DESCRIPTION
Document No. 480 7180-001.B00 04/21/15 Page 1
SPECIFICATIONS
*Power will vary depending on the SDRAM used.
HX424C12PB2K4/16
16GB (4GB 512M x 64-Bit x 4 pcs.)
DDR4-2400 CL12 288-Pin DIMM
Continued >>
kingston.com/hyperx
FEATURES
HyperX HX424C12PB2K4/16 is a kit of four 512M x 64-bit
(4GB) DDR4-2400 CL12 SDRAM (Synchronous DRAM) 1Rx8,
memory module, based on eight 512M x 8-bit FBGA
components per module. Each module kit supports Intel®
Extreme Memory Profiles (Intel® XMP) 2.0 . Total kit
capacity is 16GB. Each module has been tested to run at
DDR4-2400 at a low latency timing of 12-13-13 at 1.35V. The
SPDs are programmed to JEDEC standard latency
DDR4-2133 timing of 15-15-15 at 1.2V. Each 288-pin
DIMM uses gold contact fingers. The JEDEC standard
electrical and mechanical specifications are as follows:
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command T ime (tRFCmin)
Row Active T ime (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
15 cycles
46.5ns(min.)
260ns(min.)
33ns(min.)
TBD W*
94 V - 0
0o C to +85o C
-55o C to +100o C
XMP TIMING PARAMETERS
•JEDEC: DDR4-2133 CL15-15-15 @1.2V
•XMP Profile #1: DDR4-2400 CL12-13-13 @1.35V
• Power Supply: VDD=1.2V Typical
• VDDQ = 1.2V Typical
• VPP - 2.5V Typical
• VDDSPD=2.2V to 3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• Data bus inversion (DBI) for data bus
• On-die VREFDQ generation and calibration
• Single-rank
• On-board I2 serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Fly-by topology
• Terminated control command and address bus
• Height 2.167” (55.05mm), w/heatsink
•XMP Profile #2: DDR4-2133 CL13-13-13 @1.2V
Document No. 4807180-001.B00 Page 2
continued HyperX
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM/HYPERX
kingston.com/hyperx
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the
published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than
the published speed. Overclocking or modifying your system timing may result in damage to computer components.
MODULE DIMENSIONS
3.35
Detail E
2.10
±
±
0.15
64.60
56.10
2.70
±
0.15
31.25
17.60
133.35
129.55
Detail A
14.60
3.00
28.90
Pin 35 Pin 47
Pin 1
22.95
Pin 105 Pin 117
Detail B Detail D Detail C
8.00
11.00
MODULE WITH HEAT SPREADER
8.12 mm
133.35 mm
55.05 mm
