○Product structure：Silicon monolithic integrated circuit ○This product has no designed protection against radioactive rays
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TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
www.rohm.com
16.Dec.2015 Rev.001
Sound Processor with Built-in 3-band Equalizer
BD37541FS
General Description
BD37541FS is a sound processor with built-in 3-band
equalizer for car audio. The functions are stereo input
selector (which can switch single and ground isolation
input), input-gain control, main volume, loudness, 5ch
fader volume and mixing input. Moreover, “Advanced
switch circuit”, which is an original ROHM technology,
can reduce various switching noise (ex. No-signal, low
frequency like 20Hz & large signal inputs). Also,
“Advanced switch” makes control of microcomputer
easier, and can construct a high quality car audio
system.
Features
Reduced switching noise of input gain control,
mute, main volume, fader volume, bass, middle,
treble, loudness, mixing by using advanced switch
circuit.
Built-in differential input selector that can make
various combination of single-ended / differential
input.
Built-in ground isolation amplifier inputs, which is
ideal for external stereo input.
Built-in input gain controller reduces switching
noise for volume of a portable audio input.
Decreased number of external components due to
built-in 3-band equalizer filter and loudness filter. It
is possible to control Q, GV, fO of 3-band equalizer
through I2C BUS control.
It is possible to adjust the gain of the bass, middle,
treble up to ±20dB with 1 dB step gain adjustment.
It is equipped with output terminals for Subwoofer.
Moreover, the stereo signal output of the front and
rear can also be chosen by the I2C BUS control.
Built-in mixing input.
Energy-saving design resulting in low-current
consumption is achieved by utilizing the Bi-CMOS
process. It has the advantage in quality over
scaling down the power heat control of the internal
regulators.
Input terminals and output terminals are organized
and separately laid out to keep the signal flow in
one direction which results in simpler and smaller
PCB layout.
It is possible to control the I2C BUS by 3.3V / 5V.
Applications
It is optimal for car audio systems. It can also be used
for audio equipment of mini Compo, micro Compo, TV,
etc.
Key Specifications
Power Supply Voltage Range: 7.0V to 9.5V
Circuit Current (No signal): 38mA(Typ)
Total Harmonic Distortion 1:
(FRONT,REAR) 0.001%(Typ)
Total Harmonic Distortion 2:
(SUBWOOFER) 0.002%(Typ)
Maximum Input Voltage: 2.3Vrms(Typ)
Cross-talk Between Selectors: -100dB(Typ)
Volume Control Range: +15 dB to -79dB
Output Noise Voltage 1:
(FRONT,REAR) 3.8µVrms(Typ)
Output Noise Voltage 2:
(SUBWOOFER) 4.8µVrms(Typ)
Residual Output Noise Voltage: 1.8µVrms(Typ)
Operating Temperature Range: -40°C to +85°C
Package W(Typ) x D(Typ) x H(Max)
SSOP-A32
13.60mm x 7.80mm x 2.01mm
Datashee
t
Datashee
t
BD37541FS
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TSZ02201-0C2C0E100560-1-1
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.co.jp
m
TSZ22111・15・001
16.Dec.2015 Rev.001
Typical Application Circuit
Pin Configuration
Pin Descriptions
Pin No.
Pin
Name
Description
Pin No.
Pin
Name
Description
1
A1
A input terminal of 1ch
17
LDB2
Loudness setting terminal of 2ch
2
A2
A input terminal of 2ch
18
LDA2
Loudness setting terminal of 2ch
3
B1
B input terminal of 1ch
19
MUTE
External compulsory mute terminal
4
B2
B input terminal of 2ch
20
N.C.
No Connection
5
C1
C input terminal of 1ch
21
TEST
Test Pin
6
C2
C input terminal of 2ch
22
OUTS2
Subwoofer output terminal of 2ch
7
DP1
D positive input terminal of 1ch
23
OUTS1
Subwoofer output terminal of 1ch
8
DN
D negative input terminal
24
OUTR2
Rear output terminal of 2ch
9
DP2
D positive input terminal of 2ch
25
OUTR1
Rear output terminal of 1ch
10
EP1
E positive input terminal of 1ch
26
OUTF2
Front output terminal of 2ch
11
EN1
E negative input terminal of 1ch
27
OUTF1
Front output terminal of 1ch
12
EN2
E negative input terminal of 2ch
28
VCC
Power supply terminal
13
EP2
E positive input terminal of 2ch
29
SCL
I2C Communication clock terminal
14
MIN
Mixing input terminal
30
SDA
I2C Communication data terminal
15
LDA1
Loudness setting terminal of 1ch
31
GND
GND terminal
16
LDB1
Loudness setting terminal of 1ch
32
FIL
VCC/2 terminal
BD37541FS
32 FIL
31 GND
29 SCL
28 VCC
30 SDA
27 OUTF1
26 OUTF2
25 OUTR1
23 OUTS1
24 OUTR2
22 OUTS2
21 TEST
20 N.C.
19 MUTE
18 LDA2
17 LDB2
A1 1
A2 2
B2 4
C1 5
B1 3
C2 6
DP1 7
DN 8
EP1 10
DP2 9
EN1 11
EN2 12
EP2 13
MIN 14
LDA1 15
LDB1 16
TOP VIEW
BD37541FS
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TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Block Diagram
GND
ISO amp
Input selector (3 single-end and 2 stereo ISO)
★Volume/Mute
★3 Band P-EQ
(Tone control)
★Loudness
GND
VCC/2
32 31 30 29 28 27 26 25 24 23 22 21 20 19
1 2 3 4 5 6 7 8 910 11 12 13 14
100k100k100k100k100k100k250k
GND
ISO amp
250k250k
15 16
18 17
GND
ISO amp
250k250k
GND
ISO amp
250k250k
Fader★
Fader★
Fader★
Fader★
Fader★
■Fader
Gain:0dB～-79ｄB/1dB step
★no pop noise
■Loudness
Gain:20dB～0ｄB/1ｄB step
★no pop noise
■3 Band P-EQ (Tone control)
Gain：+20dB～-20dB/1dB step
★no pop noise
・Bass：f0=60/80/100/120Hz
Q=0.5/1.0/1.5/2.0
・Meddle:f0=500/1k/1.5k/2.5kHz
Q=0.75/1/1.25/1.5
・Treble：f0=7.5k/10k/12.5k/15kHz
Q=0.75/1.25
■Volume
Gain：+15dB～-79dB/1dB step
★no pop noise
■Input Gain
Gain：+20dB～0dB/1dB step
★no pop noise
VCC
★Input Gain
I2C BUS LOGIC
Fader
Gain:0dB to -79dB/1dB step
Loudness
Gain: 20dB to 0dB/1dB step
Gain: +20dB to -0dB/1dB step
Gain: +15dB to -79dB/1dB step
Gain: +20dB to -20dB/1dB step
BD37541FS
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TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Power Supply Voltage
VCC
10.0
V
Input Voltage
VIN
VCC+0.3 to GND-0.3
V
Power Dissipation
Pd
0.95 (Note 1)
W
Storage Temperature
Tstg
-55 to +150
°C
(Note 1) When mounted on the standard board (70 x 70 x 1.6 mm3), derate by 7.6mW/°C for Ta above 25°C.
Thermal resistance θja = 131.6(°C/W)
Material : A FR4 grass epoxy board(3% or less of copper foil area
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Voltage
VCC
7.0
-
9.5
V
Temperature
Topr
-40
-
+85
°C
Electrical Characteristics
(Unless specified, Ta=25°C, VCC=8.5V, f=1kHz, VIN=1Vrms, Rg=600Ω, RL=10kΩ, A1 input, Input gain 0dB, Mute OFF,
Volume 0dB, Tone control 0dB, Loudness 0dB, Mixing OFF, Fader 0dB)
BLOCK
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
GENERAL
Circuit Current (No Signal)
IQ
－
38
48
mA
No signal
Voltage Gain
GV
-1.5
0
+1.5
dB
GV=20log(VOUT/VIN)
Channel Balance
CB
-1.5
0
+1.5
dB
CB = GV1-GV2
Total Harmonic Distortion 1
(FRONT,REAR)
THD+N1
－
0.001
0.05
％
VOUT=1Vrms
BW=400Hz-30KHz
Total Harmonic Distortion 2
(SUBWOOFER)
THD+N2
－
0.002
0.05
％
VOUT=1Vrms
BW=400Hz-30KHz
Output Noise Voltage 1
(FRONT,REAR) *
VNO1
－
3.8
15
μVrms
Rg = 0Ω
BW = IHF-A
Output Noise Voltage 2
(SUBWOOFER) *
VNO2
－
4.8
15
μVrms
Rg = 0Ω
BW = IHF-A
Residual Output Noise Voltage *
VNOR
－
1.8
10
μVrms
Fader = -∞dB
Rg = 0Ω
BW = IHF-A
Crosstalk Between Channels *
CTC
－
-100
-90
dB
Rg = 0Ω
CTC=20log(VOUT/VIN)
BW = IHF-A
Ripple Rejection
RR
－
-70
-40
dB
f=1kHz
VRR=100mVrms
RR=20log(VCC IN/VOUT)
INPUT SELECTOR
Input Impedance(A, B,C)
RIN_S
70
100
130
kΩ
Input Impedance(D, E)
RIN_D
175
250
325
kΩ
Maximum Input Voltage
VIM
2.1
2.3
－
Vrms
VIM at THD+N(VOUT)=1％
BW=400Hz-30KHz
Crosstalk Between Selectors *
CTS
－
-100
-90
dB
Rg = 0Ω
CTS=20log(VOUT/VIN)
BW = IHF-A
Common Mode Rejection Ratio *
CMRR
50
65
－
dB
XP1 and XN input
XP2 and XN input
CMRR=20log(VIN/VOUT)
BW = IHF-A,[*X…D,E]
BD37541FS
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TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Electrical Characteristics - continued
BLOCK
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
INPUT GAIN
Minimum Input Gain
GIN_MIN
-2
0
+2
dB
Input gain 0dB
VIN=100mVrms
GIN=20log(VOUT/VIN)
Maximum Input Gain
GIN_MAX
18
20
22
dB
Input gain 20dB
VIN=100mVrms
GIN=20log(VOUT/VIN)
Gain Set Error
GIN_ERR
-2
0
+2
dB
GAIN=+1dB to +20dB
MUTE
Mute Attenuation *
GMUTE
－
-105
-85
dB
Mute ON
GMUTE=20log(VOUT/VIN)
BW = IHF-A
VOLUME
Maximum Gain
GV_MAX
13
15
17
dB
Volume = 15dB
VIN=100mVrms
GV=20log(VOUT/VIN)
Maximum Attenuation *
GV_MIN
－
-100
-85
dB
Volume = -∞DB
GV=20LOG(VOUT/VIN)
BW = IHF-A
Attenuation Set Error 1
GV_ERR1
-2
0
+2
dB
GAIN & ATT=+15dB to -15dB
Attenuation Set Error 2
GV_ERR2
-3
0
+3
dB
ATT=-16dB to -47dB
Attenuation Set Error 3
GV_ERR3
-4
0
+4
dB
ATT=-48dB to -79dB
BASS
Maximum Boost Gain
GB_BST
18
20
22
dB
Gain=+20dB f=100Hz
VIN=100mVrms
GB=20log (VOUT/VIN)
Maximum Cut Gain
GB_CUT
-22
-20
-18
dB
Gain=-20dB f=100Hz
VIN=2Vrms
GB=20log (VOUT/VIN)
Gain Set Error
GB_ERR
-2
0
+2
dB
Gain=-20dB to +20dB
f=100Hz
MIDDLE
Maximum boost gain
GM_BST
18
20
22
dB
Gain=+20dB f=1kHz
VIN=100mVrms
GM=20log (VOUT/VIN)
Maximum cut gain
GM_CUT
-22
-20
-18
dB
Gain=-20dB f=1kHz
VIN=2Vrms
GM=20log (VOUT/VIN)
Gain set error
GM_ERR
-2
0
+2
dB
Gain=-20dB to +20dB f=1kHz
TREBLE
Maximum Boost Gain
GT_BST
18
20
22
dB
Gain=+20dB f=10kHz
VIN=100mVrms
GT=20log (VOUT/VIN)
Maximum Cut Gain
GT_CUT
-22
-20
-18
dB
Gain=-20dB f=10kHz
VIN=2Vrms
GT=20log (VOUT/VIN)
Gain Set Error
GT_ERR
-2
0
+2
dB
Gain=-20dB to +20dB
f=10kHz
MIXING
Input Impedance
RIN_M
19
27
35
kΩ
Maximum Input Voltage
VIM_M
2.0
2.2
－
Vrms
VIM at THD+N(VOUT)=1％
BW=400Hz-30KHz
Maximum Attenuation
GMX_MIN
－
-100
-85
dB
MIX=OFF
GMX=20log(VOUT/VIN)
BW=INF-A
BD37541FS
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TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
16.Dec.2015 Rev.001
Electrical Characteristics - continued
BLOCK
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
FADER / SUBWOOFER
Maximum Attenuation *
GF_MIN
－
-100
-90
dB
Fader = -∞dB
GF=20log(VOUT/VIN)
BW = IHF-A
Attenuation Set Error 1
GF_ERR1
-2
0
+2
dB
ATT=-1dB to -15dB
Attenuation Set Error 2
GF_ERR2
-3
0
+3
dB
ATT=-16dB to -47dB
Attenuation Set Error 3
GF_ERR3
-4
0
+4
dB
ATT=-48dB to -79dB
Output Impedance
ROUT
－
－
50
Ω
VIN=100mVrms
Maximum Output Voltage
VOM
2
2.2
－
Vrms
THD+N=1％
BW=400Hz-30KHz
LOUDNE
SS
Maximum Gain
GL_MAX
17
20
23
dB
Gain 20dB
VIN=100mVrms
GL=20log(VOUT/VIN)
Gain Set Error
GL_ERR
-2
0
+2
dB
GAIN=+1dB to +20dB
VP-9690A(Average value detection, effective value display) filter by Matsushita Communication is used for * measurement.
Phase between input / output is same.
BD37541FS
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TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
16.Dec.2015 Rev.001
Typical Performance Curves
-5
-4
-3
-2
-1
0
1
2
3
4
5
10
100
1k
10k
100k
Frequency (Hz)
Gain (dB)
Figure 4. Bass Gain vs Freq
Figure 2. Thd vs Vo
0
10
20
30
40
50
0 2 4 6 8 10
VCC[V]
Iq[mA]
Power Supply Voltage : VCC [V]
Circuit Current (No Signal) : IQ [mA]
Figure 1. Circuit Current (No Signal) vs Power Supply
Voltage
-25
-20
-15
-10
-5
0
5
10
15
20
25
10 100 1k 10k 100k
Frequency [Hz]
BASS GAIN : -20dB to +20dB
/1dB step
fO : 60Hz Q : 0.5
Figure 4. Bass Gain vs Frequency
Bass Gain [dB]
0.001
0.01
0.1
1
10
0.001 0.01 0.1 1 10
Vout (V)
THD+N (%)
0.001
0.01
0.1
1
10
Vout
Output Voltage : VOUT [Vrms]
VIN [Vrms]
10kHz
1kHz
100Hz
Figure 2. Total Harmonic Distortion vs Output Voltage
Total Harmonic Distortion : THD+N [%]
Figure 3. Gain vs Frequency
Gain=0dB
BD37541FS
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TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Typical Performance Curves – continued
Figure 5. Bass fo vs Freq
-25
-20
-15
-10
-5
0
5
10
15
20
25
10 100 1k 10k 100k
Frequency [Hz]
fO : 60/80/100/120Hz
BASS GAIN : ±20dB
Q : 0.5
Figure 5. Bass fO vs Frequency
Gain [dB]
-25
-20
-15
-10
-5
0
5
10
15
20
25
10 100 1k 10k 100k
Q : 0.5/1/1.5/2
BASS GAIN : ±20dB
fO : 60Hz
Frequency [Hz]
Figure 6. Bass Q vs Frequency
Gain [dB]
-25
-20
-15
-10
-5
0
5
10
15
20
25
10 100 1k 10k 100k
Frequency [Hz]
MIDDLE GAIN :
-20dB to +20dB /1dB step
fO: 500Hz
Q : 0.75
Figure 7. Middle Gain vs Frequency
Middle Gain [dB]
-25
-20
-15
-10
-5
0
5
10
15
20
25
10 100 1k 10k 100k
Frequency [Hz]
Gain [dB]
fO : 500/1k/1.5k/2.5kHz
MIDDLE GAIN :
±20dB
Q : 0.75
Figure 8. Middle fO vs Frequency
BD37541FS
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TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Typical Performance Curves – continued
-25
-20
-15
-10
-5
0
5
10
15
20
25
10 100 1k 10k 100k
Frequency [Hz]
Gain [dB]
MIDDLE GAIN :
±20dB
fO : 500Hz
Q : 0.75/1/1.25/1.5
Figure 9. Middle Q vs Frequency
-25
-20
-15
-10
-5
0
5
10
15
20
25
10 100 1k 10k 100k
Gain [dB]
fO : 7.5k/10k/12.5k/15kHz
TREBLE GAIN : ±20dB
Q : 0.75
Figure 11. Treble fO vs Frequency
Frequency (Hz)
-25
-20
-15
-10
-5
0
5
10
15
20
25
10 100 1k 10k 100k
Frequency (Hz)
Gain (dB)
Gain [dB]
Q : 0.75/1.25
TREBLE GAIN : ±20dB
fO : 7.5kHz
Frequency [Hz]
Figure 12. Treble Q vs Frequency
-25
-20
-15
-10
-5
0
5
10
15
20
25
10 100 1k 10k 100k
Frequency (Hz)
Gain (dB)
Frequency [Hz]
TREBLE GAIN:-20dB to +20dB
/1dB step
fO : 7.5kHz Q : 0.75
Treble Gain [dB]
Figure 10. Treble Gain vs Frequency
BD37541FS
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TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Typical Performance Curves – continued
1
10
100
1000
-80 -70 -60 -50 -40 -30 -20 -10 010 20
Volume Gain[dB]
出力雑音電圧[uVrms]
Din-Audio IHF-A
Output Noise [µVrms]
Figure 13. Output Noise vs Volume Gain
Volume Gain [dB]
1
10
100
1000
-20 -15 -10 -5 0 5 10 15 20
Bass Gain [dB]
出力雑音電圧 [uVrms]
DIN-Audio IHF-A
Output Noise [µVrms]
Figure 14. Output Noise vs Bass Gain
Bass Gain [dB]
1
10
100
1000
-20 -15 -10 -5 0 5 10 15 20
Treble Gain [dB]
出力雑音電圧 [uVrms]
DIN-Audio IHF-A
Output Noise [µVrms]
Figure 16. Output Noise vs Treble Gain
Treble Gain [dB]
1
10
100
1000
-20 -15 -10 -5 0 5 10 15 20
Middle Gain [dB]
出力雑音電圧 [uVrms]
DIN-Audio IHF-A
Output Noise [µVrms]
Figure 15. Output Noise vs Middle Gain
Middle Gain [dB]
BD37541FS
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TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Typical Performance Curves – continued
-70
-60
-50
-40
-30
-20
-10
0
10 100 1k 10k 100k
Frequency (Hz)
Gain (dB)
Frequency [Hz]
Gain [dB]
Figure 19. Advanced Switch 1
Figure 20. Advanced Switch 2
0.0
0.5
1.0
1.5
2.0
2.5
100 1000 10000 100000
出力負荷[ohm]
最大出力[Vrms]
RLOAD [ohm]
Output Voltage : VOUT [Vrms]
Figure 18. Output Voltage vs RLOAD
Figure 17. CMRR vs Frequency
BD37541FS
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TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Timing Chart
CONTROL SIGNAL SPECIFICATION
(1) Electrical Specifications and Timing for Bus Lines and I/O Stages
Figure 21. I2C-bus Signal Timing Diagram
Table 1 Characteristics of the SDA and SCL bus lines for I2C-bus devices (Ta=25°C, VCC=8.5V)
Parameter
Symbol
Fast-mode I2C-bus
Unit
Min
Max
1
SCL clock frequency
fSCL
0
400
kHz
2
Bus free time between a STOP and START condition
tBUF
1.3
－
μS
3
Hold time (repeated) START condition. After this period, the first clock
pulse is generated
tHD;STA
0.6
－
μS
4
LOW period of the SCL clock
tLOW
1.3
－
μS
5
HIGH period of the SCL clock
tHIGH
0.6
－
μS
6
Set-up time for a repeated START condition
tSU;STA
0.6
－
μS
7
Data hold time:
tHD;DAT
0.06(Note)
－
μS
8
Data set-up time
tSU;DAT
120
－
ns
9
Set-up time for STOP condition
tSU;STO
0.6
－
μS
All values refer to VIH Min and VIL Max Levels (see Table 2).
(Note) A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIH Min of the SCL signal) in order to bridge the
undefined region of the falling edge of SCL.
For 7(tHD;DAT), 8(tSU;DAT), make the setup in which the margin is full.
Table 2 Characteristics of the SDA and SCL I/O stages for I2C-bus devices
Parameter
Symbol
Fast-mode devices
Unit
Min
Max
10
LOW level input voltage:
VIL
-0.3
+1
V
11
HIGH level input voltage:
VIH
2.3
5
V
12
Pulse width of spikes which must be suppressed by the input filter.
tSP
0
50
ns
13
LOW level output voltage: at 3mA sink current
VOL1
0
0.4
V
14
Input current each I/O pin with an input voltage between 0.4V and 4.5V.
II
-10
+10
μA
SDA
S
SCL
tLOW
tR
tHD;DAT
P
tHD;STA
tHIGH
tBUF
tF
tSU;DAT
tSU;STAT
tSU;STOT
tSP
tHD;STAT
Sr
P
Figure 22. A Command Timing Example in the I2C Data Transmission
ｔBUF
：4us
ｔHD;STA
：2us
ｔHD;DAT
：1us
ｔLOW
：3us
ｔHIGH
：1us
ｔSU;DAT
：1us
ｔSU;STO
：2us
SCL clock frequency：250kHz
SCL
SDA
tHD;STA
:2µs
tHD;DAT
:1µs
tSU;DAT
:1µs
tSU;STO
:2µs
tBUF
:2µs
tLOW
:3µs
tHIGH
:1µs
SDA
SCL
SCL clock frequency : 250kHz
BD37541FS
13/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
(2) I2C BUS FORMAT
MSB LSB MSB LSB MSB LSB
S
Slave Address
A
Select Address
A
Data
A
P
1bit 8bit 1bit 8bit 1bit 8bit 1bit 1bit
S = Start condition (Recognition of start bit)
Slave Address = Recognition of slave address. The first 7 bits correspond to the slave address.
The least significant bit is “L” which corresponds to write mode.
A = ACKNOWLEDGE bit (Recognition of acknowledgement)
Select Address = Select address corresponding to volume, bass or treble.
Data = Data on every volume and tone.
P = Stop condition (Recognition of stop bit)
(3) I2C BUS Interface Protocol
(a) Basic Format
S
Slave Address
A
Select Address
A
Data
A
P
MSB LSB MSB LSB MSB LSB
(b) Automatic Increment (Select Address increases (+1) according to the number of data.)
S
Slave Address
A
Select Address
A
Data1
A
Data2
A
････
DataN
A
P
MSB LSB MSB LSB MSB LSB MSB LSB MSB LSB
(Example) ①Data1 shall be set as data of address specified by Select Address.
②Data2 shall be set as data of address specified by Select Address +1.
③DataN shall be set as data of address specified by Select Address +N-1.
(c) Configuration Unavailable for Transmission (In this case, only Select Address1 is set.)
S
Slave Address
A
Select Address1
A
Data
A
Select Address 2
A
Data
A
P
MSB LSB MSB LSB MSB LSB MSB LSB MSB LSB
(Note) If any data is transmitted as Select Address 2 next to data, it is recognized
as data, not as Select Address 2.
(4) Slave Address
MSB LSB
A6
A5
A4
A3
A2
A1
A0
R/W
1
0
0
0
0
0
0
0
80H
BD37541FS
14/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
(5) Select Address & Data
Items
Select
Address
(hex)
MSB
Data
LSB
D7
D6
D5
D4
D3
D2
D1
D0
Initial setup 1
01
Advanced
switch
ON/OFF
0
Advanced switch time of
Input Gain/Volume
Tone/Fader/Loudness
Mixing
0
1
Advanced switch time
of Mute
Initial setup 2
02
0
0
Subwoofer Output
Select
0
0
0
0
Initial setup 3
03
0
0
0
0
0
0
1
0
Input Selector
05
Full-diff
Type
0
0
Input selector
Input gain
06
Mute
ON/OFF
0
0
Input Gain
Volume gain
20
Volume Gain / Attenuation
Fader 1ch Front
28
Fader Attenuation
Fader 2ch Front
29
Fader Attenuation
Fader 1ch Rear
2A
Fader Attenuation
Fader 2ch Rear
2B
Fader Attenuation
Fader Subwoofer
2C
Fader Attenuation
Mixing
30
Mixing ON / OFF
Bass setup
41
0
0
Bass fO
0
0
Bass Q
Middle setup
44
0
0
Middle fO
0
0
Middle Q
Treble setup
47
0
0
Treble fO
0
0
0
Treble Q
Bass gain
51
Bass
Boost/
Cut
0
0
Bass Gain
Middle gain
54
Middle
Boost/
Cut
0
0
Middle Gain
Treble gain
57
Treble
Boost/
Cut
0
0
Treble Gain
Loudness Gain
75
0
Loudness Hicut
Loudness Gain
System Reset
FE
1
0
0
0
0
0
0
1
Advanced switch
Note
1. The Advance Switch works in the latch part while changing from one function to another.
2. Upon continuous data transfer, the Select Address rolls over because of the automatic increment function, as
shown below.
3. Advance switch is not used for the function of input selector, subwoofer output select etc. Therefore, please
apply mute on the side when changing these settings.
4. When using mute function of this IC at the time of changing input selector, please switch mute ON/OFF for
waiting advanced-mute time.
→01→02→03→05→06→20→28→29→2A→2B→2C
→30→41→44→47→51→54→57→75
BD37541FS
15/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Select address 01 (hex)
Time
MSB
Advanced switch time of Mute
LSB
D7
D6
D5
D4
D3
D2
D1
D0
0.6msec
Advanced
Switch
ON/OFF
0
Advanced switch time
of Input gain/Volume
Tone/Fader/Loudness
Mixing
0
1
0
0
1.0msec
0
1
1.4msec
1
0
3.2msec
1
1
Time
MSB
Advanced switch time of Input
gain/Volume/Tone/Fader/
Loudness/Mixing
LSB
D7
D6
D5
D4
D3
D2
D1
D0
4.7 msec
Advanced
Switch
ON/OFF
0
0
0
0
1
Advanced switch
Time of Mute
7.1 msec
0
1
11.2 msec
1
0
14.4 msec
1
1
Mode
MSB
Advanced switch ON/OFF
LSB
D7
D6
D5
D4
D3
D2
D1
D0
OFF
0
0
Advanced switch time
of Input gain/Volume
Tone/Fader/Loudness
Mixing
0
1
Advanced switch
Time of Mute
ON
1
Select address 02(hex)
Mode
MSB
Subwoofer Output Select
LSB
D7
D6
D5
D4
D3
D2
D1
D0
Sub
0
0
0
0
0
0
0
0
Front
0
1
Rear
1
0
Prohibition
1
1
: Initial Condition
BD37541FS
16/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Select address 05(hex)
Mode
MSB
Input Selector
LSB
OUTF1
OUTF2
D7
D6
D5
D4
D3
D2
D1
D0
A
A1
A2
Full-
diff bias
type
select
0
0
0
0
0
0
0
B
B1
B2
0
0
0
0
1
C
C1
C2
0
0
0
1
0
D single
DP1
DP2
0
0
0
1
1
E1 single
EP1
EN1
0
1
0
1
0
E2 single
EN2
EP2
0
1
0
1
1
A diff
A1
B1
0
1
1
1
1
C diff
B2
C2
1
0
0
0
0
D diff
DP1
DP2
0
0
1
1
0
E full diff
EP1
EP2
0
1
0
0
0
Input SHORT
0
1
0
0
1
Prohibition
Other setting
Input SHORT : The input impedance of each input terminal is lowered from 100kΩ(Typ) to 6 kΩ(Typ).
(For quick charge of coupling capacitor)
Mode
MSB
Full-diff Bias Type Select
LSB
D7
D6
D5
D4
D3
D2
D1
D0
Negative Input
0
0
0
Input Selector
Bias
1
: Initial condition
Negative input type
For Ground –isolation type.
Bias type
For differential amplifier type
1ch
Differential
10
EP1
11
EN1
12
EN2
13
EP2
2ch
Differential
1ch
Differential
2ch
Differential
10
EP1
11
EN1
12
EN2
13
EP2
1ch
1ch signal input
2ch
2ch signal input
1ch
1ch signal input
2ch
2ch signal input
BD37541FS
17/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Select address 06 (hex)
Mode
MSB
Input Gain
LSB
D7
D6
D5
D4
D3
D2
D1
D0
0dB
Mute
ON/OFF
0
0
0
0
0
0
0
1dB
0
0
0
0
1
2dB
0
0
0
1
0
3dB
0
0
0
1
1
4dB
0
0
1
0
0
5dB
0
0
1
0
1
6dB
0
0
1
1
0
7dB
0
0
1
1
1
8dB
0
1
0
0
0
9dB
0
1
0
0
1
10dB
0
1
0
1
0
11dB
0
1
0
1
1
12dB
0
1
1
0
0
13dB
0
1
1
0
1
14dB
0
1
1
1
0
15dB
0
1
1
1
1
16dB
1
0
0
0
0
17dB
1
0
0
0
1
18dB
1
0
0
1
0
19dB
1
0
0
1
1
20dB
1
0
1
0
0
Prohibition
1
1
0
1
1
：
：
：
：
：
1
1
1
1
1
Mode
MSB
Mute ON/OFF
LSB
D7
D6
D5
D4
D3
D2
D1
D0
OFF
0
0
0
Input Gain
ON
1
: Initial condition
BD37541FS
18/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Select address 20, 28, 29, 2A, 2B, 2C (hex)
Gain & ATT
MSB
Vol, Fader Gain / Attenuation
LSB
D7
D6
D5
D4
D3
D2
D1
D0
Prohibition
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
：
：
：
：
：
：
：
：
0
1
1
1
0
0
0
0
15dB
0
1
1
1
0
0
0
1
14dB
0
1
1
1
0
0
1
0
13dB
0
1
1
1
0
0
1
1
：
：
：
：
：
：
：
：
：
-77dB
1
1
0
0
1
1
0
1
-78dB
1
1
0
0
1
1
1
0
-79dB
1
1
0
0
1
1
1
1
Prohibition
1
1
0
1
0
0
0
0
：
：
：
：
：
：
：
：
1
1
1
1
1
1
1
0
-∞dB
1
1
1
1
1
1
1
1
(Only 0dB to -∞dB are available at address 28, 29, 2A, 2B,2C)
Select address 30(hex)
Gain & ATT
MSB
Mixing Gain / Attenuation
LSB
D7
D6
D5
D4
D3
D2
D1
D0
MIX ON
1
0
0
0
0
0
0
0
MIX OFF
1
1
1
1
1
1
1
1
Select address 41(hex)
Q factor
MSB
Bass Q factor
LSB
D7
D6
D5
D4
D3
D2
D1
D0
0.5
0
0
Bass fO
0
0
0
0
1.0
0
1
1.5
1
0
2.0
1
1
fO
MSB
Bass fO
LSB
D7
D6
D5
D4
D3
D2
D1
D0
60Hz
0
0
0
0
0
0
Bass
Q factor
80Hz
0
1
100Hz
1
0
120Hz
1
1
Select address 44(hex)
Q factor
MSB
Middle Q factor
LSB
D7
D6
D5
D4
D3
D2
D1
D0
0.75
0
0
Middle fO
0
0
0
0
1.0
0
1
1.25
1
0
1.5
1
1
fO
MSB
Middle fO
LSB
D7
D6
D5
D4
D3
D2
D1
D0
500Hz
0
0
0
0
0
0
Middle
Q factor
1kHz
0
1
1.5kHz
1
0
2.5kHz
1
1
: Initial condition
BD37541FS
19/33
TSZ02201-0C2C0E100560-1-2
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TSZ22111・15・001
16.Dec.2015 Rev.001
Select address 47 (hex)
Q factor
MSB
Treble Q factor
LSB
D7
D6
D5
D4
D3
D2
D1
D0
0.75
0
0
Treble fO
0
0
0
0
1.25
1
fO
MSB
Treble fO
LSB
D7
D6
D5
D4
D3
D2
D1
D0
7.5kHz
0
0
0
0
0
0
0
Treble
Q factor
10kHz
0
1
12.5kHz
1
0
15kHz
1
1
Select address 51, 54, 57 (hex)
Gain
MSB
Bass/Middle/Treble Gain
LSB
D7
D6
D5
D4
D3
D2
D1
D0
0dB
Bass/
Middle/
Treble
Boost
/cut
0
0
0
0
0
0
0
1dB
0
0
0
0
1
2dB
0
0
0
1
0
3dB
0
0
0
1
1
4dB
0
0
1
0
0
5dB
0
0
1
0
1
6dB
0
0
1
1
0
7dB
0
0
1
1
1
8dB
0
1
0
0
0
9dB
0
1
0
0
1
10dB
0
1
0
1
0
11dB
0
1
0
1
1
12dB
0
1
1
0
0
13dB
0
1
1
0
1
14dB
0
1
1
1
0
15dB
0
1
1
1
1
16dB
1
0
0
0
0
17dB
1
0
0
0
1
18dB
1
0
0
1
0
19dB
1
0
0
1
1
20dB
1
0
1
0
0
Prohibition
1
0
1
0
1
：
：
：
：
：
1
1
1
1
0
1
1
1
1
1
Mode
MSB
Bass/Middle/Treble Boost/Cut
LSB
D7
D6
D5
D4
D3
D2
D1
D0
Boost
0
0
0
Bass/Middle/Treble Gain
Cut
1
:Initial condition
BD37541FS
20/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Select address 75 (hex)
Mode
MSB
Loudness Hicut
LSB
D7
D6
D5
D4
D3
D2
D1
D0
Hicut1
0
0
0
Loudness Gain
Hicut2
0
1
Hicut3
1
0
Hicut4
1
1
Gain
MSB
Loudness Gain
LSB
D7
D6
D5
D4
D3
D2
D1
D0
0dB
0
Loudness Hicut
0
0
0
0
0
1dB
0
0
0
0
1
2dB
0
0
0
1
0
3dB
0
0
0
1
1
4dB
0
0
1
0
0
5dB
0
0
1
0
1
6dB
0
0
1
1
0
7dB
0
0
1
1
1
8dB
0
1
0
0
0
9dB
0
1
0
0
1
10dB
0
1
0
1
0
11dB
0
1
0
1
1
12dB
0
1
1
0
0
13dB
0
1
1
0
1
14dB
0
1
1
1
0
15dB
0
1
1
1
1
16dB
1
0
0
0
0
17dB
1
0
0
0
1
18dB
1
0
0
1
0
19dB
1
0
0
1
1
20dB
1
0
1
0
0
Prohibition
1
0
1
0
1
：
：
：
：
：
1
1
1
1
1
: Initial condition
(6) About Power ON Reset
Built-in IC initialization is made during power ON of the supply voltage. Please send initial data to all
addresses at supply voltage on. And please turn ON mute until this initial data is sent.
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
Rise Time of VCC
tRISE
33
－
－
µsec
VCC rise time from 0V to 5V
VCC Voltage of
Release Power ON
Reset
VPOR
－
4.1
－
V
(7) About External Compulsory Mute Terminal
It is possible to force mute externally by setting an input voltage to the MUTE terminal.
Mute Voltage Condition
Mode
GND to 1.0V
MUTE ON
2.3V to VCC
MUTE OFF
Establish the voltage of MUTE in the condition you want to set.
BD37541FS
21/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Application Information
1. Function and Specifications
Function
Specifications
Input
selector
・Stereo input
・Single-End/Diff/Full-Diff
(Possible to set the number of single-end/diff/full-diff as follows )
Single-End
Differential
Full-Differential
Mode 1
0
3
1
Mode 2
1
2
1
Mode 3
3
1
1
Mode 4
4
0
1
Mode 5
5
1
0
Mode 6
6
0
0
Table.1 Combination of input selector
Input gain
・+20dB to 0dB (1dB step)
・Possible to use “Advanced switch” for prevention of switching noise.
Mute
・Possible to use “Advanced switch” for prevention of switching noise.
Volume
・+15dB to -79dB (1dB step), -∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
Bass
・+20dB to -20dB (1dB step)
・Q=0.5, 1, 1.5, 2
・fO =60, 80, 100, 120Hz
・Possible to use “Advanced switch” for prevention of switching noise.
Middle
・+20dB to -20dB (1dB step)
・Q=0.75, 1, 1.25, 1.5
・fO=500, 1k, 1.5k 2.5kHz
・Possible to use “Advanced switch” for prevention of switching noise.
Treble
・+20dB to -20dB (1dB step)
・Q=0.75, 1.25
・fO=7.5k, 10k, 12.5k, 15kHz
・Possible to use “Advanced switch” for prevention of switching noise.
Fader
・0dB to -79dB, -∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
Loudness
・20dB to 0dB(1dB step)
・Possible to use “Advanced switch” for prevention of switching noise.
Mixing
・Monaural input
・0dB/-∞dB
・Possible to use “Advanced switch” for prevention of switching noise.
BD37541FS
22/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
2. Volume / Fader Volume Attenuation Data
(dB)
D7
D6
D5
D4
D3
D2
D1
D0
(dB)
D7
D6
D5
D4
D3
D2
D1
D0
+15
0
1
1
1
0
0
0
1
-33
1
0
1
0
0
0
0
1
+14
0
1
1
1
0
0
1
0
-34
1
0
1
0
0
0
1
0
+13
0
1
1
1
0
0
1
1
-35
1
0
1
0
0
0
1
1
+12
0
1
1
1
0
1
0
0
-36
1
0
1
0
0
1
0
0
+11
0
1
1
1
0
1
0
1
-37
1
0
1
0
0
1
0
1
+10
0
1
1
1
0
1
1
0
-38
1
0
1
0
0
1
1
0
+9
0
1
1
1
0
1
1
1
-39
1
0
1
0
0
1
1
1
+8
0
1
1
1
1
0
0
0
-40
1
0
1
0
1
0
0
0
+7
0
1
1
1
1
0
0
1
-41
1
0
1
0
1
0
0
1
+6
0
1
1
1
1
0
1
0
-42
1
0
1
0
1
0
1
0
+5
0
1
1
1
1
0
1
1
-43
1
0
1
0
1
0
1
1
+4
0
1
1
1
1
1
0
0
-44
1
0
1
0
1
1
0
0
+3
0
1
1
1
1
1
0
1
-45
1
0
1
0
1
1
0
1
+2
0
1
1
1
1
1
1
0
-46
1
0
1
0
1
1
1
0
+1
0
1
1
1
1
1
1
1
-47
1
0
1
0
1
1
1
1
0
1
0
0
0
0
0
0
0
-48
1
0
1
1
0
0
0
0
-1
1
0
0
0
0
0
0
1
-49
1
0
1
1
0
0
0
1
-2
1
0
0
0
0
0
1
0
-50
1
0
1
1
0
0
1
0
-3
1
0
0
0
0
0
1
1
-51
1
0
1
1
0
0
1
1
-4
1
0
0
0
0
1
0
0
-52
1
0
1
1
0
1
0
0
-5
1
0
0
0
0
1
0
1
-53
1
0
1
1
0
1
0
1
-6
1
0
0
0
0
1
1
0
-54
1
0
1
1
0
1
1
0
-7
1
0
0
0
0
1
1
1
-55
1
0
1
1
0
1
1
1
-8
1
0
0
0
1
0
0
0
-56
1
0
1
1
1
0
0
0
-9
1
0
0
0
1
0
0
1
-57
1
0
1
1
1
0
0
1
-10
1
0
0
0
1
0
1
0
-58
1
0
1
1
1
0
1
0
-11
1
0
0
0
1
0
1
1
-59
1
0
1
1
1
0
1
1
-12
1
0
0
0
1
1
0
0
-60
1
0
1
1
1
1
0
0
-13
1
0
0
0
1
1
0
1
-61
1
0
1
1
1
1
0
1
-14
1
0
0
0
1
1
1
0
-62
1
0
1
1
1
1
1
0
-15
1
0
0
0
1
1
1
1
-63
1
0
1
1
1
1
1
1
-16
1
0
0
1
0
0
0
0
-64
1
1
0
0
0
0
0
0
-17
1
0
0
1
0
0
0
1
-65
1
1
0
0
0
0
0
1
-18
1
0
0
1
0
0
1
0
-66
1
1
0
0
0
0
1
0
-19
1
0
0
1
0
0
1
1
-67
1
1
0
0
0
0
1
1
-20
1
0
0
1
0
1
0
0
-68
1
1
0
0
0
1
0
0
-21
1
0
0
1
0
1
0
1
-69
1
1
0
0
0
1
0
1
-22
1
0
0
1
0
1
1
0
-70
1
1
0
0
0
1
1
0
-23
1
0
0
1
0
1
1
1
-71
1
1
0
0
0
1
1
1
-24
1
0
0
1
1
0
0
0
-72
1
1
0
0
1
0
0
0
-25
1
0
0
1
1
0
0
1
-73
1
1
0
0
1
0
0
1
-26
1
0
0
1
1
0
1
0
-74
1
1
0
0
1
0
1
0
-27
1
0
0
1
1
0
1
1
-75
1
1
0
0
1
0
1
1
-28
1
0
0
1
1
1
0
0
-76
1
1
0
0
1
1
0
0
-29
1
0
0
1
1
1
0
1
-77
1
1
0
0
1
1
0
1
-30
1
0
0
1
1
1
1
0
-78
1
1
0
0
1
1
1
0
-31
1
0
0
1
1
1
1
1
-79
1
1
0
0
1
1
1
1
-32
1
0
1
0
0
0
0
0
-∞
1
1
1
1
1
1
1
1
Fader Volume only 0dB to -∞dB are available.
：Initial condition
BD37541FS
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TSZ02201-0C2C0E100560-1-2
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TSZ22111・15・001
16.Dec.2015 Rev.001
3. Application Circuit
Figure 23. BD37541FS
Notes on wiring
①Please connect the decoupling capacitor of the power supply in the shortest possible distance to GND.
②GND lines should be one-point connected.
③Wiring pattern of Digital should be away from that of Analog unit and crosstalk should not be acceptable.
④SCL and SDA lines of I2C BUS should not be parallel if possible.
The lines should be shielded, if they are adjacent to each other.
⑤Analog input lines should not be parallel if possible. The lines should be shielded, if they are adjacent to each other.
⑥About TEST pin (Pin 21), please leave it OPEN.
1 to 3
FIL GND SDA SCL MUTE
10μ0.1μ
10μ
OUTF1 OUTF2 OUTR1 OUTR2 OUTS1 OUTS2
MIN
VCC
10μ10μ10μ10μ10μ
2.2μ2.2μ2.2μ2.2μ2.2μ2.2μ2.2μ10μ2.2μ2.2μ10μ2.2μ2.2μ2.2μ
GND
ISO amp
Input selector (3 single-end and 2 stereo ISO)
★Volume/Mute
★3 Band P-EQ
(Tone control)
★Loudness
GND
VCC/2
32 31 30 29 28 27 26 25 24 23 22 21 20 19
1 2 3 4 5 6 7 8 910 11 12 13 14
100k100k100k100k100k100k250k
GND
ISO amp
250k250k
15 16
18 17
GND
ISO amp
250k250k
GND
ISO amp
250k250k
Fader★
Fader★
Fader★
Fader★
Fader★
■Fader
Gain:0dB～-79ｄB/1dB step
★no pop noise
■Loudness
Gain:20dB～0ｄB/1ｄB step
★no pop noise
■3 Band P-EQ (Tone control)
Gain：+20dB～-20dB/1dB step
★no pop noise
・Bass：f0=60/80/100/120Hz
Q=0.5/1.0/1.5/2.0
・Meddle:f0=500/1k/1.5k/2.5kHz
Q=0.75/1/1.25/1.5
・Treble：f0=7.5k/10k/12.5k/15kHz
Q=0.75/1.25
■Volume
Gain：+15dB～-79dB/1dB step
★no pop noise
■Input Gain
Gain：+20dB～0dB/1dB step
★no pop noise
VCC
★Input Gain
I2C BUS LOGIC
Single1 Single2 Single3 GND Isolation1 or
Single4
Full Differential or
Single5, Single6
GND Isolation2 GND Isolation3
※Single1～3はGND Isolation2,3に切換可能
（About single input 1～3, it is possible to change from
single input to GND Isolation input 2,3.）
※GND Isolation1, Full DifferentialはSingle4～6に切換可能
（About GND Isolation1 and Full Differential, it is possible
to change from differential input to single input 4～6.）
TEST
10μ
Unit
R : [Ω]
C : [F]
(Note) About GND Isolation1 and Full Differential, it is possible to
change from differential input to single input 4 to 6.
(Note) About single input 1 to 3, it is possible to change from
single input to GND Isolation input 2,3.
Fader
Gain:0dB to -79dB/1dB step
Loudness
Gain: 20dB to 0dB/1dB step
Gain: +20dB to -0dB/1dB step
Gain: +15dB to -79dB/1dB step
Gain: +20dB to -20dB/1dB step
BD37541FS
24/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Power Dissipation
About the thermal design of the IC
Characteristics of an IC have a great deal to do with the temperature at which it is used, and exceeding absolute maximum
ratings may degrade and destroy elements. Careful consideration must be given to the heat of the IC from the two
standpoints of immediate damage and long-term reliability of operation.
Figure 24. Temperature Derating Curve
Power dissipation values vary according to the board on which the IC is mounted.
(Note) Values are actual measurements and are not guaranteed.
SSOP-A32
1.5
1.0
0.5
0.0
0
25
50
75
100
125
150
0.95W
θja = 131.6°C/W
85
Reference data
Ambient Temperature : Ta (°C)
Power Dissipation : Pd (W)
measurement Condition : ROHM Standard board
board Size : 70 x 70 x 1.6(mm3)
material : A FR4 grass epoxy board
(3% or less of copper foil area)
BD37541FS
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TSZ02201-0C2C0E100560-1-2
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TSZ22111・15・001
16.Dec.2015 Rev.001
I/O Equivalent Circuits
Terminal
No.
Terminal
Name
Terminal
Voltage
Equivalent Circuit
Terminal Description
1
2
3
4
5
6
A1
A2
B1
B2
C1
C2
4.25
A terminal for signal input.
The input impedance is 100kΩ (typ).
7
8
9
10
11
12
13
DP1
DN
DP2
EP1
EN1
EN2
EP2
4.25
Input terminal available to
Single/Differential mode.
The input impedance is 250kΩ (typ).
15
18
LDA1
LDA2
4.25
The loudness characteristic setting
terminal.
16
17
LDB1
LDB2
4.25
The loudness characteristic setting
terminal.
19
MUTE
－
A terminal for external compulsory
mute. If terminal voltage is High level, the
mute is OFF. And if the terminal voltage is
Low level, the mute is on.
Values in the pin explanation and input/output equivalent circuit are reference values only and are not guaranteed.
VCC
GND
1.65V
GND
VCC
250KΩ
1.65V
0.58×VCC
GND
VCC
100KΩ
GND
Vcc
250ｋΩ
VCC
GND
250KΩ
V
CC
GND
VCC
GND
BD37541FS
26/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
I/O Equivalent Circuits – continued
Terminal
No.
Terminal
Name
Terminal
Voltage
Equivalent Circuit
Terminal Description
22
23
24
25
26
27
OUTS2
OUTS1
OUTR2
OUTR1
OUTF2
OUTF1
4.25
A terminal for fader and Subwoofer output.
28
VCC
8.5
Power supply terminal.
29
SCL
－
A terminal for clock input of I2C BUS
communication.
30
SDA
－
A terminal for data input of I2C BUS
communication.
31
GND
0
Ground terminal.
32
FIL
4.25
1/2 VCC terminal.
Voltage for reference bias of analog signal
system. The simple precharge circuit and
simple discharge circuit for an external
capacitor are built in.
14
MIN
4.25
A terminal for signal input.
The input impedance is 27kΩ (Typ).
21
TEST
-
TEST terminal
Values in the pin explanation and input/output equivalent circuit are reference values only and are not guaranteed.
V
CC
GND
50k
50k
VCC
GND
1.65V
VCC
GND
1.65V
VCC
GND
VCC
GND
27K
Ω
BD37541FS
27/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
BD37541FS
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TSZ02201-0C2C0E100560-1-2
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TSZ22111・15・001
16.Dec.2015 Rev.001
Operational Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 25. Example of monolithic IC structure
13. About Signal Input
(a) About Input Coupling Capacitor Constant Value
The constant value of input coupling capacitor C(F) is decided with respect to the input impedance RIN(Ω) at
the input signal terminal of the IC. The first HPF characteristic of RC is composed.
(b) About the Input Selector SHORT
SHORT mode is the command which makes switch SSH =ON of input selector part so that the input impedance
RIN of all terminals becomes small. Switch SSH is OFF when SHORT command is not selected.
The constant time brought about by the small resistance inside and the capacitor outside the LSI becomes
small when this command is used. The charge time of the capacitor becomes short. Since SHORT mode turns
ON the switch of SSH and makes it low impedance, please use it at no signal condition.
N N
P+PN N
P+
P Substrate
GND
NP+N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
EParasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)Resistor
N Region
close-by
Parasitic
Elements
2
IN
2
IN
fCR21 fCR2
fA
C〔F〕
RIN
〔Ω〕
INPUT
ＳＳＨ
0
A(f)
G〔dB〕
f〔Hz〕
BD37541FS
29/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Operational Notes – continued
14. About Mute Terminal (Pin 19) when Power Supply is OFF
There should be no applied voltage across the Mute terminal (Pin 19) when power-supply is OFF.
If in case voltage is supplied to mute terminal, please insert a series resistor (about 2.2kΩ) to Mute terminal.
(Please refer to Application Circuit Diagram.)
15. About TEST Pin
TEST Pin should be left as OPEN.
Pin 21 is TEST Pin.
16. About MIX
About Specification of Fader -∞ at MIX ON.
Mix_signal is added to Main_signal after Fader_Gain(+15dB to -79dB) like the figure. When Fader is set at -∞,
the signal after a MIX signal is added is done with MUTE because the -∞ circuit of Fader is in the step after
the addition circuit.
+15dB to -79dB
+7dB to -79dB
Figure 26. About Front Fader and MIX
BD37541FS
30/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Operational Notes – continued
17. About the External Parts Setting of Loudness Circuit
This IC is equipped with a Loudness circuit.
The Loudness gain is fixed inside the IC but its frequency characteristic can be changed freely by adjusting the
external part filter. The circuit composition of the Loudness part is shown below. Incidentally, when not using the
Loudness circuit, please short the pins between LDA1(Pin 15) and LDB1(Pin 16), and between LDA2(Pin 18) and
LDB2(Pin 17), so as to avoid the inner amplifier inputs to become floating.
Figure 27. About the External Parts Setting of Loudness Circuit
The Loudness frequency characteristics are decided according to Figure 27. G_LOUD can be made 20dB when
external parts used are the same with Figure 27 (the recommended value). G_LOUD is the amount of effect of
Loudness when Loudness Gain is set at 20dB (P.20).
When Loudness frequency characteristics are changed, each parameter (Gain, Frequency) shown in Figure 27 can
be decided using the following approximate equation below.
(Note) Design value more than one digit bigger than to get effect on Loudness.
Loudness cut-off frequency
Loudness Gain (The amount of effect of Loudness)
Loudness
15
16
17
18
LDB1
LDA1
LDA2
LDB2
4.7k
4.7k
1000p
0.047μ
56k
R2
R1
C2
C1
R3
4.7k
4.7k
1000p
56k
0.047μ
R2
R1
C2
C1
R3
Hz
RRC2 1
fc2
Hz
RRC2 1
fc1
321
312
π
π
dBG
dBG
_HICUT
_LOUD
321
3
31
3
//
log20
log20
RRR R
RR R
BD37541FS
31/33
TSZ02201-0C2C0E100560-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
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TSZ22111・15・001
16.Dec.2015 Rev.001
Ordering Information
B
D
3
7
5
4
1
F
S
-
E 2
Part Number
Package
FS: SSOP-A32
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-A32(TOP VIEW)
BD37541FS
Part Number Marking
LOT Number
1PIN MARK
Datasheet
Datasheet
Notice-PGA-E Rev.00
2
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uip ments (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation de pending on ambient temperatur e. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or lia ble for failure induced under deviant conditio n from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.00
2
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for an y damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperatur e / humidity control).
Precaution for Storage / Transportati on
1. Product performance and sol dered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds thos e recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage c ondition, solderabil ity of products out of recommended storage time perio d
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified tim e after opening a humidity barrier bag. Baking is required before using Pr oducts of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using an authorized industry waste compan y.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
