LC2MOS 4-/8-Channel
High Performance Analog Multiplexers
ADG408/ADG409
Rev. C
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FEATURES
44 V supply maximum ratings
VSS to VDD analog signal range
Low on resistance (100 Ω maximum)
Low power (ISUPPLY < 75 μA)
Fast switching
Break-before-make switching action
Plug-in replacement for DG408/DG409
APPLICATIONS
Audio and video routing
Automatic test equipment
Data acquisition systems
Battery-powered systems
Sample-and-hold systems
Communication systems
FUNCTIONAL BLOCK DIAGRAMS
ADG408
S1
S8
D
ADG409
S1A
S4B
DA
DB
S4A
S1B
1-OF-4
DECODER
1-OF-8
DECODER
A0 A1 ENA0 A1 A2 EN
00027-001
Figure 1.
GENERAL DESCRIPTION
The ADG408/ADG409 are monolithic CMOS analog multiplexers
comprising eight single channels and four differential channels,
respectively. The ADG408 switches one of eight inputs to a
common output as determined by the 3-bit binary address lines
A0, A1, and A2. The ADG409 switches one of four differential
inputs to a common differential output, as determined by the
2-bit binary address lines A0 and A1. An EN input on both devices
is used to enable or disable the device. When the device is disabled,
all channels are switched off.
The ADG408/ADG409 are designed on an enhanced LC2MOS
process that provides low power dissipation yet gives high
switching speed and low on resistance. Each channel conducts
equally well in both directions when on and has an input signal
range that extends to the supplies. In the off condition, signal
levels up to the supplies are blocked. All channels exhibit break-
before-make switching action, preventing momentary shorting
when switching channels. Inherent in the design is low
charge injection for minimum transients when switching the
digital inputs.
The ADG408/ADG409 are improved replacements for the
DG408/DG409 analog multiplexers.
PRODUCT HIGHLIGHTS
1. Extended Signal Range. The ADG408/ADG409 are
fabricated on an enhanced LC2MOS process, giving an
increased signal range that extends to the supply rails.
2. Low Power Dissipation.
3. Low RON.
4. Single-Supply Operation. For applications where the
analog signal is unipolar, the ADG408/ADG409 can be
operated from a single rail power supply. The parts are
fully specified with a single 12 V power supply and remain
functional with single supplies as low as 5 V.
ADG408/ADG409
Rev. C | Page 2 of 16
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagrams............................................................. 1
General Description......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Dual Supply ................................................................................... 3
Single Supply ................................................................................. 4
Absolute Maximum Ratings ............................................................6
ESD Caution...................................................................................6
Pin Configurations and Function Descriptions............................7
Typical Performance Characteristics ..............................................8
Test Circuits..................................................................................... 11
Terminology .................................................................................... 13
Outline Dimensions ....................................................................... 14
Ordering Guide .......................................................................... 16
REVISION HISTORY
10/06—Rev. B to Rev. C
Updated Format..................................................................Universal
Changes to Table 3............................................................................ 6
Inserted Table 4 and Table 5............................................................ 7
Updated Outline Dimensions....................................................... 14
Changes to Ordering Guide .......................................................... 15
3/03—Rev. A to Rev. B
Changes to Ordering Guide .............................................................4
Updated Outline Dimensions....................................................... 11
2/01—Revision 0: Initial Version
ADG408/ADG409
Rev. C | Page 3 of 16
SPECIFICATIONS
DUAL SUPPLY
VDD = 15 V, VSS = −15 V, GND = 0 V, unless otherwise noted.
Table 1.
B Version T Version
Parameter +25ºC
−40ºC to
+85ºC +25ºC
−55ºC to
+125ºC Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range VSS to VDD V
SS to VDD V
RON 40 40 Ω typ VD = ±10 V, IS = −10 mA
100 125 100 125 Ω max
∆RON 15 15 Ω max VD = +10 V, −10 V
LEAKAGE CURRENTS
Source Off Leakage IS (OFF) ±0.5 ±50 ±0.5 ±50 nA max VD = ±10 V, VS = 10 V; see
mFigure 19
Drain Off Leakage ID (OFF) VD = ±10 V; VS = 10 V; see mFigure 20
ADG408 ±1 ±100 ±1 ±100 nA max
ADG409 ±1 ±50 ±1 ±50 nA max
Channel On Leakage ID, IS (ON) VS = VD = ±10 V; see Figure 21
ADG408 ±1 ±100 ±1 ±100 nA max
ADG409 ±1 ±50 ±1 ±50 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.4 2.4 V min
Input Low Voltage, VINL 0.8 0.8 V max
Input Current
IINL or IINH ±10 ±10 μA max VIN = 0 or VDD
CIN, Digital Input Capacitance 8 8 pF typ f = 1 MHz
DYNAMIC CHARACTERISTICS1
tTRANSITION 120 120 ns typ RL = 300 Ω, CL = 35 pF;
250 250 ns max VS1 = ±10 V, VS8 = 10 V; see mFigure 22
tOPEN 10 10 10 10 ns min RL = 300 Ω, CL = 35 pF;
V
S = 5 V; see Figure 23
tON (EN) 85 125 85 125 ns typ RL = 300 Ω CL = 35 pF;
150 225 150 225 ns max VS = 5 V; see Figure 24
tOFF (EN) 65 65 ns typ RL = 300 Ω, CL = 35 pF;
150 150 ns max VS = 5 V; see Figure 24
Charge Injection 20 20 pC typ VS = 0 V, RS = 0 Ω, CL = 10 nF; see Figure 25
OFF Isolation −75 −75 dB typ RL = 1 kΩ, f = 100 kHz;
V
EN = 0 V; see Figure 26
Channel-to-Channel Crosstalk 85 85 dB typ RL = 1 kΩ, f = 100 kHz; see Figure 27
CS (OFF) 11 11 pF typ f = 1 MHz
CD (OFF) f = 1 MHz
ADG408 40 40 pF typ
ADG409 20 20 pF typ
CD, CS (ON) f = 1 MHz
ADG408 54 54 pF typ
ADG409 34 34 pF typ
ADG408/ADG409
Rev. C | Page 4 of 16
B Version T Version
Parameter +25ºC
−40ºC to
+85ºC +25ºC
−55ºC to
+125ºC Unit Test Conditions/Comments
POWER REQUIREMENTS
IDD 1 1 μA typ VIN = 0 V, VEN = 0 V
5 5 μA max
ISS 1 1 μA typ
5 5 μA max
IDD 100 100 μA typ VIN = 0 V, VEN = 2.4 V
200 500 200 500 μA max
1 Guaranteed by design, not subject to production test.
SINGLE SUPPLY
VDD = 12 V, VSS = 0 V, GND = 0 V, unless otherwise noted.
Table 2.
B Version T Version
Parameter +25ºC
−40ºC to
+85ºC +25°C
−55ºC to
+125ºC Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 to VDD 0 to VDD V
RON 90 90 Ω typ VD = 3 V, 10 V, IS = –1 mA
LEAKAGE CURRENTS
Source Off Leakage IS (OFF) ±0.5 ±50 ±0.5 ±50 nA max VD = 8 V/0 V, VS = 0 V/8 V; see Figure 19
Drain Off Leakage ID (OFF) VD = 8 V/0 V, VS = 0 V/8 V; see Figure 20
ADG408 ±1 ±100 ±1 ±100 nA max
ADG409 ±1 ±50 ±1 ±50 nA max
Channel On Leakage ID, IS (ON) VS = VD = 8 V/0 V; see Figure 21
ADG408 ±1 ±100 ±1 ±100 nA max
ADG409 ±1 ±50 ±1 ±50 nA max
DIGITAL INPUTS
Input High Voltage, VINH 2.4 2.4 V min
Input Low Voltage, VINL 0.8 0.8 V max
Input Current
IINL or IINH ±10 ±10 μA max VIN = 0 or VDD
CIN, Digital Input Capacitance 8 8 pF typ f = 1 MHz
DYNAMIC CHARACTERISTICS1
tTRANSITION 130 130 ns typ RL = 300 Ω, CL = 35 pF;
V
S1 = 8 V/0 V, VS8 = 0 V/8 V; see Figure 22
tOPEN
10 10 ns typ
RL = 300 Ω, CL = 35 pF;
V
S = 5 V; see Figure 23
tON (EN) 140 140 ns typ RL = 300 Ω CL = 35 pF;
V
S = 5 V; see Figure 24
tOFF (EN) 60 60 ns typ RL = 300 Ω, CL = 35 pF;
V
S = 5 V; see Figure 24
Charge Injection 5 5 pC typ VS = 0 V, RS = 0Ω, CL = 10 nF; see Figure 25
Off Isolation –75 –75 dB typ RL = 1 kΩ f = 100 kHz;
V
EN = 0 V; see Figure 26
ADG408/ADG409
Rev. C | Page 5 of 16
B Version T Version
Parameter +25ºC
−40ºC to
+85ºC +25°C
−55ºC to
+125ºC Unit Test Conditions/Comments
Channel-to-Channel Crosstalk 85 85 dB typ RL = 1 kΩ, f = 100 kHz; see Figure 27
CS (OFF) 11 11 pF typ f = 1 MHz
CD (OFF) f = 1 MHz
ADG408 40 40 pF typ
ADG409 20 20 pF typ
CD, CS (ON) f = 1 MHz
ADG408 54 54 pF typ
ADG409 34 34 pF typ
POWER REQUIREMENTS
IDD 1 1 μA typ VIN = 0 V, VEN = 0 V
5 5 μA max
IDD 100 100 μA typ VIN = 0 V, VEN = 2.4 V
200 500 200 500 μA max
1 Guaranteed by design, not subject to production test.
ADG408/ADG409
Rev. C | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
VDD to VSS 44 V
VDD to GND −0.3 V to +32 V
VSS to GND +0.3 V to −32 V
Analog, Digital Inputs VSS − 2 V to VDD + 2 V or 20 mA,
whichever occurs first
Continuous Current, S or D 20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle
Maximum)
40 mA
Operating Temperature Range
Industrial (B Version) −40° C to +85°C
Extended (T Version) −55° C to +125°C
Storage Temperature Range −65° C to +150°C
Junction Temperature 150°C
CERDIP Package, Power Dissipation 900 mW
θJA, Thermal Impedance 76°C/W
Lead Temperature, Soldering
(10 sec)
300°C
PDIP Package, Power Dissipation 470 mW
θJA, Thermal Impedance 117°C/W
Lead Temperature, Soldering
(10 sec)
260°C
TSSOP Package, Power Dissipation 450 mW
θJA, Thermal Impedance 155°C/W
θJC, Thermal Impedance 50°C/W
SOIC Package, Power Dissipation 600 mW
θJA, Thermal Impedance 77°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ADG408/ADG409
Rev. C | Page 7 of 16
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
A0
1
EN
2
V
SS 3
S1
4
A1
16
A2
15
GND
14
V
DD
13
S2
5
S5
12
S3
6
S6
11
S4
7
S7
10
D
8
S8
9
ADG408
TOP VIEW
(Not to Scale)
00027-002
Figure 2. ADG408 Pin Configuration
A0 1
EN 2
VSS 3
S1A 4
A116
GND15
VDD
14
S1B
13
S2A 5
S3A 6
S4A 7
S2B12
S3B11
S4B10
DA 8DB9
ADG409
TOP VIEW
(Not to Scale)
00027-003
Figure 3. ADG409 Pin Configuration
Table 4. ADG408 Pin Function Descriptions
Pin
No. Mnemonic Description
1 A0 Logic Control Input.
2 EN Active High Digital Input. When low, the
device is disabled and all switches are off.
When high, Ax logic inputs determine on
switches.
3 VSS Most Negative Power Supply Potential in
Dual Supplies. In single-supply applications,
it can be connected to ground.
4 S1 Source Terminal 1. Can be an input or
an output.
5 S2 Source Terminal 2. Can be an input or
an output.
6 S3 Source Terminal 3. Can be an input or
an output.
7 S4 Source Terminal 4. Can be an input or
an output.
8 D Drain Terminal. Can be an input or an
output.
9 S8 Source Terminal 8. Can be an input or
an output.
10 S7 Source Terminal 7. Can be an input or
an output.
11 S6 Source Terminal 6. Can be an input or
an output.
12 S5 Source Terminal 5. Can be an input or
an output.
13 VDD Most Positive Power Supply Potential.
14 GND Ground (0 V) Reference.
15 A2 Logic Control Input.
16 A1 Logic Control Input.
Table 5. ADG409 Pin Function Descriptions
Pin
No. Mnemonic Description
1 A0 Logic Control Input.
2 EN Active High Digital Input. When low, the
device is disabled and all switches are off.
When high, Ax logic inputs determine on
switches.
3 VSS Most Negative Power Supply Potential in
Dual Supplies. In single-supply applications,
it can be connected to ground.
4 S1A Source Terminal 1A. Can be an input or
an output.
5 S2A Source Terminal 2A. Can be an input or
an output.
6 S3A Source Terminal 3A. Can be an input or
an output.
7 S4A Source Terminal 4A. Can be an input or
an output.
8 DA Drain Terminal A. Can be an input or an
output.
9 DB Drain Terminal B. Can be an input or an
output.
10 S4B Source Terminal 4B. Can be an input or
an output.
11 S3B Source Terminal 3B. Can be an input or
an output.
12 S2B Source Terminal 2B. Can be an input or
an output.
13 S1B Source Terminal 1B. Can be an input or
an output.
14 VDD Most Positive Power Supply Potential.
15 GND Ground (0 V) Reference.
16 A1 Logic Control Input.
Table 6. ADG408 Truth Table
A2 A1 A0 EN ON SWITCH
X X X 0 NONE
0 0 0 1 1
0 0 1 1 2
0 1 0 1 3
0 1 1 1 4
1 0 0 1 5
1 0 1 1 6
1 1 0 1 7
1 1 1 1 8
Table 7. ADG409 Truth Table
ON SWITCH
A1 A0 EN PAIR
X X 0 NONE
0 0 1 1
0 1 1 2
1 0 1 3
1 1 1 4
ADG408/ADG409
Rev. C | Page 8 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
120
20
80
40
100
60
V
D
[V
S
](V)
R
ON
(Ω)
T
A
=25°C
V
DD
=+5V
V
SS
=–5V
V
DD
= +12V
V
SS
= –12V
V
DD
= +15V
V
SS
=–15V
V
DD
=+10V
V
SS
= –10V
–15 –10 –5 0 5 10 15
00027-004
Figure 4. RON as a Function of VD (VS): Dual-Supply Voltage
100
30
80
70
50
40
60
90
V
DD
=+15V
V
SS
= –15V
125°C
85°C
25°C
V
D
[V
S
](V)
–15 –10 –5 0 5 10 15
R
ON
(Ω)
00027-005
Figure 5. RON as a Function of VD (VS) for Different Temperatures
0.2
–0.2
LEAKAGE CURRENT (nA)
0
–0.1
0.1
ID(OFF)
IS(OFF)
ID(ON)
VD[VS](V)
–15 –10 –5 0 5 10 15
TA= 25°C
VDD =+15V
VSS = –15V
00027-006
Figure 6. Leakage Currents as a Function of VD (VS)
180
40
140
120
80
60
160
100
V
D
[V
S
](V)
R
ON
(Ω)
T
A
=25°C
V
DD
=5V
V
SS
=0V
V
DD
=12V
V
SS
=0V
V
DD
=15V
V
SS
=0V
V
DD
=10V
V
SS
=0V
0369121
00027-007
5
Figure 7. RON as a Function of VD (VS): Single-Supply Voltage
130
60
100
80
70
90
120
110
R
ON
(Ω)
V
D
[V
S
](V)
V
DD
=12V
V
SS
=0V
125°C
85°C
25°C
024681012
00027-008
Figure 8. RON as a Function of VD (VS) for Different Temperature
0.04
–0.06
LEAKAGE CURRENT (nA)
0
–0.04
0.02
–0.02
V
D
[V
S
](V)
T
A
= 25°C
V
DD
=12V
V
SS
=0V
I
S
(OFF)
I
D
(OFF)
I
D
(ON)
024681012
0
0027-009
Figure 9. Leakage Currents as a Function of VD (VS)
ADG408/ADG409
Rev. C | Page 9 of 16
120
20
TIME (ns)
60
40
100
80
V
IN
(V)
V
DD
= +15V
V
SS
= –15V
t
TRANSITION
t
OFF
(EN)
t
ON
(EN)
13579111315
00027-010
Figure 10. Switching Time vs. VIN (Bipolar Supply)
400
0
TIME (ns)
200
100
300
V
IN
=5V
57911131
V
SUPPLY
(V)
5
t
TRANSITION
t
ON
(EN)
t
OFF
(EN)
00027-011
Figure 11. Switching Time vs. Single Supply
FREQUENCY (Hz)
100
1k
10k
I
DD
(µA)
V
DD
= +15V
V
SS
= –15V
EN = 2.4V
EN = 0V
10 100 1k 10k 100k 1M 10M
0
0027-012
Figure 12. Positive Supply Current vs. Switching Frequency
140
40
TIME (ns)
100
60
120
80
VIN (V)
VDD =12V
VSS =0V
135791113
t
OFF (EN)
t
ON (EN)
t
TRANSITION
00027-013
Figure 13. Switching Time vs. VIN (Single Supply)
300
0
±5 ±15±7
TIME (ns)
±9 ±11 ±13
200
100
VIN =5V
VSUPPLY (V)
t
TRANSITION
t
ON (EN)
t
OFF (EN)
00027-014
Figure 14. Switching Time vs. Bipolar Supply
EN = 0V
EN = 2.4V
VDD = +15V
VSS =–15V
FREQUENCY (Hz)
I
SS
(µA)
10k
1k
100
10
0
–10
10 100 1k 10k 100k 1M 10M
00027-015
Figure 15. Negative Supply Current vs. Switching Frequency
ADG408/ADG409
Rev. C | Page 10 of 16
FREQUENCY (Hz)
110
70
OFF ISOLATION (dB)
90
80
100
1k 10k 100k 1M
V
DD
= +15V
V
SS
= –15V
00027-016
Figure 16. Off Isolation vs. Frequency
10k
FREQUENCY (Hz)
110
70
CROSSTALK (dB)
90
80
100
60
V
DD
=+15V
V
SS
= –15V
1k 100k 1M
0
0027-017
Figure 17. Crosstalk vs. Frequency
ADG408/ADG409
Rev. C | Page 11 of 16
TEST CIRCUITS
R
ON
=V1/I
DS
V
S
SD
V1
I
DS
00027-018
Figure 18. On Resistance
S1
D
S2
S8
A
EN
GND
0.8V
IS(OFF)
VSVD
VDD VSS
VDD VSS
00027-019
Figure 19. IS (OFF)
I
D
(OFF)
S1
D
S2
S8
A
EN
GND
0.8V
V
S
V
D
V
SS
V
DD
V
SS
V
DD
00027-020
Figure 20. ID (OFF)
S1 D
S8 A
EN
GND
2.4V
ID(ON)
VD
VS
V
DD
V
SS
VDD VSS
00027-021
Figure 21. ID (ON)
3V
0V
OUTPUT
tr< 20ns
tf< 20ns
ADDRESS
DRIVE (VIN)
tTRANSITION tTRANSITION
50% 50%
90%
90%
OUTPUT
ADG4081
A0
A1
A2
50Ω
300Ω
GND
S1
S2–S7
S8
D
35pF
VIN
2.4V EN
V
DD
V
SS
VDD VSS
VS1
VS8
1SIMILAR CONNECTION FOR ADG409.
00027-022
Figure 22. Switching Time of Multiplexer, tTRANSlTlON
OUTPUT
ADG408
1
A0
A1
A2
50Ω
300Ω
GND
S1
S2–S7
S8
D
35pF
V
IN
2.4V EN
V
DD
V
SS
V
DD
V
SS
V
S
1
SIMILAR CONNECTION FOR ADG409.
3V
0V
OUTPUT
80% 80%
ADDRESS
DRIVE (V
IN
)
00027-023
t
OPEN
Figure 23. Break-Before-Make Delay, tOPEN
ADG408/ADG409
Rev. C | Page 12 of 16
OUTPUT
ADG408
1
A0
A1
A2
50Ω300Ω
GND
S1
S2–S8
D
35pF
V
IN
EN
V
DD
V
SS
V
DD
V
SS
V
S
1
SIMILAR CONNECTION FOR ADG409.
3V
0V
O
UTPUT
50% 50%
t
OFF
(EN)
t
ON
(EN)
0.9V
O
0.9V
O
ENABLE
D
R
IVE (V
IN
)
00027-024
Figure 24. Enable Delay, tON (EN), tOFF (EN)
3V
V
IN
V
OUT
Q
INJ
=C
L
×ΔV
OUT
ΔV
OUT
DS
EN
GND C
L
10nF
V
OUT
V
IN
R
S
V
S
V
DD
V
SS
V
DD
V
SS
A0
A1
A2
ADG408
1
1
SIMILAR CONNECTION FOR ADG409.
00027-025
Figure 25. Charge Injection
OFF ISOLATION = 20 log V
OUT
/V
IN
ADG408
A0
A1
A2
EN
GND
D
S1
S8
0V
1kΩ
V
OUT
V
S
V
SS
V
DD
V
SS
V
DD
00027-026
Figure 26. Off Isolation
ADG408
A0
A1
A2
EN
GND
D
S1
S8
1kΩ1kΩS2
2.4V
CROSSTALK = 20 log VOUT/VIN
V
SS
V
DD
VSS
VDD
VOUT
VS
0
0027-027
Figure 27. Channel-to-Channel Crosstalk
ADG408/ADG409
Rev. C | Page 13 of 16
TERMINOLOGY
RON
Ohmic resistance between D and S.
ΔRON
Difference between the RON of any two channels.
IS (OFF)
Source leakage current when the switch is off.
ID (OFF)
Drain leakage current when the switch is off.
ID, IS (ON)
Channel leakage current when the switch is on.
VD (VS)
Analog voltage on Terminal D and Terminal S.
CS (OFF)
Channel input capacitance for off condition.
CD (OFF)
Channel output capacitance for off condition.
CD, CS (ON)
On switch capacitance.
CIN
Digital input capacitance.
tON (EN)
Delay time between the 50% and 90% points of the digital input
and switch on condition.
tOFF (EN)
Delay time between the 50% and 90% points of the digital input
and switch off condition.
tTRANSITION
Delay time between the 50% and 90% points of the digital
inputs and the switch on condition when switching from one
address state to another.
tOPEN
Off time measured between the 80% point of both switches
when switching from one address state to another.
VINL
Maximum input voltage for Logic 0.
VINH
Minimum input voltage for Logic 1.
IINL (IINH)
Input current of the digital input.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance.
Off Isolation
A measure of unwanted signal coupling through an off channel.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching.
IDD
Positive supply current.
ISS
Negative supply current.
ADG408/ADG409
Rev. C | Page 14 of 16
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
COMPLIANT TO JEDEC STANDARDS MS-001-AB
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
16
18
9
0.100 (2.54)
BSC
0.800 (20.32)
0.790 (20.07)
0.780 (19.81)
PIN 1
0.210
(5.33)
MAX
SEATING
PLANE
0.015
(0.38)
MIN
0.005 (0.13)
MIN
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
0.060 (1.52)
MAX
0.430 (10.92)
MAX
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
0.015 (0.38)
GAUGE
PLANE
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
Figure 28. 16-Lead Plastic Dual In-Line Package [PDIP]
Narrow Body
(N-16)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
0.840 (21.34) MAX
15°
0°
0.320 (8.13)
0.290 (7.37)
0.015 (0.38)
0.008 (0.20)
0
.200 (5.08)
MAX
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.310 (7.87)
0.220 (5.59)
0.005 (0.13) MIN 0.098 (2.49) MAX
0.100 (2.54) BSC
PIN 1
18
9
16
SEATING
PLANE
0.150
(3.81)
MIN
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
Figure 29. 16-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-16)
Dimensions shown in inches and (millimeters)
ADG408/ADG409
Rev. C | Page 15 of 16
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AC
16 9
8
1
4.00 (0.1575)
3.80 (0.1496)
10.00 (0.3937)
9.80 (0.3858)
1.27 (0.0500)
BSC
6.20 (0.2441)
5.80 (0.2283)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
8°
0°
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARITY
0.10
× 45°
Figure 30. 16-Lead Standard Small Outline Package [SOIC_N]
Narrow Body
(R-16)
Dimensions shown in millimeters and (inches)
16 9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09 0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
ADG408/ADG409
Rev. C | Page 16 of 16
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG408BN −40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADG408BNZ1−40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADG408BR −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG408BR-REEL −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG408BR-REEL7 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG408BRU −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG408BRU-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG408BRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG408BRUZ1−40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG408BRUZ-REEL1−40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG408BRUZ-REEL71−40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG408BRZ1−40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG408BRZ-REEL1−40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG408BRZ-REEL71−40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG408TQ −55°C to +125°C 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16
ADG408BCHIPS DIE
ADG409BN −40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADG409BNZ1−40°C to +85°C 16-Lead Plastic Dual In-Line Package [PDIP] N-16
ADG409BR −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG409BR-REEL −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG409BR-REEL7 −40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG409BRU −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG409BRU-REEL −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG409BRU-REEL7 −40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG409BRUZ1−40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG409BRUZ-REEL1−40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG409BRUZ-REEL71−40°C to +85°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG409BRZ1−40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG409BRZ-REEL1−40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG409BRZ-REEL71−40°C to +85°C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16
ADG409TQ −55°C to +125°C 16-Lead Ceramic Dual In-Line Package [CERDIP] Q-16
1 Z = Pb-free part.
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registered trademarks are the property of their respective owners.
C00027-0-10/06(C)