Publication# 10205 Rev. FAmendment/0
Issue Date: May 1995
2-56
Advanced
Micro
Devices
Am27C010
1 Megabit (131,072 x 8-Bit) CMOS EPROM
FINAL
DISTINCTIVE CHARACTERISTICS
Fast access time
55 ns
Low power consumption
20 µA typical CMOS standby current
JEDEC-approved pinout
Single +5 V power supply
±10% power supply tolerance available
100% Flashrite programming
Typical programming time of 16 seconds
Latch-up protected to 100 mA from –1 V to
VCC + 1 V
High noise immunity
Versatile features for simple interfacing
Both CMOS and TTL input/output
compatibility
Two line control functions
Compact 32-pin DIP, PDIP, TSOP, PLCC
packages
GENERAL DESCRIPTION
The Am27C010 is a 1 Megabit ultraviolet erasable pro-
grammable read-only memory. It is organized as 128K
words by 8 bits per word, operates from a single +5 V
supply, has a static standby mode, and features fast sin-
gle address location programming. Products are avail-
able in windowed ceramic DIP packages as well as plas-
tic one time programmable (OTP) PDIP, TSOP, and
PLCC packages.
Typically, any byte can be accessed in less than 55 ns,
allowing operation with high-performance microproces-
sors without any WAIT states. The Am27C010 offers
separate Output Enable (OE) and Chip Enable (CE)
controls, thus eliminating bus contention in a multiple
bus microprocessor system.
AMD’s CMOS process technology provides high speed,
low power, and high noise immunity. Typical power con-
sumption is only 100 mW in active mode, and 100 µW in
standby mode.
All signals are TTL levels, including programming sig-
nals. Bit locations may be programmed singly, in blocks,
or at random. The Am27C010 supports AMD’s Flashrite
programming algorithm (100 µs pulses) resulting in a
typical programming time of 16 seconds.
BLOCK DIAGRAM
VCC
VSS
Output Enable
Chip Enable
and
Prog Logic
Y
Decoder
X
Decoder
CE
OE
Output
Buffers
Y
Gating
1,048,576
Bit Cell
Matrix
A0–A16
Address
Inputs
Data Outputs
DQ0–DQ7
10205F-1
VPP
PGM
AMD
2-57
Am27C010
PRODUCT SELECTOR GUIDE
Family Part No.
Ordering Part No:
VCC ±5% -55 -255
VCC ±10% -70 -90 -120 -150 -200
Max Access Time (ns) 55 70 90 120 150 200 250
CE (E) Access (ns) 55 70 90 120 150 200 250
OE (G) Access (ns) 35 35 40 50 65 75 75
Am27C010
CONNECTION DIAGRAMS
Top View DIP
Notes:
1. JEDEC nomenclature is in parentheses.
2. The 32-pin DIP to 32-pin PLCC configuration varies from the JEDEC 28-pin DIP to 32-pin PLCC configuration.
PLCC
VPP VCC
DQ0
A14
1
3
5
7
9
11
12
10
2
4
8
6
32
30
28
26
24
14
21
23
31
29
25
27
13
22
20
19
15
16 18
17
DQ1
DQ2
VSS
PGM (P)
NC
A13
A8
A9
A11
OE (G)
A10
CE (E)
DQ7
DQ6
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ5
DQ4
DQ3
10205F-2
10205F-3
13130234
5
6
7
8
9
10
11
12
13 17 18 19 20161514
29
28
27
26
25
24
23
22
21
32
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
A14
A13
A8
A9
OE (G)
A10
CE (E)
DQ7
A12
A15
A16
VPP
VCC
PGM (P)
NC
DQ1
DQ2
VSS
DQ3
DQ4
DQ5
DQ6
A11
A11 OE
A7
PGM
A13 DQ7
1
3
5
7
9
11
12
10
2
4
8
6
32
30
28
26
24
14
21
23
31
29
25
27
A8
A14
13
22
20
19
NC
15
16 18
17
VCC
VPP
A16
A15
A12
A6
A5
A4
A10
CE
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ0
A0
A1
A2
A3
DQ1
A9
10205F-5
TSOP
Standard Pinout
AMD
2-58 Am27C010
A0–A16
DQ0–DQ7
CE (E)
PGM (P)
OE (G)
8
17
PIN DESIGNATIONS
A0–A16 = Address Inputs
CE (E) = Chip Enable Input
DQ0–DQ7 = Data Input/Outputs
OE (G) = Output Enable Input
PGM (P) = Program Enable Input
VCC =V
CC Supply Voltage
VPP = Program Voltage Input
VSS = Ground
LOGIC SYMBOL
10205F-4
AMD
2-59
Am27C010
ORDERING INFORMATION
UV EPROM Products
Valid Combinations
Valid Combinations list configurations planned to be
supported in volume for this device. Consult the lo-
cal AMD sales office to confirm availability of specific
valid combinations and to check on newly released
combinations.
DEVICE NUMBER
Am27C010
1 Megabit (131,072 x 8-Bit) CMOS UV EPROM
PACKAGE TYPE
D = 32-Pin Ceramic DIP (CDV032)
AMD Standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of:
BCD-55AM27C010
OPTIONAL PROCESSING
Blank = Standard Processing
B = Burn-in
TEMPERATURE RANGE
C = Commercial (0°C to +70°C)
I = Industrial (–40°C to +85°C)
E = Extended Commercial (–55°C to +125°C)
SPEED OPTION
See Product Selector Guide and Valid Combinations
Valid Combinations
AM27C010-55
AM27C010-70
AM27C010-90
AM27C010-120
AM27C010-150
AM27C010-200
AM27C010-255
DC, DCB, DI, DIB
DC, DCB, DE, DEB,
DI, DIB
DC
DC, DCB, DI, DIB
AMD
2-60 Am27C010
ORDERING INFORMATION
OTP Products
Valid Combinations
Valid Combinations list configurations planned to be
supported in volume for this device. Consult the lo-
cal AMD sales office to confirm availability of specific
valid combinations and to check on newly released
combinations.
DEVICE NUMBER
Am27C010
1 Megabit (131,072 x 8-Bit) CMOS OTP EPROM
Valid Combinations
AM27C010-70
AM27C010-90
AM27C010-120
AM27C010-150
AM27C010-200
AM27C010-255
PACKAGE TYPE
P = 32-Pin Plastic DIP (PD 032)
J = 32-Pin Rectangular Plastic Leaded Chip
Carrier (PL 032)
E = 32-Pin TSOP Standard Pinout (TS 032)
AMD Standard products are available in several packages and operating ranges. The order number (Valid Combination) is
formed by a combination of:
CP-70AM27C010
OPTIONAL PROCESSING
Blank = Standard Processing
TEMPERATURE RANGE
C = Commercial (0°C to +70°C)
I = Industrial (–40°C to + 85°C)
SPEED OPTION
See Product Selector Guide and Valid Combinations
PC, JC, EC, PI,
JI, EI
AMD
2-61
Am27C010
FUNCTIONAL DESCRIPTION
Erasing the Am27C010
In order to clear all locations of their programmed con-
tents, it is necessary to expose the Am27C010 to an
ultraviolet light source. A dosage of 15 W seconds/cm2 is
required to completely erase an Am27C010. This
dosage can be obtained by exposure to an ultraviolet
lamp—wavelength of 2537 A
°—with intensity of
12,000 µW/cm2
for 15 to 20 minutes. The Am27C010
should be directly under and about one inch from the
source and all filters should be removed from the UV
light source prior to erasure.
It is important to note that the Am27C010 and similar
devices will erase with light sources having wavelengths
shorter than 4000 A
°. Although erasure times will be
much longer than with UV sources at 2537 A
°, exposure
to fluorescent light and sunlight will eventually erase the
Am27C010 and exposure to them should be prevented
to realize maximum system reliability. If used in such an
environment, the package window should be covered
by an opaque label or substance.
Programming the Am27C010
Upon delivery or after each erasure the Am27C010 has
all 1,048,576 bits in the “ONE” or HIGH state. “ZEROs”
are loaded into the Am27C010 through the procedure
of programming.
The programming mode is entered when 12.75 V ±
0.25 V is applied to the VPP pin, CE and PGM are at VIL,
and OE is at VIH.
For programming, the data to be programmed is applied
8 bits in parallel to the data output pins.
The Flashrite algorithm reduces programming time by
using 100 µs programming pulses and by giving each
address only as many pulses as is necessary in order to
reliably program the data. After each pulse is applied to
a given address, the data in that address is verified. If
the data does not verify, additional pulses are given until
it verifies or the maximum is reached. This process is re-
peated while sequencing through each address of the
Am27C010. This part of the algorithm is done at
VCC = 6.25 V to assure that each EPROM bit is pro-
grammed to a sufficiently high threshold voltage. After
the final address is completed, the entire EPROM mem-
ory is verified at VCC = VPP = 5.25 V.
Please refer to Section 6 for programming flow chart
and characteristics.
Program Inhibit
Programming of multiple Am27C010 in parallel with dif-
ferent data is also easily accomplished. Except for CE,
all like inputs of the parallel Am27C010 may be com-
mon. A TTL low-level program pulse applied to an
Am27C010 CE input and VPP = 12.75 V ± 0.25 V, PGM
Low and OE High will program that Am27C010. A
high-level CE input inhibits the other Am27C010 de-
vices from being programmed.
Program Verify
A verify should be performed on the programmed bits to
determine that they were correctly programmed. The
verify should be performed with OE and CE at VIL , PGM
at VIH, and VPP between 12.5 V and 13.0 V.
Auto Select Mode
The auto select mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and type. This mode is intended for use by programming
equipment for the purpose of automatically matching
the device to be programmed with its corresponding
programming algorithm. This mode is functional in the
25°C ± 5°C ambient temperature range that is required
when programming the Am27C010.
To activate this mode, the programming equipment
must force 12.0 V ± 0.5 V on address line A9 of the
Am27C010. Two identifier bytes may then be se-
quenced from the device outputs by toggling address
line A0 from VIL to VIH. All other address lines must be
held at VIL during auto select mode.
Byte 0 (A0 = VIL) represents the manufacturer code, and
byte 1 (A0 = VIH), the device code. For the Am27C010,
these two identifier bytes are given in the Mode Select
Table. All identifiers for manufacturer and device codes
will possess odd parity, with the MSB (DQ7) defined as
the parity bit.
Read Mode
The Am27C010 has two control functions, both of which
must be logically satisfied in order to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output Enable (OE)
is the output control and should be used to gate data to
the output pins, independent of device selection. As-
suming that addresses are stable, address access time
(tACC) is equal to the delay from CE to output (tCE). Data
is available at the outputs tOE after the falling edge of
OE, assuming that CE has been LOW and addresses
have been stable for at least tACC–tOE.
Standby Mode
The Am27C010 has a CMOS standby mode which re-
duces the maximum VCC current to 100 µA. It is placed in
CMOS-standby when CE is at VCC ± 0.3 V. The
Am27C010 also has a TTL-standby mode which re-
duces the maximum VCC current to 1.0 mA. It is placed in
TTL-standby when CE is at VIH. When in standby mode,
the outputs are in a high-impedance state, independent
of the OE input.
AMD
2-62 Am27C010
Output OR-Tieing
To accommodate multiple memory connections, a two-
line control function is provided to allow for:
Low memory power dissipation
Assurance that output bus contention will not occur
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and con-
nected to the READ line from the system control bus.
This assures that all deselected memory devices are in
low-power standby mode and that the output pins are
only active when data is desired from a particular
memory device.
System Applications
During the switch between active and standby condi-
tions, transient current peaks are produced on the rising
and falling edges of Chip Enable. The magnitude of
these transient current peaks is dependent on the out-
put capacitance loading of the device. At a minimum, a
0.1-µF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
VCC and VSS to minimize transient effects. In addition, to
overcome the voltage drop caused by the inductive ef-
fects of the printed circuit board traces on EPROM ar-
rays, a 4.7-µF bulk electrolytic capacitor should be used
between VCC and VSS for each eight devices. The loca-
tion of the capacitor should be close to where the power
supply is connected to the array.
MODE SELECT TABLE
Notes:
1. V
H
= 12.0 V
±
0.5 V
2. X = Either V
IH
or V
IL
3. A1–A8 = A10–A16 = V
IL
4. See DC Programming Characteristics for VPP voltage during programming.
CE OE PGM A0 A9 VPP Outputs
Read VIL VIL XXX X D
OUT
Output Disable X VIH X X X X High-Z
Standby (TTL) VIH X X X X X High-Z
Standby (CMOS) VCC ± 0.3 V X X X X X High-Z
Program VIL VIH VIL XXV
PP DIN
Program Verify VIL VIL VIH XXV
PP DOUT
Program Inhibit VIH XXXXV
PP High-Z
Manufacturer
Code VIL VIL XV
IL VHX 01H
Device Code VIL VIL XV
IH VHX0E
Auto Select
(Note 3)
Mode Pins
AMD
2-63
Am27C010
ABSOLUTE MAXIMUM RATINGS
Storage Temperature
OTP Products –65°C to +125°C. . . . . . . . . . . . . . .
All Other Products –65°C to +150°C. . . . . . . . . . . .
Ambient Temperature
with Power Applied –55°C to +125°C. . . . . . . . . . . . .
Voltage with Respect To VSS
All pins except A9,VPP,VCC –0.6 V to VCC + 0.5 V.
A9 and VPP –0.6 V to +13.5 V. . . . . . . . . . . . . . . .
VCC –0.6 V to +7.0 V. . . . . . . . . . . . . . . . . . . . . . .
Notes:
1. Minimum DC voltage on input or I/O pins is –0.5 V. During
transitions, the inputs may overshoot V
SS
to –2.0 V for pe-
riods of up to 20 ns. Maximum DC voltage on input and I/O
pins is V
CC
+ 0.5 V which may overshoot to V
CC
+ 2.0 V for
periods up to 20ns.
2. For A9 and V
PP
the minimum DC input is –0.5 V. During
transitions, A9 and V
PP
may overshoot V
SS
to –2.0 V for
periods of up to 20 ns. A9 and V
PP
must not exceed 13.5 V
for any period of time .
Stresses above those listed under “Absolute Maximum Rat-
ings” may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these
or any other conditions above those indicated in the opera-
tional sections of this specification is not implied. Exposure of
the device to absolute maximum rating conditions for ex-
tended periods may affect device reliability.
OPERATING RANGES
Commercial (C) Devices
Ambient Temperature (TA)0°C to +70°C. . . . . . .
Industrial (I) Devices
Ambient Temperature (TA) –40°C to +85°C. . . . .
Extended Commercial (E) Devices
Ambient Temperature (TA) –55°C to +125°C. . . .
Supply Read Voltages
VCC for Am27C010-XX5 +4.75 V to +5.25 V. . . . .
VCC for Am27C010-XX0 +4.50 V to +5.50 V. . . . .
VCC for Am27C010-55 +4.75 V to +5.25 V. . . . . . .
Operating ranges define those limits between which the func-
tionality of the device is guaranteed.
AMD
2-64 Am27C010
DC CHARACTERISTICS over operating range unless otherwise specified.
(Notes 1, 2, and 4)
Parameter
Symbol Parameter Description Test Conditions Min Max Unit
VOH Output HIGH Voltage IOH = –400 µA 2.4 V
VOL Output LOW Voltage IOL = 2.1 mA 0.45 V
VIH Input HIGH Voltage 2.0 VCC + 0.5 V
VIL Input LOW Voltage –0.5 +0.8 V
ILI Input Load Current VIN = 0 V to VCC 1.0 µA
ILO Output Leakage Current VOUT = 0 V to VCC 5.0 µA
ICC1 VCC Active Current CE = VIL, f = 10 MHz,
(Note 3) IOUT = 0 mA
ICC2 VCC TTL Standby Current CE = VIH 1.0 mA
ICC3 VCC CMOS Standby Current CE = VCC ± 0.3 V 100 µA
IPP1 VPP Current During Read CE = OE = VIL, VPP = VCC 100 µA
C/I Devices
E Devices
30
60 mA
Notes:
1. V
CC
must be applied simultaneously or before V
PP
, and removed simultaneously or after V
PP
.
2. Caution: The Am27C010 must not be removed from (or inserted into) a socket when V
CC
or V
PP
is applied.
3. I
CC1
is tested with
OE
= V
IH
to simulate open outputs.
4. Minimum DC Input Voltage is –0.5 V. During transitions, the inputs may overshoot to –2.0 V for periods less than 20 ns.
Maximum DC Voltage on output pins is V
CC
+ 0.5 V, which may overshoot to V
CC
+ 2.0 V for periods less than 20 ns.
10205F-7
Figure 1. Typical Supply Current
vs. Frequency
VCC = 5.5 V, T = 25°C
Figure 2. Typical Supply Current
vs. Temperature
VCC = 5.5 V, f = 10 MHz
10205F-6
–75 –50 –25 0 25 50 75 100 125 150
30
25
20
15
10
12345678910
30
25
20
15
10
Supply Current
in mA
Supply Current
in mA
Frequency in MHz Temperature in °C
AMD
2-65
Am27C010
CAPACITANCE
Parameter Parameter
Symbol Description Test Conditions Typ Max Typ Max Typ Max Typ Max Unit
CIN Input
Capacitance VIN = 0 9 12 8 12 8 12 10 12 pF
COUT Output
Capacitance VOUT = 0 1315111411141214pF
CDV032 PL 032 PD 032
Notes:
1. This parameter is only sampled and not 100% tested.
2. T
A
= +25
°
C, F = 1 MHz
TS 032
SWITCHING CHARACTERISTICS over operating range unless otherwise specified
(Notes 1, 3, and 4)
Parameter Test
JEDEC Standard Description Conditions -55 -70 -90 -120 -150 -200 -255 Unit
tAVQV tACC Address to CE = OE = Min
Output Delay VIL Max 55 70 90 120 150 200 250 ns
tELQV tCE Chip Enable to OE = VIL Min
Output Delay Max 55 70 90 120 150 200 250 ns
tGLQV tOE Output Enable to CE = VIL Min
Output Delay Max 35 35 40 50 65 75 75 ns
tEHQZ tDF Min
tGHQZ (Note 2) Max 25 25 25 35 35 40 40 ns
tAXQX tOH Output Hold from Min 0 0 0 0 0 0 0
Addresses, CE, Max ns
or OE, whichever
occurred first
Notes:
1. V
CC
must be applied simultaneously or before V
PP
, and removed simultaneously or after V
PP
.
2. This parameter is only sampled and not 100% tested.
3. Caution: The Am27C010 must not be removed from (or inserted into) a socket or board when V
PP
or V
CC
is applied.
4. Output Load: 1 TTL gate and C
L
= 100 pF
Input Rise and Fall Times: 20 ns
Input Pulse Levels: 0.45 V to 2.4 V
Timing Measurement Reference Level: 0.8 V and 2 V inputs and outputs
For the Am27C010-55:
Output Load: 1 TTL Gate and C
L
= 30 pF
Input Rise and Fall Times: 20 ns
Input Pulse Levels: 0 V to 3 V
Timing Measurement Reference Level: 1.5 V for inputs and outputs
Parameter
Symbols Am27C010
Chip Enable HIGH or
Output Enable HIGH,
whichever comes
first, to Output Float
AMD
2-66 Am27C010
SWITCHING TEST CIRCUIT
Device
Under
Test
CL
+5.0 V
CL = 100 pF including jig capacitance (30 pF for –55)
6.2 k
2.7 k
Diodes = IN3064
or Equivalent
10205F-8
SWITCHING TEST WAVEFORM
AC Testing: Inputs are driven at 2.4 V for a logic “1” and 0.45 V for a logic “0”. Input pulse rise and fall times are 20 ns.
10205F-9
2.4 V
0.45 V
2.0 V
0.8 V
Test Points
2.0 V
0.8 V
Input Output
AMD
2-67
Am27C010
KEY TO SWITCHING WAVEFORMS
Must Be
Steady
May
Change
from H to L
May
Change
from L to H
Does Not
Apply
Don’t Care,
Any Change
Permitted
Will Be
Steady
Will Be
Changing
from H to L
Will Be
Changing
from L to H
Changing
State
Unknown
Center
Line is High
Impedence
“Off” State
WAVEFORM INPUTS OUTPUTS
KS000010
SWITCHING WAVEFORMS
Addresses
CE
OE
Output
10205F-10
Addresses Valid
High Z High Z
tCE
Valid Output
2.4
0.45
2.0
0.8 2.0
0.8
tACC
(Note 1)
tOE tDF
(Note 2)
tOH
Notes:
1.
OE
may be delayed up to t
ACC
–t
OE
after the falling edge of the addresses without impact on t
ACC.
2. t
DF
is specified from
OE
or
CE
, whichever occurs first.