FAR-F6KA-2G1400-D4DW-Z - TAIYO YUDEN

Notice for TAIYO YUDEN products　

Please read this notice before using the TAIYO YUDEN products.

REMINDERS

■ Product information in this catalog is as of October 2015. All of the contents speciﬁed herein are subject to change

without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-

fore practical application or usage of the Products.

Please note that TAIYO YUDEN CO., LTD. shall not be responsible for any defects in products or equipment incor-

porating such products, which are caused under the conditions other than those speciﬁed in this catalog or indi-

vidual speciﬁcation.

■ Please contact TAIYO YUDEN CO., LTD. for further details of product speciﬁcations as the individual speciﬁcation

is available.

■ Please conduct validation and veriﬁcation of products in actual condition of mounting and operating environment

before commercial shipment of the equipment.

■ All electronic components or functional modules listed in this catalog are developed, designed and intended for

use in general electronics equipment.(for AV, office automation, household, office supply, information service,

telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any

equipment in the ﬁeld such as transportation,( automotive control, train control, ship control), transportation signal,

disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have

direct inﬂuence to harm or injure a human body, please contact TAIYO YUDEN CO., LTD. for more detail in ad-

vance.

Do not incorporate the products into any equipment in ﬁelds such as aerospace, aviation, nuclear control, subma-

rine system, military, etc. where higher safety and reliability are especially required.

In addition, even electronic components or functional modules that are used for the general electronic equipment,

if the equipment or the electric circuit require high safety or reliability function or performances, a sufﬁcient reliabil-

ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to

install a protective circuit is strongly recommended at customer's design stage.

■ The contents of this catalog are applicable to the products which are purchased from our sales ofﬁces or distribu-

tors (so called TAIYO YUDENs ofﬁcial sales channel).

It is only applicable to the products purchased from any of TAIYO YUDEN s ofﬁcial sales channel.

■ Please note that TAIYO YUDEN CO., LTD. shall have no responsibility for any controversies or disputes that may

occur in connection with a third party's intellectual property rights and other related rights arising from your usage

of products in this catalog. TAIYO YUDEN CO., LTD. grants no license for such rights.

■ Caution for export

Certain items in this catalog may require speciﬁc procedures for export according to Foreign Exchange and For-

eign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations.

Should you have any question or inquiry on this matter, please contact our sales staff.

sawfilter_e-E04R01

SAW/FBAR DEVICES for MOBILE COMMUNICATIONS

REFLOW

■PARTS NUMBER

(A) Previous Rule (applied products registered on March 31, 2010 or before.)

F A R - D 6 N F - 1 G 9 6 0 0 - P 1 B Z - Z

① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ⑫

①Family

②Common sign

③Series name

Code Product Frequency Range［MHｚ］

D5 Duplexer 700 - 1000

D6 Duplexer 1000 - 5000

J5 Dual Duplexers 700 - 1000

F5 Device 700 - 1000

F6 Device 1000 - 5000

G5 Dual Devices 700 - 1000

G6 Dual Devices 1000 - 5000

④Package code

⑤Product code

⑥Common sign

⑦Frequency

⑧Common sign

⑨Internal code

⑩Internal code

⑪Custom code

⑫Packaging

(B) New Rule (applied to products registered on April 1, 2010 or later.)

D 6 N F 1 G 9 6 0 0 P 1 B Z - Z

① ② ③ ④ ⑤ ⑥ ⑦ ⑧

①Series name

Code Product Frequency Range［MHｚ］

D5 Duplexer 700 - 1000

D6 Duplexer 1000 - 5000

J5 Dual Duplexers 700 - 1000

F5 Device 700 - 1000

F6 Device 1000 - 5000

G5 Dual Devices 700 - 1000

G6 Dual Devices 1000 - 5000

*For further details, please contact to TAIYO YUDEN CO., LTD.

②Package code

③Product code

④Frequency

⑤Internal code

⑥Internal code

⑦Custom code

⑧Packaging

■EXTERNAL DIMENSIONS

2.5×2.0×0.6 (9pin) 2.0×1.6×0.5 1.4×1.0×0.5

1.1×0.9×0.5 1.8×1.4×0.5 1.5×1.1×0.5

HIGH FREQUENCY PRODUCTS

▶Thiscatalogcontainsthetypicalspecicationonlyduetothelimitationofspace.Whenyouconsiderthepurchaseofourproducts,pleasecheckourspecication.

 Fordetailsofeachproduct(characteristicsgraph,reliabilityinformation,precautionsforuse,andsoon),seeourWebsite(http://www.ty-top.com/).

SAW/FBAR DEVICES for MOBILE COMMUNICATIONS

REFLOW

151

■PARTS NUMBER

●Duplexers

System Part number Package Size［mm］ Insertion Loss［dB］ Isolation［dB］ Remarks

W-CDMA Band 1 D6PE2G140P3AW 2.0×1.6×0.5 1.5/1.6 59/47 9 Pin, B Type Rx : Bal.100ohm

D6DA2G140K2A4 1.8×1.4×0.5 1.8/1.8 56/51 8 Pin, B Type Rx : Bal.100ohm

D6RB2G140E1AJ 1.8×1.4×0.5 1.7/1.8 57/48 8 Pin, B Type Rx : Bal.100ohm

D6RB2G140E1AL 1.8×1.4×0.44 1.7/1.8 57/51 8 Pin, B Type Rx : Bal.100ohm

PCS/W-CDMA Band 2 D6PF1G960M3B6 2.0×1.6×0.57 2.2/2.7 55/52 9 Pin, B Type

D6PF1G960M3B9 2.0×1.6×0.57 2.2/2.7 57/52 9 Pin, B Type

D6PE1G960P3BY 2.0×1.6×0.57 2.0/3.1 57/53 9 Pin, B Type Rx : Bal.100ohm

D6PE1G960P3BP 2.0×1.6×0.57 2.3/3.0 56/52 9 Pin, B Type Rx : Bal.100ohm

D6RB1G960E1HB 1.8×1.4×0.6 2.1/2.9 56/55 8 Pin, B Type Rx : Bal.100ohm

W-CDMA Band 4 D6DA2G132K2D4 1.8×1.4×0.5 1.5/1.7 57/55 8 Pin B Type

D6PE2G132P3DWB 2.0×1.6×0.5 1.8/1.8 55/50 9 Pin, B Type Rx : Bal.100ohm

D6RB2G132E1DF 1.8×1.4×0.5 1.6/1.8 62/54 8 Pin B Type Rx : Bal.100ohm

CDMA/W-CDMA Band 5 FAR-D5PF-881M50-M3E7 2.0×1.6×0.5 1.5/1.8 58/51 9 Pin, A Type

FAR-D5PF-881M50-M3E9 2.0×1.6×0.5 1.5/1.8 58/51 9 Pin, B Type

FAR-D5PE-881M50-P3EZ 2.0×1.6×0.5 1.4/1.7 59/52 9 Pin, B Type Rx : Bal.100ohm

FAR-D5PE-881M50-P3EY 2.0×1.6×0.5 1.4/1.7 59/52 9 Pin, A Type Rx : Bal.100ohm

D5DA881M5K2E4 1.8×1.4×0.5 1.4/1.7 58/59 8 Pin, B Type

D5RB881M5E1BH 1.8×1.4×0.47 1.4/1.7 58/52 8 Pin, B Type Rx : Bal.100ohm

LTE Band 7 D6HL2G655DL06 2.0×1.6×0.54 2.1/2.3 53/57 9 Pin, B Type FBAR

D6HN2G655BN54 2.0×1.6×0.54 1.8/2.6 55/42 9 Pin, B Type Bal.100ohm, FBAR WLAN coexistence Ver.

W-CDMA Band 8 D5PF942M5M3G6 2.0×1.6×0.5 2.1/2.1 57/55 9 Pin, B Type for LTE

D5PF942M5M3G9 2.0×1.6×0.5 1.9/2.2 60/52 9 Pin, B Type

D5DA942M5K2G6 1.8×1.4×0.5 1.7/1.8 58/59 8 Pin, B Type

D5PE942M5P3GT 2.0×1.6×0.5 1.7/2.2 58/54 9 Pin, B Type Rx : Bal.100ohm

D5RB942M5E1CF 1.8×1.4×0.5 1.5/1.9 56/51 8 Pin, B Type Rx : Bal.100ohm

LTE Band 12 D5DA737M5K2H2 1.8×1.4×0.5 1.65/1.65 63/58 8 Pin, B Type

LTE Band 13 D5PE782M0M3P9 2.0×1.6×0.5 1.6/2.0 53/64 9 Pin, B Type

D5DA782M0K2J6 1.8×1.4×0.5 1.65/1.65 63/58 8 Pin, B Type

LTE Band 13+17 Triplexer J5NA782M0P1H6 2.5×2.0×0.6 1.6/1.9 60/53 9 Pin, B Type

LTE Band 17 D5PF740M0M3R9 2.0×1.6×0.5 1.6/1.8 50/50 9 Pin, B Type

D5PE740M0P3NZ 2.0×1.6×0.5 1.9/2.0 63/60 9 Pin, B Type Rx : Bal.100ohm

LTE Band 21 D6PE1G503P3KW 2.0×1.6×0.5 1.6/2.0 55/56 9 Pin, B Type Rx : Bal.100ohm

LTE Band 25 D6HL1G962DL39 2.0×1.6×0.57 2.4/2.9 56/56 9 Pin, B Type FBAR

LTE Band 26 D5PF876M5M3U9 2.0×1.6×0.5 2.0/1.9 50/50 9 Pin, B Type

D5PE876M5P3UZ 2.0×1.6×0.5 2.2/2.6 60/49 9 Pin, B Type Rx : Bal.100ohm

LTE Band 28 D5PF773M0M3Y6 2.0×1.6×0.5 1.8/2.3 60/53 Block A 9Pin, B Type

D5PF788M0M3Y9 2.0×1.6×0.5 1.8/2.4 60/54 Block B 9Pin, B Type

CDMA BC0+BC10 D5PE878M0P3UT 2.0×1.6×0.5 1.9/2.2 59/51 9 Pin, B Type Rx : Bal.100ohm

●CDMA/GSM850/Band 5

System Part number Package Size［mm］ Insertion Loss［dB］ Attenuation［dB］ Remarks

CDMA Tx FAR-F5KB-836M50-B4ER 1.4×1.0×0.5 1.7 44 100ohm input

FAR-F5KB-836M50-B4EG 1.4×1.0×0.5 1.6 42 200ohm input

F5QA836M5M2AR 1.1×0.9×0.5 1.9 45 High Att.

CDMA/GSM850 Tx FAR-F5KA-836M50-D4DF 1.4×1.0×0.5 1.9 44 High Att.

CDMA/W-CDMA Band 5 Rx FAR-F5KB-881M50-B4ED 1.4×1.0×0.5 1.5 61 100ohm output

FAR-F5KY-881M50-B4UZ 1.4×1.0×0.5 1.5 61 100ohm, High Att.

FAR-F5KB-881M50-B4EJ 1.4×1.0×0.5 1.4 64 200ohm output

FAR-F5QB-881M50-P2BG 1.1×0.9×0.5 1.5 60 100ohm output

F5QG881M5P2KG 1.1×0.9×0.5 1.5 56 100ohm, High Att., Low Loss

GSM850/CDMA Rx FAR-F5KA-881M50-D4DB 1.4×1.0×0.5 1.7 56 High Att.

FAR-F5QA-881M50-M2AF 1.1×0.9×0.5 1.6 46 -

F5QA881M5M2AU 1.1×0.9×0.5 1.3 51 Low Loss/high Att.

GSM850 Rx FAR-F5KB-881M50-B4EA 1.4×1.0×0.5 1.7 53 150ohm output

FAR-F5QB-881M50-P2BA 1.1×0.9×0.5 1.3 63 150ohm output

●CDMA2000 BC0+BC10

System Part number Package Size［mm］ Insertion Loss［dB］ Attenuation［dB］ Remarks

CDMA2000 BC0+10 Tx F5KA833M0D4DU 1.4×1.0×0.5 2.3 43 High Att.

F5KA833M0D4MG 1.4×1.0×0.5 1.4 20 Low IL

CDMA2000 BC0+10 Rx F5KY878M0B4ND 1.4×1.0×0.5 2.1 53 100ohm output

●GSM/EGSM/Band 8

System Part number Package Size［mm］ Insertion Loss［dB］ Attenuation［dB］ Remarks

EGSM Tx FAR-F5KA-897M50-D4DC 1.4×1.0×0.5 2.2 16 High Att.

FAR-F5KA-897M50-D4VW 1.4×1.0×0.5 2.6 38 High Att.

F5QA897M5M2AC 1.1×0.9×0.5 2.3 18 -

EGSM Rx FAR-F5KA-942M50-D4DD 1.4×1.0×0.5 2.0 34 High Att.

FAR-F5KB-942M50-B4EB 1.4×1.0×0.5 1.6 26 150ohm output

FAR-F5KB-942M50-B4ES 1.4×1.0×0.5 2.4 29 100ohm output

FAR-F5QB-942M50-P2BB 1.1×0.9×0.5 1.6 28 150ohm output

W-CDMA/LTE Band 8 F5KA942M5D4MYB 1.4×1.0×0.5 1.9 53 High Att.

FAR-F5KY-942M50-B4UW 1.4×1.0×0.5 2.0 57 100ohm, High Att.

F5QG942M5P2KB 1.1×0.9×0.5 2.2 56 100ohm, High Att.

F5QG942M5P2KF 1.1×0.9×0.5 2.2 60 100ohm output for LTE

sawfilter_e-E04R01

HIGH FREQUENCY PRODUCTS

152

■PARTS NUMBER

●DCS/Band 3

System Part number Package Size［mm］ Insertion Loss［dB］ Attenuation［dB］ Remarks

DCS Tx FAR-F6KA-1G7475-D4CY 1.4×1.0×0.5 2.5 30

F6QA1G747M2QS 1.1×0.9×0.5 2.1 22

DCS Rx FAR-F6KA-1G8425-D4CK 1.4×1.0×0.5 2.1 20

FAR-F6KB-1G8425-B4GA 1.4×1.0×0.5 1.5 14 150ohm output

F6QB1G842P2BM 1.1×0.9×0.5 1.8 15 100ohm

F6QB1G842P2BF 1.1×0.9×0.5 1.6 17 150ohm

W-CDMA/LTE Band 3 F6QA1G842M2AN 1.1×0.9×0.5 2.0 38 Unbal.

F6KY1G842B4UM 1.4×1.0×0.5 3.0 50 100ohm, High Att.

F6QG1G842P2KD 1.1×0.9×0.5 3.2 45 100ohm output

●PCS/GSM1900/Band 2

System Part number Package Size［mm］ Insertion Loss［dB］ Attenuation［dB］ Remarks

US-PCS Tx FAR-F6KA-1G8800-L4AF 1.4×1.0×0.5 2.4 35 High Att.

FAR-F6KB-1G8800-B4GS 1.4×1.0×0.5 2.3 28 100ohm input

F6QA1G880M2AQ 1.1×0.9×0.5 1.7 20

US-PCS Rx FAR-F6KA-1G9600-D4MT 1.4×1.0×0.5 3.4 43 High Att.

F6QA1G960M2AP 1.1×0.9×0.5 2.8 39 High Att.

FAR-F6KB-1G9600-B4GP 1.4×1.0×0.5 2.1 23 100ohm output

FAR-F6KY-1G9600-B4UU 1.4×1.0×0.5 2.9 49 100ohm, High Att.

F6KY1G960B4NF 1.4×1.0×0.5 2.8 50 100ohm output

F6QG1G960P2KT 1.1×0.9×0.5 2.8 44 100ohm output

GSM1900/US-PCS Rx FAR-F6KA-1G9600-D4CR 1.4×1.0×0.5 2.0 18

GSM1900 Rx FAR-F6KB-1G9600-B4GB 1.4×1.0×0.5 1.6 18 150ohm output

F6QB1G960P2BK 1.1×0.9×0.5 1.5 15 150ohm output

●GSM Dual

System Part number Package Size［mm］ Insertion Loss［dB］ Attenuation［dB］ Remarks

GSM850+EGSM Rx FAR-G5QC-942M50-N2FB 1.5×1.1×0.5 1.5/1.8 50/29 GSM850 150ohm output EGSM 150ohm output

GSM850+EGSM Rx（Common Input） FAR-G5KT-942M50-Y4RW 1.8×1.4×0.5 1.9/2.2 50/25 GSM850 150ohm output EGSM 150ohm output

GSM850+EGSM Rx （Common Output） FAR-G5KW-942M50-Y4YD 1.8×1.4×0.5 2.5/1.8 32/38 EGSM 150ohm output GSM850 150ohm output

EGSM+GSM850 Rx FAR-G5KC-942M50-Y4YW 1.8×1.4×0.5 1.8/1.4 31/54 EGSM 150ohm output GSM850 150ohm output

FAR-G5QC-942M50-N2CD 1.5×1.1×0.5 1.7/1.4 29/51 EGSM 150ohm output GSM850 150ohm output

EGSM+GSM850 Rx（Common Input） FAR-G5KT-942M50-Y4RZ 1.8×1.4×0.5 2.2/1.9 25/52 EGSM 150ohm output GSM850 150ohm output

FAR-G5QD-942M50-N2DB 1.5×1.1×0.5 2.5/2.0 25/55 EGSM 150ohm output GSM850 150ohm output

DCS+GSM1900 Rx FAR-G6QC-1G9600-N2FA 1.5×1.1×0.5 1.9/1.7 17/13 DCS 150ohm output GSM1900 150ohm output

G6QJ1G960M2MB 1.5×1.1×0.5 1.9/1.9 19/19 Rx Dual Unbal

DCS+GSM1900 Rx（Common Input） FAR-G6KT-1G9600-Y4RU 1.8×1.4×0.5 1.8/2.0 18/13 DCS 150ohm output GSM1900 150ohm output

DCS+GSM1900 Rx（Common Input） G6QD1G960N2DY 1.5×1.1×0.5 1.8/1.9 18/14 1 IN 4 OUT 150ohm output

GSM1900+DCS Rx FAR-G6KC-1G9600-Y4YY 1.8×1.4×0.5 1.9/1.8 14/16 GSM1900 150ohm output DCS 150ohm output

G6QC1G960N2CH 1.5×1.1×0.5 1.6/1.6 13/15 GSM1900 150ohm output DCS 150ohm output

GSM1900+DCS Rx（Common Input） G6QN1G960M2RE 1.5×1.1×0.5 2.0/2.3 22/25 Unbal 1in2out

FAR-G6KT-1G9600-Y4RY 1.8×1.4×0.5 1.9/1.8 13/18 GSM1900 150ohm output DCS 150ohm output

GSM1900+DCS Rx（Common Output） FAR-G6KW-1G9600-Y4YC 1.8×1.4×0.5 2.2/3.1 13/15 170ohm output for IMC

G6QE1G960N2EC 1.5×1.1×0.5 2.5/2.5 18/13 GSM1900 150ohm output DCS 150ohm output

G6QE1G960N2EE 1.5×1.1×0.5 2.2/2.2 31/14 GSM1900/DCS 150ohm output Low Loss

GSM1900+850 Rx G6QF1G960N2GA 1.5×1.1×0.5 1.6/1.4 14/54 GSM1900 150ohm output GSM850 150ohm output

●GPS

System Part number Package Size［mm］ Insertion Loss［dB］ Attenuation［dB］ Remarks

GPS FAR-F6KA-1G5754-L4AJ 1.4×1.0×0.5 0.9 - Low loss, High Att.

F6QA1G575H2JF 1.1×0.9×0.5 0.96 - Low loss, High Att.

FAR-F6KB-1G5754-B4GE 1.4×1.0×0.5 1.1 - 100ohm, Low loss

FAR-F6KB-1G5754-B4GU 1.4×1.0×0.5 1.2 - 100ohm, High Att.

GPS/GNSS FAR-F6KA-1G5859-D4MS 1.4×1.0×0.5 1.0/1.2 - -

F6QA1G585M2AT 1.1×0.9×0.5 1.1/1.4 - -

FAR-F6KB-1G5859-B4HR 1.4×1.0×0.5 1.1/1.4 - 100ohm output

F6QB1G585P2BQ 1.1×0.9×0.5 1.5/1.7 - 100ohm output

GPS+GLONASS+Galileo+Compass F6KA1G581D4JR 1.4×1.0×0.5 1.6 - -

F6QA1G581M2QZ 1.1×0.9×0.5 1.1/1.4 - -

F6QA1G582H2JM 1.1×0.9×0.5 1.2/1.8 - Ladder High Att.

F6BG1G582R6TT 1.1×0.9×0.44 1.7 - 100ohm output

sawfilter_e-E04R01

HIGH FREQUENCY PRODUCTS

153

■PARTS NUMBER

●W-CDMA

System Part number Package Size［mm］ Insertion Loss［dB］ Attenuation［dB］ Remarks

W-CDMA Band 1 Tx FAR-F6KA-1G9500-D4DG 1.4×1.0×0.5 1.6 38 Low loss, High Att.

FAR-F6KB-1G9500-B4GJ 1.4×1.0×0.5 2.1 34 100ohm output

F6QA1G950M2AA 1.1×0.9×0.5 1.8 38 Low loss, High Att.

W-CDMA Band 1/4 Rx FAR-F6KA-2G1400-D4CG 1.4×1.0×0.5 1.9 39 Unbal.

FAR-F6KB-2G1400-B4GC 1.4×1.0×0.5 1.7 39 100ohm output

FAR-F6KA-2G1400-D4DW 1.4×1.0×0.5 1.9 48 High Att.

FAR-F6KY-2G1400-B4UY 1.4×1.0×0.5 1.8 64 100ohm, High Att.

F6QA2G140M2AM 1.1×0.9×0.5 1.9 46 Unbal.

F6QG2G140P2KA 1.1×0.9×0.5 1.7 55 100ohm, High Att.

W-CDMA Band 1+2 Rx G6QL2G140M2PA 1.5×1.1×0.5 1.9/3.0 48/41 Rx Div Unbal.

W-CDMA Band 2+1 Rx G6QH2G140N2LP 1.5×1.1×0.5 3.2/2.3 53/54 2 (1.9G)100ohm out 1 (2G)100ohm out

W-CDMA Band 4 Tx FAR-F6KA-1G7400-D4DE 1.4×1.0×0.5 1.5 44

W-CDMA Band 5+8 Rx G5QH942M5N2LN 1.5×1.1×0.5 1.6/20 56/50 100ohm output

W-CDMA Band 8+5 Rx（Common Output） G5QT942M5N2VA 1.5×1.1×0.5 2.3/2.0 48/48 100ohm output

W-CDMA Band 7 Tx F6KA2G535L4AM 1.4×1.0×0.5 1.6 30 Unbal.

W-CDMA/LTE Band 7 Rx FAR-F6KY-2G6550-B4UN 1.4×1.0×0.5 2.8 54 100ohm. High Att.

F6QG2G655P2KE 1.1×0.9×0.5 2.5 52 100ohm. High Att.

W-CDMA Band 9 Tx FAR-F6KA-1G7675-D4CT 1.4×1.0×0.5 1.8 31 Unbal.

W-CDMA Band 9 Rx FAR-F6KB-1G8625-B4GT 1.4×1.0×0.5 2.1 40 100ohm output

LTE Band 12 Tx F5KA707M5D4JW 1.4×1.0×0.5 1.6 23 Unbal.

LTE Band 12 Rx F5KY737M0B4NN 1.4×1.0×0.5 1.4 57 100ohm output

LTE Band 13 Tx FAR-F5KA-782M00-D4VP 1.4×1.0×0.5 1.5 55 Unbal.

F5QA782M0M2AZ 1.1×0.9×0.5 1.5 56 Unbal.

LTE Band 13 Rx FAR-F5KY-751M00-B4UQ 1.4×1.0×0.5 1.6 50 100ohm output

F5QA751M0M2QM 1.1×0.9×0.5 1.9 50 Unbal.

LTE Band 17 Tx FAR-F5KA-710M00-D4VQ 1.4×1.0×0.5 1.2 32 Unbal.

F5QA710M0M2AY 1.1×0.9×0.5 1.3 33 Unbal.

LTE Band 17 Rx FAR-F5KY-740M00-B4UR 1.4×1.0×0.5 1.4 60 100ohm output

F5QG740M0P2KH 1.1×0.9×0.5 1.4 65 100ohm output

LTE Band 18 Tx F5KA822M5D4VR 1.1×0.9×0.5 1.6 40 Unbal.

LTE Band 18+5 (BC0) Tx F5KA832M0D4JS 1.4×1.0×0.5 1.5 19 Unbal.

LTE Band 20 Tx F5KA847M0D4ML 1.4×1.0×0.5 1.7 52 Unbal.

LTE Band 20 Rx F5KY806M0B4NE 1.4×1.0×0.5 2.5 45 100ohm output

F5QA806M0M2QE 1.1×0.9×0.5 2.7 41 Unbal.

LTE Band 21 Rx F6KY1G503B4NS 1.4×1.0×0.5 1.4 47 100ohm output Low loss

F6QA1G503M2QF 1.1×0.9×0.5 2.0 52 Unbal.

LTE Band 25 Tx F6QA1G882M2AS 1.1×0.9×0.5 1.8 23 Unbal.

LTE Band 26 Rx F5QG876M5P2KQ 1.1×0.9×0.5 2.2 59 100ohm output

LTE Band 28 Rx F5QA773M0M2QC 1.1×0.9×0.5 2.1 52 Block A

F5QA788M0M2QB 1.1×0.9×0.5 2.0 52 Block B

LTE Band 29 Rx F5BA722M5M6UW 1.1×0.9×0.44 1.6 38 Unbal.

TD LTE Bnad 38 Tx F6KA2G595A4VL 1.4×1.0×0.5 1.5 - Input Power　+29dBm

TD LTE Bnad 38 Rx F6QA2G595M2QK 1.1×0.9×0.5 1.9 -

F6KB2G595B4HS 1.4×1.0×0.5 2.6 - 150ohm output

F6QB2G595P2BS 1.1×0.9×0.5 2 - Balanced 100ohm

TD LTE Band 38+40（Common output） G6QE2G595N2EJ 1.5×1.1×0.5 2.9/2.8 - Balanced 100ohm

TD LTE Band 40 Tx F6HF2G350AF41 1.4×1.0×0.6 2.3 - Input Power +29dBm　FBAR

TD LTE Band 40 Rx F6QA2G350M2QA 1.1×0.9×0.5 2.2 -

F6KB2G350B4HT 1.4×1.0×0.5 2.7 - 150ohm output

F6KB2G350B4HTB 1.4×1.0×0.5 2.5 - Balanced 100ohm

Band 41 F6KA2G605A4LA 1.4×1.0×0.5 2.4 - Unbal High power design 2555-2655MHz BW100MHz

F6HP2G593AP20 2.0×1.6×0.6 2.9 - Unbal High power design 2496-2690MHz BW194MHz

●Other

System Part number Package Size［mm］ Insertion Loss［dB］ Attenuation［dB］ Remarks

ISM900（B.W.26MHz） FAR-F5QA-915M00-M2AK 1.1×0.9×0.5 1.8 -

TD-SCDMA/TD-LTE Band 34 FAR-F6KA-2G0175-D4DR 1.4×1.0×0.5 1.8 - High Att

TD-SCDMA/TD-LTE Band 39 FAR-F6KA-1G9000-D4DS 1.4×1.0×0.5 1.6 -

TD-SCDMA Band 34+39 G6QJ2G017M2MD 1.5×1.1×0.5 1.3/1.4 - 2 IN/2 OUT

G6QE2G017N2EU 1.5×1.1×0.5 1.8/1.8 - Balanced 100ohm

G6QN2G017M2RD 1.5×1.1×0.5 1.6/2.0 - 1 IN/2 OUT

G6QN2G017M2RF 1.5×1.1×0.5 1.5/1.8 - 1 IN/2 OUT　Good Shape Factor

TD-SCDMA Band 39+34（Common input） G6QD2G017N2DU 1.5×1.1×0.5 1.7/2.0 - Balanced 100ohm

TD-SCDMA Band 34+39（Common input） G6QD2G017N2DC 1.5×1.1×0.5 2.2/1.8 - Balanced 200ohm

Wireless LAN FAR-F6KA-2G4418-D4CU 1.4×1.0×0.5 2.6 - +10dBm

FAR-F6KA-2G4418-A4VA 1.4×1.0×0.5 3.0 - +23dBm

FAR-F6KA-2G4500-A4VD 1.4×1.0×0.5 1.9 - Low IL,+19dBm

F6KA2G436A4VE 1.4×1.0×0.5 2.5 - BW=72MHz,+24dBm

F6KA2G466A4VJ 1.4×1.0×0.5 2.8 - BW=68MHz,+24dBm

F6HF2G441AF46 1.4×1.0×0.6 1.6 - 2402.5-2481.5MHz Input Power +28dBm FBAR

sawfilter_e-E04R01

HIGH FREQUENCY PRODUCTS

154

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

emifilter_pack_e-E02R01

MULTILAYER EMI SUPPRESSION FILTERS

■PACKAGING

①Minimum Quantity

●Taped package

Type Thickness

mm（inch）

Standard Quantity [pcs]

Embossed tape

FK 2125（0805） 1.0（0.039） 3000

②Tape material

●Embossed Tape

Top tape

Base tape

Sprocket hole

Chip cavity

Chip filled

Chip

③Taping dimensions

●Embossed tape 8mm wide

Type Chip cavity Insertion pitch Tape thickness

A B F K T

FK 2125（0805） 1.5±0.2

（0.059±0.008）

2.3±0.2

（0.091±0.008）

4.0±0.1

（0.157±0.004）

2.0 max.

（0.079 max.）

0.3 max.

（0.012 max.）

Unit : mm（inch）

④Leader and Blank portion

Blank portion Chip cavity Blank portion Leader

160mm or more

(6.3inches or more)

Direction of tape feed

100mm or more

(3.94inches or more)

400mm or more

(15.7inches or more)

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

emifilter_pack_e-E02R01

⑤Reel size

R B

A B C D E R t W

φ178±2.0 φ50min. φ13.0±0.2 φ21.0±0.8 2.0±0.5 1.0 2.5max. 10±1.5

Unit：mm

⑥Top tape strength

The top tape requires a peel;-off force of 0.1～0.7N in the direction of the arrow as illustrated below.

0～15° Top tape

Base tape

Pull direction

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

sawfilter_reli_e-E02R01

Filter

■RELIABILITY DATA

1. Terminal stregth

Specified Value No damage to be found.

Test Methods and

Remarks

Bending Test.

according to IEC60068-2-21(JISC60068-2-21)

2. Mechanical shock

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks

Apply 14700m/s2 for 0.5ms 5 times for each of 6 directions.

according to IEC68-2-27(JISC60068-2-27).

3. Vibration

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks

With 1.5 mm of whole amplitude at 10 to 55 Hz of frequency, and 98m/s2 of acceleration at 55 to 500Hz, apply a

vibration for 2 hours for each of 3 directions, period is 15 minutes(10 to 500 to 10Hz)

4. Drop 1

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks Drop 3 times onto concrete floor from the height of 1.0m.

5. Drop 2

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks Drop with 150g weight 3 times in each 6 direction onto concrete floor from the height of 1.8m.

6. Temperature cycling

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks Temp. range －40 to ＋100℃. 500cycle.

７. Static humidity

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks ＋85℃, 90% to 95%RH, apply DC5V, 1000hours.

8. High temperature storage life

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks ＋100℃, 1000hours.

9. Low temperature storage life

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks －40℃, 1000hours.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

sawfilter_reli_e-E02R01

10. Solderbility 1

Specified Value More than 90% of area of terminals to be covered with the solder.

A change of the remarkable appearance do not have it.

Test Methods and

Remarks Lead-free Solder paste, Reflow；Peak temperature 245℃

11. Solderbility 2

Specified Value More than 90% of area of terminals to be covered with the solder.

A change of the remarkable appearance do not have it.

Test Methods and

Remarks Sn-Pb Solder paste, Reflow；Peak temperature 235℃

12. Solder heat resistance

Specified Value After testing, meet the specified characteristics at a room temperature.

A change of the remarkable appearance do not have it.

Test Methods and

Remarks

◆Recommended temperature profile of reflow soldering

Figure shows recommended temperature profile of reflow soldering in the case of lead-free solder alloy Sn3.0Ag0.5Cu.

Suitable condition for solder heating is differed depending on composition and manufacturing method.

Please contact to solder manufacturer for the details.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

sawfilter_reli_e-E02R01

Duplexer

■RELIABILITY DATA

1. Terminal stregth

Specified Value No damage to be found.

Test Methods and

Remarks

Bend width 4mm, hold for 5±1 sec.

according to IEC60068-2-21(JISC60068-2-21)

2. Mechanical shock

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks

Apply 14700m/s2 for 0.5ms 5 times for each of 6 directions.

according to IEC68-2-27(JISC60068-2-27).

3. Vibration

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks

With 1.5 mm of whole amplitude at 10 to 55 Hz of frequency, and 98m/s2 of acceleration at 55 to 500Hz, apply a

vibration for 2 hours for each of 3 directions, period is 15 minutes(10 to 500 to 10Hz)

4. Drop 1

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks Drop 3 times onto concrete floor from the height of 1.0m.

5. Drop 2

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks Drop with 150g weight 3 times in each 6 direction onto concrete floor from the height of 1.8m.

6. Temperature cycling

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks Temp. range －40 to ＋100℃. 500cycle.

７. Static humidity

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks ＋85℃, 90% to 95%RH, apply DC5V, 1000hours.

8. High temperature storage life

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks ＋100℃, 1000hours.

9. Low temperature storage life

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks －40℃, 1000hours.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

sawfilter_reli_e-E02R01

10. High Temperature Bias

Specified Value After testing, meet the specified characteristics at a room temperature.

Test Methods and

Remarks ＋50℃, ＋29dBm, 50000hours.

11. Solderbility 1

Specified Value More than 90% of area of terminals to be covered with the solder.

A change of the remarkable appearance do not have it.

Test Methods and

Remarks Lead-free Solder paste, Reflow；Peak temperature 245℃

12. Solderbility 2

Specified Value More than 90% of area of terminals to be covered with the solder.

A change of the remarkable appearance do not have it.

Test Methods and

Remarks Sn-Pb Solder paste, Reflow；Peak temperature 235℃

13. Solder heat resistance

Specified Value After testing, meet the specified characteristics at a room temperature.

A change of the remarkable appearance do not have it.

Test Methods and

Remarks

◆Recommended temperature profile of reflow soldering

Figure shows recommended temperature profile of reflow soldering in the case of lead-free solder alloy Sn3.0Ag0.5Cu.

Suitable condition for solder heating is differed depending on composition and manufacturing method.

Please contact to solder manufacturer for the details.