.1±
13.0± 0.5
●Package Method:(unit:mm)
220
245
470
Aluminum Foil Bag
220
645
210
185
6 box/carton
Bar Code Label
3000 pcs/reel
12 bag/box
200
Ver.1.0 Page 3 of 7
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● Bin Limits
Intensity Bin Limits (At 20mA)
BIN CODE Min. (mcd) Max. (mcd)
K 11.0 21.0
L 16.0 32.0
M 24.0 48.0
N 37.0 72.0
● BIN：x
Intensity BIN CODE
Ver.1.0 Page 4 of 7
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● Reliability Test
Classification Test Item Reference Standard Test Conditions Result
Operation Life MIL-STD-750:1026
MIL-STD-883:1005
JIS-C-7021 :B-1
Connect with a power If=20mA
Ta=Under room temperature
Test time=1,000hrs
0/20
High
Temperature
High Humidity
Storage
MIL-STD-202:103B
JIS-C-7021 :B-11
Ta=+65℃±5℃
RH=90%-95%
Test time=240hrs 0/20
High
Temperature
Storage
MIL-STD-883:1008
JIS-C-7021 :B-10
High Ta=+85℃±5℃
Test time=1,000hrs 0/20
Endurance
Test
Low
Temperature
Storage
JIS-C-7021 :B-12
Low Ta=-35℃±5℃
Test time=1,000hrs 0/20
Temperature
Cycling
MIL-STD-202:107D
MIL-STD-750:1051
MIL-STD-883:1010
JIS-C-7021 :A-4
-35℃ ~ +25℃ ~ +85℃ ~ +25℃
60min 20min 60min 20min
Test Time=5cycle 0/20
Thermal Shock MIL-STD-202:107D
MIL-STD-750:1051
MIL-STD-883:1011
-35℃±5℃ ~+85℃±5℃
20min 20min
Test Time=10cycle
0/20
Environmental
Test
Solder
Resistance MIL-STD-202:201A
MIL-STD-750:2031
JIS-C-7021 :A-1
Preheating：
140℃-160℃,within 2 minutes.
Operation heating：
235℃(Max.), within 10seconds. (Max.)
0/20
● Judgment criteria of failure for the reliability
Measuring items Symbol Measuring conditions Judgement criteria for failure
Forward voltage VF ( V) IF=20mA Over Ux1.2
Reverse current IR(uA) VR=5V Over Ux2
Luminous intensity Iv ( mcd ) IF=20mA Below SX0.5
Note: 1.U means the upper limit of specified characteristics. S means initial value.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to
normal ambient conditions after completion of each test.
Ver.1.0 Page 5 of 7
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● Soldering :
1. Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3
seconds per solder-land is to be observed.
2. Reflow Soldering
Preheating : 140℃~160℃±5℃,within 2 minutes.
Operation heating : 235℃(Max.) within 10 seconds.(Max)
Gradual Cooling (Avoid quenching).
3. DIP soldering (Wave Soldering) :
Preheating : 120℃~150℃,within 120~180 sec.
Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)
Gradual Cooling (Avoid quenching).
● Handling :
Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to
high temperature.
Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such
as the sand blast and the metal hook.
Temperature
Time
OVER 2 MIN.
4℃ /SEC. MAX.
4℃ /SEC. MAX.
10 SEC. MAX.
235℃ MAX.
140~160℃
Temperature
Time
120~180 sec.
Preheat
245 ±5℃ within 5 sec.
Soldering heat Max. 260 ℃
120~150℃
Ver.1.0 Page 6 of 7
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● Notes for designing:
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT
LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with
instantaneous voltage at the turning ON and OFF of the circuit.
When using the pulse drive care must be taken to keep the average current within the rated figures.
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the
BRIGHT LEDs.
● Storage:
In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as
possible after unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or
equivalent soldering process must be:
a. Completed within 24 hours.
b. Stored at less than 30% RH.
(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
12 hours at 60℃±3℃.
● Package and Label of Products:
(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached
on each bag.
(2) Label:
BRIGHT LED LOGO
Part No.
Quantity
BIN.
Sealing Date
x
xx xx xx
Year Month Day
Manufacture Location
Ver.1.0 Page 7 of 7
