PTVS18VS1UR-115 - NXP - Datasheet.Directory

1. Product profile

1.1 General description

400 W unidirectional Transient Voltage Suppressor (TVS) in a SOD123W small and flat

lead low-profile Surface-Mounted Device (SMD) plastic package, designed for transient

overvoltage protection.

1.2 Features and benefits

1.3 Applications

Power supply protection

Automotive application

Industrial application

Power management

1.4 Quick reference data

[1] In accordance with IEC 61643-321 (10/1000 μs current waveform).

[2] For PTVS3V3S1UR: PPPM =350W

PTVSxS1UR series

400 W Transient Voltage Suppressor

Rev. 3 — 10 January 2011 Product data sheet

Rated peak puls e po we r:

PPPM = 400 W (350 W for 3V3)

Small plastic package suitable for

surface-mounted design

Reverse standof f voltage range:

VRWM =3.3Vto64V

Very low package height: 1 mm

Reverse current: IRM =0.001μAAEC-Q101 qualified

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

PPPM rated peak pulse power [1][2] --400W

VRWM reverse standoff voltage 3.3 - 64 V

Product data sheet Rev. 3 — 10 January 2011 2 of 12

NXP Semiconductors PTVSxS1UR series

400 W Transient Voltage Suppressor

2. Pinning information

[1] The marking bar indicates the cathode.

3. Ordering information

[1] The series consists of 35 types with reverse standoff voltages from 3.3 V to 64 V.

4. Marking

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 cathode [1]

2 anode 21

006aaa15

Table 3. Ordering i nformation

Type number[1] Package

Name Description Version

PTVSxS1UR series - plastic surface-mounted package; 2 leads SOD123W

Table 4. Marking codes

Type number Marking code Type number Marking code

PTVS3V3S1UR A1 PTVS20VS1UR AL

PTVS5V0S1UR A2 PTVS22VS1UR AM

PTVS6V0S1UR A3 PTVS24VS1UR AN

PTVS6V5S1UR A4 PTVS26VS1UR AP

PTVS7V0S1UR A5 PTVS28VS1UR AR

PTVS7V5S1UR A6 PTVS30VS1UR AS

PTVS8V0S1UR A7 PTVS33VS1UR AT

PTVS8V5S1UR A8 PTVS36VS1UR AU

PTVS9V0S1UR A9 PTVS40VS1UR AV

PTVS10VS1UR AA PTVS43VS1UR AW

PTVS11VS1UR AB PTVS45VS1UR AX

PTVS12VS1UR AC PTVS48VS1UR AY

PTVS13VS1UR AD PTVS51VS1UR AZ

PTVS14VS1UR AE PTVS54VS1UR B1

PTVS15VS1UR AF PTVS58VS1UR B2

PTVS16VS1UR AG PTVS60VS1UR B3

PTVS17VS1UR AH PTVS64VS1UR B4

PTVS18VS1UR AK - -

Product data sheet Rev. 3 — 10 January 2011 3 of 12

NXP Semiconductors PTVSxS1UR series

400 W Transient Voltage Suppressor

5. Limiting values

[1] In accordance with IEC 61643-321 (10/1000 μs current waveform).

[2] For PTVS3V3S1UR: PPPM =350W

[1] Device stressed with ten non-repetitive ElectroStatic Discharge (ESD) pulses.

[2] Soldering point of cathode tab.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

PPPM rated peak pulse power [1][2] -400W

IPPM rated peak pulse current [1] -see

Table 9

and 10

IFSM Non-repetitive peak

forward current single half-sine

wave; tp=8.3ms -50A

Tjjunction temperature - 150 °C

Tamb ambient temperature −55 +150 °C

Tstg storage temperature −65 +150 °C

Table 6. ESD maximum ratings

Tamb =25

C unless otherwise specified.

Symbol Parameter Conditions Min Max Unit

Per diode

VESD electrostatic discharge voltage IEC 61000-4-2

(contact discharge) [1][2] -30kV

Table 7. ESD standards compliance

Standard Conditions

Per diode

IEC 61000-4-2; level 4 (ESD) > 1 5 kV (air); > 8 kV (contact)

MIL-STD-883; class 3 (human body model) > 4 kV

Product data sheet Rev. 3 — 10 January 2011 4 of 12

NXP Semiconductors PTVSxS1UR series

400 W Transient Voltage Suppressor

6. Thermal characteristics

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[3] Device mounted on a ceramic PCB, Al2O3, standard footprint.

[4] Soldering point of cathode tab.

7. Characteristics

Table 8. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance from

junction to ambient in free air [1] --220K/W

[2] --130K/W

[3] --70K/W

Rth(j-sp) thermal resistance from

junction to solder point [4] --18K/W

Table 9. Characteristics per type; PTVS3V3S1UR to PTVS7V0S1UR

Tj=25

C unless otherwise specified.

Type number Reverse standoff

voltage

VRWM (V)

Breakdown voltage

VBR (V) Reverse leakage

current

IRM (μA)

Clamping voltage

VCL (V)

IR=10mA at VRWM (V)

Max Min Typ Max Typ Max Max IPPM (A)

PTVS3V3S1UR 3.3 5.20 5.60 6.00 5 600 8.0 43.8

PTVS5V0S1UR 5.0 6.40 6.70 7.00 5 400 9.2 43.5

PTVS6V0S1UR 6.0 6.67 7.02 7.37 5 400 10.3 38.8

PTVS6V5S1UR 6.5 7.22 7.60 7.98 5 250 11.2 35.7

PTVS7V0S1UR 7.0 7.78 8.20 8.60 3 100 12.0 33.3

Table 10. Characteristics p er type; PTVS7V5S1UR to PTVS64VS1UR

Tj=25

C unless otherwise specified.

Type number Reverse standoff

voltage

VRWM (V)

Breakdown voltage

VBR (V) Reverse leakage

current

IRM (μA)

Clamping voltage

VCL (V)

IR=1mA at VRWM (V)

Max Min Typ Max Typ Max Max IPPM (A)

PTVS7V5S1UR 7.5 8.33 8.77 9.21 0.2 50 12.9 31.0

PTVS8V0S1UR 8.0 8.89 9.36 9.83 0.03 25 13.6 29.4

PTVS8V5S1UR 8.5 9.44 9.92 10.40 0.01 10 14.4 27.8

PTVS9V0S1UR 9.0 10.00 10.55 11.10 0.005 5 15.4 26.0

PTVS10VS1UR 10 11.10 11.70 12.30 0.005 2.5 17.0 23.5

PTVS11VS1UR 11 12.20 12.85 13.50 0.005 2.5 18.2 22.0

PTVS12VS1UR 12 13.30 14.00 14.70 0.005 2.5 19.9 20.1

PTVS13VS1UR 13 14.40 15.15 15.90 0.001 0.1 21.5 18.6

Product data sheet Rev. 3 — 10 January 2011 5 of 12

NXP Semiconductors PTVSxS1UR series

400 W Transient Voltage Suppressor

PTVS14VS1UR 14 15.60 16.40 17.20 0.001 0.1 23.2 17.2

PTVS15VS1UR 15 16.70 17.60 18.50 0.001 0.1 24.4 16.4

PTVS16VS1UR 16 17.80 18.75 19.70 0.001 0.1 26.0 15.4

PTVS17VS1UR 17 18.90 19.90 20.90 0.001 0.1 27.6 14.5

PTVS18VS1UR 18 20.00 21.00 22.10 0.001 0.1 29.2 13.7

PTVS20VS1UR 20 22.20 23.35 24.50 0.001 0.1 32.4 12.3

PTVS22VS1UR 22 24.40 25.60 26.90 0.001 0.1 35.5 11.3

PTVS24VS1UR 24 26.70 28.10 29.50 0.001 0.1 38.9 10.3

PTVS26VS1UR 26 28.90 30.40 31.90 0.001 0.1 42.1 9.5

PTVS28VS1UR 28 31.10 32.80 34.40 0.001 0.1 45.4 8.8

PTVS30VS1UR 30 33.30 35.10 36.80 0.001 0.1 48.4 8.3

PTVS33VS1UR 33 36.70 38.70 40.60 0.001 0.1 53.3 7.5

PTVS36VS1UR 36 40.00 42.10 44.20 0.001 0.1 58.1 6.9

PTVS40VS1UR 40 44.40 46.80 49.10 0.001 0.1 64.5 6.2

PTVS43VS1UR 43 47.80 50.30 52.80 0.001 0.1 69.4 5.8

PTVS45VS1UR 45 50.00 52.65 55.30 0.001 0.1 72.7 5.5

PTVS48VS1UR 48 53.30 56.10 58.90 0.001 0.1 77.4 5.2

PTVS51VS1UR 51 56.70 59.70 62.70 0.001 0.1 82.4 4.9

PTVS54VS1UR 54 60.00 63.15 66.30 0.001 0.1 87.1 4.6

PTVS58VS1UR 58 64.40 67.80 71.20 0.001 0.1 93.6 4.3

PTVS60VS1UR 60 66.70 70.20 73.70 0.001 0.1 96.8 4.1

PTVS64VS1UR 64 71.10 74.85 78.60 0.001 0.1 103.0 3.9

Table 10. Characteristics p er type; PTVS7V5S1UR to PTVS64VS1UR …continued

Tj=25

C unless otherwise specified.

Type number Reverse standoff

voltage

VRWM (V)

Breakdown voltage

VBR (V) Reverse leakage

current

IRM (μA)

Clamping voltage

VCL (V)

IR=1mA at VRWM (V)

Max Min Typ Max Typ Max Max IPPM (A)

Product data sheet Rev. 3 — 10 January 2011 6 of 12

NXP Semiconductors PTVSxS1UR series

400 W Transient Voltage Suppressor

Fig 1. 10/1000 μs pulse waveform according to

IEC 61643-321 Fig 2. Relative variation of rated peak pulse power as

a function of junction temperature; typical

values

Tamb =25°C

(1) PTVS5V0S1UR to PTVS64VS1UR

(2) PTVS3V3S1UR

Fig 3. Rated peak pulse power as a function of pulse duration; typical values

tp (ms)

0 4.03.01.0 2.0

006aab319

100

150

IPP

(%)

50 % IPP; 1000 μs

100 % IPP; 10 μs

(°C)

0 20015050 100

006aab321

0.4

0.8

1.2

PPM

PPM(25°C)

006aab418

10−1

tp (μs)

103104

102

110

104

103

105

PPPM

(W)

102

(2)

(1)

Product data sheet Rev. 3 — 10 January 2011 7 of 12

NXP Semiconductors PTVSxS1UR series

400 W Transient Voltage Suppressor

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in auto motive applications.

9. Package outline

Fig 4. V-I characteristics for a unidirectional TVS protection diode

006aab32

−V

RWM

−I

P-N

−+

−I

PPM

Fig 5. Package outline SOD123W

08-11-06Dimensions in mm

2.8

2.4

3.7

3.3

1.05

0.75

1.9

1.5

0.6

0.3

0.22

0.10

1.1

0.9

Product data sheet Rev. 3 — 10 January 2011 8 of 12

NXP Semiconductors PTVSxS1UR series

400 W Transient Voltage Suppressor

10. Packing information

[1] For further information and the availability of packing methods, see Section 14.

[2] The series consists of 35 types with reverse standoff voltages from 3.3 V to 64 V.

11. Soldering

Table 11. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number[2] Package Description Packing quantity

3000

PTVSxS1UR series SOD123W 4 mm pitch, 8 mm tape and reel -115

Reflow soldering is the only recommended soldering method.

Fig 6. Reflow soldering footprint SOD123W

2.9

2.8

4.4

1.62.1 1.2

(2×)

1.1

(2×)

solder lands

solder resist

occupied area

solder paste

1.1

(2×)

1.2

(2×)sod123w_

Dimensions in mm

Product data sheet Rev. 3 — 10 January 2011 9 of 12

NXP Semiconductors PTVSxS1UR series

400 W Transient Voltage Suppressor

12. Revision history

Table 12. Revision history

Document ID Release date Data sheet status Change notice Supersedes

PTVSXS1UR_SER v.3 20110110 Product data sheet - PTVSXS1UR_SER v.2

Modifications: •Table 6 and 7: added.

•Section 13 “Legal information”: updated.

PTVSXS1UR_SER v.2 20090910 Product data sheet - PTVSXS1UR_SER v.1

PTVSXS1UR_SER v.1 20090202 Product data sheet - -

Product data sheet Rev. 3 — 10 January 2011 10 of 12

NXP Semiconductors PTVSxS1UR series

400 W Transient Voltage Suppressor

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agr eed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

13.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 3 — 10 January 2011 11 of 12

NXP Semiconductors PTVSxS1UR series

400 W Transient Voltage Suppressor

Quick reference data — The Quick reference dat a is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors PTVSxS1UR series

400 W Transient Voltage Suppressor

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 10 January 2011

Document identifier: PTVSxS1UR_SER

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 7

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 7

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7

10 Packing information . . . . . . . . . . . . . . . . . . . . . 8

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

14 Contact information. . . . . . . . . . . . . . . . . . . . . 11

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12